CN102520494B - Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module - Google Patents
Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module Download PDFInfo
- Publication number
- CN102520494B CN102520494B CN201210009552.XA CN201210009552A CN102520494B CN 102520494 B CN102520494 B CN 102520494B CN 201210009552 A CN201210009552 A CN 201210009552A CN 102520494 B CN102520494 B CN 102520494B
- Authority
- CN
- China
- Prior art keywords
- array
- circuit board
- optical
- pad
- lenticule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a packaging structure of a multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module, which comprises a chip group, optical components, a circuit board, a gasket and a tube shell. In the packaging structure of the multi-mode QSFP parallel optical transceiver module, the fixed connection is realized among all the optical components as well as between the optical components and the circuit board through positioning circular holes and positioning cylinders which are matched with each other, so that the flexible adjustment when optical paths are actively coupled is facilitated, and the optical path reasonable conversion among the optical components is ensured, thereby the coupling efficiency of the optical paths is improved, and the transmission distance of data signals is increased; and in addition, an array lens frame is tightly jointed with the end surface of an adapter in an optical fiber connector and is simultaneously clamped between a base of the tube shell and a clamping groove of an upper cover so as to avoid the coupling deviation caused due to stress generated by the plug-in and the pull-out of an external optical fiber ribbon to the optical components.
Description
Technical field
The present invention relates to optical communication technique field, relate in particular to the encapsulating structure of a kind of multimode QSFP (Quad Small Form-factor Pluggable, four-way compact package is hot-swappable) parallel light transceiving module.
Background technology
The continuous expansion of communication network primary transmission capacity and speed improve constantly the main transmission means that makes optical fiber communication become present information network, for existing optical communication network, such as wide area network (WAN), Metropolitan Area Network (MAN) (MAN), LAN (Local Area Network) (LAN) etc., wherein the kind of the needed optical transceiver module as one of core light electron device is more and more, require also more and more higher, complexity also with surprising rapidity development.The optical transceiver module of selling in the market has " 1 × 9 ", SFF (Small Form Factor according to encapsulated type difference, compact package), SFP (Small Form-factor Pluggable, compact package is hot-swappable), GBIC, XENPAK, XFP (10Gb SFP, 10Gb small-sized encapsulated is hot-swappable), SFP+ (upgrade version of SFP) etc.
Optical transceiver module is except to several future developments such as hot plug, low cost, low-power consumption, and more obviously trend is miniaturization and two-forty.Mostly traditional optical transceiver module is module transmitting two paths of signals independently, and speed, from initial 155Mbit/s, has developed into the 10Gbit/s of main flow now, and the speed of forward 40Gbit/s marches at present.From present stage circuit engineering, 40Gbit/s approaches the limit of " electronic bottleneck ", if exceed this bottleneck, the problems such as the loss of signal causing, power dissipation, electromagnetic interference and impedance matching are all difficult to solve.In this case, the development of parallel light transceiving module has caused extensive concern in the industry.
Parallel light transceiving module, by adopting highdensity hyperchannel design to realize the transmission of superelevation speed, Large Volume Data, has more advantage in short-range data communication aspects.World-renowned optical module supplier provided respectively the parallel light transceiving module of several packing forms such as SNAP 12, POP 4, QSFP, CXP in recent years, wherein QSFP is by adopting the design of 8 passages (transmission, reception account for respectively 4 passages), utilize and only have more 30% PCB (Printed Circuit Board than SFP, printed circuit board (PCB)) space can realize the accumulation transmission data bandwidth than many 10 times of SFP, and therefore the relevant Development Techniques of QSFP is more and more subject to attention in the industry.
Compared with traditional double-channel optical transceiver module, the device density of parallel light transceiving module is high, therefore consideration that all will be more careful aspect photoelectric coupling design, heat radiation, electromagnetic interference shield design and the circuit design of module, selecting rational modular structure design is the key that module performance ensures.At present, correlation technique developer is being devoted to research and is meeting the structural design scheme of QSFP MSA (Multisource Agree-ment, multi-source agreement) specification and function admirable, with low cost, easy operating in the industry.
Summary of the invention
Embodiments of the invention aim to provide the multimode QSFP parallel light transceiving module encapsulating structure of a kind of QSFP of meeting MSA agreement and function admirable, with low cost, easy operating.
For achieving the above object, embodiments of the invention provide a kind of encapsulating structure of multimode QSFP parallel light transceiving module, comprise chipset, optical module, circuit board, pad and shell, wherein,
Described chipset comprises opto-electronic conversion array chip group, functional circuit chipset and microcontroller chip;
Described circuit board is provided with circuit board fixed orifice and the first array positioning round orifice, also be provided with opto-electronic conversion array chip group paster mark, functional circuit chipset paster mark and pad sticking position marks to be respectively used to bonding described opto-electronic conversion array chip group, described functional circuit chipset and described pad, on described circuit board, be also welded with described microcontroller chip;
Described pad is provided with the second array positioning round orifice;
Described optical module comprises adapter in array lens assembly, fiber array web member, array lens frame and the joints of optical fibre that are connected successively;
Described array lens assembly comprises orthogonal the first array lenticule and the second array lenticule, and be provided with array positioning cylinder on end face corresponding to described the first array lenticule, on other end corresponding to described the second array lenticule, be provided with web member positioning round orifice;
Described fiber array web member longitudinally connects and is provided with many root multimode fibers, and is respectively arranged with web member positioning cylinder and lens mount positioning round orifice on two end faces corresponding with described multimode optical fiber two ends;
Described array lens frame is provided with rectangular opening, is inlaid with the 3rd array lenticule in described rectangular opening, is respectively arranged with lens mount positioning cylinder and fibre ribbon positioning cylinder on the both sides end face of described array lens frame;
In the described joints of optical fibre adapter have for the bead of described array lens frame laminating, in the described joints of optical fibre, adapter is also provided with the groove for inserting for fibre ribbon;
Described array lens frame is by described lens mount positioning cylinder being inserted to described lens mount positioning round orifice and being connected with described fiber array web member, and described fiber array web member is by inserting described web member positioning round orifice by described web member positioning cylinder and being connected with described array lens assembly; Adapter is by making the justified margin of described bead and described array lens frame bonding and be connected with described array lens frame in the described joints of optical fibre;
Described optical module is fixed to described circuit board by the array positioning cylinder of described array lens assembly being passed to the second array positioning round orifice of described pad and inserting described the first array positioning round orifice;
Described shell comprises base, upper cover and interpolation frame; Described circuit board is fixed on described base by described circuit board fixed orifice; Described base and described on be covered with corresponding slot, for adapter card in described array lens frame and the described joints of optical fibre is located between described base and described upper cover; Described interpolation frame connects and fixes described base and described upper cover.
As shown from the above technical solution, the encapsulating structure of the multimode QSFP parallel light transceiving module that the embodiment of the present invention provides, flexible can realize the active coupling of light path time, ensure the light path reasonable conversion between optical module, thereby improve the efficiency of light path coupling, increase the transmission range of data-signal; And can avoid because the plug of external fiber band produces to optical module the coupling deviation that stress causes.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of the encapsulating structure embodiment of QSFP parallel light transceiving module of the present invention;
Fig. 2 is the positive view after the assembling of optical module and circuit board in Fig. 1 embodiment;
Fig. 3 is the back side view after the assembling of optical module and circuit board in Fig. 1 embodiment;
Fig. 4 and Fig. 5 are respectively stereographic map and the sectional view of array lens assembly in Fig. 1 embodiment;
Fig. 6 and Fig. 7 are respectively backsight and the front perspective view of fiber array web member in Fig. 1 embodiment;
Fig. 8 is the schematic perspective view of array lens frame in Fig. 1 embodiment;
Fig. 9 is the schematic perspective view of the interior adapter of the joints of optical fibre in Fig. 1 embodiment;
Figure 10 is the schematic perspective view of Fig. 1 embodiment Intermediate gasket.
In figure, each Reference numeral is as follows:
Chipset 101 opto-electronic conversion array chip group 102 functional circuit chipsets
103 microcontroller chips
Circuit board 200 201 circuit board fixed orifice 202 first array positioning round orifice
203 opto-electronic conversion array chip group paster marks
204 functional circuit chipset paster marks
205 pad sticking position marks 206 golden finger electrode tips
207 gold plated pads
Pad 300 301 second array positioning round orifice
Optical module 41 array lens assemblies
411 first array lenticule 412 second array lenticules
413 end face 414 end faces
415 array positioning cylinder 416 web member positioning round orifice
42 fiber array web members
421 multimode optical fiber 422 lens mount positioning round orifice
423 web member positioning cylinders
43 array lens framves
431 rectangular openings 432 the 3rd array lenticule
433 lens mount positioning cylinder 434 fibre ribbon positioning cylinders
Adapter in 44 joints of optical fibre
441 bead 442 grooves
443 outshots
Shell 51 base 511 slots
52 upper covers
53 interpolation frames
Embodiment
Describe specific embodiments of the invention in detail below in conjunction with each accompanying drawing.It should be noted that the embodiments described herein, only for illustrating, is not limited to the present invention.In addition, the dimension scale relation between each accompanying drawing is also inconsistent, so that the clear structure that shows embodiment.
Embodiments of the invention propose a kind of encapsulating structure of multimode QSFP parallel light transceiving module, it is made up of five parts such as chipset, circuit board 200, pad 300, optical module and shells, Fig. 1 is the decomposing schematic representation of the encapsulating structure embodiment of multimode QSFP parallel light transceiving module of the present invention, as shown in the figure, wherein, chipset comprises opto-electronic conversion array chip group 101, functional circuit chipset 102 and microcontroller chip 103.Circuit board 200 is provided with circuit board fixed orifice 201 and the first array positioning round orifice 202, also be provided with opto-electronic conversion array chip group paster mark 203, functional circuit chipset paster mark 204 and pad sticking position marks 205 to be respectively used to bonding opto-electronic conversion array chip group 101, functional circuit chipset 102 and pad 300, in addition, on circuit board 200, be also welded with microcontroller chip 103.Pad 300 is provided with the second array positioning round orifice 301, and in the time that pad 300 is pasted to the pad sticking position marks 205 on circuit board 200, this second array positioning round orifice 301 is overlapping and justified margin with the first array positioning round orifice 202 on circuit board 200.
Continue as shown in Figure 1, optical module comprises adapter 44 in array lens assembly 41, fiber array web member 42, array lens frame 43 and the joints of optical fibre that are connected successively.Wherein, shown in Fig. 4 and Fig. 5, array lens assembly 41 comprises orthogonal the first array lenticule 411 and the second array lenticule 412, and be provided with array positioning cylinder 415 on the end face 413 of the first array lenticule 411 correspondences, on the other end 414 of the second array lenticule 412 correspondences, be provided with web member positioning round orifice 416; In one embodiment, the distance between the first array lenticule 411 and the second array lenticule 412 and each self-corresponding end face 413,414 equals respectively the focal length of the first array lenticule 411 and the second array lenticule 412; In addition, in one embodiment, the first array lenticule 411 and the second array lenticule 412 are 1 × 12 array lenticule.Continue, shown in Fig. 6 and Fig. 7, fiber array web member 42 longitudinally connects and is provided with many (in the present embodiment being 12) multimode optical fibers 421, and is respectively arranged with lens mount positioning round orifice 422 and web member positioning cylinder 423 on two end faces corresponding with multimode optical fiber 421 two ends.In conjunction with reference to shown in figure 8, above-mentioned array lens frame 43 is provided with rectangular opening 431, and in rectangular opening 431, is inlaid with the 3rd array lenticule 432, is respectively arranged with lens mount positioning cylinder 433 and fibre ribbon positioning cylinder 434 on the both sides end face of array lens frame 43; In one embodiment, fiber array web member 42 is provided with 12 root multimode fibers 421, thereby corresponding with the array lenticule of above embodiment 1 × 12; Correspondingly, the 3rd array lenticule 432 is also 1 × 12 array lenticule, and the distance between the corresponding end face of the fiber array web member 42 that the 3rd array lenticule 432 is connected with array lens frame 43 (being as shown in Figure 6, the end face at lens mount positioning round orifice 422 places) equals the focal length of the 3rd array lenticule 432.Continue, in conjunction with reference to shown in figure 9, in the joints of optical fibre, adapter 44 has the bead 441 for fitting with array lens frame 43.In addition, in the joints of optical fibre, adapter 44 is also provided with for supplying MPO (Multi-fiber Push On, multicore plug) groove 442 that inserts of fibre ribbon, fibre ribbon inserts after the groove 442 of adapter 44 in the joints of optical fibre herein, further can match with the fibre ribbon positioning cylinder 434 on array lens frame 43 end faces by the positioning round orifice of himself front end.
Continue, in conjunction with referring to figs. 1 to shown in Fig. 3, array lens frame 43 is by lens mount positioning cylinder 433 being inserted to lens mount positioning round orifice 422 and being connected with fiber array web member 42, and fiber array web member 42 is by inserting web member positioning round orifice 416 by web member positioning cylinder 423 and being connected with array lens assembly 41; Adapter 44 is connected with array lens frame 43 by making to carry out bonding after the justified margin of bead 442 and array lens frame 43 in the joints of optical fibre, and ensures that the outshot 443 of adapter 44 in the joints of optical fibre places upward.Complete optical module entirety that above each step is connected by by the array positioning cylinder of array lens assembly 41 415 through the second array positioning round orifice 301 of pad 300 and insert the first array positioning round orifice 202 and be fixed to circuit board 200, correspondingly, the equal diameters of the first array positioning round orifice 202 and the second array positioning round orifice 301, and be greater than the diameter of array positioning cylinder 415.In one embodiment, in the time that optical module is fixed to circuit board 200, pad 300 is between the combination and circuit board 200 of fiber array web member 42 and array lens assembly 41, and between circuit board 200 and pad 300, all fix by a glue between pad 300 and array lens assembly 41 and pad 300 and fiber array web member 42; And the space between the second array positioning round orifice 301 of the array positioning cylinder 415 of array lens assembly 41 and pad 300 and the first array positioning round orifice 202 of circuit board 200 is also fixed by a glue.Correspondingly, in array lens assembly 41, fiber array web member 42, array lens frame 43 and the joints of optical fibre, between adapter 44 end face adjacent one another are, also fix by a glue.In one embodiment, above-mentioned some glue can use UV glue (without shadow glue) to carry out.
Be noted that in conjunction with the above; in the present embodiment; pad 300 mainly plays the effect of an overfill protection opto-electronic conversion array chip group 101; thereby for preventing that array lens assembly 41 (can be with reference to the state shown in figure 2 in the time being mounted to circuit board 200; now opto-electronic conversion array chip group 101 between array lens assembly 41 and circuit board 200 and invisible), can cause on chip the normal work that affects chip of pushing because of itself and the hypotelorism of opto-electronic conversion array chip group 101.In addition, in one embodiment, the width of pad 300 can be narrower than array lens assembly 41, fix so that carry out above-mentioned some glue between the two, and this design can increase the useful area of a glue, thereby make between circuit board 200 and pad 300, fixing more firm between pad 300 and array lens assembly 41 and pad 300 and fiber array web member 42.
Finally, continue with reference to shown in figure 1, shell comprises base 51, upper cover 52 and interpolation frame 53; Circuit board 200 is fixed on base 51 by circuit board fixed orifice 201; And, base 51 is provided with slot 511, upper cover 52 is provided with the slot (not shown) corresponding with it, thus in the time that upper cover 52 closes on base 51 by array lens frame 43 and the joints of optical fibre in adapter 44 be arranged between base 51 and upper cover 52; 53 of interpolation frames are for connecting and firm banking 51 and upper cover 52.
In one embodiment, on circuit board 200, contrast opto-electronic conversion array chip group paster mark 203 and functional circuit chipset paster mark 204 respectively by opto-electronic conversion array chip group 101 and functional circuit chipset 102 pasters and weld microcontroller chip 103 on circuit board 200 time, between opto-electronic conversion array chip group 101 and functional circuit chipset 102 pad separately, and between the pad of functional circuit chipset 102 and the gold plated pads 207 of circuit board 200, be to adopt the mode of spun gold welding to realize to be electrically connected, microcontroller chip 103 is to adopt reflow soldering process to be directly welded on circuit board 200.And microcontroller chip 103 is the duties for controlling and detect opto-electronic conversion array chip group 101 herein.
In one embodiment, above-mentioned opto-electronic conversion array chip group 101 comprises point two groups of opto-electronic conversion chip arrays that are arranged, every group comprises (two groups totally 8 of 4 opto-electronic conversion chips, be 8 channels designs of corresponding QFSP), and in every group of opto-electronic conversion chip array, the centre distance between adjacent opto-electronic conversion chip is 250 microns.Further, corresponding to the spacing of opto-electronic conversion chip herein, centre distance in the 3rd array lenticule 432 microlens array separately of the first included array lenticule 411 of above-mentioned array lens assembly 41 and the second array lenticule 412 and array lens frame 43 between contiguous microlens, and the centre distance between adjacent fiber in 12 root multimode fibers 421 of fiber array web member 42, all unanimously remain above-mentioned 250 microns, thereby ensure to form complete light-path.In addition, can find out from the above, opto-electronic conversion array chip group 101 is only provided with 8 opto-electronic conversion chips, but first, second, third array lenticule 411-413 and multimode optical fiber 421 are provided with 12 tunnels, this is that what in reality, use is and above-mentioned two groups of 4 opto-electronic conversion chips peripheral 8 Reuter's mirror and optical fiber one to one because 4 tunnels in the middle of these lens and optical fiber are set as leaving unused.Particularly, in one embodiment, above-mentioned opto-electronic conversion array chip group 101 is for example the photoelectric detector chip of two group of 1 × 4 array or the vertical cavity surface emitting laser chip of two group of 1 × 4 array.
In one embodiment, above-mentioned circuit board 300 adopts six stacked interposed structures, and the top layer of this six stacked interposed structure and bottom all adopt Rogers (Rogers) material.
In conjunction with the detailed description of multimode QSFP parallel light transceiving module encapsulating structure embodiment above, below the process flow that will realize this embodiment encapsulating structure specifically described.In one embodiment, the implementation procedure of multimode QSFP parallel light transceiving module encapsulating structure of the present invention specifically comprises the step of five parts such as paster, routing, optical module assembling, coupling and assembling.
The execution step of paster process is as follows: first on circuit board 200, weld microcontroller chip 103, and paste respectively opto-electronic conversion array chip group 101 and functional circuit chipset 102 on the position of opto-electronic conversion array chip group paster mark 203 and functional circuit chipset paster mark 204; Then according to pad sticking position marks 205, pad 300 is sticked on circuit board 200, especially note making two the first array positioning round orifice 202 on circuit board 200 and two the second array positioning round orifice 301 on pad 300 overlapping and ensure justified margin.
The execution step of routing process is as follows: adopt the mode of spun gold welding coupling together between opto-electronic conversion array chip group 101 and functional circuit chipset 102 pad separately and between the pad of functional circuit chipset 102 and the gold plated pads 207 of circuit board 200, make in the situation that circuit board 200 is switched on work, opto-electronic conversion array chip group 101 keeps normal operating conditions.
The execution step of optical module assembling process is as follows: first the lens mount positioning cylinder 433 on array lens frame 43 is inserted respectively in two lens mount positioning round orifice 422 on fiber array web member 42, and put a small amount of glue between the end face being connected with fiber array web member 42 at array lens frame 43, make the two in conjunction with firm; Then the web member positioning cylinder 423 on fiber array web member 42 is inserted respectively in two web member positioning round orifice 416 on array lens assembly 41, and put a small amount of glue between the end face being connected with array lens assembly 41 at fiber array web member 42, make the two in conjunction with firm; Then keep the outshot 443 of adapter 44 in the joints of optical fibre upwards, gluing in the bead 441 of adapter 44 in the joints of optical fibre, adapter 44 in the joints of optical fibre is alignd with array lens frame 43, adapter in the joints of optical fibre 44 and array lens frame 43 are bonded together; Finally a female MPO fan-out fibre ribbon is inserted closely in the joints of optical fibre in adapter 44, and fibre ribbon front end is provided with positioning round orifice, thereby is used for matching with the fibre ribbon positioning cylinder 434 on array lens frame 43.
The execution step of coupling process is as follows: the optical module assembling is placed on the pad 300 on circuit board 200, and the array positioning cylinder 415 on array lens assembly 41 is run through respectively to two the second array positioning round orifice 301 that insert on pad 300, and insert in two the first array positioning round orifice 202 of circuit board 200; The golden finger electrode tip 206 of circuit board 200 is inserted to SMT (the Surface Mount Technology of testing circuit board, surface mounting technology) electric connector, controlling microcontroller chip 103 normally works opto-electronic conversion array chip group 101, the fan out of the corresponding MPO fibre ribbon of light-path end of Si road transmitting terminal connects light power meter with monitoring luminous power, and the fan out of the corresponding MPO fibre ribbon of light-path end of Yu tetra-road receiving ends connects multimode light source, monitoring feedback light size of current correspondingly; In coupling process, the position of the optical module assembling is finely tuned on limit, the size of limit monitoring luminous power and photocurrent, and the optical module at the two during all in maximal value and the relative position of circuit board 200 are optimum position; Keep this optimum position, the gap location point glue between fiber array web member 42, pad 300 and circuit board 200 threes is fixed up the relative position between optical module and circuit board 200; In addition, in by the space between two the second array positioning round orifice 301 on the array positioning cylinder 415 on array lens assembly 41 and pad 300 and two the first array positioning round orifice 202 of circuit board 200, put glue and fix, the relative position between optical module and circuit board 200 that further fixed coupling is good.
The execution step of assembling process is as follows: first pull out the MPO fibre ribbon being connected with array lens frame 43, then the circuit board of bonding optical module 200 is placed on the base 51 of shell, the part that attention will combine the bead 441 of adapter 44 in array lens frame 43 and the joints of optical fibre is stuck in the slot 511 of base 51; Then screw in the circuit board fixed orifice 201 on circuit board 200 with screw, circuit board 200 and base 51 are fixed up; Finally by the section aligned of bead 441 combinations of adapter 44 in the slot of shell upper cover 52 and array lens frame 43 and the joints of optical fibre, thereby then insert the base 51 of working good and the side of upper cover 52 is connected and fixed the two with interpolation frame 53.Just completed thus the assembling process of the present embodiment multimode QSFP parallel light transceiving module encapsulating structure.
In sum, the encapsulating structure of the multimode QSFP parallel light transceiving module that the embodiment of the present invention provides, realize being connected between each optical module and between optical module and circuit board by supporting positioning round orifice and positioning cylinder, thereby the flexible while being convenient to the active coupling of light path, ensure the light path reasonable conversion between optical module, thereby improve the efficiency of light path coupling, increase the transmission range of data-signal; In addition, in array lens frame and the joints of optical fibre, the end face of adapter fits tightly, and card is set between shell base and the draw-in groove of upper cover simultaneously, thereby avoids causing because the plug of external fiber band produces stress to optical module the deviation that is coupled.
Although described the present invention with reference to several exemplary embodiments, should be appreciated that term used is explanation and exemplary and nonrestrictive term.Because can specifically implementing in a variety of forms, the present invention do not depart from spirit or the essence of invention, so be to be understood that, above-described embodiment is not limited to any aforesaid details, and explain widely in the spirit and scope that should limit in the claim of enclosing, therefore fall into whole variations in claim or its equivalent scope and remodeling and all should be the claim of enclosing and contain.
Claims (8)
1. an encapsulating structure for multimode QSFP parallel light transceiving module, comprises chipset, optical module, circuit board, pad and shell, wherein,
Described chipset comprises opto-electronic conversion array chip group, functional circuit chipset and microcontroller chip;
Described circuit board is provided with circuit board fixed orifice and the first array positioning round orifice, also be provided with opto-electronic conversion array chip group paster mark, functional circuit chipset paster mark and pad sticking position marks to be respectively used to bonding described opto-electronic conversion array chip group, described functional circuit chipset and described pad, on described circuit board, be also welded with described microcontroller chip;
Described pad is provided with the second array positioning round orifice;
Described optical module comprises adapter in array lens assembly, fiber array web member, array lens frame and the joints of optical fibre that are connected successively;
Described array lens assembly comprises orthogonal the first array lenticule and the second array lenticule, and be provided with array positioning cylinder on end face corresponding to described the first array lenticule, on other end corresponding to described the second array lenticule, be provided with web member positioning round orifice;
Described fiber array web member longitudinally connects and is provided with many root multimode fibers, and is respectively arranged with web member positioning cylinder and lens mount positioning round orifice on two end faces corresponding with described multimode optical fiber two ends;
Described array lens frame is provided with rectangular opening, is inlaid with the 3rd array lenticule in described rectangular opening, is respectively arranged with lens mount positioning cylinder and fibre ribbon positioning cylinder on the both sides end face of described array lens frame;
In the described joints of optical fibre adapter have for the bead of described array lens frame laminating, in the described joints of optical fibre, adapter is also provided with the groove for inserting for fibre ribbon;
Described array lens frame is by described lens mount positioning cylinder being inserted to described lens mount positioning round orifice and being connected with described fiber array web member, and described fiber array web member is by inserting described web member positioning round orifice by described web member positioning cylinder and being connected with described array lens assembly; Adapter is by making the justified margin of described bead and described array lens frame bonding and be connected with described array lens frame in the described joints of optical fibre;
Described optical module is fixed to described circuit board by the array positioning cylinder of described array lens assembly being passed to the second array positioning round orifice of described pad and inserting described the first array positioning round orifice;
Described shell comprises base, upper cover and interpolation frame; Described circuit board is fixed on described base by described circuit board fixed orifice; Described base and described on be covered with corresponding slot, for adapter card in described array lens frame and the described joints of optical fibre is located between described base and described upper cover; Described interpolation frame connects and fixes described base and described upper cover.
2. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 1, wherein, the distance between described the first array lenticule and described the second array lenticule and the each self-corresponding end face in described array lens assembly equals respectively described the first array lenticule and the lenticular focal length of described the second array; Distance between the corresponding end face of the described fiber array web member that described the 3rd array lenticule in described array lens frame and described array lens frame are connected equals the lenticular focal length of described the 3rd array.
3. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 1, wherein, between the gold plated pads between the pad of described opto-electronic conversion array chip group and the pad of described functional circuit chipset and on pad and the described circuit board of described functional circuit chipset, all adopt spun gold welding to be electrically connected.
4. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 3, wherein, described opto-electronic conversion array chip group comprises two groups of opto-electronic conversion chip arrays, and in every group of opto-electronic conversion chip array, the centre distance between adjacent opto-electronic conversion chip is 250 microns.
5. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 1, wherein, when described optical module is fixed to described circuit board, described pad, between described fiber array web member and described circuit board, and is fixed by a glue between described circuit board and described pad and between described pad and described fiber array web member; And the space between the second array positioning round orifice of the array positioning cylinder of described array lens assembly and described pad and the first array positioning round orifice of described circuit board is also fixed by a glue.
6. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 1, wherein, the equal diameters of described the first array positioning round orifice and described the second array positioning round orifice, and be greater than the diameter of described array positioning cylinder.
7. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 1, wherein, described the first array lenticule, the second array lenticule and the 3rd array lenticule are 1 × 12 array lenticule, and described fiber array web member is provided with 12 described multimode optical fibers.
8. the encapsulating structure of multimode QSFP parallel light transceiving module as claimed in claim 7, wherein, the centre distance between adjacent described multimode optical fiber is 250 microns, and milled processed is all passed through at every described multimode optical fiber two ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210009552.XA CN102520494B (en) | 2012-01-13 | 2012-01-13 | Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210009552.XA CN102520494B (en) | 2012-01-13 | 2012-01-13 | Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102520494A CN102520494A (en) | 2012-06-27 |
| CN102520494B true CN102520494B (en) | 2014-11-05 |
Family
ID=46291474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210009552.XA Active CN102520494B (en) | 2012-01-13 | 2012-01-13 | Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102520494B (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103676041B (en) * | 2012-09-26 | 2016-03-02 | 台达电子工业股份有限公司 | Optical communication module and coupling light assembling method thereof |
| CN103698864B (en) * | 2012-09-27 | 2016-12-07 | 鸿富锦精密工业（深圳）有限公司 | The joints of optical fibre |
| CN104280828B (en) * | 2013-04-08 | 2019-01-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN104142540B (en) * | 2013-05-08 | 2018-06-19 | 广州市海奕电子科技有限公司 | Optical communication module |
| CN104834063A (en) * | 2014-06-16 | 2015-08-12 | 硅光电科技股份有限公司 | Optical-coupling packaging part with locking device, and method |
| CN104459906A (en) * | 2014-10-21 | 2015-03-25 | 华天科技（昆山）电子有限公司 | Passive alignment structure for active optical cable optical system and processing process |
| CN104411092B (en) * | 2014-10-27 | 2017-09-15 | 苏州米达思精密电子有限公司 | A kind of production method with marking reinforcing chip |
| CN104865653B (en) * | 2015-06-12 | 2016-06-08 | 烽火通信科技股份有限公司 | For the optical module vertical coupled with optoelectronic transceiver array and manufacture method |
| CN105403962B (en) * | 2015-12-08 | 2017-09-12 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| US9746625B2 (en) | 2015-12-04 | 2017-08-29 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| CN105785524B (en) * | 2016-03-31 | 2018-05-08 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN111736278A (en) | 2016-04-28 | 2020-10-02 | 苏州旭创科技有限公司 | Optical module |
| US10502908B2 (en) * | 2017-03-13 | 2019-12-10 | Mellanox Technologies, Ltd. | Long-reach active optical cable |
| CN107861199A (en) * | 2017-11-24 | 2018-03-30 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN108051893B (en) * | 2017-12-11 | 2020-01-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN110501789A (en) * | 2019-08-30 | 2019-11-26 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN112987193A (en) * | 2019-12-13 | 2021-06-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112230350B (en) * | 2020-10-23 | 2022-04-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112379490B (en) * | 2020-11-16 | 2022-03-29 | 河北华美光电子有限公司 | Optical module |
| CN113805289B (en) * | 2021-09-16 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093341A (en) * | 2021-03-24 | 2021-07-09 | 中航光电科技股份有限公司 | Wireless light turns to contact and wireless light structure of turning perpendicularly |
| CN113093342A (en) * | 2021-03-24 | 2021-07-09 | 中航光电科技股份有限公司 | Light steering structure and light steering system |
| CN113238330B (en) * | 2021-05-10 | 2023-04-28 | 杭州耀芯科技有限公司 | Ultrathin plate-to-plate photoelectric conversion device |
| CN113835169B (en) * | 2021-11-26 | 2022-02-25 | 长芯盛（武汉）科技有限公司 | Active photoelectric module, method of manufacturing the same, photoelectric conversion unit, and method of packaging the same |
| CN114244442B (en) * | 2021-12-10 | 2023-04-14 | 武汉电信器件有限公司 | Q-packaged high-speed parallel optical interconnection module and implementation method |
| CN114421245A (en) * | 2021-12-28 | 2022-04-29 | 东莞福可喜玛通讯科技有限公司 | HDMI photoelectric hybrid connector |
| CN114660735B (en) * | 2022-03-14 | 2024-04-16 | 深圳市埃尔法光电科技有限公司 | Threading equipment and threading method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101788701A (en) * | 2009-01-22 | 2010-07-28 | 河北华美光电子有限公司 | Parallel optical transceiver used for data transmission |
| CN102169216A (en) * | 2011-05-18 | 2011-08-31 | 苏州旭创科技有限公司 | Parallel light transceiver component for broadband high-speed transmission |
| CN102183829A (en) * | 2011-05-03 | 2011-09-14 | 苏州旭创科技有限公司 | Light receiving and transmitting assembly for broadband parallel optics |
-
2012
- 2012-01-13 CN CN201210009552.XA patent/CN102520494B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101788701A (en) * | 2009-01-22 | 2010-07-28 | 河北华美光电子有限公司 | Parallel optical transceiver used for data transmission |
| CN102183829A (en) * | 2011-05-03 | 2011-09-14 | 苏州旭创科技有限公司 | Light receiving and transmitting assembly for broadband parallel optics |
| CN102169216A (en) * | 2011-05-18 | 2011-08-31 | 苏州旭创科技有限公司 | Parallel light transceiver component for broadband high-speed transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102520494A (en) | 2012-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102520494B (en) | Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module | |
| US10605999B2 (en) | Package structure for photonic transceiving device | |
| CN107479150B (en) | Four-channel coarse wavelength division multiplexing QSFP optical module | |
| US9671580B1 (en) | Photonic transceiving device package structure | |
| EP2790048B1 (en) | Optical module | |
| WO2019184100A1 (en) | Optical module | |
| US9588307B2 (en) | Parallel optical transceiver with top and bottom lenses | |
| TWM484713U (en) | Replaceable type light-emitting module and optical transceiver equipped with replaceable type light-emitting module | |
| CN105278056A (en) | Wavelength division multiplexing and de-multiplexing optical assembly | |
| CN203786345U (en) | Light emitter packaging structure | |
| CN106291836A (en) | Hybrid integrated optical sub-module | |
| US9400359B1 (en) | Optical transmitter package structure | |
| CN105334586A (en) | Optical transceiver | |
| CN110989099A (en) | Optical module | |
| CN115421259A (en) | Optical module | |
| CN115079356A (en) | Optical module | |
| CN214375420U (en) | Light emission component based on AWG chip and optical module | |
| JP5277389B2 (en) | Optical module | |
| JP2004085756A (en) | Optical transmission/reception module | |
| US20130016981A1 (en) | Photoelectrci coversion system with optical transceive module | |
| TWI502238B (en) | Optical engine | |
| CN213091948U (en) | Optical packaging structure for light engine and light engine | |
| TW201608293A (en) | Bidirectional optical sub-assembly | |
| CN114994839A (en) | Optical module | |
| CN114879324A (en) | Optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |