CN105846309A - Photoelectric device - Google Patents
Photoelectric device Download PDFInfo
- Publication number
- CN105846309A CN105846309A CN201610345488.0A CN201610345488A CN105846309A CN 105846309 A CN105846309 A CN 105846309A CN 201610345488 A CN201610345488 A CN 201610345488A CN 105846309 A CN105846309 A CN 105846309A
- Authority
- CN
- China
- Prior art keywords
- optical assembly
- circuit board
- photoelectric device
- flexible pcb
- laser diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Provided in the invention is a photoelectric device comprising circuit boards, an optical assembly in a butterfly-shaped packaging mode, and a connector. The circuit boards include a rigid circuit board and a flexible circuit board connected with the rigid circuit board; all pins of the optical assembly are connected to the flexible circuit board; and the connector connected to one circuit board is used for outputting signals of all pins of the optical assembly. The flexible circuit board has a U-shaped accommodation space; the optical assembly is arranged inside the U-shaped accommodation space; all pins of the optical assembly are welded to the two sides of the U-shaped accommodation space; and the connector is connected to the rigid circuit board or the flexible circuit board. In addition, the optical assembly also includes a function circuit that is arranged on the rigid circuit board and is connected with the optical assembly. The optical assembly is a laser diode or a laser. According to the invention, because the optical assembly like a laser diode is welded to the flexible circuit board, the flexible circuit board has a good bending performance, so that pin aging or fracture caused by frequent plugging of the optical assembly can be avoided and installation and replacement of the optical assembly can be realized conveniently.
Description
Technical field
The present invention relates to optical technical field, be specially a kind of photoelectric device.
Background technology
Laser diode, as a kind of precise light electrical part, generally has fixing encapsulation, to provide high interchangeability.Butterfly encapsulation is
The common encapsulation of miniwatt laser diode, has 14 pins, and its structure chart is as shown in Figure 1.Laser due to butterfly encapsulation
Diode lower surface needs to be in close contact with radiator structure, and heat during for distributing laser diode work is the most specifically installed
Implementation process in can meet difficulty.Under normal circumstances, the laser diode of this butterfly encapsulation has grafting and welding 2 kinds to install hands
Section.Grafting, is by various connectors, laser diode is installed pin and is connected with pcb board.Advantage is to facilitate installing/dismounting,
Shortcoming is that reliability is general, and the pin of laser diode is softer, pliable.Often plug easily causes that pin is aging even to fracture.
Welding is directly to be welded on pcb board by laser diode, and advantage is highly reliable, and shortcoming is dismounting inconvenience, to subsequent installation also
Certain impact can be produced.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of photoelectric device, is used for solving existing skill
In art, laser diode is connected the easily bending or the problem of dismounting inconvenience produced with PCB.
For achieving the above object and other relevant purposes, the present invention provides a kind of photoelectric device, and described photoelectric device includes: electricity
Road plate, including rigid circuit board and with the described rigid circuit board flexible PCB that is connected of one；The optical assembly of butterfly encapsulation, institute
The each pin stating optical assembly is connected on described flexible PCB；Adapter, is connected on described circuit board, is used for exporting described
Each leg signal of optical assembly.
In one embodiment of the invention, described flexible PCB has a U-shaped receiving space, and described optical assembly is placed in described U
Type accommodates in space, and each pin of described optical assembly is connected to the dual-side in described U-shaped receiving space.
In one embodiment of the invention, each pin of described optical assembly is welded on described flexible PCB.
In one embodiment of the invention, described adapter is connected on described rigid circuit board.
In one embodiment of the invention, described adapter is connected on described flexible PCB.
In one embodiment of the invention, described photoelectric device also include being arranged on described rigid circuit board and with described optical assembly
The functional circuit connected.
In one embodiment of the invention, described functional circuit is drive circuit, sample circuit, the one in power-sensing circuit
Or several combination.
In one embodiment of the invention, described photoelectric device also includes being connected to carry out described optical assembly with described optical assembly
The radiator of heat radiation.
In one embodiment of the invention, described optical assembly is butterfly encapsulation.
In one embodiment of the invention, described optical assembly is laser diode or laser instrument.
As it has been described above, a kind of photoelectric device of the present invention, have the advantages that
1, the present invention is by being welded on optical assembly (such as laser diode) on flexible PCB, and flexible PCB bending property is good,
Optical assembly can be avoided aging and fracture because often plugging the pin caused, facilitate installation and the replacing of optical assembly.
2, in the present invention, flexible PCB has a U-shaped receiving space, can facilitate external equipments such as optical assembly and radiators
Fixing.
3, present configuration is simple, controls flexibility and reliability, economical and practical, has wide applicability.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of the laser diode of butterfly encapsulation.
Fig. 2 is shown as the structural representation of a kind of photoelectric device of the present invention.
Element numbers explanation
1 photoelectric device
11 rigid circuit boards
12 flexible PCBs
13 optical assemblies
14 adapters
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by disclosed by this specification
Content understand other advantages and effect of the present invention easily.The present invention can also be added by the most different detailed description of the invention
To implement or application, the every details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention
Various modification or change is carried out under god.
The purpose of the present embodiment is to provide a kind of photoelectric device, is used for solving laser diode in prior art and is connected product with PCB
Raw easily bending or the problem of dismounting inconvenience.The principle of a kind of photoelectric device of the present embodiment described in detail below and embodiment party
Formula, makes those skilled in the art need not creative work and is i.e. appreciated that a kind of photoelectric device of the present embodiment.
The present embodiment provides a kind of photoelectric device, specifically, as in figure 2 it is shown, described photoelectric device 1 includes: circuit board, bag
Include rigid circuit board 11 and the flexible PCB 12 being connected with described rigid circuit board 11 one；The optical assembly 13 of butterfly encapsulation,
Each pin of described optical assembly 13 is connected on described flexible PCB 12；Adapter 14, is connected on described circuit board, uses
In each leg signal exporting described optical assembly 13.
Hereinafter the photoelectric device 1 in the present embodiment is described in detail.
In the present embodiment, described circuit board includes rigid circuit board 11 and the flexibility being connected with described rigid circuit board 11 one
Circuit board 12.Described rigid circuit board 11 and described flexible PCB 12 can when making circuit board integral production so that circuit
Plate one end is rigid circuit board 11, and one end is flexible PCB 12.Flexible PCB 12 is the electricity that a kind of special material makes
Road plate, its thickness is thin, lightweight, and bending property is good, can put electronic device and be attached simultaneously on flexible PCB 12.
In the present embodiment, described optical assembly 13 is butterfly encapsulation, and described optical assembly 13 includes but not limited to laser diode
Or laser instrument.Wherein, each pin of the optical assembly 13 of butterfly encapsulation is connected on described flexible PCB 12.Flexible PCB
12 bending property good, can avoid optical assembly 13 because of often plug the pin caused aging with fracture, facilitate the installation of optical assembly 13
And replacing.
Specifically, in the present embodiment, described flexible PCB 12 has a U-shaped receiving space, the most described flexible PCB
12 is a U-shaped flexible PCB, and described optical assembly 13 is placed in described U-shaped receiving space, respectively drawing of described optical assembly 13
Foot is connected to the dual-side in described U-shaped receiving space.Owing to the flexible PCB 12 in the present embodiment has a U-shaped receiving sky
Between, can facilitate and optical assembly 13 is fixed with external equipments such as radiators.
Further, in the present embodiment, each pin of described optical assembly 13 is welded on described flexible PCB 12, makes
Obtain optical assembly 13 more reliable with the connection of described flexible PCB 12.Such as, flexible PCB 12 uses welding means and laser
Diode is connected, and the flexible portion of flexible PCB 12 can conveniently finely tune fixed position.
In the present embodiment, described adapter 14 is connected on described circuit board, for exporting each pin of described optical assembly 13
Signal.Wherein, described adapter 14 is connected on described rigid circuit board 11 or is connected on described flexible PCB 12.
In the present embodiment, described adapter 14 is connected on rigid circuit board 11, convenient plug and replacing.Use special can
The adapter 14 of plug, can avoid the infringement that laser diode causes because of Rewelding or plug.
Additionally, in the present embodiment, described photoelectric device 1 also include being arranged on described rigid circuit board 11 and with described light group
The functional circuit that part 13 connects, described functional circuit is drive circuit, sample circuit, one or more in power-sensing circuit
Combination.
Such as, the peripheral circuit of laser diode, such as temperature sampling ADC, power detection ADC etc. may be mounted at rigid electric
On road plate 11.
In the present embodiment, described photoelectric device 1 also includes being connected to carry out described optical assembly 13 with described optical assembly 13
The radiator of heat radiation.Such as, described radiator is installed on laser diode by logical screw.
The present embodiment illustrates as a example by described optical assembly 13 is as laser diode the combination installation process of photoelectric device 1.
During installation, adapter 14 can be integrally connected on described rigid circuit board 11, then by laser two when making circuit board
The mode of the most effective welding is arranged on flexible PCB 12, and utilizes screw to fix with radiator laser diode, finally
Fixing rigid circuit board 11.The key benefit using flexible PCB 12 to connect butterfly encapsulation laser diode is reliable and clever
Live.Use special pluggable adapter 14, the infringement that laser diode causes because of Rewelding or plug can be avoided,
Using U-shaped flexible PCB 12, can facilitate tightens up a screw laser diode from top is fixed.
In sum, the present invention is by being welded on optical assembly (such as laser diode) on flexible PCB, flexible PCB
Bending property good, can avoid optical assembly because of often plug the pin caused aging with fracture, facilitate installation and the replacing of optical assembly；
In the present invention, flexible PCB has a U-shaped receiving space, can facilitate and be fixed with external equipments such as radiators by optical assembly；This
Inventive structure is simple, controls flexibility and reliability, economical and practical, has wide applicability.So, the present invention effectively overcomes existing
The various shortcoming in technology is had to have high industrial utilization.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as
All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc.
Effect is modified or changes, and must be contained by the claim of the present invention.
Claims (10)
1. a photoelectric device, it is characterised in that: described photoelectric device includes:
Circuit board, including rigid circuit board and with the described rigid circuit board flexible PCB that is connected of one；
Optical assembly, each pin of described optical assembly is connected on described flexible PCB；
Adapter, is connected on described circuit board, for exporting each leg signal of described optical assembly.
Photoelectric device the most according to claim 1, it is characterised in that: described flexible PCB has a U-shaped receiving space,
Described optical assembly is placed in described U-shaped receiving space, and each pin of described optical assembly is connected to described U-shaped receiving space
Dual-side.
Photoelectric device the most according to claim 1 and 2, it is characterised in that: each pin of described optical assembly is welded in described flexibility
On circuit board.
Photoelectric device the most according to claim 1, it is characterised in that: described adapter is connected on described rigid circuit board.
Photoelectric device the most according to claim 1, it is characterised in that: described adapter is connected on described flexible PCB.
Photoelectric device the most according to claim 1 and 2, it is characterised in that: described photoelectric device also includes being arranged at described rigidity
The functional circuit being connected on circuit board and with described optical assembly.
Photoelectric device the most according to claim 6, it is characterised in that: described functional circuit is drive circuit, sample circuit, merit
One or more combination in rate testing circuit.
Photoelectric device the most according to claim 1, it is characterised in that: described photoelectric device also includes being connected use with described optical assembly
In the radiator that described optical assembly is dispelled the heat.
Photoelectric device the most according to claim 1, it is characterised in that: described optical assembly is butterfly encapsulation.
Photoelectric device the most according to claim 1, it is characterised in that: described optical assembly is laser diode or laser instrument.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345488.0A CN105846309A (en) | 2016-05-23 | 2016-05-23 | Photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610345488.0A CN105846309A (en) | 2016-05-23 | 2016-05-23 | Photoelectric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105846309A true CN105846309A (en) | 2016-08-10 |
Family
ID=56594119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610345488.0A Pending CN105846309A (en) | 2016-05-23 | 2016-05-23 | Photoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105846309A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919596A (en) * | 2018-03-16 | 2018-11-30 | 青岛海信激光显示股份有限公司 | A kind of light source module group and laser projection |
| CN111596515A (en) * | 2019-02-20 | 2020-08-28 | 青岛海信激光显示股份有限公司 | Laser light source and laser projector |
| EP3716418A4 (en) * | 2019-01-10 | 2021-12-08 | Hisense Laser Display Co., Ltd. | Laser light source and laser projecting device |
| US11570411B2 (en) | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130064506A1 (en) * | 2011-09-12 | 2013-03-14 | Tyco Electronics Corporation | Flexible lensed optical interconnect device for signal distribution |
| CN104503043A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN204405902U (en) * | 2014-12-31 | 2015-06-17 | 苏州旭创科技有限公司 | Optical module |
| CN105093439A (en) * | 2014-05-21 | 2015-11-25 | 住友电气工业株式会社 | Optical transceiver and method to assemble the same |
| CN204945584U (en) * | 2015-09-02 | 2016-01-06 | 深圳市百乐奇科技有限公司 | Lcd module |
| CN205790931U (en) * | 2016-05-23 | 2016-12-07 | 国神光电科技（上海）有限公司 | A kind of photoelectric device |
-
2016
- 2016-05-23 CN CN201610345488.0A patent/CN105846309A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130064506A1 (en) * | 2011-09-12 | 2013-03-14 | Tyco Electronics Corporation | Flexible lensed optical interconnect device for signal distribution |
| CN105093439A (en) * | 2014-05-21 | 2015-11-25 | 住友电气工业株式会社 | Optical transceiver and method to assemble the same |
| CN104503043A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Multi-path parallel optical assembly |
| CN204405902U (en) * | 2014-12-31 | 2015-06-17 | 苏州旭创科技有限公司 | Optical module |
| CN204945584U (en) * | 2015-09-02 | 2016-01-06 | 深圳市百乐奇科技有限公司 | Lcd module |
| CN205790931U (en) * | 2016-05-23 | 2016-12-07 | 国神光电科技（上海）有限公司 | A kind of photoelectric device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919596A (en) * | 2018-03-16 | 2018-11-30 | 青岛海信激光显示股份有限公司 | A kind of light source module group and laser projection |
| CN110277722A (en) * | 2018-03-16 | 2019-09-24 | 青岛海信激光显示股份有限公司 | A kind of package assembling of laser, light source module group and laser projection |
| EP3716418A4 (en) * | 2019-01-10 | 2021-12-08 | Hisense Laser Display Co., Ltd. | Laser light source and laser projecting device |
| US11570411B2 (en) | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| CN111596515A (en) * | 2019-02-20 | 2020-08-28 | 青岛海信激光显示股份有限公司 | Laser light source and laser projector |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160810 |