CN104486914B - Thick inconsistent thick copper circuit board of ectonexine copper and preparation method thereof - Google Patents
Thick inconsistent thick copper circuit board of ectonexine copper and preparation method thereof Download PDFInfo
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- CN104486914B CN104486914B CN201410648297.2A CN201410648297A CN104486914B CN 104486914 B CN104486914 B CN 104486914B CN 201410648297 A CN201410648297 A CN 201410648297A CN 104486914 B CN104486914 B CN 104486914B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention discloses a kind of preparation method of the thick inconsistent thick copper circuit board of ectonexine copper, belong to PCB printed wiring board technical fields.This method includes pressing plate, drilling and etching work procedure, wherein：In pressing plate process, from the prepreg of resin content >=65%, pressing plate is carried out using heat pressing process and cold-press process successively；And the hot pressing parameterses condition is：Pressure is 250 450PSI, and temperature is 175 220 DEG C, and vacuum is 0 68cm Hg, and the time is 90 150min；The cold-press process Parameter Conditions are：Pressure is 50 450PSI, and temperature is 165 220 DEG C, and the time is 130 230min.This method coordinates heating pressurized control, makes gummosis filling uniform by the design of laminar structure and lamination mode, and pressure distribution during pressing plate is uniform, and filling effect is good, bubble can be avoided to produce, and has and presses the characteristics of good.
Description
Technical field
The present invention relates to PCB printed wiring board technical fields, more particularly to a kind of thick inconsistent thick copper of ectonexine copper
Wiring board and preparation method thereof.
Background technology
Automotive electronics part, particularly grade high-power in engine power supply section, automobile central appliance power supply
High voltage part, often using the thick inconsistent thick copper circuit board (such as outer layer 6OZ, internal layer 12OZ thick copper circuit boards) of ectonexine copper
When, it is desirable to circuit has heat-resistant aging, the low temperature resistant contour reliability properties of circulation.
The pressing plate process of the thick inconsistent thick copper circuit board of above-mentioned ectonexine copper, it is to consolidate copper foil, half in routine techniques
Change pressing after the inner plating after piece and oxidation processes overlaps in order and multi-layer sheet is made.Resin in prepreg therein is half
Hardened material, can soften and flow after by high temperature, fill into the space between circuit, by one section softening and flow when
Between after, gradually can absorb energy again and polymerisation occurs so that its viscosity increases to hardening, and two layers of copper foil is glued together.
But because 12OZ thickness copper coin is laminated the added-time inside, need the space of potting resin big between circuit, and wiring board is
Outer layer 6OZ internal layer 12OZ thickness copper coins, thickness itself is big, and blocking effect is obvious, is unfavorable for filling, and the number of plies is more, and heat transfer is not
, easily there is bubble and press the problems such as bad.
The content of the invention
Based on this, the defects of it is an object of the invention to overcome prior art, there is provided a kind of ectonexine copper is thick inconsistent
Thick copper circuit board and preparation method thereof, this method coordinate heating pressurized control by the design of laminar structure and lamination mode,
Make gummosis filling uniformly, pressure distribution is uniform.The wiring board being prepared using this method, filling effect is good, presses good nothing
Bubble.
To achieve the above object, the present invention takes following technical scheme：
A kind of preparation method of the thick inconsistent thick copper circuit board of ectonexine copper, including pressing plate, drilling and etching work procedure, its
In：
In pressing plate process, from the prepreg of resin content >=65%, entered successively using heat pressing process and cold-press process
Row pressing plate；
The hot pressing parameterses condition is：Pressure is 250-450PSI, and temperature is 175-220 DEG C, vacuum 0-
68cm Hg, time 90-150min；
The cold-press process Parameter Conditions are：Pressure is 50-450PSI, and temperature is 165-220 DEG C, time 130-
230min。
The present inventor passes through numerous studies, it is found that the technological parameter of pressing plate is very big to pressing plate influential effect, improper use
Pressing plate parameter the defects of easily producing bad bubble, pressing plate, stria：It is substandard product that wherein bubble, pressing plate are bad, stria
The peel strength deficiency of outer-layer circuit may be caused, serious stria makes to produce drilling burr in drilling operating.
On the basis of the studies above, preparation method of the invention, using the higher semi-solid preparation of resin content, tied by being laminated
The design of structure and lamination mode, coordinate heating pressurized control, make gummosis filling uniform, pressure distribution during pressing plate is uniform, filling
Effect is good, bubble can be avoided to produce, and has and presses the characteristics of good.
In one of the embodiments, in the heat pressing process, pressure is set as 250-450PSI, retention time 90-
150min；
In the cold-press process, pressure is according to following change of program：
1st program, pressure are set as 50-100PSI, retention time 2-5min；
2nd program, pressure are set as 150-250PSI, retention time 5-25min；
3rd program, pressure are set as 250-450PSI, retention time 120-200min.
In above-mentioned one of embodiment, in the heat pressing process, pressure is set as 300-400PSI, retention time
For 105-130min；
In the cold-press process, pressure is according to following change of program：
1st program, pressure are set as 60-90PSI, retention time 2-5min；
2nd program, pressure are set as 175-225PSI, retention time 10-20min；
3rd program, pressure are set as 300-400PSI, retention time 140-180min.
In one of the embodiments, in the heat pressing process, temperature is according to following change of program：
1st program, temperature are set as 175-215 DEG C, retention time 30-70min；
2nd program, temperature are set as 180-220 DEG C, retention time 40-80min；
In the cold-press process, temperature is according to following change of program：
1st program, temperature are set as 170-210 DEG C, retention time 10-40min；
2nd program, temperature are set as 180-220 DEG C, retention time 40-80min；
3rd program, temperature are set as 170-210 DEG C, retention time 5-25min；
4th program, temperature are set as 165-205 DEG C, retention time 5-25min.
In above-mentioned one of embodiment, in the heat pressing process, temperature is according to following change of program：
1st program, temperature are set as 185-205 DEG C, retention time 40-60min；
2nd program, temperature are set as 190-210 DEG C, retention time 50-70min；
In the cold-press process, temperature is according to following change of program：
1st program, temperature are set as 180-200 DEG C, retention time 15-30min；
2nd program, temperature are set as 190-210 DEG C, retention time 50-70min；
3rd program, temperature are set as 180-200 DEG C, retention time 10-20min；
4th program, temperature are set as 175-195 DEG C, retention time 10-20min.
In one of the embodiments, in the drilling operating, first plate 4-6 hours baked Xia 140 ± 20 DEG C, then bored
Hole.First enter the baked plate of row to dual platen before drilling, significantly improve plate it is curved/Qu Wenti, can be curved by the plate of dual platen/bent
Control is (1.18-1.376mm) in certain scope, to ensure drilling effect.And roughness is less than or equal in control hole
0.8mil, more preferably drilling effect can be obtained.
In above-mentioned one of embodiment, in the drilling operating, according to pore size, bored according to parameters described below
Hole：
Bore diameter is 0.30mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 28-32 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.35mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 37-41 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.40mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 46-50 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.45mm, and it is thousand revs/min of 88-92 to bore nozzle drilling speed, and it is 52-56 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.50mm, and it is thousand revs/min of 83-87 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.55mm, and it is thousand revs/min of 76-80 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.65mm, and it is thousand revs/min of 68-72 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 0.95mm, and it is thousand revs/min of 46-50 to bore nozzle drilling speed, and it is 49-53 inch/minutes to bore nozzle feed speed,
It is 900-1100 inch/minutes to bore nozzle withdrawing speed；
Bore diameter is 1.00mm, and it is thousand revs/min of 44-48 to bore nozzle drilling speed, and it is 46-50 inch per minutes to bore nozzle feed speed
Clock, it is 900-1100 inch/minutes to bore nozzle withdrawing speed.
Using above-mentioned drilling parameter, the quality of drilling can be improved.
In one of the embodiments, in the etching work procedure, outer layer etch process conditions are：Cu2+Concentration be 150 ±
20g/L, temperature are 50 ± 3 DEG C, and total acidity is 2.8 ± 0.6N, and proportion is 1.30 ± 0.10, and etching speed is 1.6 ± 0.4m/
Min, etching number are 2 times, and overturn plate face once after each etching.The etch process used in routine techniques, when with
When 6OZ thick copper layers are etched, larger lateral erosion effect can be produced, the effective cross-section shape of circuit is influenceed, shows as etching factor
Too low situation, in addition occur can not eating away layers of copper completely situation, have a strong impact on quality requirements.And the etching that the present invention uses
Technique, outer layer etching factor is improved, reduce lateral erosion effect, line width/line gap is met design requirement, improve wiring board
Yields and quality.
In one of the embodiments, the preferred 65-71% of the resin content of the prepreg.Using the resin content
Prepreg, both can guarantee that the filling effect of pressing, and and can avoids excessive excessive glue from bringing bad influence.
In one of the embodiments, the internal layer copper thickness is 12OZ, and the outer layer copper thickness is 6OZ.Above-mentioned preparation method
It is the thick copper circuit board that 12OZ outer layer copper thickness is 6OZ particularly suitable for preparing internal layer copper thickness.
Invention additionally discloses a kind of preparation method of the thick inconsistent thick copper circuit board of above-mentioned ectonexine copper to be prepared
Wiring board.The wiring board has filling effect good, the advantages of pressing good bubble-free.
Compared with prior art, the invention has the advantages that：
A kind of preparation method of the thick inconsistent thick copper circuit board of ectonexine copper of the present invention, passes through laminar structure and lamination
The design of mode, coordinate heating pressurized control, make gummosis filling uniform, pressure distribution during pressing plate is uniform, and filling effect is good, energy
Enough avoid bubble from producing, have and press the characteristics of good.
Also led to the means such as baked plate, improve plate it is curved/Qu Wenti, and have adjusted drilling parameter, so as to ensure drilling effect,
Improve the quality problem in hole.
And etch process conditions are adjusted, improve outer layer etching factor, reduce lateral erosion effect, Jin Erti
The high yields and quality of wiring board.
Using the obtained wiring board of preparation method of the present invention, have filling effect good, the advantages of pressing good bubble-free.
Also there is the advantages of lateral erosion effect is small, and drilling quality is high.
Brief description of the drawings
Fig. 1 is that etching factor illustrates schematic diagram in experimental example.
Embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
In following examples：1mil is 25.4 μm, and 1OZ is 34.29 μm.
Embodiment 1
A kind of preparation method of the thick inconsistent thick copper circuit board (internal layer 12OZ, outer layer 6OZ thickness copper coin) of ectonexine copper, should
Wiring board uses four-layer structure, wherein first layer and the 4th sandwich circuit layer 6OZ thickness copper foils, and second and third layer line layer are used
12OZ thickness copper foils, thickness of slab 65-81mil.
The preparation method of the present embodiment includes pressing plate, drilling and etching work procedure, and other processes are conventionally prepared.Its
In：
(1) in pressing plate process, from 1080 prepregs that resin content is 68%, successively using heat pressing process and cold pressing
Technique carries out pressing plate；Specific process parameter is as shown in the table.
The sheeting process parameter setting of table 1.
In above-mentioned cold pressing process, the time of the 1/3-2/3 before cold pressing starts to terminate to temperature control (is in the present embodiment
Preceding 60min), cooling water is closed, the subsequent time opens 2/3 cooling water, last 5-15min (last 10min in the present embodiment)
Standard-sized sheet cooling water to temperature control terminates (common 110min in the present embodiment).
(2) in drilling operating, first baked plate 5 hours Xia 140 DEG C, then drilled.And in control hole roughness be less than or
Equal to 0.8mil, adjusting parameter is drilled with adapting to thick copper, shown in table specific as follows.
The bore process parameter setting of table 2.
(3) in etching work procedure, outer layer etch process conditions are：Cu2+Concentration is 135g/L, and temperature is 50 DEG C, and total acidity is
2.8N, proportion 1.185, etching speed are 1.6m/min, and etching number is 2 times, and overturn plate face one after each etching
It is secondary.
Wiring board A is prepared using the method for the present embodiment.
Embodiment 2
A kind of preparation method of the thick inconsistent thick copper circuit board (internal layer 12OZ, outer layer 6OZ thickness copper coin) of ectonexine copper,
The wiring board uses four-layer structure, wherein first layer and the 4th sandwich circuit layer 6OZ thickness copper foils, and second and third layer line layer are used
12OZ thickness copper foils, thickness of slab 65-81mil.
The preparation method of the present embodiment includes pressing plate, drilling and etching work procedure, and other processes are conventionally prepared.Its
In：
(1) in pressing plate process, from 1080 prepregs that resin content is 71%, successively using heat pressing process and cold pressing
Technique carries out pressing plate；Specific process parameter is as shown in the table.
The sheeting process parameter setting of table 3.
(2) in drilling operating, first baked plate 6 hours Xia 120 DEG C, then drilled.And in control hole roughness be less than or
It is as shown in the table equal to 0.8mil, drilling parameter.
The bore process parameter setting of table 4.
(3) in etching work procedure, outer layer etch process conditions are：Cu2+Concentration is 150g/L, and temperature is 48 DEG C, and total acidity is
2.2N, proportion are 1.185 ± 0.02, and etching speed is 1.2m/min, and etching number is 2 times, and are overturn after each etching
Plate face is once.
Wiring board B is prepared using the method for the present embodiment.
Embodiment 3
A kind of preparation method of the thick inconsistent thick copper circuit board (internal layer 12OZ, outer layer 6OZ thickness copper coin) of ectonexine copper, should
Wiring board uses four-layer structure, wherein first layer and the 4th sandwich circuit layer 6OZ thickness copper foils, and second and third layer line layer are used
12OZ thickness copper foils, thickness of slab 65-81mil.
The preparation method of the present embodiment includes pressing plate, drilling and etching work procedure, and other processes are conventionally prepared.Its
In：
(1) in pressing plate process, from 1080 prepregs that resin content is 65%, successively using heat pressing process and cold pressing
Technique carries out pressing plate；Specific process parameter is as shown in the table.
The sheeting process parameter setting of table 5.
(2) in drilling operating, first baked plate 4 hours Xia 160 DEG C, then drilled.And in control hole roughness be less than or
It is as shown in the table equal to 0.8mil, drilling parameter.
The bore process parameter setting of table 6.
(3) in etching work procedure, outer layer etch process conditions are：Cu2+Concentration is 120g/L, and temperature is 52 DEG C, and total acidity is
3.4N, proportion are 1.185 ± 0.02, and etching speed is 2.0m/min, and etching number is 2 times, and are overturn after each etching
Plate face is once.
Wiring board C is prepared using the method for the present embodiment.
Embodiment 4
A kind of preparation method of the thick inconsistent thick copper circuit board (internal layer 12OZ, outer layer 6OZ thickness copper coin) of ectonexine copper, should
Wiring board uses four-layer structure, wherein first layer and the 4th sandwich circuit layer 6OZ thickness copper foils, and second and third layer line layer are used
12OZ thickness copper foils, thickness of slab 65-81mil.
The preparation method of the present embodiment includes pressing plate, drilling and etching work procedure, and other processes are conventionally prepared.Its
In：
(1) in pressing plate process, from 1080 prepregs that resin content is 68%, successively using heat pressing process and cold pressing
Technique carries out pressing plate；Specific process parameter is as shown in the table.
The sheeting process parameter setting of table 7.
(2) drilling operating is same as Example 1.
(3) etching work procedure is same as Example 1.
Wiring board D is prepared using the method for the present embodiment.
Embodiment 5
A kind of preparation method of the thick inconsistent thick copper circuit board (internal layer 12OZ, outer layer 6OZ thickness copper coin) of ectonexine copper, should
Wiring board uses four-layer structure, wherein first layer and the 4th sandwich circuit layer 6OZ thickness copper foils, and second and third layer line layer are used
12OZ thickness copper foils, thickness of slab 65-81mil.
The preparation method of the present embodiment includes pressing plate, drilling and etching work procedure, and other processes are conventionally prepared.Its
In：
(1) in pressing plate process, from 1080 prepregs that resin content is 68%, successively using heat pressing process and cold pressing
Technique carries out pressing plate；Specific process parameter is as shown in the table.
The sheeting process parameter setting of table 8.
(2) drilling operating is same as Example 1.
(3) etching work procedure is same as Example 1.
Wiring board E is prepared using the method for the present embodiment.
Embodiment 6
The preparation method base of the preparation method and embodiment 1 of the thick inconsistent thick copper circuit board of the ectonexine copper of the present embodiment
This is identical, and difference is：
(2) the baked plates of Bu Yu Xian in drilling operating, are directly drilled, drilling parameter is as shown in the table.
The bore process parameter setting of table 9.
Wiring board F is prepared using the method for the present embodiment.
Embodiment 7
The preparation method base of the preparation method and embodiment 1 of the thick inconsistent thick copper circuit board of the ectonexine copper of the present embodiment
This is identical, and difference is：
(3) in etching work procedure, outer layer etch process conditions are：In etching work procedure, outer layer etch process conditions are：Cu2+It is dense
It is 52 DEG C, total acidity 3.4N to spend for 115g/L, temperature, and proportion is 1.185 ± 0.02, and etching speed is 0.8m/min, erosion
It is 1 time to carve number.
Wiring board G is prepared using the method for the present embodiment.
Comparative example 1
The preparation method of the preparation method and embodiment 1 of the thick inconsistent thick copper circuit board of the ectonexine copper of this comparative example
Essentially identical, difference is：The prepreg used is 1080 prepreg that resin content is 60%.
Wiring board H is prepared using the method for the present embodiment.
Experimental example Performance
The thick inconsistent thickness of ectonexine copper that above-described embodiment 1-7 and comparative example 1 preparation method are prepared below
Copper circuit board is tested, and investigates its properties.
First, effect detection：
1st, stria：Visual inspection, it is as a result as shown in the table.
The stria testing result of table 10.
| Wiring board is numbered | Testing result |
| A | Plate has slight stria by the gross, and drilling will not be caused to produce burr |
| B | Plate has slight stria by the gross, and drilling will not be caused to produce burr |
| C | Plate has slight stria by the gross, and drilling will not be caused to produce burr |
| D | The wiring board that there are about 6% has stria |
| E | The wiring board that there are about 5% has stria |
| H | Plate 100% has serious stria by the gross |
By the above results, it is known that wiring board A-C pressings effect is preferable, only slight stria, follow-up work is not influenceed
The making of skill.And wiring board D, E, though there is a small amount of wiring board to have stria, it is about 95% that it, which presses yields, available for producing
In.Wiring board H, because the prepreg resin content of use is relatively low, plate 100% has serious stria to obtained wiring board by the gross,
It cannot be used for producing.
2nd, the micro- sem observation of section is done：40 blocks of plates are respectively chosen in A-E, the wiring board of H batches respectively and do sections observation, are tied
Fruit is as shown in the table.
The section testing result of table 11.
| Wiring board is numbered | Testing result |
| A | The problems such as empty, pressing plate is bad is not found |
| B | The problems such as empty, pressing plate is bad is not found |
| C | The problems such as empty, pressing plate is bad is not found |
| D | The wiring board that there are about 5% has cavity |
| E | The wiring board that there are about 2.5% has cavity |
| H | Plate 100% has cavity by the gross |
By the above results, it is known that wiring board A-C pressings effect is preferable, cavity is not found, pressing plate is good.And line
Road plate D, E, though there is a small amount of wiring board to have cavity, it presses yields and is more than 95%, available in production.Wiring board H, due to
The prepreg resin content of use is relatively low, and plate 100% has cavity to obtained wiring board by the gross, it is impossible to be used in production
3rd, Thermal Stress is tested：40 blocks of plates are respectively chosen in A-E, the wiring board of H batches respectively, it is baked by 4 hours 155 DEG C
Plate processing, test board is put into 10S in 288 ± 5 DEG C of tin stove, is observed, as a result as shown in the table.
The Thermal Stress test result of table 12.
| Wiring board batch | Testing result |
| A | Observation is without plate bursting defect after placing cooling |
| B | Observation is without plate bursting defect after placing cooling |
| C | Observation is without plate bursting defect after placing cooling |
| D | There is plate bursting in the wiring board that there are about 5% |
| E | There is plate bursting in the wiring board that there are about 5% |
| H | There is plate bursting in plate 100% by the gross |
By the above results, it is known that wiring board A-C pressings effect is preferable, no plate bursting defect produces.And wiring board D,
E, though plate bursting occurs in the wiring board for having 5%, it is about 95% that it, which presses yields, available in production.Wiring board H, due to adopting
Prepreg resin content is relatively low, and plate bursting occurs to obtained wiring board in plate 100% by the gross, it is impossible to be used in production.
4th, thickness of slab detects：12 blocks of plates are respectively chosen in the wiring board of A-G batches respectively, onboard diverse location detection thickness of slab,
Full thickness of slab data are obtained, as shown in table 13, and calculate the maximin and average value of each batch thickness of slab, as shown in table 14.
The batch A of table 13. wiring board full inspection thickness of slab data
The thickness of slab testing result of table 14.
| Wiring board batch | Average value (mm) | Maximum (mm) | Minimum value (mm) | Yields (%) |
| A | 1.78 | 1.9 | 1.66 | 100% |
| B | 1.82 | 1.95 | 1.70 | 100% |
| C | 1.75 | 1.95 | 1.66 | 100% |
| D | 1.85 | 2.08 | 1.73 | 98% |
| E | 1.75 | 1.9 | 1.64 | 98% |
| H | 1.70 | 1.85 | 1.56 | 25.4% |
By the above results, it will be seen that wiring board A-C presses best results, all wiring boards meet the requirements.
And wiring board D, E, though having, 2% wiring board thickness of slab is exceeded, and it is about 98% that it, which presses yields, available in production.Circuit
Plate H, because the prepreg resin content of use is relatively low, obtained wiring board thickness distribution is uniform and requirement up to specification.
2nd, line width, line gap situation
10 pieces are extracted in every batch of wiring board at random, line width/line gap and etching factor are taken a sample test using optical electron microscope
Data.
The line width of table 15., line gap situation
Note：60.63 ± 8mil of linewidth requirements, line gap require that 13.78 ± 1mil is qualified.
In from the above, it will be seen that being etched using 1-3 of embodiment of the present invention method, line width/line gap meets
Design requirement.Without the wiring board G using preferred outer layer etching condition, its part line width and line gap do not meet design requirement.
Key index for weighing etch capabilities is etching factor F=V/X, as shown in fig.1, wherein plate 1 is upper
It is covered with the base material of copper coin.Layers of copper 2 is provided with, the surface of layers of copper 2 is provided with corrosion preventing layer 3, in etching, due to the side of layers of copper 2
There is no the protection of corrosion preventing layer 3, it may occur that etch (i.e. lateral erosion), the V in etching factor F is copper layer thickness, and X is lateral erosion width, erosion
It is bigger to carve the factor, represents that etch capabilities are better, lateral erosion effect is lower.
The wiring board A etching factor measurement results that following table is prepared for embodiment 1, wherein etching factor F requirements >=
2.0。
The wiring board A of table 16. etching factor
As can be seen from the table, the minimum value of the batch A circuit board etching factor is all higher than 2.0, and etch effect is good.
3rd, drilling situation
4 blocks of plates are respectively chosen in the wiring board of A-C, F batches respectively, observe its drilling situation.
Batch A-C wiring board is without burr, and no consent, the quality in hole is good, and it is not easy to wear to bore nozzle.And batch F line
Road plate, because plate is curved/bent and super-thick copper thickness have impact on drilling quality, there is the problems such as burr, copper scale consent, and bore the contracting of nozzle life-span
It is short, it is as shown in the table.
Table 17. bores nozzle life situations
| The a diameter of 0.3mm brill nozzle life-span | |
| A | 500 |
| B | 500 |
| C | 500 |
| F | 300 |
In from the above, it will be seen that in embodiment 1-3, improved by rational bore mode adjusting parameter
The quality problem in hole.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. the preparation method of the thick inconsistent thick copper circuit board of a kind of ectonexine copper, it is characterised in that the internal layer copper thickness is
12OZ, the outer layer copper thickness are 6OZ, including pressing plate, drilling and etching work procedure, wherein：
In pressing plate process, from the prepreg of resin content >=65%, pressed successively using heat pressing process and cold-press process
Plate；
The hot pressing parameterses condition is：Pressure is 300-400PSI, and temperature is 175-220 DEG C, vacuum 0-68cm
Hg, time 105-130min；
The cold-press process Parameter Conditions are：Pressure is 50-450PSI, and temperature is 165-220 DEG C, time 130-230min；
Pressure is according to following change of program：
1st program, pressure are set as 60-90PSI, retention time 2-5min；
2nd program, pressure are set as 175-225PSI, retention time 10-20min；
3rd program, pressure are set as 300-400PSI, retention time 140-180min.
2. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper according to claim 1, it is characterised in that institute
State in heat pressing process, temperature is according to following change of program：
1st program, temperature are set as 175-215 DEG C, retention time 30-70min；
2nd program, temperature are set as 180-220 DEG C, retention time 40-80min；
In the cold-press process, temperature is according to following change of program：
1st program, temperature are set as 170-210 DEG C, retention time 10-40min；
2nd program, temperature are set as 180-220 DEG C, retention time 40-80min；
3rd program, temperature are set as 170-210 DEG C, retention time 5-25min；
4th program, temperature are set as 165-205 DEG C, retention time 5-25min.
3. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper according to claim 2, it is characterised in that institute
State in heat pressing process, temperature is according to following change of program：
1st program, temperature are set as 185-205 DEG C, retention time 40-60min；
2nd program, temperature are set as 190-210 DEG C, retention time 50-70min；
In the cold-press process, temperature is according to following change of program：
1st program, temperature are set as 180-200 DEG C, retention time 15-30min；
2nd program, temperature are set as 190-210 DEG C, retention time 50-70min；
3rd program, temperature are set as 180-200 DEG C, retention time 10-20min；
4th program, temperature are set as 175-195 DEG C, retention time 10-20min.
4. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper according to claim 1, it is characterised in that institute
State in drilling operating, first plate 4-6 hours baked Xia 140 ± 20 DEG C, then drilled.
5. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper according to claim 4, it is characterised in that institute
State in drilling operating, according to pore size, drilled according to parameters described below：
Bore diameter is 0.30mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 28-32 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.35mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 37-41 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.40mm, and it is thousand revs/min of 92-97 to bore nozzle drilling speed, and it is 46-50 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.45mm, and it is thousand revs/min of 88-92 to bore nozzle drilling speed, and it is 52-56 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.50mm, and it is thousand revs/min of 83-87 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.55mm, and it is thousand revs/min of 76-80 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.65mm, and it is thousand revs/min of 68-72 to bore nozzle drilling speed, and it is 55-59 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 0.95mm, and it is thousand revs/min of 46-50 to bore nozzle drilling speed, and it is 49-53 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes；
Bore diameter is 1.00mm, and it is thousand revs/min of 44-48 to bore nozzle drilling speed, and it is 46-50 inch/minutes to bore nozzle feed speed, bores nozzle
Withdrawing speed is 900-1100 inch/minutes.
6. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper according to claim 1, it is characterised in that institute
State in etching work procedure, outer layer etch process conditions are：Cu2+Concentration is 135 ± 15g/L, and temperature is 50 ± 2 DEG C, total acidity 2.8
± 0.6N, proportion are 1.185 ± 0.02, and etching speed is 1.6 ± 0.4m/min, and etching number is 2 times, and after each etching
Overturn plate face once.
What 7. the preparation method of the thick inconsistent thick copper circuit board of ectonexine copper described in claim any one of 1-6 was prepared
Wiring board.
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| CN104874826B (en) * | 2015-05-04 | 2017-12-26 | 深圳崇达多层线路板有限公司 | A kind of drilling preparation method of thick copper circuit board |
| CN105208781B (en) * | 2015-08-10 | 2018-07-06 | 江门崇达电路技术有限公司 | A kind of outer layer engraving method of thickness copper coin |
| CN105430941B (en) * | 2015-11-02 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of technique for improving thick copper coin pressing white edge |
| CN105407643B (en) * | 2015-12-15 | 2018-04-17 | 皆利士多层线路版(中山)有限公司 | Mount the 6OZ ＆ 12OZ thick copper circuit board manufacturing methods of heat sink |
| US10212812B2 (en) | 2016-01-15 | 2019-02-19 | International Business Machines Corporation | Composite materials including filled hollow glass filaments |
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
| CN109168265A (en) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | A kind of high-frequency microwave plate high density interconnection board manufacturing method |
| CN110996568B (en) * | 2020-01-08 | 2021-07-09 | 龙南骏亚电子科技有限公司 | Manufacturing method for solving pressing cavity of inner-layer open area in PCB mainboard |
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| JPH09323200A (en) * | 1996-06-06 | 1997-12-16 | Meiki Co Ltd | Method and device for press forming |
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