CN104468885A - Mobile phone shell and manufacturing method thereof - Google Patents
Mobile phone shell and manufacturing method thereof Download PDFInfo
- Publication number
- CN104468885A CN104468885A CN201410658958.XA CN201410658958A CN104468885A CN 104468885 A CN104468885 A CN 104468885A CN 201410658958 A CN201410658958 A CN 201410658958A CN 104468885 A CN104468885 A CN 104468885A
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- China
- Prior art keywords
- metal substrate
- phone housing
- carry out
- preparation
- plastic part
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
- B29C2045/14245—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Abstract
The invention discloses a method for manufacturing a mobile phone shell. The method comprises the steps of preparing a metal substrate used for manufacturing the mobile phone shell; punching the metal substrate; bending the position, close to an antenna slot, of the punched metal substrate to obtain a bent part; conducting upsetting and extrusion on the bent part; conducting injection molding on the metal substrate to obtain a required plastic part; conducting filling injection molding on the bent part; conducting surface treatment on the metal substrate, the plastic part and filled plastic. By punching the metal substrate firstly, then conducting bending, upsetting and extrusion on the position, close to the antenna slot, of the metal substrate, obtaining the required plastic part through injection molding on the metal substrate, conducting plastic supplement, and finally conducting surface treatment on the whole workpiece, the method has the advantages that time for conducting surface treatment on the metal substrate can be shortened and production cost can be saved compared with the prior art. The invention further provides a mobile phone shell.
Description
Technical field
The present invention relates to the technical field of mobile phone, the preparation method particularly relating to a kind of phone housing and the phone housing adopting this preparation method to process.
Background technology
The preparation method of current phone housing for: first prepare the metal substrate needed for; Then, this metal substrate is stamped out to the frame profile and antenna slot that make phone housing; Then, CNC machining center is adopted to carry out Surface Machining to metal substrate; Again then, injection mo(u)lding goes out plastic part on metallic substrates, to isolate the conducting of metal substrate and antenna when fixing up an aerial wire; Afterwards, then adopt CNC machining center to carry out Surface Machining to metal substrate and plastic part.Visible, when carrying out Surface Machining to the associated components of phone housing, be commonly and adopt the process of CNC machining center, and CNC machining center limiting by board and process time, there is the problems such as high, the upper amount of cost is slow, have a strong impact on development progress.
Therefore, be necessary to provide a kind of technological means to address the aforementioned drawbacks.
Summary of the invention
The object of the invention is to the defect overcoming prior art, the preparation method of phone housing being provided, adopting CNC machining center slow and have a strong impact on the problem of development progress to carry out Surface Machining process to workpiece to there is high, the upper amount of cost with the preparation method solving phone housing of the prior art because being mostly.
The present invention is achieved in that the preparation method of phone housing, comprises the steps:
Prepare the metal substrate in order to prepare described phone housing;
Punch process is carried out to described metal substrate, to stamp out frame profile and the antenna slot of described phone housing;
Bending Processing is carried out to the position near described antenna slot on the described metal substrate after punching press, goes out a kink with bending;
Pier is carried out to described kink and squeezes processing, stretch out required form with pier pultrusion;
On described metal substrate, carry out injection molding, go out required plastic part with injection mo(u)lding;
Carry out filling up injection moulding on described kink, with inject strengthen that described plastic part is retained on retain strength on described metal substrate fill up plastic cement;
Surface treatment processing is carried out to described metal substrate, described plastic part and described plastic cement of filling up.
Particularly, carry out in punch process step to described metal substrate, also comprise and the frame contour machining of described phone housing is gone out a ledge structure.
Selectively, carry out in Bending Processing step to the position near described antenna slot on the described metal substrate after punching press, also comprise and the frame contour machining of described phone housing is gone out a ledge structure.
Selectively, carry out punch process step in described metal substrate and carry out between Bending Processing step to the position near described antenna slot on the described metal substrate after punching press, also comprising one and the frame contour machining of described phone housing is gone out a ledge structure step.
Particularly, carry out on described metal substrate in injection molding step, the outer ledge of described plastic part is alignd with the outer ledge of described frame profile.
Particularly, carry out filling up in injection step on described kink, the outer ledge filling up plastic cement described in making aligns with the outer ledge of described frame profile.
Particularly, bender is adopted to carry out Bending Processing to the position near described antenna slot on the described metal substrate after punching press.
Particularly, adopt stretching-machine to carry out pier to described kink and squeeze processing.
Particularly, CNC machining center is adopted to carry out surface treatment processing to described metal substrate, described plastic part and described plastic cement of filling up.
The technique effect of the preparation method of phone housing of the present invention is: first carry out punch process to metal substrate, to construct frame profile and the antenna slot of phone housing; Again Bending Processing is carried out to the position near antenna slot on the metal substrate after punching press, a kink is gone out with bending, in this, on the one hand, the problem easily occurring became uneven in preorder punching course near antenna slot can be overcome, on the other hand, Bending Processing can improve the intensity of phone housing, is conducive to the thickness reducing phone housing further; Follow-uply pier is carried out to kink squeeze processing and on kink, carry out benefit and mould to inject and fill up plastic cement, plastic part fixing retain strength on metallic substrates can be strengthened, and the weight of phone housing can be reduced, relative to the preparation method of prior art, greatly reduce the time needing metal substrate to be carried out to CNC machining center, not only enhance productivity, save production cost, also shorten the discharging cycle.
The present invention also provides phone housing, and this phone housing is adopt above-mentioned preparation method to process, and accelerates the manufacturing schedule of phone housing, and reduce its production cost simultaneously with this.
Accompanying drawing explanation
Fig. 1 is the FB(flow block) of first embodiment of the preparation method of the phone housing of the embodiment of the present invention;
Fig. 2 includes the FB(flow block) frame contour machining of phone housing being gone out the step of a ledge structure in first embodiment of the preparation method of the phone housing of the embodiment of the present invention;
Fig. 3 is the structural representation of the metal substrate of the phone housing of the embodiment of the present invention;
Schematic diagram when Fig. 4 is the metal substrate bending of the phone housing of the embodiment of the present invention;
Fig. 5 be the phone housing of the embodiment of the present invention metal substrate on be injected with the schematic diagram of plastic part;
Fig. 6 be the phone housing of the embodiment of the present invention metal substrate on be injected with the schematic diagram filling up plastic cement;
Fig. 7 is the FB(flow block) of second embodiment of the preparation method of the phone housing of the embodiment of the present invention;
Fig. 8 is the FB(flow block) of the 3rd embodiment of the preparation method of the phone housing of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
the embodiment of the preparation method of phone housing:
Embodiment one:
Refer to Fig. 1 to Fig. 6, the preparation method of the phone housing that the present embodiment provides, comprises the steps:
S1, procedure for preparation, prepare the metal substrate 10 in order to prepare mobile phone phone housing 100, wherein, the material of this metal base 10 is stainless steel, aluminum or aluminum alloy, to ensure that metal base 10 has good intensity, outward appearance machined surface, also help simultaneously and produce various appearance, as wire drawing, Gao Guang etc.;
S2, stamping procedure, carry out punch process to metal substrate 10, to stamp out the frame profile of phone housing 100 and the antenna slot 30 in order to fix up an aerial wire, the frame profile on this metal substrate 10 comprises the first limit 11 and Second Edge 12, particularly, this antenna slot 30 is opened on the first limit 11;
S3, bending process, due in a upper operation, in order to ensure the size of the frame profile stamping out required phone housing 100, and according to material principle of invariance, the part had more or lack material can cause antenna slot 30, the situation of became uneven is easily there is near such antenna slot 30, this operation is for solving the problem, Bending Processing is carried out to the position P near antenna slot 30 on the metal substrate 10 after punching press, go out one in order to the kink 13 of fixing plastic part with bending, and this bending structure also can improve the intensity of phone housing 100;
S4, pier squeeze operation, carry out pier and squeeze processing, stretch out required form with pier pultrusion to kink 13;
S5, injection step, injection molding is carried out on metal substrate 10, inner wall position Z place on the first limit 11 as shown in Figure 4 carries out injection moulding, required plastic part 20 is gone out with injection mo(u)lding, wherein, this plastic components 20 is except strengthening the intensity of metal substrate 10, also by astronomical cycle to the effect playing conducting between isolating metal substrate 10 and antenna during antenna slot 30, ensure the proper communication of mobile phone, in addition, this plastic components 20 is preferably not conductive plastic cement, such as, this plastic components 20 may be selected to be epoxy resin, so that draw materials, and, epoxy resin also has good non-conductive property and cementation,
S6, benefit mould operation, carry out filling up injection moulding on kink 13, with inject strengthen that plastic part 20 is retained on retain strength on metal substrate 10 fill up plastic cement 40, improve bonding strength between plastic part 20 and metal substrate 10 with this, be conducive to plastic part 20 and be attached on metal substrate 10; Preferably, the material filling up injection moulding is epoxy resin, so that draw materials;
S7, surface treatment manufacturing procedure, to metal substrate 10, plastic part 20 with fill up plastic cement 40 and carry out surface treatment processing, so that remove metal substrate 10, plastic part 20 and fill up plastic cement too much on the outer surface of plastic cement 40 or excessive glue, obtain meticulous appearance with this.
In the above-mentioned preparation method of the present embodiment, first punch process is carried out to metal substrate 10, frame profile and the antenna slot of phone housing 100 can be constructed out in advance; Afterwards, Bending Processing is carried out to the position near antenna slot on the metal substrate 10 after punching press, a kink 13 is gone out with bending, in this, on the one hand, the problem easily occurring became uneven in preorder punching course near antenna slot 30 can be overcome, on the other hand, Bending Processing can improve the intensity of phone housing 100, is conducive to the thickness reducing phone housing 100 further; Then, then to kink 13 the crowded processing of pier is carried out; Again then, metal substrate 10 injects required plastic part 20, and on kink 13, carry out benefit mould to inject and fill up plastic cement 40, plastic part 20 can be strengthened and be retained on retain strength on metal substrate 10, and the weight of phone housing can be reduced; Finally, surface treatment is carried out to whole workpiece, relative to the preparation method of prior art, greatly reduce the time needing metal substrate 10 to be carried out to CNC machining center, not only enhance productivity, save production cost, also shorten the discharging cycle.
Refer to Fig. 2, and composition graphs 4, for the ease of moulding in operation in follow-up benefit, can make to fill up plastic cement 40 adhesion is preferably retained on metal substrate 10, therefore, carrying out in punch process step to metal substrate 10, also comprise and the frame contour machining of phone housing 100 is gone out a ledge structure 14, and after processing, the surface of this ledge structure 14 and the outer ledge Q2 of Second Edge 12 form a smooth breach B1, like this, metal substrate 10 can be made and fill up plastic cement 40 seam very neat, fill up plastic cement 40 when tightly using and be not easy disappearance, thus ensure that the attractive in appearance of phone housing 100 appearance.
Refer to Fig. 4, and composition graphs 6, preferably, this kink 13 is step-like structure, so that bending process; Certainly, also bendable is converted into other shape, and as concavo-convex, tortuous shape etc., and these structures also can make plastic cement be retained on metal substrate 10 preferably; In addition, the surface of this step-like kink 13 and the outer ledge of Second Edge 12 form a breach B2.Thus, mould in operation in benefit, first plastic cement is filled up the breach B1 place above ledge structure 14, then, then plastic cement is filled up the breach B2 place above kink 13, and such injection molding manner that is connected continuously, effectively ensure to grab glue retain strength between plastic cement.
Refer to Fig. 5 and Fig. 6, in injection step, the outer ledge of plastic part 20 is alignd with the outer ledge of the frame profile on metal substrate 10, is specially, the outer ledge of plastic part 20 aligns with the outer ledge Q1 on the first limit 11, ensures the overall appearance of phone housing 100 with this.In like manner, mould in operation in benefit, make to fill up the outer ledge of plastic cement 40 and align with the outer ledge of the frame profile on metal substrate 10, be specially, the outer ledge Q2 of the outer ledge and Second Edge 12 of filling up plastic cement 40 aligns, and ensures the overall appearance of phone housing 100 with this.
Have plenty of again, adhere to preferably to make plastic part 20 and be retained on metal substrate 10, concaveconvex structure can be provided with in the inner wall position Z place on the first limit 11; In like manner, the surface needing to fill up ledge structure 14, kink 13 injection moulding is provided with concaveconvex structure, also can makes to fill up plastic cement 40 and adhere to preferably and be retained on metal substrate 10.Preferably, the through hole that one is communicated with these two positions is provided with in the position needing the position of injection moulding plastic parts 20 and injection moulding to fill up plastic cement 40, mould in operation at injection step or benefit, plastic cement is injected at this through hole, and plastic cement inside this through hole can connection plastic glue component 20 and fill up both plastic cement 40, can further improve plastic part 20, fill up plastic cement 40 and adhere to the retain strength being retained on metal substrate 10.
As the preferred version of the present embodiment, forcing press is adopted to carry out punch process to metal substrate 10, and this forcing press is equipped in order to metal substrate 10 to be stamped out the frame profile of phone housing 100 and the diel of antenna slot 30, wherein, by forcing press and diel, metal substrate 10 just can be made quickly and easily to form frame profile and the antenna slot 30 of mobile phone phone housing 100.Particularly, this diel is provided with the die cavity corresponding with the frame profile of phone housing 100 and antenna slot 30.
As another preferred version of the present embodiment, bender is adopted to carry out Bending Processing, to form required kink 13 to the position near antenna slot 30 on the metal substrate 10 after punching press.Wherein, bender is a kind of machine that can carry out bending to thin plate, and uses bender to be conducive to making the quick bending of metal substrate 10 go out required form, and bender is easy to operate, is conducive to enhancing productivity.
As another preferred version of the present embodiment, adopt stretching-machine to carry out pier to kink 13 and squeeze processing, and adopt stretching-machine, the pier pultrusion being conducive to controlling kink 13 is stretched, and this tensile force is generally and reaches 2-10KN.
As another preferred version of the present embodiment, injection molding machine is adopted to carry out injection molding on metal substrate 10, and when adopting this injection molding machine, usually, this metal substrate 10 can be placed on corresponding injection mold, then carry out injection molding according to predetermined structure, thus, just can mold comparatively complicated plastic part preferably.
As another preferred version of the present embodiment, injection molding machine is adopted to carry out filling up injection moulding on kink 13, and adopt injection molding machine to carry out filling up injection moulding, as long as metal substrate 10 to be placed in corresponding injection mold and to aim at kink 13 by operating personnel, thus, be conducive to improving the production efficiency filling up injection moulding.
As another preferred version of the present embodiment, adopt CNC machining center to metal substrate 10, plastic part 20 and fill up plastic cement 40 and carry out surface treatment processing, adopt CNC machining center can control metal substrate 10, plastic part 20 preferably and fill up the precision processing of the finished surface on plastic cement 40.Preferably, surface treatment processing comprises carries out finish-milling to metal substrate 10, plastic part 20 and the outer surface of filling up plastic cement 40, and pass through finish-milling, not only effectively remove too much plastic cement or excessive glue, metal substrate 10, plastic part 20 can also be made and fill up the appearance that plastic cement 40 reaches comparatively bright and clean, preferably, this metal substrate 10, plastic part 20 and the finish-milling precision of finished surface filled up on plastic cement 40 reach IT8 ~ IT7.And after finish-milling processing, if desired better finished surface is obtained, polishing processing can be carried out to metal substrate 10, plastic part 20 and the outer surface filling up plastic cement 40, thus, except being conducive to the intensity strengthening metal substrate 10, plastic part 20 and fill up the finished surface on plastic cement 40, also can further improve this metal substrate 10, plastic part 20 and fill up the precision of the finished surface on plastic cement 40, metal substrate 10 now, plastic part 20 and the accuracy class filling up the finished surface on plastic cement 40 can reach IT6 ~ IT5.
Embodiment two:
Refer to Fig. 7, and composition graphs 3 to Fig. 6, the way of example of embodiment two and the execution mode of embodiment one similar, specifically can the execution mode of reference example one, be not described further, both differences are the manufacturing procedure to ledge structure 14 herein, and embodiment two is specially:
The frame contour machining of phone housing 100 is gone out a ledge structure 14 to be arranged on the metal substrate after punching press 10 and to carry out in Bending Processing step near the position of antenna slot 30, like this, pass through mould, once ledge structure 14 and kink 13 can be completed simultaneously, can process time be saved, cut down finished cost.
Embodiment three:
Refer to Fig. 8, and composition graphs 3 to Fig. 6, the way of example of embodiment three and the execution mode of embodiment one similar, specifically can the execution mode of reference example one, be not described further, both differences are the manufacturing procedure to ledge structure 14 herein, and embodiment three is specially:
The frame contour machining of phone housing 100 is gone out ledge structure 14 step to be arranged at metal substrate 10 and to carry out punch process step and carry out between Bending Processing step, by this course of processing as independent step on the metal substrate 10 after punching press near the position of antenna slot 30.This pattern, Mould Machining is fairly simple, advantage of lower cost.
the embodiment of phone housing:
Refer to Fig. 1 to Fig. 8, below the most preferred embodiment of phone housing of the present invention is set forth.
The present invention also provides phone housing 100, and this phone housing 100 is adopt above-mentioned preparation method to process, and accelerates the manufacturing schedule of phone housing 100, cripetura process time, and reduce its production cost simultaneously with this.
The foregoing is only preferred embodiment of the present invention, its structure is not limited to the above-mentioned shape enumerated, and all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the preparation method of phone housing, is characterized in that, comprises the steps:
Prepare the metal substrate in order to prepare described phone housing;
Punch process is carried out to described metal substrate, to stamp out frame profile and the antenna slot of described phone housing;
Bending Processing is carried out to the position near described antenna slot on the described metal substrate after punching press, goes out a kink with bending;
Pier is carried out to described kink and squeezes processing, stretch out required form with pier pultrusion;
On described metal substrate, carry out injection molding, go out required plastic part with injection mo(u)lding;
Carry out filling up injection moulding on described kink, with inject strengthen that described plastic part is retained on retain strength on described metal substrate fill up plastic cement;
Surface treatment processing is carried out to described metal substrate, described plastic part and described plastic cement of filling up.
2. the preparation method of phone housing as claimed in claim 1, is characterized in that: carry out in punch process step to described metal substrate, also comprises and the frame contour machining of described phone housing is gone out a ledge structure.
3. the preparation method of phone housing as claimed in claim 1, it is characterized in that: carry out in Bending Processing step to the position near described antenna slot on the described metal substrate after punching press, also comprise and the frame contour machining of described phone housing is gone out a ledge structure.
4. the preparation method of phone housing as claimed in claim 1, it is characterized in that: carry out punch process step in described metal substrate and carry out between Bending Processing step to the position near described antenna slot on the described metal substrate after punching press, also comprising one and the frame contour machining of described phone housing is gone out a ledge structure step.
5. the preparation method of the phone housing as described in any one of claim 1-4, is characterized in that: carry out in injection molding step on described metal substrate, and the outer ledge of described plastic part is alignd with the outer ledge of described frame profile.
6. the preparation method of the phone housing as described in any one of claim 1-4, is characterized in that: carry out filling up in injection step on described kink, and the outer ledge filling up plastic cement described in making aligns with the outer ledge of described frame profile.
7. the preparation method of the phone housing as described in any one of claim 1-4, is characterized in that: adopt bender to carry out Bending Processing to the position near described antenna slot on the described metal substrate after punching press.
8. the preparation method of the phone housing as described in any one of claim 1-4, is characterized in that: adopt stretching-machine to carry out pier to described kink and squeeze processing.
9. the preparation method of the phone housing as described in any one of claim 1-4, is characterized in that: adopt CNC machining center to carry out surface treatment processing to described metal substrate, described plastic part and described plastic cement of filling up.
10. phone housing, is characterized in that: adopt the preparation method described in any one of claim 1-9 to process.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711157485.5A CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
| CN201410658958.XA CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410658958.XA CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711157485.5A Division CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104468885A true CN104468885A (en) | 2015-03-25 |
| CN104468885B CN104468885B (en) | 2018-01-23 |
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| CN201410658958.XA Active CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
| CN201711157485.5A Expired - Fee Related CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711157485.5A Expired - Fee Related CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
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| WO2018001134A1 (en) * | 2016-06-27 | 2018-01-04 | 广东欧珀移动通信有限公司 | Processing method for housing, housing, and electronic device |
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| CN108539376B (en) * | 2018-05-02 | 2021-01-08 | Oppo广东移动通信有限公司 | Shell assembly, antenna assembly, manufacturing method of antenna assembly and electronic equipment |
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| CN108737603B (en) * | 2018-05-25 | 2020-09-11 | Oppo广东移动通信有限公司 | Housing and electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104468885B (en) | 2018-01-23 |
| CN107756722B (en) | 2020-04-03 |
| CN107756722A (en) | 2018-03-06 |
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