CN104461211A - 3D manufacturing method for resistive touch screen - Google Patents
3D manufacturing method for resistive touch screen Download PDFInfo
- Publication number
- CN104461211A CN104461211A CN201410237620.7A CN201410237620A CN104461211A CN 104461211 A CN104461211 A CN 104461211A CN 201410237620 A CN201410237620 A CN 201410237620A CN 104461211 A CN104461211 A CN 104461211A
- Authority
- CN
- China
- Prior art keywords
- electrode
- conductive
- conductive layer
- layer
- touch screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention relates to a 3D manufacturing method for a resistive touch screen. The 3D manufacturing method is characterized by including the following steps that firstly, an upper substrate is provided; secondly, a lower substrate is provided; thirdly, an insulated isolation layer is provided; fourthly, a sealing frame is provided; fifthly, the upper substrate and the lower substrate are aligned and attached; sixthly, a conducting column is provided; seventhly, an FPC with a touch IC chip is electrically connected with connecting pins of a first electrode and a second electrode through hot pressing, and then the final resistive touch screen is formed. The 3D manufacturing method is used for manufacturing the resistive touch screen, the process is greatly simplified compared with that of a traditional method, multiple complex procedures such as exposure, developing and etching of the traditional process are omitted, and production raw materials and manufacturing cost are saved.
Description
Technical field
The present invention relates to the manufacture field of touch-screen, the 3D particularly relating to a kind of resistive touch screen prints manufacture method.
Background technology
Touch-screen is one of main application of touch sensible technology, and it, as a kind of brand-new man-machine communication's mode, the new mode of operation of electronic product input equipment occupies consequence gradually.It is to catch the touch action information of human finger for basic point of departure, the convert information of finger touch action is become electric signal and is judged to identify, makes it " pressing " and the release movement equivalence of touching case button with tradition machinery.
The manufacture of existing touch-screen adopts the technology such as photoetching, printing and plated film more, wherein photoetching technique and coating technique need a lot of roads technique, the multiple working procedures such as exposure, development, etching, cleaning are just included as photoetching process, manufacture craft is relatively loaded down with trivial details, and it belongs to " subtracting material manufacture ", inevitably causes the waste of material.Though print process overcomes the problem of waste of material, its touch-screen degree of accuracy made is not high, and resolution is also lower.These traditional handicrafts, need multiple tracks gold-tinted and coating process, adopt subtraction making devices, so cause the complexity of technique, yield rate, and the problem such as wastage of material.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, combine the advantage that 3D prints, provide a kind of 3D of resistive touch screen to print manufacture method.
Technical program of the present invention lies in:
A 3D manufacture method for resistive touch screen, is characterized in that, comprise the following steps:
Step 1 a: upper substrate is provided; Described upper substrate comprises the first glass substrate, be arranged at the first conductive layer of the first glass substrate viewing area, be arranged at first electrode at first substrate edge, be arranged at several first conductive channel on the first electrode and several the second conductive channel; Wherein,
The transparency conducting layer that the conductive material that described first conductive layer adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described first electrode adopts 3D to print one deck or some layers is formed;
Step 2 a: infrabasal plate is provided; Described infrabasal plate comprises the second glass substrate, is arranged at the second conductive layer of the second glass substrate viewing area, is arranged at second electrode at second substrate edge, the 3rd electrode and the 4th electrode; Wherein,
The transparency conducting layer that the conductive material that described second conductive layer adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described second electrode adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described 3rd electrode adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described 4th electrode adopts 3D to print one deck or some layers is formed;
Step 3 a: dielectric isolation layer is provided; Adopt 3D to print the insulation insulated column of one deck or some layers at described lower substrate surface, form a dielectric isolation layer;
Step 4: an envelope framework is provided; Adopt 3D to print the insulation sealed plastic box of one deck or some layers in the surrounding of described infrabasal plate, form described envelope framework;
Step 5: described upper substrate is aimed at described infrabasal plate and fitted;
Step 6 a: conductive pole is provided; The conductive metal material adopting 3D to manufacture one deck or some layers in described first conductive channel and the second conductive channel forms a conductive pole, for connecting described 3rd electrode and described 4th electrode;
Step 7: the FPC with touch-control IC chip is carried out electricity connection by the connection pin of hot pressing and described first electrode and described second electrode, forms final resistive touch screen;
Wherein, described 3D printing concrete steps are as follows:
S11: the three-dimensional digital model designing the first conductive layer, the first electrode, the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and the conductive pole generating resistive touch screen successively;
S12: utilize software to carry out layering successively to the first set up conductive layer, the first electrode, the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and conductive pole three-dimensional model, obtains the two-dimentional sublayer of Z-direction;
S13: imported described two-dimentional sublayer in 3D printer program, draws material on every layer of two dimensional surface and shape according to institute's established model, designs printing path;
S14: described glass substrate layer is placed on 3D printing equipment table top, print described first conductive layer and the first electrode successively in upper substrate surface, print the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and conductive pole successively at lower substrate surface.
Wherein, the structure of several first conductive channel described and described second conductive channel is right cylinder, rectangular parallelepiped, square, adopts Laser Processing or machine drilling to form.
Described first conductive layer and described second conductive layer are transparency conducting layer, and the structure of described transparency conducting layer is ordered grid shape or unordered latticed, or is planar structure; Described latticed conductive layer is made up of transparent conductive material or nontransparent conductive material; Described planar structure conductive layer is made up of transparent conductive material.
Described transparency conducting layer comprise in metal nanoparticle, metal quantum point, metal oxide, Graphene, carbon nano-tube, metal nanometer line one or both and be composited above.
The shape of described first electrode, the second electrode, the 3rd electrode and described 4th electrode is latticed, strip, planar; Described first electrode, the second electrode, the 3rd electrode and described 4th electrode can starch one or both and the list structure conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.
Described separation layer is made up of several transparent insulated columns, described insulated column is the formation horizontal line of uniform intervals arrangement from left to right in the horizontal direction, in the vertical direction is even is spaced formation vertical row, distance in the horizontal and vertical directions between adjacent separaant is 1-100 millimeter, insulated column height is 10-5000 micron, and diameter is 10-3000 micron.
Described envelope framework is made up of opaque sealed plastic box, and the thickness of described sealed plastic box is more than or equal to the height of insulated column.
Described conductive pole can starch one or both and the conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.
It is shaping that described 3D Method of printing comprises stereolithography apparatus, selective laser sintering, Fused Deposition Modeling, three dimensional printing and inkjet printing.
Print a touch-screen or multiple touch-screen array on the same substrate, described multiple touch-screen array adopts the mode of cutting to be separated.
The invention has the advantages that:
The method that the present invention adopts 3D to manufacture is to carry out the manufacture of resistive touch screen, and technique comparatively classic method simplifies greatly, saves the multiple tracks complicated technologies such as traditional handicraft exposure, development, etching, saves raw materials for production and manufacturing cost.
Accompanying drawing explanation
Fig. 1 is the process flow diagram that a kind of 3D provided by the invention manufactures resistive touch screen.
Fig. 2 is that a kind of 3D provided by the invention manufactures resistive touch screen structure schematic diagram.
Fig. 3 is that a kind of 3D provided by the invention manufactures resistive touch screen upper substrate floor map.
Fig. 4 is that a kind of 3D provided by the invention manufactures resistive touch screen infrabasal plate floor map.
Embodiment
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, is described in detail below by reference to the accompanying drawings.
Below will be described in further detail the present invention by specific embodiment.
Referring to figs. 1 through Fig. 4, the 3D manufacture method of resistive touch screen, includes following step:
(S1) upper substrate 10 is provided.Described upper substrate 10 comprises the first glass substrate 11, be arranged at the first conductive layer 12 of the first glass substrate viewing area, be arranged at first electrode 13 at first substrate edge, be arranged at several first conductive channel 14 on the first electrode 13 and several the second conductive channel 15.Wherein, described first conductive layer 12, described first electrode 13 can adopt 3D manufacturing technology to realize, and concrete manufacturing step is as follows:
(S11) glass substrate 11 is provided.According to design size, choose a suitable glasses substrate, be placed in by described glass substrate 110 is Win-10: DI water=3 by volume: 97 cleaning fluids, the ultrasonic machine cleaning 15min utilizing frequency to be 32KHz, after spray 2min, being placed in volume ratio is again Win41: DI water=5: 95 cleaning fluids, the ultrasonic machine cleaning 10min utilizing frequency to be 40KHz, after circulation tap water spray rinsing 2min, recycling frequency is that the ultrasonic machine of 28KHz cleans 10min in DI pure water, is placed in 50 DEG C of cleaning ovens is incubated 30min through air knife drying.
(S12) the first conductive layer 12 makes.With reference to Fig. 3, described conductive layer 12 is transparency conducting layer, and the structure of described transparency conducting layer is ordered grid shape or unordered latticed, also can be planar structure.Described latticed conductive layer is made up of transparent conductive material or nontransparent conductive material; Described planar structure conductive layer is made up of transparent conductive material.The material of described transparency conducting layer comprise in metal nanoparticle, metal quantum point, metal oxide, Graphene, carbon nano-tube, metal nanometer line one or both and be composited above.Described first conductive layer can adopt laser sintered or melt extrude shaping preparation, also can adopt the Stereo Lithography of photochromics, three dimensional printing or inkjet printing to prepare.Wherein, metal nanoparticle, metal quantum point or metal oxide can adopt selective laser sintering or melt extrude shaping being made; Metal quantum point, Graphene, carbon nano-tube, metal nanometer line, metal oxide nanostructure also can adopt solid shaping, the three dimensional printing of the cubic light of photochromics or three dimensional ink jet printing and making to form.
The present embodiment preferred selective laser sintering metal nano Argent grain makes latticedly transparently leads the first conductive layer 12, and concrete steps are as follows:
(S121) design generates the three-dimensional digital model of the first conductive layer 12 in resistive touch screen;
(S122) utilize the three-dimensional model of software to set up patterned transparent conductive layer 12 to carry out layering successively, determine the parameter of orderly latticed planar transparency conducting layer, comprise web thickness, wire diameter and aperture; This thickness implementing the metal grid lines of preferred planar conductive layer is 0.2 micron, and the width of metal grid lines is 3 microns, and metal grill aperture is 8 microns;
(S123) described two-dimentional sublayer is imported in 3D printer program, draw material on every layer of two dimensional surface and shape according to institute's established model, design printing path;
(S124) above-mentioned glass substrate layer is placed on 3D printing equipment table top, prints described first conductive layer 12.Concrete principle is as follows: utilize powder-laying roller equipment in the horizontal direction argent nano particle to be evenly transferred to the viewing area of glass basic surface, controlling laser beam makes its sintering temperature be the solution temperature of argent nano particle, laser head moves along direction initialization, the superlaser that laser sends leads to and irradiates the argent powder of nanometric particles of substrate surface, and dissolves the silver nano-grain on its scanning pattern; Repeat said process and obtain required patterned transparent conductive layer 12.
(S125) substrate surface treatment.The substrate manufactured is shifted out 3D printing device, and cleaning array surface, with inner, comprise spraying and prints and remain in the unnecessary metal copper nano granules of substrate surface in laser sintered process.
(S13) the first electrode 13 makes.With reference to Fig. 3, the shape of described first electrode is latticed, strip, planar or other pattern; Described first electrode can starch one or both and the list structure conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.Described first electrode can adopt alternative laser sintered or melt extrude shaping preparation, the Stereo Lithography of photochromics, three dimensional printing or three dimensional ink jet also can be adopted to print and prepare; Wherein, metal nanoparticle, metal quantum point can adopt selective laser sintering or melt extrude shaping being made; Metal quantum point, metal paste, carbon slurry also can adopt solid shaping, the three dimensional printing of the cubic light of photochromics or three dimensional ink jet printing and making to form
The present embodiment preferred three-dimensional prints the first electrode 13 that argent quantum dot makes list structure, and concrete steps are as follows:
(S131) design generates the three-dimensional digital model of the first electrode 130 in resistive touch screen;
(S132) utilize the three-dimensional model of software to the second set up connecting electrode 160 to carry out layering successively, determine the structural parameters of the first electrode 13, comprise thickness of electrode, spacing between width and adjacent electrode; This width implementing preferred strip conductive layer is 150um, and the spacing between adjacent strip conductive layer is 80um; The metal thickness forming every bar strip conductive layer is 250nm.；
(S133) described two-dimentional sublayer is imported in 3D printer program, draw material on every layer of two dimensional surface and shape according to institute's established model, design printing path;
(S134) described glass substrate layer is placed on 3D printing equipment table top, prints described first electrode 13.Concrete principle is as follows: sent by storage vat by argent quantum dot, again with cylinder by the argent quantum dot sent at the very thin argent quantum dot layer of substrate of glass 11 surrounding layer overlay, 3D printing nozzle, according to the profile ejection cementing agent out of definition after computer model section, sticks together argent quantum dot; After one deck completes, machine table declines a bit automatically, and storage vat rises a bit, repeats said process and obtains the first required electrode 13.
(S135) substrate manufactured is shifted out 3D printing device, cleaning array surface, with inner, comprise in spraying printing shaping process and remains in the unnecessary argent quantum dot of substrate surface.,
(S14) the first conductive channel 14 and the second conductive channel 15 make.With reference to Fig. 3, the structure of several first conductive channel 14 described and described second conductive channel 15 can be right cylinder, rectangular parallelepiped, square or other pattern, and Laser Processing or machine drilling can be adopted to form.The preferred Laser Processing of this example becomes the first conductive channel 14 of cube structure and described second conductive channel 15, and concrete steps are as follows:
(S141) structural parameters of the first conductive channel 14 and described second conductive channel 15 are designed, comprise the number of the first conductive channel 14, the size of conductive channel, the spacing between conductive channel and conductive channel, the number of the second conductive channel 15, the size of conductive channel, the spacing between conductive channel and conductive channel;
(S142) select suitable laser instrument, control laser energy, Laser Processing forms the first conductive channel 14 and the second conductive channel 15.
(S2) infrabasal plate 20 is provided.Described infrabasal plate 20 comprises the second glass substrate 21, is arranged at the second conductive layer 22 of the second glass substrate 21 viewing area, is arranged at second electrode 23 at second substrate edge, the 3rd electrode 24 and the 4th electrode 25.Wherein, described second conductive layer 22, described second electrode 23, the 3rd electrode 24 and the 4th electrode 25 can adopt 3D manufacturing technology to realize, and concrete manufacturing step is as follows:
(S21) glass substrate 11 is provided.According to design size, choose a suitable glasses substrate, be placed in by described glass substrate 110 is Win-10: DI water=3 by volume: 97 cleaning fluids, the ultrasonic machine cleaning 15min utilizing frequency to be 32KHz, after spray 2min, being placed in volume ratio is again Win41: DI water=5: 95 cleaning fluids, the ultrasonic machine cleaning 10min utilizing frequency to be 40KHz, after circulation tap water spray rinsing 2min, recycling frequency is that the ultrasonic machine of 28KHz cleans 10min in DI pure water, is placed in 50 DEG C of cleaning ovens is incubated 30min through air knife drying.
(S22) the second conductive layer 22 makes.With reference to Fig. 4, described conductive layer 22 is transparency conducting layer, and the structure of described transparency conducting layer is ordered grid shape or unordered latticed, also can be planar structure.Described latticed conductive layer is made up of transparent conductive material or nontransparent conductive material; Described planar structure conductive layer is made up of transparent conductive material.The material of described transparency conducting layer comprise in metal nanoparticle, metal quantum point, metal oxide, Graphene, carbon nano-tube, metal nanometer line one or both and be composited above.Described first conductive layer can adopt laser sintered or melt extrude shaping preparation, also can adopt the Stereo Lithography of photochromics, three dimensional printing or inkjet printing to prepare.Wherein, metal nanoparticle, metal quantum point or metal oxide can adopt selective laser sintering or melt extrude shaping being made; Metal quantum point, Graphene, carbon nano-tube, metal nanometer line, metal oxide nanostructure also can adopt solid shaping, the three dimensional printing of the cubic light of photochromics or three dimensional ink jet printing and making to form.The present embodiment preferred selective laser sintering metal nano Argent grain makes latticedly transparently leads the first conductive layer 22, and concrete steps are consistent with (S12).
(S23) the second electrode 23, the 3rd electrode 24 and the 4th electrode 25 make.With reference to Fig. 4, the shape of described second electrode 23, the 3rd electrode 24 and the 4th electrode 25 is latticed, strip, planar or other pattern; Described first electrode can starch one or both and the list structure conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.Described second electrode 23, the 3rd electrode 24 and the 4th electrode 25 can adopt alternative laser sintered or melt extrude shaping preparation, the Stereo Lithography of photochromics, three dimensional printing or three dimensional ink jet also can be adopted to print and prepare; Wherein, metal nanoparticle, metal quantum point can adopt selective laser sintering or melt extrude shaping being made; Metal quantum point, metal paste, carbon slurry also can adopt solid shaping, the three dimensional printing of the cubic light of photochromics or three dimensional ink jet printing and making and cost implementation preferred three-dimensional to print argent quantum dot and make described second electrode 23 of list structure, the 3rd electrode 24 and the 4th electrode 25, and concrete steps are consistent with (S23) step.
(S3) separation layer makes.Described separation layer is made up of several transparent insulated columns 30, described insulated column 30 is the formation horizontal line of uniform intervals arrangement from left to right in the horizontal direction, in the vertical direction is even is spaced formation vertical row, distance in the horizontal and vertical directions between adjacent insulated column 30 is 1-100 millimeter, insulated column height is 10-5000 micron, and diameter is 10-3000 micron.Described insulated column 30 can adopt alternative laser sintered or melting transparent medium to make.
The preferred laser sintered polyethylene particle of the present invention is made into transparent insulated column 30.Concrete steps are as follows:
(S31) design generates the three-dimensional digital model of the insulated column 30 in resistive touch screen;
(S32) utilize the three-dimensional model of software to set up insulated column 30 to carry out layering successively, determine the structural parameters of insulated column 30, comprise the distance between the height of insulated column 30, diameter, adjacent insulated column;
(S33) described two-dimentional sublayer is imported in 3D printer program, draw material on every layer of two dimensional surface and shape according to institute's established model, design printing path;
(S34) polyethylene particle transfer.Utilize powder-laying roller equipment in the horizontal direction polyethylene particle to be evenly transferred to substrate surface, or utilize the shower nozzle increased in material equipment (3D printing), along its scanning pattern (metal grill wire diameter direction) is mobile, polyethylene particle is uniformly coated on substrate surface; This is implemented preferred powder-laying roller equipment and in the horizontal direction polyethylene particle is evenly transferred to substrate surface.
(S35) polyethylene particle melting.Controlling laser beam makes its sintering temperature be 132 DEG C, and laser head moves along the planar direction of setting, and the polyethylene particle of the superlaser that laser sends to substrate surface irradiates, and dissolves the polyethylene particle on its scanning pattern.After fusing, polyethylene particle and substrate stick together;
(S36) (S34) and (S35) step is repeated, the insulated column 30 needed for formation.
(S37) substrate manufactured is shifted out 3D printing device, cleaning array surface, with inner, comprise in laser sintered process and remains in the unnecessary polyethylene particle of substrate surface.
(S4) seal framework 40 to make.Described envelope framework can print opaque sealed plastic box by 3D and be formed, and the thickness of described sealed plastic box is more than or equal to the height of described insulated column 30.
(S5) laminating is aimed at.Described upper substrate 10 and infrabasal plate 20 are aimed at, hot pressing is fitted.
(S6) conductive pole 50 makes.Described conductive pole 50 is starched one or both by Stereo Lithography, selective laser sintering, Fused Deposition Modeling, three dimensional printing or inkjet printing metal nanoparticle, metal quantum point, metal paste, carbon and is composited above.
The present embodiment preferred inkjet printing Nano Silver electric ink makes conductive pole 50, and specific experiment step is as follows:
(S61) design generates the three-dimensional digital model of the conductive pole 50 in resistive touch screen;
(S62) utilize software to carry out layering successively to set up conductive pole 50 three-dimensional model, obtain the two-dimentional sublayer of Z-direction;
(S63) described two-dimentional sublayer is imported in 3D printer program, draw material on every layer of two dimensional surface and shape according to institute's established model, design printing path;
(S64) above-mentioned glass substrate layer is placed on 3D printing equipment table top, prints described conductive pole 50.Concrete principle is as follows: will prepare 3D printing Nano Silver electric ink in dispersed nano-silver particles to solution, electric ink is moved in fluid reservoir, by micro-printhead of inkjet printing, Nano Silver electric ink is printed in the first conductive channel 14 and the second conductive channel 15, low temperature drying process is to remove desolventizing, carry out annealing in process again, repeat said process and form required conductive pole 50.
(S65) substrate manufactured is shifted out 3D printing device, cleaning array surface, with inner, comprise spraying and prints and remain in the unnecessary electric ink of substrate surface in annealing process.
(S7) FPC and electrode pin pressing.FPC60 with touch-control IC chip is carried out electricity by the pin of hot pressing and described first electrode 13 and described second electrode 23 be connected, form final resistive touch screen, as shown in Figure 2.
So far, the 3D printing manufacture method of a kind of resistive touch screen of first preferred embodiment of the invention completes.
The foregoing is only preferred embodiment of the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. a 3D manufacture method for resistive touch screen, is characterized in that, comprise the following steps:
Step 1 a: upper substrate is provided; Described upper substrate comprises the first glass substrate, be arranged at the first conductive layer of the first glass substrate viewing area, be arranged at first electrode at first substrate edge, be arranged at several first conductive channel on the first electrode and several the second conductive channel; Wherein,
The transparency conducting layer that the conductive material that described first conductive layer adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described first electrode adopts 3D to print one deck or some layers is formed;
Step 2 a: infrabasal plate is provided; Described infrabasal plate comprises the second glass substrate, is arranged at the second conductive layer of the second glass substrate viewing area, is arranged at second electrode at second substrate edge, the 3rd electrode and the 4th electrode; Wherein,
The transparency conducting layer that the conductive material that described second conductive layer adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described second electrode adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described 3rd electrode adopts 3D to print one deck or some layers is formed;
The conductive layer that the conductive metal material that described 4th electrode adopts 3D to print one deck or some layers is formed;
Step 3 a: dielectric isolation layer is provided; Adopt 3D to print the insulation insulated column of one deck or some layers at described lower substrate surface, form a dielectric isolation layer;
Step 4: an envelope framework is provided; Adopt 3D to print the insulation sealed plastic box of one deck or some layers in the surrounding of described infrabasal plate, form described envelope framework;
Step 5: described upper substrate is aimed at described infrabasal plate and fitted;
Step 6 a: conductive pole is provided; The conductive metal material adopting 3D to manufacture one deck or some layers in described first conductive channel and the second conductive channel forms a conductive pole, for connecting described 3rd electrode and described 4th electrode;
Step 7: the FPC with touch-control IC chip is carried out electricity connection by the connection pin of hot pressing and described first electrode and described second electrode, forms final resistive touch screen;
Wherein, described 3D printing concrete steps are as follows:
S11: the three-dimensional digital model designing the first conductive layer, the first electrode, the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and the conductive pole generating resistive touch screen successively;
S12: utilize software to carry out layering successively to the first set up conductive layer, the first electrode, the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and conductive pole three-dimensional model, obtains the two-dimentional sublayer of Z-direction;
S13: imported described two-dimentional sublayer in 3D printer program, draws material on every layer of two dimensional surface and shape according to institute's established model, designs printing path;
S14: described glass substrate layer is placed on 3D printing equipment table top, print described first conductive layer and the first electrode successively in upper substrate surface, print the second conductive layer, the second electrode, the 3rd electrode, the 4th electrode, separation layer, envelope framework and conductive pole successively at lower substrate surface.
2. the 3D manufacture method of a kind of resistive touch screen according to claim 1, it is characterized in that, the structure of several first conductive channel described and described second conductive channel is right cylinder, rectangular parallelepiped, square, adopts Laser Processing or machine drilling to form.
3. the 3D manufacture method of a kind of resistive touch screen according to claim 1, it is characterized in that, described first conductive layer and described second conductive layer are transparency conducting layer, and the structure of described transparency conducting layer is ordered grid shape or unordered latticed, or is planar structure; Described latticed conductive layer is made up of transparent conductive material or nontransparent conductive material; Described planar structure conductive layer is made up of transparent conductive material.
4. the 3D manufacture method of a kind of resistive touch screen according to claim 3, it is characterized in that, described transparency conducting layer comprise in metal nanoparticle, metal quantum point, metal oxide, Graphene, carbon nano-tube, metal nanometer line one or both and be composited above.
5. the 3D manufacture method of a kind of resistive touch screen according to claim 1, is characterized in that, the shape of described first electrode, the second electrode, the 3rd electrode and described 4th electrode is latticed, strip, planar; Described first electrode, the second electrode, the 3rd electrode and described 4th electrode can starch one or both and the list structure conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.
6. the 3D manufacture method of a kind of resistive touch screen according to claim 1, it is characterized in that, described separation layer is made up of several transparent insulated columns, described insulated column is the formation horizontal line of uniform intervals arrangement from left to right in the horizontal direction, in the vertical direction is even is spaced formation vertical row, distance in the horizontal and vertical directions between adjacent separaant is 1-100 millimeter, and insulated column height is 10-5000 micron, and diameter is 10-3000 micron.
7. the 3D manufacture method of a kind of resistive touch screen according to claim 1, it is characterized in that, described envelope framework is made up of opaque sealed plastic box, and the thickness of described sealed plastic box is more than or equal to the height of insulated column.
8. the 3D manufacture method of a kind of resistive touch screen according to claim 1, is characterized in that, described conductive pole can starch one or both and the conductive layer that is composited above thereof by metal nanoparticle, metal quantum point, metal paste, carbon.
9. the 3D manufacture method of a kind of resistive touch screen according to claim 1, it is characterized in that, it is shaping that described 3D Method of printing comprises stereolithography apparatus, selective laser sintering, Fused Deposition Modeling, three dimensional printing and inkjet printing.
10. the 3D manufacture method of a kind of resistive touch screen according to claim 1, is characterized in that, prints a touch-screen or multiple touch-screen array on the same substrate, and described multiple touch-screen array adopts the mode of cutting to be separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410237620.7A CN104461211B (en) | 2014-05-31 | 2014-05-31 | A kind of 3D manufacture methods of resistive touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410237620.7A CN104461211B (en) | 2014-05-31 | 2014-05-31 | A kind of 3D manufacture methods of resistive touch screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104461211A true CN104461211A (en) | 2015-03-25 |
| CN104461211B CN104461211B (en) | 2017-07-04 |
Family
ID=52907363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410237620.7A Active CN104461211B (en) | 2014-05-31 | 2014-05-31 | A kind of 3D manufacture methods of resistive touch screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104461211B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270507A (en) * | 2015-06-23 | 2017-01-04 | 空中客车德国运营有限责任公司 | Including the metal assembly of integrated glass fibre and the 3D Method of printing manufacturing it |
| CN106388807A (en) * | 2016-08-30 | 2017-02-15 | 中国科学院深圳先进技术研究院 | Preparation method for surface adhesive electrode array |
| CN108318541A (en) * | 2017-01-16 | 2018-07-24 | 华邦电子股份有限公司 | Gas measuring device |
| CN108788156A (en) * | 2018-07-04 | 2018-11-13 | 苏州泛普科技股份有限公司 | Based on the processing method with self-correcting function touch control film processing unit (plant) |
| CN111619228A (en) * | 2018-07-04 | 2020-09-04 | 苏州泛普科技股份有限公司 | Production equipment of large-size touch control film |
| CN113968078A (en) * | 2018-07-04 | 2022-01-25 | 苏州泛普智能科技有限公司 | Printing processing method for touch control film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101082713A (en) * | 2007-07-02 | 2007-12-05 | 信利半导体有限公司 | Method for making Electric impedance type glass/glass type touch screen |
| CN101673165A (en) * | 2008-09-11 | 2010-03-17 | 比亚迪股份有限公司 | Resistance type glass-glass touch screen and manufacturing method thereof |
| CN101781095A (en) * | 2009-01-16 | 2010-07-21 | 中国南玻集团股份有限公司 | Manufacturing method of resistance-type touch screen |
| CN103327741A (en) * | 2013-07-04 | 2013-09-25 | 江俊逢 | 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof |
| CN103440074A (en) * | 2013-07-18 | 2013-12-11 | 苏州触动电子科技有限公司 | Manufacturing process of projection type capacitive touch screen |
| CN103747943A (en) * | 2011-04-17 | 2014-04-23 | 斯特拉塔西斯有限公司 | System and method for additive manufacturing of an object |
-
2014
- 2014-05-31 CN CN201410237620.7A patent/CN104461211B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101082713A (en) * | 2007-07-02 | 2007-12-05 | 信利半导体有限公司 | Method for making Electric impedance type glass/glass type touch screen |
| CN101673165A (en) * | 2008-09-11 | 2010-03-17 | 比亚迪股份有限公司 | Resistance type glass-glass touch screen and manufacturing method thereof |
| CN101781095A (en) * | 2009-01-16 | 2010-07-21 | 中国南玻集团股份有限公司 | Manufacturing method of resistance-type touch screen |
| CN103747943A (en) * | 2011-04-17 | 2014-04-23 | 斯特拉塔西斯有限公司 | System and method for additive manufacturing of an object |
| CN103327741A (en) * | 2013-07-04 | 2013-09-25 | 江俊逢 | 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof |
| CN103440074A (en) * | 2013-07-18 | 2013-12-11 | 苏州触动电子科技有限公司 | Manufacturing process of projection type capacitive touch screen |
Non-Patent Citations (1)
| Title |
|---|
| 马鹏举: "《加工工艺学》", 31 March 2014 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270507A (en) * | 2015-06-23 | 2017-01-04 | 空中客车德国运营有限责任公司 | Including the metal assembly of integrated glass fibre and the 3D Method of printing manufacturing it |
| CN106388807A (en) * | 2016-08-30 | 2017-02-15 | 中国科学院深圳先进技术研究院 | Preparation method for surface adhesive electrode array |
| CN106388807B (en) * | 2016-08-30 | 2019-12-20 | 中国科学院深圳先进技术研究院 | Preparation method of surface-attached electrode array |
| CN108318541A (en) * | 2017-01-16 | 2018-07-24 | 华邦电子股份有限公司 | Gas measuring device |
| CN108788156A (en) * | 2018-07-04 | 2018-11-13 | 苏州泛普科技股份有限公司 | Based on the processing method with self-correcting function touch control film processing unit (plant) |
| CN108788156B (en) * | 2018-07-04 | 2020-05-12 | 苏州泛普科技股份有限公司 | Processing method based on touch control film processing device with self-correcting function |
| CN111619228A (en) * | 2018-07-04 | 2020-09-04 | 苏州泛普科技股份有限公司 | Production equipment of large-size touch control film |
| CN111619228B (en) * | 2018-07-04 | 2022-01-11 | 苏州泛普科技股份有限公司 | Production equipment of large-size touch control film |
| CN113968078A (en) * | 2018-07-04 | 2022-01-25 | 苏州泛普智能科技有限公司 | Printing processing method for touch control film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104461211B (en) | 2017-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104461211A (en) | 3D manufacturing method for resistive touch screen | |
| CN104409172B (en) | 3D manufacturing method of latticed conducting array | |
| CN104407749A (en) | A method for 3D manufacturing an OGS capacitive touch screen | |
| CN103747943B (en) | System and method for additive manufacturing of an object | |
| TWI606915B (en) | 3D printing device with reciprocating spray forming mechanism | |
| CN104708809A (en) | Three-dimensional printing device | |
| CN103200782B (en) | A kind of complete ink-jet printed method of manufacturing circuit board | |
| CN105793803B (en) | Touch sensor and touch-panel device | |
| CN104760402A (en) | Exposure device used for three-dimensional printer, three-dimensional printer and three-dimensional printing method | |
| CN103135866A (en) | Manufacture method for capacitance type touch screen | |
| CN104407409B (en) | 3D printing method for dynamic liquid crystal grating | |
| TWI538141B (en) | Method for producing conductive circuits and touch screen | |
| CN102662549A (en) | Coverplate glass and transfer print technology on surface of coverplate glass | |
| CN104354463A (en) | Patterned printing equipment for nanometer materials | |
| Liu et al. | An Integrative 3D printing method for rapid additive manufacturing of a capacitive force sensor | |
| Huang et al. | The theoretical model and verification of electric-field-driven jet 3D printing for large-height and conformal micro/nano-scale parts | |
| Zhu et al. | Fabricating transparent electrodes by combined electric-field-driven fusion direct printing and the liquid bridge transfer method | |
| US10379687B2 (en) | Manufacture method for a projection capacitive touch screen | |
| CN104407750A (en) | 3D (Three-Dimensional) production method of capacitive touch screen | |
| CN103761017A (en) | Electronic equipment and manufacturing method for single-layered multipoint capacitive touch screen and touch layer | |
| CN104407459B (en) | A kind of built-in type touch display screen and its manufacture method | |
| CN104461188B (en) | A kind of preparation method of capacitance touch screen bridging structure | |
| CN104965619A (en) | Manufacturing method for metal grid type transparent conductive substrate | |
| CN104866154B (en) | A kind of method for printing screen for making projecting type capacitor touch screen | |
| CN104944415B (en) | Method for preparing flake graphite and system thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221026 Address after: 351100 Hanjiang District, Putian City, Fujian Province (Putian Hi tech Industrial Development Zone) Patentee after: Fujian hongshuochuang Electronic Technology Co.,Ltd. Address before: 350108 new campus of Fuzhou University, No. 2, Xue Yuan Road, University Town, Minhou street, Minhou, Fujian. Patentee before: FUZHOU University |
|
| TR01 | Transfer of patent right |