CN104461211B - A kind of 3D manufacture methods of resistive touch screen - Google Patents
A kind of 3D manufacture methods of resistive touch screen Download PDFInfo
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- CN104461211B CN104461211B CN201410237620.7A CN201410237620A CN104461211B CN 104461211 B CN104461211 B CN 104461211B CN 201410237620 A CN201410237620 A CN 201410237620A CN 104461211 B CN104461211 B CN 104461211B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The present invention relates to a kind of 3D manufacture methods of resistive touch screen, it is characterised in that comprise the following steps：Step 1：One upper substrate is provided；Step 2：One infrabasal plate is provided；Step 3：One dielectric isolation layer is provided；Step 4：One envelope framework is provided；Step 5：The upper substrate is directed at laminating with the infrabasal plate；Step 6：One conductive pole is provided；Step 7：FPC with touch-control IC chip is electrically connected by hot pressing with the connection pin of the first electrode and the second electrode, final resistive touch screen is formed.The present invention carries out the manufacture of resistive touch screen using the method that 3D is manufactured, and technique is greatly simplified compared with conventional method, saves the multiple tracks complicated technologies such as traditional handicraft exposure, development, etching, saves raw materials for production and manufacturing cost.
Description
Technical field
The present invention relates to the manufacture field of touch-screen, more particularly to a kind of resistive touch screen 3D printing manufacture method.
Background technology
Touch-screen is one of main application of touch sensible technology, its as a kind of brand-new man-machine communication's mode, in electricity
Consequence is gradually occupied in the new mode of operation of sub- product input device.It is catching the touch action information of human finger
It is basic point of departure, the information of finger touch action is changed into electric signal and identification is judged, is allowed to light with tradition machinery
" pressing " and the release movement for touching case button are of equal value.
Using technologies such as photoetching, printing and plated films more than the manufacture of existing touch-screen, wherein photoetching technique and coating technique is needed
Many road techniques are wanted, the multiple working procedures such as exposure, development, etching, cleaning are included if photoetching process, manufacture craft is relatively cumbersome,
And it belongs to " subtracting material manufacture ", inevitably causes the waste of material.Though print process overcomes the problem of waste of material,
The touch-screen accuracy that it makes is not high, and resolution ratio is relatively low.These traditional handicrafts are, it is necessary to multiple tracks gold-tinted and coating process, adopt
Subtraction making devices is used, so the complexity of technique is caused, yield rate, and the problems such as wastage of material.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, the advantage of 3D printing is combined, there is provided a kind of resistance-type
The 3D printing manufacture method of touch-screen.
Technical program of the present invention lies in：
The 3D manufacture methods of a kind of resistive touch screen, it is characterised in that comprise the following steps：
Step 1：One upper substrate is provided；The upper substrate includes the first glass substrate, to be arranged at the first glass substrate visual
First conductive layer in region, the first electrode for being arranged at first substrate edge, be arranged in first electrode several first lead
Circulation passage and several second conductive channels；Wherein,
If the transparency conducting layer that first conductive layer is constituted using the conductive material of one layer of 3D printing or dried layer；
If the conductive layer that the first electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
Step 2：One infrabasal plate is provided；The infrabasal plate includes the second glass substrate, to be arranged at the second glass substrate visual
Second conductive layer in region, the second electrode for being arranged at second substrate edge, the 3rd electrode and the 4th electrode；Wherein,
If the transparency conducting layer that second conductive layer is constituted using the conductive material of one layer of 3D printing or dried layer；
If the conductive layer that the second electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
If the conductive layer that the 3rd electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
If the conductive layer that the 4th electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
Step 3：One dielectric isolation layer is provided；If the lower substrate surface using one layer of 3D printing or the insulation of dried layer every
From post, a dielectric isolation layer is formed；
Step 4：One envelope framework is provided；If using the insulator seal frame of one layer of 3D printing or dried layer in the surrounding of the infrabasal plate
Glue, forms the envelope framework；
Step 5：The upper substrate is directed at laminating with the infrabasal plate；
Step 6：One conductive pole is provided；In first conductive channel and the second conductive channel using 3D manufacture one layer or
If the conductive metal material of dried layer constitutes a conductive pole, for connecting the 3rd electrode and the 4th electrode；
Step 7：FPC with touch-control IC chip is passed through into hot pressing and the first electrode and the company of the second electrode
Connect pin to be electrically connected, form final resistive touch screen；
Wherein, the 3D printing is comprised the following steps that：
S11：Design successively generates the first conductive layer, first electrode, the second conductive layer, second electricity of resistive touch screen
The three-dimensional digital model of pole, the 3rd electrode, the 4th electrode, separation layer, envelope framework and conductive pole；
S12：Using software to set up the first conductive layer, first electrode, the second conductive layer, second electrode, the 3rd electricity
Pole, the 4th electrode, separation layer, envelope framework and conductive pole threedimensional model are layered successively, obtain the two-dimentional sublayer of Z-direction；
S13：The two-dimentional sublayer is imported in 3D printer program, is drawn on every layer of two dimensional surface according to institute's established model
Material and shape, design printing path；
S14：The glass substrate layer is placed on 3D printing device table top, described first is printed successively in upper substrate surface
Conductive layer and first electrode, lower substrate surface print successively the second conductive layer, second electrode, the 3rd electrode, the 4th electrode, every
Absciss layer, envelope framework and conductive pole.
Wherein, the structure of described several first conductive channels and second conductive channel is cylinder, cuboid, just
Cube, is formed using Laser Processing or machine drilling.
First conductive layer and second conductive layer are transparency conducting layer, and the structure of the transparency conducting layer is orderly
It is latticed or unordered latticed, or be planar structure；The latticed conductive layer is by transparent conductive material or nontransparent conduction material
Material is constituted；The planar structure conductive layer is made up of transparent conductive material.
The transparency conducting layer include metal nanoparticle, metal quantum point, metal oxide, Graphene, CNT,
In metal nanometer line one or two and its above be composited.
The first electrode, second electrode, the 3rd electrode and the 4th electrode are shaped as latticed, strip, planar；
The first electrode, second electrode, the 3rd electrode and the 4th electrode can by metal nanoparticle, metal quantum point,
The list structure conductive layer that metal paste, carbon are starched one or two and its is composited above.
The separation layer is made up of several transparent isolation posts, between the insulated column is uniform from left to right in the horizontal direction
Every a horizontal line is arranged to make up, in the vertical direction is even to be spaced one vertical row of composition, in the horizontal and vertical directions
The distance between adjacent separaant is 1-100 millimeters, and insulated column is highly 10-5000 microns, a diameter of 10-3000 microns.
The envelope framework is made up of opaque sealant, the height of the thickness more than or equal to insulated column of the sealant
Degree.
The conductive pole can by metal nanoparticle, metal quantum point, metal paste, carbon starch one or two and its more than
The conductive layer being composited.
The 3D printing method includes stereolithography apparatus, selective laser sintering, Fused Deposition Modeling, three dimensional printing
It is molded with inkjet printing.
A touch-screen or multiple touch-screen arrays are printed on the same substrate, and the multiple touch-screen array is using cutting
Mode separated.
The advantage of the invention is that：
The present invention carries out the manufacture of resistive touch screen using the method that 3D is manufactured, and technique is significantly simple compared with conventional method
Change, save the multiple tracks complicated technologies such as traditional handicraft exposure, development, etching, save raw materials for production and manufacturing cost.
Brief description of the drawings
Fig. 1 is the flow chart that a kind of 3D that the present invention is provided manufactures resistive touch screen.
Fig. 2 is a kind of 3D manufacture resistive touch screen structure schematic diagrames that the present invention is provided.
Fig. 3 is a kind of 3D manufacture resistive touch screen upper substrate floor map that the present invention is provided.
Fig. 4 manufactures resistive touch screen infrabasal plate floor map for a kind of 3D that the present invention is provided.
Specific embodiment
It is that features described above of the invention and advantage can be become apparent, special embodiment below makees detailed with reference to accompanying drawing
It is described as follows.
The present invention will be below described in further detail by specific embodiment.
Referring to figs. 1 to Fig. 4, the 3D manufacture methods of resistive touch screen include following steps：
（S1）One upper substrate 10 is provided.The upper substrate 10 includes the first glass substrate 11, is arranged at the first glass substrate
If the first conductive layer 12 of viewing area, being arranged at the first electrode 13 at first substrate edge, being arranged in first electrode 13
Dry the first conductive channel 14 and several second conductive channels 15.Wherein, first conductive layer 12, the first electrode 13
Can be realized using 3D manufacturing technologies, specific manufacturing step is as follows：
（S11）One glass substrate 11 is provided.According to design size, a suitable glasses substrate is chosen, by the glass substrate
110 are placed in by volume as Win-10:DI water=3:In 97 cleaning fluids, using frequency for the ultrasonic machine of 32KHz is cleaned
15min, after spray 2min, then is placed in volume ratio for Win41:DI water=5:It is 40KHz using frequency in 95 cleaning fluids
Ultrasonic machine cleaning 10min, after circulating running water spray rinsing 2min, recycle frequency pure in DI for the ultrasonic machine of 28KHz
10min is cleaned in water purification, is placed in after air knife drying in 50 DEG C of cleaning ovens and is incubated 30min.
（S12）First conductive layer 12 makes.Reference picture 3, the conductive layer 12 is transparency conducting layer, the transparency conducting layer
Structure be ordered grid shape or unordered latticed, or planar structure.The latticed conductive layer is by transparent conductive material
Or nontransparent conductive material is constituted；The planar structure conductive layer is made up of transparent conductive material.The material of the transparency conducting layer
Material include one kind in metal nanoparticle, metal quantum point, metal oxide, Graphene, CNT, metal nanometer line or
Two kinds and its above are composited.First conductive layer can be prepared using laser sintered or melting extrusion shaping, can also be adopted
Prepared with the Stereo Lithography of light-sensitive material, three dimensional printing or inkjet printing.Wherein, metal nanoparticle, metal quantum point
Or metal oxide can be made using selective laser sintering or melting extrusion shaping；Metal quantum point, Graphene, carbon are received
Mitron, metal nanometer line, metal oxide nanostructure also can be admittedly molded using the cubic light of light-sensitive material, three dimensional printing or three
Dimension inkjet printing is made.
The laser sintered metal nano Argent grain of preferably selecting property of the present embodiment make it is latticed it is transparent lead the first conductive layer 12,
Comprise the following steps that：
（S121）The three-dimensional digital model of the first conductive layer 12 in design generation resistive touch screen；
（S122）The threedimensional model of the patterned transparent conductive layer 12 using software to being set up is layered successively, it is determined that
The parameter of the planar transparency conducting layer of ordered grid shape, including web thickness, line footpath and aperture；The preferred planar conductive layer of this implementation
The thickness of metal grid lines be 0.2 micron, the width of metal grid lines is 3 microns, and metal grill aperture is 8 microns；
（S123）The two-dimentional sublayer is imported in 3D printer program, is drawn on every layer of two dimensional surface according to institute's established model
Material and shape, design printing path；
（S124）Above-mentioned glass substrate layer is placed on 3D printing device table top, first conductive layer 12 is printed.Specifically
Principle is as follows：Metal silver nano-grain is uniformly transferred to the visual of glass basic surface in the horizontal direction using powdering roller apparatus
Region, the solution temperature for controlling laser beam to make its sintering temperature be metal silver nano-grain, laser head is moved along direction initialization, is swashed
The logical metal silver nano-particle powder to substrate surface of superlaser that light sends is irradiated, and dissolves on its scanning pattern
Silver nano-grain；Repeat said process and obtain required patterned transparent conductive layer 12.
（S125）Substrate surface treatment.The substrate that manufacture is completed removes 3D printing equipment, cleaning array surface and inside,
Including spraying printing and it is laser sintered during remain in the unnecessary metal copper nano granules of substrate surface.
（S13）First electrode 13 makes.Reference picture 3, being shaped as the first electrode is latticed, strip, planar or its
Its pattern；The first electrode can by metal nanoparticle, metal quantum point, metal paste, carbon starch one or two and its with
On the list structure conductive layer that is composited.The first electrode can using alternative laser sintered or melting extrusion shaping come
Prepare, can also be prepared using the printing of the Stereo Lithography of light-sensitive material, three dimensional printing or three dimensional ink jet；Wherein, metal nano
Particle, metal quantum point can be made using selective laser sintering or melting extrusion shaping；Metal quantum point, metal pulp
Material, carbon are starched also can be admittedly molded using the cubic light of light-sensitive material, three dimensional printing or three dimensional ink jet printing and making are formed
The present embodiment preferred three-dimensional printing argent quantum dot makes the first electrode 13 of list structure, and specific steps are such as
Under：
（S131）The three-dimensional digital model of the first electrode 130 in design generation resistive touch screen；
（S132）The threedimensional model of the second connection electrode 160 using software to being set up is layered successively, determines
The structural parameters of one electrode 13, including the spacing between thickness of electrode, width and adjacent electrode；The preferred strip conductive layer of this implementation
Width be 150um, spacing between adjacent strip conductive layer is 80um；Constitute every strip conductive layer metal thickness be
250nm.；
（S133）The two-dimentional sublayer is imported in 3D printer program, is drawn on every layer of two dimensional surface according to institute's established model
Material and shape, design printing path；
（S134）The glass substrate layer is placed on 3D printing device table top, the first electrode 13 is printed.It is specific former
Reason is as follows：By argent quantum dot by storage vat send out, then with roller will send out argent quantum dot in substrate of glass 11 4
The very thin argent quantum dot layer of all layer overlay, 3D printing nozzle defines the profile for coming and sprays after being cut into slices according to computer model
Go out binding agent, stick together argent quantum dot；After the completion of one layer, machine table declines a bit automatically, and storage vat rises a bit, in repetition
The process of stating obtains required first electrode 13.
（S135）The substrate that manufacture is completed removes 3D printing equipment, cleaning array surface and inside, including spraying printing
The unnecessary argent quantum dot of substrate surface is remained in forming process.,
（S14）First conductive channel 14 and the second conductive channel 15 make.Reference picture 3, described several first conductings are logical
The structure of road 14 and second conductive channel 15 can be cylinder, cuboid, square or other patterns, can be added using laser
Work or machine drilling are formed.This example preferably laser machines into the first conductive channel 14 of cube structure and second conducting
Passage 15, comprises the following steps that：
（S141）The structural parameters of the first conductive channel 14 and second conductive channel 15 are designed, including the first conducting is led to
The number in road 14, the size of conductive channel, the spacing between conductive channel and conductive channel, the number of the second conductive channel 15,
The size of conductive channel, the spacing between conductive channel and conductive channel；
（S142）Suitable laser is selected, laser energy is controlled, Laser Processing forms the first conductive channel 14 and second
Conductive channel 15.
（S2）One infrabasal plate 20 is provided.The infrabasal plate 20 includes the second glass substrate 21, is arranged at the second glass substrate
Second conductive layer 22 of 21 viewing areas, second electrode 23, the 3rd electrode 24 and the 4th electrode for being arranged at second substrate edge
25.Wherein, second conductive layer 22, the second electrode 23, the 3rd electrode 24 and the 4th electrode 25 can manufacture skill using 3D
Art realizes that specific manufacturing step is as follows：
（S21）One glass substrate 11 is provided.According to design size, a suitable glasses substrate is chosen, by the glass substrate
110 are placed in by volume as Win-10:DI water=3:In 97 cleaning fluids, using frequency for the ultrasonic machine of 32KHz is cleaned
15min, after spray 2min, then is placed in volume ratio for Win41:DI water=5:It is 40KHz using frequency in 95 cleaning fluids
Ultrasonic machine cleaning 10min, after circulating running water spray rinsing 2min, recycle frequency pure in DI for the ultrasonic machine of 28KHz
10min is cleaned in water purification, is placed in after air knife drying in 50 DEG C of cleaning ovens and is incubated 30min.
（S22）Second conductive layer 22 makes.Reference picture 4, the conductive layer 22 is transparency conducting layer, the transparency conducting layer
Structure be ordered grid shape or unordered latticed, or planar structure.The latticed conductive layer is by transparent conductive material
Or nontransparent conductive material is constituted；The planar structure conductive layer is made up of transparent conductive material.The material of the transparency conducting layer
Material include one kind in metal nanoparticle, metal quantum point, metal oxide, Graphene, CNT, metal nanometer line or
Two kinds and its above are composited.First conductive layer can be prepared using laser sintered or melting extrusion shaping, can also be adopted
Prepared with the Stereo Lithography of light-sensitive material, three dimensional printing or inkjet printing.Wherein, metal nanoparticle, metal quantum point
Or metal oxide can be made using selective laser sintering or melting extrusion shaping；Metal quantum point, Graphene, carbon are received
Mitron, metal nanometer line, metal oxide nanostructure also can be admittedly molded using the cubic light of light-sensitive material, three dimensional printing or three
Dimension inkjet printing is made.The laser sintered metal nano Argent grain of preferably selecting property of the present embodiment makes latticed transparent leads the
One conductive layer 22, specific steps with（S12）Unanimously.
（S23）Second electrode 23, the 3rd electrode 24 and the 4th electrode 25 make.Reference picture 4, the second electrode 23,
Three electrodes 24 and the 4th electrode 25 are shaped as latticed, strip, planar or other patterns；The first electrode can be received by metal
The list structure conductive layer that rice grain, metal quantum point, metal paste, carbon are starched one or two and its is composited above.Institute
State the second electrode 23, the 3rd electrode 24 and the 4th electrode 25 can using alternative laser sintered or melting extrusion shaping come
Prepare, can also be prepared using the printing of the Stereo Lithography of light-sensitive material, three dimensional printing or three dimensional ink jet；Wherein, metal nano
Particle, metal quantum point can be made using selective laser sintering or melting extrusion shaping；Metal quantum point, metal pulp
Material, carbon slurry also can be admittedly molded using the cubic light of light-sensitive material, three dimensional printing or three dimensional ink jet printing and making and cost implementation
Preferred three-dimensional printing argent quantum dot makes the second electrode 23, the 3rd electrode 24 and the 4th electrode 25 of list structure,
Specific steps with（S23）Step is consistent.
（S3）Separation layer makes.The separation layer is made up of several transparent isolation posts 30, and the insulated column 30 is in level
Uniform intervals are arranged to make up a horizontal line from left to right on direction, and in the vertical direction is even to be spaced composition one vertically
Arrange, the distance between adjacent insulated column 30 is 1-100 millimeters in the horizontal and vertical directions, and insulated column is highly 10-5000
Micron, it is a diameter of 10-3000 microns.The insulated column 30 can be made using alternative laser sintered or melting transparent medium
Make.
Preferably laser sintered polyethylene particle of the invention is fabricated to transparent isolation post 30.Comprise the following steps that：
（S31）The three-dimensional digital model of the insulated column 30 in design generation resistive touch screen；
（S32）The threedimensional model of the insulated column 30 using software to being set up is layered successively, determines insulated column 30
Structural parameters, including insulated column 30 the distance between height, diameter, adjacent insulated column；
（S33）The two-dimentional sublayer is imported in 3D printer program, is drawn on every layer of two dimensional surface according to institute's established model
Material and shape, design printing path；
（S34）Polyethylene particle is shifted.Polyethylene particle is uniformly transferred to base in the horizontal direction using powdering roller apparatus
Basal surface, or utilization increases material equipment（3D printing）In shower nozzle along its scanning pattern（Metal grill line footpath direction）Move poly- second
Alkene particle is uniformly coated on substrate surface；Uniformly be transferred to polyethylene particle in the horizontal direction by the preferred powdering roller apparatus of this implementation
Substrate surface.
（S35）Polyethylene particle is melted.Controlling laser beam makes its sintering temperature be 132 DEG C, and laser head is along the planar for setting
Direction is moved, and the superlaser that laser sends is irradiated to the polyethylene particle of substrate surface, and dissolves on its scanning pattern
Polyethylene particle.Polyethylene particle sticks together with substrate after fusing；
（S36）Repeat（S34）With（S35）Step, the insulated column 30 needed for being formed.
（S37）The substrate that manufacture is completed removes 3D printing equipment, cleaning array surface and inside, including laser sintered mistake
The unnecessary polyethylene particle of substrate surface is remained in journey.
（S4）Envelope framework 40 makes.The envelope framework can be formed by the opaque sealant of 3D printing, the sealant
Height of the thickness more than or equal to the insulated column 30.
（S5）Alignment laminating.The upper substrate 10 and infrabasal plate 20 are aligned, hot pressing laminating.
（S6）Conductive pole 50 makes.The conductive pole 50 can be by Stereo Lithography, selective laser sintering, fusion sediment
Manufacture, three dimensional printing or inkjet printing metal nanoparticle, metal quantum point, metal paste, carbon starch one or two and its with
On be composited.
The preferred inkjet printing Nano Silver electric ink of the present embodiment makes conductive pole 50, and specific experiment step is as follows：
（S61）The three-dimensional digital model of the conductive pole 50 in design generation resistive touch screen；
（S62）The threedimensional model of conductive pole 50 set up is layered successively using software, obtains the two dimension of Z-direction
Sublayer；
（S63）The two-dimentional sublayer is imported in 3D printer program, is drawn on every layer of two dimensional surface according to institute's established model
Material and shape, design printing path；
（S64）Above-mentioned glass substrate layer is placed on 3D printing device table top, the conductive pole 50 is printed.Concrete principle is such as
Under：Will in dispersed nano-silver particles to solution prepare 3D printing Nano Silver electric ink, by electric ink move into fluid reservoir in,
Nano Silver electric ink is printed upon in the first conductive channel 14 and the second conductive channel 15 by micro- printhead of inkjet printing,
Low temperature drying processes to remove solvent, then is made annealing treatment, and repeats said process and forms required conductive pole 50.
（S65）The substrate for completing will be manufactured and remove 3D printing equipment, cleaning array surface with it is internal, including spraying printing and
The unnecessary electric ink of substrate surface is remained in annealing process.
（S7）FPC is pressed with electrode pin.FPC60 with touch-control IC chip is passed through into hot pressing and the first electrode 13
Pin with the second electrode 23 is electrically connected, and forms final resistive touch screen, as shown in Figure 2.
So far, a kind of 3D printing manufacture method of resistive touch screen of first preferred embodiment of the invention is completed.
The foregoing is only presently preferred embodiments of the present invention, all impartial changes done according to scope of the present invention patent with
Modification, should all belong to covering scope of the invention.
Claims (10)
1. 3D manufacture methods of a kind of resistive touch screen, it is characterised in that comprise the following steps：
Step 1：One upper substrate is provided；The upper substrate includes the first glass substrate, is arranged at the first glass substrate viewing area
The first conductive layer, the first electrode for being arranged at first substrate edge, several first conductings for being arranged in first electrode it is logical
Road and several second conductive channels；Wherein,
If the transparency conducting layer that first conductive layer is constituted using the conductive material of one layer of 3D printing or dried layer；
If the conductive layer that the first electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
Step 2：One infrabasal plate is provided；The infrabasal plate includes the second glass substrate, is arranged at the second glass substrate viewing area
The second conductive layer, the second electrode, the 3rd electrode and the 4th electrode that are arranged at second substrate edge；Wherein,
If the transparency conducting layer that second conductive layer is constituted using the conductive material of one layer of 3D printing or dried layer；
If the conductive layer that the second electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
If the conductive layer that the 3rd electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
If the conductive layer that the 4th electrode is constituted using the conductive metal material of one layer of 3D printing or dried layer；
Step 3：One dielectric isolation layer is provided；If in the lower substrate surface being dielectrically separated from using one layer of 3D printing or dried layer
Post, forms a dielectric isolation layer；
Step 4：One envelope framework is provided；If using the insulation sealant of one layer of 3D printing or dried layer in the surrounding of the infrabasal plate,
Form the envelope framework；
Step 5：The upper substrate is directed at laminating with the infrabasal plate；
Step 6：One conductive pole is provided；In first conductive channel and the second conductive channel one layer or some is manufactured using 3D
The conductive metal material of layer constitutes a conductive pole, for connecting the 3rd electrode and the 4th electrode；
Step 7：FPC with touch-control IC chip is drawn by hot pressing with the connection of the first electrode and the second electrode
Pin is electrically connected, and forms final resistive touch screen；
Wherein, the 3D printing is comprised the following steps that：
S11：Design generation the first conductive layer of resistive touch screen, first electrode, the second conductive layer, second electrode, the successively
The three-dimensional digital model of three electrodes, the 4th electrode, separation layer, envelope framework and conductive pole；
S12：Using software to the first conductive layer, first electrode, the second conductive layer, second electrode, the 3rd electrode, set up
Four electrodes, separation layer, envelope framework and conductive pole threedimensional model are layered successively, obtain the two-dimentional sublayer of Z-direction；
S13：The two-dimentional sublayer is imported in 3D printer program, the material on every layer of two dimensional surface is drawn according to institute's established model
And shape, design printing path；
S14：The glass substrate layer is placed on 3D printing device table top, it is conductive to print described first successively in upper substrate surface
Layer and first electrode, the second conductive layer, second electrode, the 3rd electrode, the 4th electrode, isolation are printed in lower substrate surface successively
Layer, envelope framework and conductive pole.
2. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that it is described several first
The structure of conductive channel and second conductive channel is cylinder, cuboid, square, using Laser Processing or machine drilling
Form.
3. a kind of 3D manufacture methods of resistive touch screen according to claim 1, it is characterised in that first conductive layer
It is transparency conducting layer with second conductive layer, the structure of the transparency conducting layer is ordered grid shape or unordered latticed, or
It is planar structure；The latticed conductive layer is made up of transparent conductive material or nontransparent conductive material；The planar structure is led
Electric layer is made up of transparent conductive material.
4. a kind of 3D manufacture methods of resistive touch screen according to claim 3, it is characterised in that the transparency conducting layer
Including the one kind or two in metal nanoparticle, metal quantum point, metal oxide, Graphene, CNT, metal nanometer line
Plant and its be composited above.
5. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that the first electrode,
Second electrode, the 3rd electrode and the 4th electrode are shaped as latticed, strip, planar；The first electrode, second
Electrode, the 3rd electrode and the 4th electrode can be by metal nanoparticle, metal quantum point, metal paste, carbon slurry one kind or two
The list structure conductive layer planted and its be composited above.
6. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that if the separation layer by
Dry transparent isolation post is constituted, and uniform intervals are arranged to make up a horizontal line to the insulated column from left to right in the horizontal direction,
In the vertical direction is even to be spaced one vertical row of composition, and the distance between adjacent insulated column is equal in the horizontal and vertical directions
It it is 1-100 millimeters, insulated column is highly 10-5000 microns, a diameter of 10-3000 microns.
7. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that the envelope framework is not by
Transparent sealant composition, the height of the thickness more than or equal to insulated column of the sealant.
8. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that the conductive pole can be by
The conductive layer that metal nanoparticle, metal quantum point, metal paste, carbon are starched one or two and its is composited above.
9. a kind of 3D manufacture methods of resistive touch screen according to claim 1, it is characterised in that the 3D printing method
Including the shaping of stereolithography apparatus, selective laser sintering, Fused Deposition Modeling, three dimensional printing and inkjet printing.
10. 3D manufacture methods of a kind of resistive touch screen according to claim 1, it is characterised in that on the same substrate
One touch-screen of printing or multiple touch-screen arrays, the multiple touch-screen array are separated by the way of cutting.
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| DE102015211559A1 (en) * | 2015-06-23 | 2016-12-29 | Airbus Operations Gmbh | Metal component with integrated glass fibers for an aerospace vehicle and 3D printing process for producing a metal component with integrated glass fibers |
| CN106388807B (en) * | 2016-08-30 | 2019-12-20 | 中国科学院深圳先进技术研究院 | Preparation method of surface-attached electrode array |
| CN108318541B (en) * | 2017-01-16 | 2021-05-04 | 华邦电子股份有限公司 | Gas sensing device |
| CN108788156B (en) * | 2018-07-04 | 2020-05-12 | 苏州泛普科技股份有限公司 | Processing method based on touch control film processing device with self-correcting function |
| CN111619228B (en) * | 2018-07-04 | 2022-01-11 | 苏州泛普科技股份有限公司 | Production equipment of large-size touch control film |
| CN108829291B (en) * | 2018-07-04 | 2021-07-27 | 苏州泛普智能科技有限公司 | Processing method based on multifunctional processing device for touch control film |
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