CN103200782B - A kind of complete ink-jet printed method of manufacturing circuit board - Google Patents
A kind of complete ink-jet printed method of manufacturing circuit board Download PDFInfo
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- CN103200782B CN103200782B CN201310135283.6A CN201310135283A CN103200782B CN 103200782 B CN103200782 B CN 103200782B CN 201310135283 A CN201310135283 A CN 201310135283A CN 103200782 B CN103200782 B CN 103200782B
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Abstract
A kind of complete ink-jet printed method of manufacturing circuit board, described method comprises: prepare support plate according to layout design size; And print electrically conductive ink and dielectric ink on its surface by ink jet printing simultaneously, and form the method for inner layer circuit board.The present invention can shorten printed circuit board manufacture work flow by high degree, relates to tens technological processes, shortens to only several technological process and just can complete, decrease the input waste of the resources such as factory, personnel and auxiliary facility simultaneously by original.
Description
Technical field
The present invention relates to the manufacture field of printed board, be specially a kind of complete ink-jet printed method of manufacturing circuit board.
Background technology
Ink jet printing is also referred to as inkjet printing as a kind of typography, itself and lithographic printing, the same transfer that can be used for figure of silk screen printing.Ink jet printing is contactless physical print technique, do not need to use chemical medicinal liquid, also unlike type printing and exposed photographic, use forme or film to print, it only needs printed pattern directly by computer export, controlled the shower nozzle of ink-jet system by controller, ink particle is being sprayed by nozzle and forms figure.
1. application number 200480012609.5 discloses a kind of composition, and it can adopt ink jet printing to produce the method for soldering-resistant pattern on circuit boards, but is only limitted to the welding resistance figure manufacturing circuit board.
2. application number 200610168058.2 discloses a kind of multi-layer circuit board fabrication process, mention the method being manufactured conductive pattern by spray printing catalyst grains and chemical method, the method is confined to manufacture conductive pattern, and need a large amount of chemical medicinal liquid and the manufacture of process matched therewith ability completing circuit plate, should filtering technique be belonged to.
3. the tectal method of the open a kind of manufacture printed circuit board of application number 200710153026.X, it adopts ink jet printing that ink jet-printing will be protected at circuit board surface, but is only confined to the outer surface cover layer figure manufacturing circuit board.
4. application number 200810303086.X discloses a kind of ink of silver emulsion that uses and manufactures the method for conducting wire by ink jet printing, and the method is also only confined to the conductive pattern manufacturing circuit board.
In sum, current existing printed circuit board ink-jet technology is only confined to certain step on the numerous manufacturing process flow of printed circuit board, but all cannot fundamentally solve printed circuit panel products because of technological process huge tediously long, and the many serious chemical contamination existed, exhaust emission, the environmental issues such as high energy consumption.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of complete ink-jet printed method of manufacturing circuit board, and the method not only accurately can control figure, easy and simple to handle, and high degree shortens circuit board work flow; And do not relate to the processing procedure of any chemical medicinal liquid or gas, therefore produce waste liquid, waste gas, significantly reduce waste of raw materials, be the printed-circuit board manufacturing technology of a kind of low-carbon (LC), energy-saving and environmental protection simultaneously.
Technical problem solved by the invention realizes by the following technical solutions:
A kind of complete ink-jet printed method of manufacturing circuit board, comprises the following steps:
(1) by circuit board layout designing requirement, prepare measure-alike support plate, be placed into ink-jet printer;
(2) by computer, inner line figure is inputted ink-jet printer, use electrically conductive ink to print line pattern, logicalnot circuit graphics field uses insulating resin ink print out, manufactures individual layer inner layer circuit board;
(3) after inner layer circuit board being carried out hot pressing leveling, hot curing or photocuring process, repeat step 1, step 2, form the multilayer inner layer circuit board that thickness meets the conductive layer of designing requirement, via and insulating barrier;
(4) be separated with support plate by multilayer inner layer circuit board, specific function support plate can not be separated;
(5) use electrically conductive ink, go out the outer layer conductive layer figure of circuit board at the upper and lower surperficial inkjet printing of multilayer inner layer circuit board, and carry out hot pressing leveling and hot curing or photocuring process;
(6) use solder mask and protection ink, layer circuit board surface inkjet printing goes out welding resistance figure and protection figure outside, and carries out hot pressing leveling and hot curing or photocuring process;
(7) use legend ink, in the ink jet printing of circuit board finished surface, character indicates pattern, and carries out hot curing or photocuring process;
(8) external form processing is carried out to the circuit board after printed character, form final multilayer printed circuit board finished product.
As preferred version of the present invention, described support plate can use the loading plate of papery, metal, glass, pottery or resin material class, can need to select flexible or rigid according to function simultaneously.
As preferred version of the present invention, described ink-jet printer, common household printer can be used, Epson printer of such as modified form, the color that Computer Design pressed by dissimilar ink exports, be placed in corresponding ink-cases of printers, to ensure good printing effect, wherein electrically conductive ink can adopt the electrically conductive ink of Nano Silver or nanometer Cu and its oxides; Dielectric ink can adopt epoxy resin, polyphenylene oxide, polyimides etc. and modified resin ink thereof; Solder mask and legend ink are welding resistance and the legend ink of ordinary epoxy resin class; Protection ink is that tin cream class helps solder paste ink.
As preferred version of the present invention, described hot pressing leveling, can use temperature control electric iron to carry out the smooth process of hot pressing to circuit board semi-finished product, and to ensure smooth printing interface well, described external form processing, adopts the method such as laser cutting or machine cuts.
As preferred version of the present invention, described conductive layer thickness is 2-20 μm, and described via height is 5-50 μm, and described thickness of insulating layer is 5-75 μm; Heat curing temperature is 80-200 degree, and the time is 2-60 minute; Light curable type is UV photocuring, and curing time is 1-30 minute; Hot pressing leveling temperature is 50-100 degree, pressure 1-50KG.
Compared with prior art, tool of the present invention has the following advantages:
1, the present invention can shorten printed circuit board manufacture work flow by high degree, relates to tens technological processes, shortens to only several technological process and just can complete, decrease the input waste of the resources such as factory, personnel and auxiliary facility simultaneously by original;
2, Product processing of the present invention does not relate to any chemical medicinal liquid and gas, produce without waste liquid, waste gas, meet national requirements for environmental protection, Product processing is without any need for auxiliary consumptive material simultaneously, material average utilization can bring up to more than 95% by original 60%, meets low-carbon energy-saving theory;
3, the complete ink-jet printed method of manufacturing circuit board of the present invention, is also applicable to metal-based circuit board, thick copper printed circuit board, buries appearance and bury the Product processing such as resistance circuit plate, semiconducter IC support plate.
Accompanying drawing explanation
Fig. 1 support plate and ground floor spray printing layer schematic diagram;
The schematic diagram of Fig. 2 support plate and the two-sided inner plating of spray printing;
Fig. 3 full spray printing two sided pcb schematic diagram;
The full spray printing of Fig. 4 four layers of printed circuit board schematic diagram.
Embodiment
Be described further below in conjunction with accompanying drawing and the preferred embodiment of the present invention.
As Fig. 1, 2, 3, shown in 4, comprise: ground floor conductive layer 1, ground floor insulating barrier 2, spray printing 3 for the first time, support plate 4, third layer conductive layer 21, access hole 22, third layer insulating barrier 23, second time spray printing 25, spray printing 24 for the third time, ground floor solder mask 30, second layer character layer 31, second layer protective layer 32, second layer solder mask 33, second layer insulating barrier 34, ground floor protective layer 35, ground floor character layer 36, layer 5 conductive layer 41, layer 7 conductive layer 42, layer 7 insulating barrier 44, layer 6 insulating barrier 45, layer 5 insulating barrier 46, 4th layer insulating 47,
Embodiment 1
As Figure 1-3, the manufacture method of a kind of complete ink-jet printed circuit board in the present embodiment, comprise the following steps: elder generation according to computer export figure spray printing the 1st layer of conductive layer and the 1st layer insulating, after 3 spray printings, completes double-deck inner layer circuit board on support plate; Again by this double-deck inner layer circuit board, spray printing solder mask and protective layer, last spray printing character layer, finally completes odt circuit board manufacturing process, comprises step by step following successively:
1, a support plate 4 is prepared;
2, ground floor conductive layer 1 and ground floor insulating barrier 2 on spray printing on this support plate, its thickness is 10 μm;
3, hot curing process is carried out, temperature 120 degree, 10 minutes time;
4, repeat step 2, on support plate, spray printing forms access hole 22 and second layer insulating barrier 34, and its thickness is 20 μm;
5, step 3 is repeated;
6, repeat step 2, on support plate, spray printing forms third layer conductive layer 21 and third layer insulating barrier 23, and its thickness is 10 μm; This step completes two-sided inner plating;
7, support plate 4 is separated with two-sided inner plating;
8, at two-sided inner plating lower surface, spray printing ground floor solder mask 30 and ground floor protective layer 35, its thickness is 5 μm;
9, on ground floor solder mask 30 surface, spray printing ground floor character layer 36, its thickness is 3 μm;
10, repeat step 8, at two-sided inner plating upper surface spray printing second layer solder mask 33 and second layer protective layer 32, its thickness is 5 μm;
11, step 9 is repeated, on second layer solder mask 33 surface, spray printing second layer protective layer 32, its thickness is 3 μm;
12, as shown in Figure 3, final double-sided PCB is carried out last hot curing, its temperature is 120 degree, 60 minutes.
In described step 3, hot curing process preferably uses vacuum drying oven or nitrogen oven, and to ensure that conductive layer can not be oxidized, the support plate 4 after being separated in step 7 can be recycled.
Embodiment 2
As shown in Fig. 1,2,4, the manufacture method of a kind of complete ink-jet printed circuit board in the present embodiment, comprise the following steps: elder generation according to computer export figure spray printing the 1st layer of conductive layer and the 1st layer insulating, after 7 spray printings, completes four layers of inner layer circuit board on support plate; Again by these four layers of inner layer circuit boards, spray printing solder mask and protective layer, last spray printing character layer, finally completes four-layer circuit board manufacture process, comprises step by step following successively:
1, a support plate 4 is prepared;
2, ground floor conductive layer 1 and ground floor insulating barrier 2 on spray printing on this support plate, its thickness is 15 μm;
3, hot curing process is carried out, temperature 120 degree, 30 minutes time;
4, repeat step 2, on support plate, spray printing forms access hole 22 and second layer insulating barrier 34, and its thickness is 30 μm;
5, step 3 is repeated;
6, repeat step 2, on support plate, spray printing forms third layer conductive layer 21 and third layer insulating barrier 23, and its thickness is 15 μm;
7, repeat step 2-6, support plate forms via 22, the 4th layer insulating 47 successively, layer 5 conductive layer 41, layer 5 insulating barrier 46, via 22, layer 6 insulating barrier 45, layer 7 conductive layer 42 and layer 7 insulating barrier 44; This step completes four layers of inner plating, as shown in Figure 4;
8, support plate 4 is separated with four layers of inner plating;
9, at four layers of inner plating lower surface, spray printing ground floor solder mask 30 and ground floor protective layer 35, its thickness is 8 μm;
10, on ground floor solder mask 30 surface, spray printing ground floor character layer 36, its thickness is 5 μm;
11, at four layers of inner plating upper surface spray printing second layer solder mask 33 and second layer protective layer 32, its thickness is 8 μm;
12, on second layer solder mask 33 surface, spray printing second layer protective layer 32, its thickness is 5 μm;
13, final four-layer circuit board is carried out last hot curing, its temperature is 130 degree, 60 minutes time.
In described step 3, hot curing process preferably uses vacuum drying oven or nitrogen oven, to ensure that conductive layer can not be oxidized; Support plate 4 after being separated in step 8 can be recycled.Step 7, according to product design requirement, can produce multilayer inner plating after repeatedly repeating, therefore the method can produce the circuit board product being greater than more than 3 layers.
In addition; it should be noted that, the specific embodiment described in this specification, its each several part title etc. can be different; all equivalences of doing according to structure, feature and the principle described in inventional idea of the present invention or simple change, be included in the protection range of patent of the present invention.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment; only otherwise depart from structure of the present invention or surmount this scope as defined in the claims, protection scope of the present invention all should be belonged to.
Claims (5)
1. a complete ink-jet printed method of manufacturing circuit board, is characterized in that, comprise the following steps:
(1) by circuit board layout designing requirement, prepare measure-alike support plate, be placed into ink-jet printer;
(2) by computer, inner line figure is inputted ink-jet printer, use electrically conductive ink to print line pattern, logicalnot circuit graphics field uses insulating resin ink print out, manufactures individual layer inner layer circuit board;
(3) after inner layer circuit board being carried out hot pressing leveling, hot curing or photocuring process, repeat step 1, step 2, form the multilayer inner layer circuit board that thickness meets the conductive layer of designing requirement, via and insulating barrier;
(4) multilayer inner layer circuit board is separated with support plate;
(5) use electrically conductive ink, go out the outer layer conductive layer figure of circuit board at the upper and lower surperficial inkjet printing of multilayer inner layer circuit board, and carry out hot pressing leveling and hot curing or photocuring process;
(6) use solder mask and protection ink, layer circuit board surface inkjet printing goes out welding resistance figure and protection figure outside, and carries out hot pressing leveling and hot curing or photocuring process;
(7) use legend ink, in the ink jet printing of circuit board finished surface, character indicates pattern, and carries out hot curing or photocuring process;
(8) external form processing is carried out to the circuit board after printed character, form final multilayer printed circuit board finished product.
2. a kind of complete ink-jet printed method of manufacturing circuit board according to claim 1, is characterized in that, described support plate uses the loading plate of papery, metal, glass, pottery or resin material class, can need to select flexibility or rigid according to function simultaneously.
3. a kind of complete ink-jet printed method of manufacturing circuit board according to claim 1, is characterized in that described ink-jet printer uses common household printer.
4. a kind of complete ink-jet printed method of manufacturing circuit board according to claim 1, it is characterized in that, described hot pressing leveling, temperature control electric iron is used to carry out the smooth process of hot pressing to circuit board semi-finished product, to ensure smooth printing interface well, described external form processing, adopts laser cutting or mechanical cutting method.
5. a kind of complete ink-jet printed method of manufacturing circuit board according to claim 1, it is characterized in that, described conductive layer thickness is 2-20 μm, and described via height is 5-50 μm, and described thickness of insulating layer is 5-75 μm; Heat curing temperature is 80-200 degree, and the time is 2-60 minute; Light curable type is UV photocuring, and curing time is 1-30 minute; Hot pressing leveling temperature is 50-100 degree, pressure 1-50KG.
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017133055A (en) * | 2016-01-26 | 2017-08-03 | セイコーエプソン株式会社 | Three-dimensional manufacturing method for function element structure, and function element structure |
| CN108235557A (en) * | 2016-12-12 | 2018-06-29 | 碁鼎科技秦皇岛有限公司 | Flexible support plate and its manufacturing method |
| CN106714464B (en) * | 2017-02-24 | 2019-04-02 | 广东成德电子科技股份有限公司 | A method of printed circuit board is processed using calixarenes |
| CN107567203A (en) * | 2017-10-25 | 2018-01-09 | 信利光电股份有限公司 | A kind of method of spray printing anti-solder ink |
| CN108337826B (en) * | 2018-02-11 | 2020-07-03 | 西安瑞特三维科技有限公司 | Multilayer PCB manufacturing tool and manufacturing method |
| CN109041442A (en) * | 2018-09-05 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of pcb board preparation method, pcb board and electronic equipment |
| CN108990263A (en) * | 2018-09-14 | 2018-12-11 | 无锡市科虹标牌有限公司 | One kind is printed on one side substrate and its bilayer conductive ink technology |
| CN108994449B (en) * | 2018-09-28 | 2020-04-14 | 龙南鑫龙业新材料有限公司 | Automatic processing equipment and method for aluminum-based circuit board |
| CN110139491B (en) * | 2019-06-11 | 2021-04-20 | 北京大华博科智能科技有限公司 | Circuit board preparation method and circuit board |
| CN110557896A (en) * | 2019-08-08 | 2019-12-10 | 广合科技（广州）有限公司 | Full ink-jet manufacturing method of circuit board |
| CN114745875B (en) * | 2022-06-08 | 2022-09-23 | 芯体素(杭州)科技发展有限公司 | High-precision multilayer circuit board and 3D printing preparation method thereof |
| CN117156731A (en) * | 2023-10-31 | 2023-12-01 | 常州明耀半导体科技有限公司 | Single-sided multilayer aluminum substrate and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101636043A (en) * | 2008-07-25 | 2010-01-27 | 富葵精密组件(深圳)有限公司 | Method for manufacturing electric conduction line |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005210079A (en) * | 2003-12-22 | 2005-08-04 | Canon Inc | Wiring formation method, wiring formation equipment, and wiring board |
| JP2006332094A (en) * | 2005-05-23 | 2006-12-07 | Seiko Epson Corp | Process for producing electronic substrate, process for manufacturing semiconductor device and process for manufacturing electronic apparatus |
| KR100735411B1 (en) * | 2005-12-07 | 2007-07-04 | 삼성전기주식회사 | Method For Forming Printed Wiring Board and Printed Wiring Board Thus Obtained |
| KR100657406B1 (en) * | 2006-02-15 | 2006-12-14 | 삼성전기주식회사 | Manufacturing multi-layer pcb |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101636043A (en) * | 2008-07-25 | 2010-01-27 | 富葵精密组件(深圳)有限公司 | Method for manufacturing electric conduction line |
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