CN104378950A - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
CN104378950A
CN104378950A CN201310351852.0A CN201310351852A CN104378950A CN 104378950 A CN104378950 A CN 104378950A CN 201310351852 A CN201310351852 A CN 201310351852A CN 104378950 A CN104378950 A CN 104378950A
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CN
China
Prior art keywords
heat pipe
heat
housing cavity
independently
communicated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310351852.0A
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Chinese (zh)
Inventor
杨修维
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Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to CN201310351852.0A priority Critical patent/CN104378950A/en
Publication of CN104378950A publication Critical patent/CN104378950A/en
Pending legal-status Critical Current

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Abstract

A heat dissipation module comprises a shell, a plurality of independent shell cavities are arranged in the shell and not communicated with one another, each shell cavity is communicated with one open end of at least one heat pipe, the open ends are communicated with heat pipe cavities in the heat pipes, and the independent cavities are communicated with the heat pipe cavities.

Description

Heat radiation module
Technical field
The present invention relates to a kind of heat radiation module, especially have the heat radiation module related to the pyrotoxin heat radiation producing different heat.
Background technology
With existing electronic equipment gradually using the frivolous demand as bragging about, therefore each item all must reduce its size thereupon, but the thermal change that the size of electronic equipment reduces with and produces becomes the major obstacle of electronic equipment and system enhancement performance.So industry is in order to effectively solve the element radiating problem in electronic equipment, just propose to there is heat conduction efficiency preferably temperature-uniforming plate (Vapor chamber) and heat pipe (Heat pipe), effectively to solve the heat dissipation problem of present stage respectively.
(Vapor chambef system comprises the capillary structure of housing in square type shape and enclosure interior chamber wall thereof to temperature-uniforming plate, and this enclosure interior is filled with hydraulic fluid, and the side of this housing (i.e. evaporating area) is sticked at a heater element (as central processing unit, north and south bridge wafer, electric crystal etc.) the upper heat adsorbing this heater element and produce, the hydraulic fluid of liquid state is made to be converted to steam state in the evaporating area generation evaporation of this housing, by heat conduction to the condensing zone of this housing, the hydraulic fluid of this steam state is condensed into liquid state after condensing zone is cooled, the hydraulic fluid of this liquid state is back to evaporating area through gravity or capillary structure again and continues steam-condensate circulating, effectively to reach the effect of temperature uniforming heat radiation.
The principle of heat pipe (Heat pipe) is identical with Theoretical Framework and temperature-uniforming plate, hollow space mainly in the heat pipe of pipe bore inserts metal dust, and form the capillary structure of a ring-type in the inwall of this heat pipe through the mode of sintering, thereafter this heat pipe vacuumized and fill hydraulic fluid, finally closing to form heat pipe structure.When hydraulic fluid diffuses to this condensation end by evaporation part by after thermal evaporation, and this hydraulic fluid is steam state in this evaporation part, left when this condensation end backward spreads by this evaporation part and be progressively converted to liquid state by cooling condensation, and be back to this evaporation part through capillary structure again.
Relatively temperature-uniforming plate only has heat conducting mode different from heat pipe, and the heat exchange pattern of temperature-uniforming plate is two-dimentional, is the heat exchange pattern in face, but the heat exchange pattern of heat pipe is the heat exchange pattern of one dimension.
The heat accumulation that general wafer produces from the teeth outwards, but the heat on surface may distribute inconsistent, this is because the long-pending body member distribution density in wafer causes, how effects on surface heat distributes the better radiating effect of inconsistent generation, to significantly promoting heat conducting efficiency, and effectively solve the heat dissipation problem of high power electronic element, being that current dealer is required improves.
Summary of the invention
Therefore, for solving the shortcoming of above-mentioned prior art, main purpose of the present invention, the heat pipe chamber providing an a kind of housing to have multiple separate chamber to be communicated with a heat pipe respectively, makes the thermal diffusion of each separate chamber with temperature-uniforming plate and the far-end heat transmission function of heat pipe.
Another object of the present invention is to provide a kind of heat radiation module producing multiple steam-condensate circulatings and heat transfer process after heated.
Another object of the present invention is to provide each heat pipe a kind of and connects the running that each separate chamber system independently produces steam-condensate circulating and heat trnasfer and can not interfere with each other.
Another object of the present invention is to provide the heat radiation module that a kind of pyrotoxin for heat skewness provides best radiating effect.
Another object of the present invention is to provide a kind of housing cavity and is communicated with heat pipe chamber, to promote cavity volume, and increases the capacity holding hydraulic fluid, increases the maximum heat biography amount (Qmax) of heat pipe simultaneously.
Another object of the present invention is to provide each separate chamber a kind of and utilizes the heat radiation module that One-dimensional heat transfer dispels the heat and Two-Dimensional Heat Conduction dispels the heat simultaneously.
For achieving the above object, the invention provides a kind of heat radiation module, comprise a housing and comprise multiple independently housing cavity, these housing cavity are not communicated with each other, each housing cavity is communicated with an open end of at least one heat pipe, this open end is communicated with the heat pipe chamber being positioned at this heat pipe, and wherein this separate chamber is communicated with this heat pipe chamber.A kind of heat radiation module, comprise: a housing comprises multiple independently housing cavity, these housing cavity are not communicated with each other, each housing cavity is communicated with an open end of at least one heat pipe, this open end is communicated with and is positioned at a heat pipe chamber of this heat pipe, wherein this independently housing cavity be communicated with this heat pipe chamber.
The volume of these independently housing cavity is identical or different.
More specifically, the invention provides a kind of heat radiation module, comprising: a housing, comprise multiple housing cavity independent of each other, these housing cavity this be not communicated with, and in each housing cavity, there is a working fluid; Multiple independently the first heat pipe; each first heat pipe connects an independently housing cavity respectively; wherein each first heat pipe comprises one first contrary open end and one first blind end; one first heat pipe chamber to be defined in this first heat pipe and to be communicated with this first open end, wherein this first open end and this this housing cavity of the first heat pipe chamber; And wherein each working fluid independently in housing cavity produces respective running respectively by connection first heat pipe.
The present invention implements another, comprise multiple independently the second heat pipe, each second heat pipe connects an independently housing cavity respectively, wherein each second heat pipe comprises one second contrary open end and one second blind end, one second heat pipe chamber to be defined in this second heat pipe and to be communicated with this second open end, wherein this second open end and this this housing cavity of the second heat pipe chamber, and this working fluid operates between this housing cavity and this second heat pipe chamber.These independently have at least one space bar between housing cavity makes these independently housing cavity intervals in the horizontal direction.
This first heat pipe is that circular heat pipe or thin flat heat pipe or D type heat pipe or semi-circular heat pipe are wherein arbitrary.
This second heat pipe is that circular heat pipe or thin flat heat pipe or D type heat pipe or semi-circular heat pipe are wherein arbitrary.
This housing has bottom a top and one, and these are housing cavity between this top and bottom and each other interval in the horizontal direction independently.
The one side at this top forms the end face of each independently housing cavity, and the one side bottom this forms the bottom surface of each independently housing cavity, and the another side of bottom is thermal interface.
This housing offers multiple open-work and is communicated with each independently housing cavity respectively, and one first open end of these the first heat pipes connects this open-work respectively.
This housing offers multiple open-work and is communicated with each independently housing cavity respectively, and the first open end and second open end of these first heat pipes and the second heat pipe connect this open-work respectively.
The volume of these independently housing cavity is identical or different.
Accompanying drawing explanation
Fig. 1 is perspective exploded view of the present invention;
Fig. 2 is solid combination schematic diagram of the present invention;
Fig. 3 is the profile of the X-X line of Fig. 2 of the present invention;
Fig. 4 is the profile of the YY line of wooden invention Fig. 2;
Fig. 5 is the schematic diagram of another enforcement of the present invention;
Fig. 6 A is the perspective exploded view that the present invention is applied at least one pyrotoxin;
Fig. 6 B is that the present invention contacts a pyrotoxin horizontal cross-sectional schematic diagram;
Fig. 6 C is that the present invention contacts a pyrotoxin vertical cross section schematic diagram;
Fig. 7 is the schematic diagram of two independently housing cavity of the present invention;
Fig. 8 is the schematic diagram of three independently housing cavity of the present invention;
Fig. 9 is the schematic diagram of five independently housing cavity of the present invention;
Symbol description
10 heat radiation modules
11,11' housing
111a ~ 111d, 311,312,411,412,413,511,512,513,514,515 housing cavity
113 tops
1131 end faces
Bottom 114
1141 bottom surfaces
1142 thermal interfaces
115 space bars
116 open-works
12 first heat pipes
121 first open ends
122 first blind ends
123 first heat pipe chambers
16 second heat pipes
161 second open ends
162 second blind ends
163 second heat pipe chamber
20 pyrotoxins
201 ~ 204 first districts are to the 4th district
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawings.
Refer to Fig. 1 to 4, Fig. 1 is perspective exploded view of the present invention, and Fig. 2 is the solid combination schematic diagram of the present invention, and Fig. 3 is the profile of the X-X line of Fig. 2 of the present invention, and Fig. 4 is the profile of the Y-Y line of Fig. 2 of the present invention.As shown in Figures 1 to 4, heat radiation module 10 comprises a housing 11, this housing 11 comprises multiple housing cavity 111a independent of each other ~ 111d, these housing cavity 111a ~ 111d is not communicated with each other, each housing cavity 111a ~ 111d is communicated with an open end of at least one heat pipe, this open end is communicated with and is positioned at a heat pipe chamber of this heat pipe, wherein this independently housing cavity 111a ~ 111d be communicated with this heat pipe chamber.
This housing 11 aforementioned is that the good material of thermal conductive property is made, such as, be metal or plastic cement, to have bottom a top 113 and one 114, these independently housing cavity 111a ~ 111d between this top 113 and bottom 114.Aforementioned top 113 forms the end face 1131 of each independently housing cavity 111a ~ 111d in the face of the one side of these separate chamber, afore-mentioned bottom 114 forms the bottom surface 1141 of each independently housing cavity 111a ~ 111d in the face of the one side of these separate chamber, bottom this, the another side of 114 is that thermal interface 1142 is used for contacting at least one pyrotoxin, these between this top 113 and bottom 114 independently have at least one space bar 115 between housing cavity 111a ~ 111d, the two ends up and down of space bar 115 connect this top 113 and bottom 114, so that these are housing cavity 111a ~ 111d interval and not being communicated with in the horizontal direction each other independently.Housing 11 offers multiple open-work 116 and is communicated with each independently housing cavity 111a ~ 111d respectively, represent in this better diagram this independently housing cavity 111a ~ 111d be four, therefore housing 11 is provided with four open-works 116 and is communicated with each housing cavity 111a ~ 111d respectively.In each housing cavity 111a ~ 111d, hold a working fluid respectively, and the inwall of housing cavity 111a ~ 111d is respectively equipped with a capillary structure layer.
Aforesaid heat pipe, this better add implement expression four hate independently the first heat pipe 12, each first heat pipe 12 connects an independently housing cavity 111a ~ 111d respectively, wherein each first heat pipe 12 comprises one first contrary open end 121 and one first blind end 122, one first heat pipe chamber 123 to be defined in this first heat pipe 12 and to be communicated with this first open end 121, be connected to this open-work 116 by this first open end 121, the first heat pipe chamber 123 of this each the first heat pipe 12 is communicated with this housing cavity 111a ~ 111d.The inwall of these the first heat pipe chambers 123 is provided with a capillary structure layer.Because the first heat pipe chamber 123 is communicated with this housing cavity 111a ~ 111d, so be contained in working fluid in housing cavity 111a ~ 111d can produce steam-condensate circulating and heat trnasfer running between each the first heat pipe chamber 123 of each housing cavity 111a ~ 111d and connection.Namely first heat pipe 123 of each independently housing cavity 111a ~ 111d and connection thereof is the running producing independently steam-condensate circulating and heat trnasfer respectively, and first heat pipe 123 of each independently housing cavity 111a ~ 111d and connection thereof can not interfere with each other.With regard to this enforcement, four independent case chamber 111a ~ 111d are had to be communicated with four first heat pipes 123 respectively, so when housing 11 can produce four independently steam-condensate circulating and heat trnasfer runnings after heated.
Although in addition aforesaid diagram represent each independently housing cavity 111a ~ 111d connect one first heat pipe 12, but be not limited thereto, as Fig. 5, for the present invention, another implements shown in schematic diagram, each independently housing cavity 111a ~ 111d except connecting one first heat pipe 12, more connect one second heat pipe 16, each second heat pipe 16 comprises one second contrary open end 161 and one second blind end 162, one second heat pipe chamber 163 Room to be defined in this second heat pipe 16 and to be communicated with this second open end 161, wherein this second open end 162 and this second heat pipe chamber 163 are communicated with this housing cavity 111a ~ 111d.Therefore the working fluid in housing cavity 111a ~ 111d can operate between this housing cavity 111a ~ 111d and this first heat pipe chamber 123 and the second heat pipe chamber 163.
Be noted that especially aforesaid first heat pipe 12 and the second heat pipe 16 the graphic representation of this better enforcement be circular heat pipe but and not Authority limit therewith, also can be thin flat heat pipe.
For making more to know the present invention, below embody rule of the present invention will be illustrated.
As shown in Fig. 6 A to 6C, the thermal interface 1142 of the bottom 114 of housing 11 is made to contact the surface of at least one pyrotoxin 20 (such as CPU or MCU etc.).For convenience of description pyrotoxin 20 surface is roughly divided into four regions and is respectively the firstth district to the 4th district 201 ~ 204, pyrotoxin is when actual operation, the temperature that firstth district on surface produces to the 4th district 201 ~ 204 is different, such as the temperature in the first district 201 is 32 degree, the temperature in the secondth district is 65 degree, the temperature in the 3rd district is 48 degree, and the temperature in the 4th district is 39 degree (temperature in each district is as signs of Fig. 6 C).
In housing 11 housing cavity 111a ~ 111d independently across firstth district on corresponding pyrotoxin 20 surface respectively, bottom 114 of housing 11 to the 4th district 201 ~ 204, each independently housing cavity 111a ~ 111d the first heat pipe chamber 123 making the hydraulic fluid in it produce the first heat pipe 12 that vapour-liquid change is connected by each housing cavity 111a ~ 111d respectively that is heated produce steam-condensate circulating.
More specifically must illustrate, hydraulic fluid wherein in first housing separate chamber 111a is because the heat in surperficial first district 201 of pyrotoxin 20 makes the first heat pipe chamber 123 of past first heat pipe 12 of hydraulic fluid vaporization in it move, and by the carry heat in surperficial for pyrotoxin 20 first district 201 toward the first heat pipe chamber 123, hydraulic fluid after vaporization reverts back to liquid after blind end 121 place's condensation of the first heat pipe 12, then flows back to independently in housing cavity 111a along the capillary structure of the first heat pipe chamber indoor.
Working solution in second housing separate chamber 111b is stopped because the heat in surperficial second district 202 of pyrotoxin 20 makes hydraulic fluid vaporization in it to move and by the carry heat in surperficial for pyrotoxin 20 second district 202 toward the first heat pipe chamber 123 toward the first heat pipe chamber 123 of the first heat pipe 12, hydraulic fluid after vaporization reverts back to liquid after blind end 121 place's condensation of the first heat pipe 12, then flows back to independently in housing cavity 111b along the capillary structure in the first heat pipe chamber 123.
Hydraulic fluid in 3rd housing separate chamber 111c is because the heat in the 3rd district 203, pyrotoxin 20 surface makes the vaporization of hydraulic fluid in it to move and by the carry heat in the 3rd district 203, pyrotoxin 20 surface toward the first heat pipe chamber 123 toward the first heat pipe chamber 123 of the first heat pipe 12, hydraulic fluid after vaporization reverts back to liquid after blind end 121 place's condensation of the first heat pipe 12, then flows back to independently in housing cavity 111c along the capillary structure in the first heat pipe chamber 123.
Hydraulic fluid in 4th housing separate chamber 111d is because the heat in the 4th district 204, pyrotoxin 20 surface makes the vaporization of hydraulic fluid in it to move and by the carry heat in the 4th district 201, pyrotoxin 20 surface toward the first heat pipe chamber 123 toward the first heat pipe chamber 123 of the first heat pipe 12, hydraulic fluid after vaporization reverts back to liquid after blind end 121 place's condensation of the first heat pipe 12, then flows back to independently in housing cavity 111d along the capillary structure in the first heat pipe chamber 123.
Four independently housing cavity 111a ~ 111d produce four independently steam-condensate circulating and heat trnasfer respectively, and do not interfere with each other each other, and the thermal temperature of each independently housing cavity 111a ~ 111d contact is different, the steam-condensate circulating of generation is different from the performance of heat trnasfer.
Above-mentionedly contact a pyrotoxin 20 as an example with housing 11, but in another is specifically implemented, on the position that pyrotoxin is intensive, housing 11 can be made to contact multiple pyrotoxin, wherein each separate chamber corresponds to a pyrotoxin, each separate chamber can also be played like this and produce independently steam-condensate circulating and heat trnasfer, and not disturb each other.
Be noted that especially, represent that above this housing cavity 111a ~ 111d is four and the volume of each housing cavity 111a ~ 111d is identical, but be not limited to this, as shown in Figs. 7-9, can be located in housing 11' according to use and radiating requirements and two independently housing cavity 311,312 or three independently housing cavity 411,412,413 or five independently housing cavity 511,512,513,514,515 are set, and volume can be identical or different.Moreover can according to the volume of each independently housing cavity, adjustment connects the quantity of heat pipe or the length of heat pipe, and what the volume of such as housing cavity was larger can connect two heat pipes; Or housing cavity connects two heat pipes and connects a heat pipe with a housing cavity, the heat pipe length now connecting two heat pipes is shorter compared to the length of a connection heat pipe.
In sum, the thermal diffusion of each separate chamber of the present invention with temperature-uniforming plate and the far-end heat transmission function of heat pipe, and produce multiple independently steam-condensate circulating and heat transfer processes after heated, the pyrotoxin for heat skewness provides best radiating effect.Structure of the present invention promotes cavity volume simultaneously, to increase the capacity holding hydraulic fluid, makes the maximum heat biography amount (QmaX) of heat pipe increase.

Claims (12)

1. dispel the heat a module, comprising:
One housing comprises multiple independently housing cavity, these housing cavity are not communicated with each other, each housing cavity is communicated with an open end of at least one heat pipe, and this open end is communicated with and is positioned at a heat pipe chamber of this heat pipe, wherein this independently housing cavity be communicated with this heat pipe chamber.
2. dispel the heat module as claimed in claim 1, and the volume of these independently housing cavity is identical or different.
3. dispel the heat a module, comprising:
One housing, comprises multiple housing cavity independent of each other, these housing cavity this be not communicated with, and in each housing cavity, there is a working fluid;
Multiple independently the first heat pipe; each first heat pipe connects an independently housing cavity respectively; wherein each first heat pipe comprises one first contrary open end and one first blind end; one first heat pipe chamber to be defined in this first heat pipe and to be communicated with this first open end, wherein this first open end and this this housing cavity of the first heat pipe chamber; And
Wherein each working fluid independently in housing cavity produces respective running respectively by connection first heat pipe.
4. dispel the heat module as claimed in claim 3, comprise multiple independently the second heat pipe, each second heat pipe connects an independently housing cavity respectively, wherein each second heat pipe comprises one second contrary open end and one second blind end, one second heat pipe chamber to be defined in this second heat pipe and to be communicated with this second open end, wherein this second open end and this this housing cavity of the second heat pipe chamber, and this working fluid operates between this housing cavity and this second heat pipe chamber.
5. the heat radiation module as described in claim 3 or 4, wherein these independently have at least one space bar and make these independently housing cavity intervals in the horizontal direction between housing cavity.
6. dispel the heat module as claimed in claim 3, and wherein this first heat pipe is that circular heat pipe or thin flat heat pipe or D type heat pipe or semi-circular heat pipe are wherein arbitrary.
7. dispel the heat module as claimed in claim 4, and wherein this second heat pipe is that circular heat pipe or thin flat heat pipe or D type heat pipe or semi-circular heat pipe are wherein arbitrary.
8. dispel the heat module as claimed in claim 3, and wherein this housing has bottom a top and one, and these are housing cavity between this top and bottom and each other interval in the horizontal direction independently.
9. dispel the heat module as claimed in claim 8, and wherein the one side at this top forms the end face of each independently housing cavity, and the one side bottom this forms the bottom surface of each independently housing cavity, and the another side of bottom is thermal interface.
10. dispel the heat module as claimed in claim 3, and wherein this housing offers multiple open-works and is communicated with each independently housing cavity respectively, and one first open end of these the first heat pipes connects this open-work respectively.
11. dispel the heat module as claimed in claim 4, and wherein this housing offers multiple open-works and is communicated with each independently housing cavity respectively, and the first open end and second open end of these first heat pipes and the second heat pipe connect this open-work respectively.
12. dispel the heat module as claimed in claim 1, and the volume of these independently housing cavity is identical or different.
CN201310351852.0A 2013-08-13 2013-08-13 Heat dissipation module Pending CN104378950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310351852.0A CN104378950A (en) 2013-08-13 2013-08-13 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310351852.0A CN104378950A (en) 2013-08-13 2013-08-13 Heat dissipation module

Publications (1)

Publication Number Publication Date
CN104378950A true CN104378950A (en) 2015-02-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW216837B (en) * 1992-01-14 1993-12-01 Sun Microsystems Inc
US20070022603A1 (en) * 2005-07-29 2007-02-01 Delta Electronics Inc. Vapor chamber and manufacturing method thereof
CN201754049U (en) * 2010-08-17 2011-03-02 安徽莱德光电技术有限公司 Hot pipe heat radiator and high power LED lamp with hot pipe heat radiator as heat radiating device
CN103135711A (en) * 2011-11-23 2013-06-05 昆山广兴电子有限公司 Cooling device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW216837B (en) * 1992-01-14 1993-12-01 Sun Microsystems Inc
US20070022603A1 (en) * 2005-07-29 2007-02-01 Delta Electronics Inc. Vapor chamber and manufacturing method thereof
CN201754049U (en) * 2010-08-17 2011-03-02 安徽莱德光电技术有限公司 Hot pipe heat radiator and high power LED lamp with hot pipe heat radiator as heat radiating device
CN103135711A (en) * 2011-11-23 2013-06-05 昆山广兴电子有限公司 Cooling device

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