CN205430849U - Flexible even temperature plate - Google Patents
Flexible even temperature plate Download PDFInfo
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- CN205430849U CN205430849U CN201520956238.1U CN201520956238U CN205430849U CN 205430849 U CN205430849 U CN 205430849U CN 201520956238 U CN201520956238 U CN 201520956238U CN 205430849 U CN205430849 U CN 205430849U
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- flexible
- even temperature
- metal
- temperature plate
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Abstract
The utility model provides a flexible even temperature plate, its includes a plurality of samming portions, this flexible even temperature plate of still includes the flexible construction who connects a plurality of samming portions, and a plurality of samming portions interval sets up on this flexible construction, and this flexible construction between these a plurality of samming portions constitutes flexible portion.
Description
Technical field
This utility model relates to a kind of flexible even temperature plate.
Background technology
Electronic installation in use, due to the operation of electronic component, can produce substantial amounts of heat.If these heats fail to conduct in time and accumulate on the inside of this electronic component, it will cause the temperature of this electronic component to raise and affect its usefulness, even damaging this electronic component.Therefore, industry is devoted to the heat dissipation problem researching and developing various heat dissipation element to solve electronic component always, and temperature-uniforming plate is exactly the most common a kind of heat dissipation element.
Conventional temperature-uniforming plate is mainly made up of housing, working fluid, capillary structure and supporting construction.Enclosure interior is formed with hollow reservoir, and hollow reservoir is filled with working fluid.Working fluid becomes steam after absorbing the heat that distributes of electronic component, meet cold after revert back to liquid and can be recycled, undergone phase transition the transmission carrying out heat by working fluid, reach effect of heat radiation.
But, the conventional generally rectangular plate body of temperature-uniforming plate, and owing to this cannot bend as cavity material, and electronic installation is generally of multiple scattered heater element, the plurality of heater element is also possible to be positioned in different planes, want to cover multiple scattered heater element simultaneously, be necessary for arranging multiple temperature-uniforming plate, thus add manufacture difficulty and manufacturing cost.
Utility model content
In view of this, this utility model provides flexible even temperature plate that is a kind of bent and that have multiple heat sink region.
A kind of flexible even temperature plate, it includes some samming portions, and this flexible even temperature plate also includes the flexible structure connecting some samming portions, and these some samming portions are arranged at intervals in this flexible structure, and this flexible structure between these some samming portions constitutes flexible portion.
Compared to prior art, flexible even temperature plate of the present utility model not only possesses the function of existing temperature-uniforming plate efficient absorption heat, and utilize the characteristic of flexible material, make temperature-uniforming plate possess bent function, thus realize a piece of temperature-uniforming plate and can solve the heat dissipation problem that smart mobile phone, household appliances and mechanical arm etc. have the electronic installation of multiple pyrotoxin.Therefore, flexible even temperature plate of the present utility model simplifies processing procedure, and reduces manufacturing cost.Additionally, flexible even temperature plate of the present utility model can be wider always according to demand custom-shaped and size, the scope of application.
Accompanying drawing explanation
Fig. 1 is the plane graph of the flexible even temperature plate of this utility model first embodiment.
Fig. 2 is the flexible even temperature plate generalized section along II-II line of Fig. 1.
Fig. 3 is the flexible even temperature plate generalized section along III-III line of Fig. 1.
Fig. 4 is the flexible even temperature plate of Fig. 1 generalized section when electronic installation dispels the heat.
Fig. 5 is the generalized section that the flexible even temperature plate of Fig. 1 is bent after 90 ° when electronic installation dispels the heat.
Fig. 6 is the generalized section that the flexible even temperature plate of Fig. 1 is bent after 180 ° when electronic installation dispels the heat.
Fig. 7 is the generalized section of the flexible even temperature plate of this utility model the second embodiment.
Main element symbol description
| Flexible even temperature plate | 100、200 |
| First samming portion | 10 |
| Metal-based layer | 12、22 |
| Accepting groove | 122、222 |
| Supporting construction | 124、224 |
| Working solution | 14、24 |
| Adhesion coating | 16、26 |
| Second samming portion | 20 |
| Flexible structure | 30、40 |
| Flexible metal clad laminate | 32 |
| Flexible parent metal | 34、44 |
| Flexible portion | 36、46 |
| Breach | 362 |
| First flexible metal clad laminate | 41 |
| Second flexible metal clad laminate | 42 |
| First heat dissipation element | 300 |
| Second heat dissipation element | 400 |
| Heat-conducting glue | 500 |
Following detailed description of the invention will further illustrate this utility model in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1 and Fig. 2, this utility model first embodiment provides a flexible even temperature plate 100, and it includes the 10, second samming portion 20 of the first samming portion and connects the first samming portion 10 and flexible structure 30 in the second samming portion 20.Described first samming portion 10 and the second samming portion 20 are for the different heat element radiating (such as, the photographing unit in mobile phone and CPU) in electronic installation.
Flexible structure 30 includes a flexible metal clad laminate 32 and is covered on the flexible parent metal 34 on this flexible metal clad laminate 32 surface.In the present embodiment, flexible metal clad laminate 32 is flexible copper foil base material, and its thickness can be 12 μm ~ 35 μm.The material of flexible parent metal 34 can be polyimides, polyethylene terephthalate or PEN.The thickness of flexible parent metal 34 can be 12 μm ~ 50 μm.
Refer to Fig. 3, the first samming portion 10 includes a metal-based layer 12 and is arranged at the working solution 14 in this metal-based layer 12.Form some accepting grooves 122 by etching mode in metal-based layer 12, between adjacent accepting groove 122, form supporting construction 124.The flexible metal clad laminate 32 of flexible structure 30 is fitted in the upper surface of metal-based layer 12 by adhesion coating 16, so that the accepting groove 122 of flexible metal clad laminate 32 and metal-based layer 12 is collectively forming some host cavities, working solution 14 is filled in host cavity.In the present embodiment, working solution 14 is solid-liquid type phase-change material.
The structure in the second samming portion 20 is identical with the structure in the first samming portion 10, does not repeats them here.
Flexible structure 30 connects the first samming portion 10 and the second samming portion 20, and wherein flexible metal clad laminate 32 is covered in the first samming portion 10 and upper surface in the second samming portion 20.Flexible metal clad laminate 32 and flexible parent metal 34 between first samming portion 10 and the second samming portion 20 constitute flexible portion 36, and for the ease of bending, the flexible metal clad laminate 32 of this flexible portion 36 is formed a breach 362 by surface towards flexible parent metal 34.
Flexible even temperature plate 100 of the present utility model can be used for dispelling the heat for the heat dissipation element of scattering devices multiple in electronic installation.Flexible parent metal 34 has pliability, the thinner thickness of the flexible metal clad laminate 32 at flexible portion 36, the most pliable space of can also saving, the flexible metal clad laminate 32 of flexible portion 36 can also carry out heat conduction, to improve the heat-transfer effect of temperature-uniforming plate between the first samming portion 10 and the second samming portion 20.Therefore, flexible even temperature plate 100 of the present utility model is applicable not only to the electronic installation that multiple heater element is generally aligned in the same plane, and applies also for multiple heater element and is positioned at the electronic installation of Different Plane.
First, as shown in Figure 4, in the present embodiment, the first samming portion 10 and the second samming portion 20 of flexible even temperature plate 100 fit on the first heat dissipation element 300 and second heat dissipation element 400 of an electronic installation by heat-conducting glue 500 respectively, owing to the first samming portion 10 and the second samming portion 20 are in the same plane, therefore, flexible even temperature plate 100 does not bends.
Secondly, as shown in Figure 5, first samming portion 10 of flexible even temperature plate 100 and the second samming portion 20 fit on the first heat dissipation element 300 and second heat dissipation element 400 of an electronic installation by heat-conducting glue 500 respectively, flexible even temperature plate 100 is bent in 90 ° of angles, so that the first samming portion 10 and the second samming portion 20 are mutually perpendicular to.
Finally, as shown in Figure 6, first samming portion 10 of flexible even temperature plate 100 and the second samming portion 20 fit in the first heat dissipation element 300 and the second heat dissipation element 400 of an electronic installation respectively by heat-conducting glue 500, flexible even temperature plate 100 is bent in 180 °, so that the first samming portion 10 and the second samming portion 20 are parallel to each other.
As shown in Figure 7, the structure of the flexible even temperature plate 200 that the second embodiment of the present utility model provides is substantially the same with the structure of the flexible even temperature plate 100 of offer in first embodiment, and its difference is the first flexible metal clad laminate 41 and the second flexible metal clad laminate 42 that flexible structure 40 of the flexible even temperature plate 200 of the second embodiment offer includes flexible parent metal 44, is arranged at intervals on flexible parent metal 44.First samming portion 10 and the second samming portion 20 are respectively arranged at the first flexible metal clad laminate 41 and the second flexible metal clad laminate 42 surface.Flexible parent metal 44 between first flexible metal clad laminate 41 and the second flexible metal clad laminate 42 constitutes flexible portion 46.This flexible portion 46 does not comprise flexible metal clad laminate, therefore possesses higher pliability.
It is appreciated that the quantity in samming portion, shape and the size of the flexible even temperature plate that this utility model provides can regulate customization according to actual needs, however it is not limited to quantity, shape and the size disclosed in the present embodiment.
It is appreciated that the shape and size of the flexible even temperature plate that this utility model provides can also regulate customization according to actual needs, however it is not limited to the shape and size disclosed in the present embodiment.
Compared to prior art, flexible even temperature plate of the present utility model uses flexible structure to connect several samming portions, and flexible portion is set in flexible structure, can not only efficient absorption heat, and utilize the characteristic of flexible material, make temperature-uniforming plate can bend with multi-angle, it is adaptable to have the electronic installation of the heater element of multiple scattering device.It is achieved thereby that a piece of temperature-uniforming plate can solve the heat dissipation problem that smart mobile phone, household appliances and mechanical arm etc. have the electronic installation of multiple pyrotoxin, simplify the processing procedure of flexible even temperature plate, reduce manufacturing cost.Additionally, flexible even temperature plate of the present utility model can be applied widely always according to demand custom-shaped and size.
Claims (10)
1. a flexible even temperature plate, it includes some samming portions, it is characterised in that this flexible even temperature plate also includes the flexible structure connecting these some samming portions, these some samming portions are arranged at intervals in this flexible structure, and this flexible structure between these some samming portions constitutes flexible portion.
2. flexible even temperature plate as claimed in claim 1, it is characterized in that, this flexible structure includes flexible parent metal and flexible metal clad laminate, and this flexible parent metal between these some samming portions and this flexible metal clad laminate constitute this flexible portion, and this flexible metal clad laminate is away from being formed with breach on the surface of this flexible parent metal.
3. flexible even temperature plate as claimed in claim 1, it is characterized in that, this flexible structure includes flexible parent metal and is disposed on some flexible metal clad laminates on this flexible parent metal surface, these some equal isothermal segments are not arranged at the surface of these some flexible metal clad laminates, and this flexible parent metal between these some samming portions constitutes this flexible portion.
4. flexible even temperature plate as claimed in claim 2 or claim 3, it is characterised in that this flexible even temperature plate can realize multi-angle by this flexible portion and bend.
5. flexible even temperature plate as claimed in claim 2 or claim 3, it is characterised in that the material of this flexible parent metal is polyimides, polyethylene terephthalate or PEN.
6. flexible even temperature plate as claimed in claim 5, it is characterised in that this flexible metal clad laminate is single side floppy copper foil base material.
7. flexible even temperature plate as claimed in claim 2 or claim 3, it is characterised in that this each temperature-uniforming plate also includes a metal-based layer, forms some accepting grooves in this metal-based layer, form supporting construction between this adjacent accepting groove.
8. flexible even temperature plate as claimed in claim 7, it is characterised in that this metal-based layer is copper foil layer.
9. flexible even temperature plate as claimed in claim 8, it is characterised in that this flexible metal clad laminate of this flexible structure is fitted in the upper surface of this metal-based layer, so that this accepting groove of this flexible metal clad laminate and this metal-based layer is collectively forming some host cavities.
10. flexible even temperature plate as claimed in claim 9, it is characterised in that be filled with solid-liquid phase change material in this host cavity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520956238.1U CN205430849U (en) | 2015-11-26 | 2015-11-26 | Flexible even temperature plate |
| TW104220964U TWM548416U (en) | 2015-11-26 | 2015-12-28 | Flexible uniform temperature plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520956238.1U CN205430849U (en) | 2015-11-26 | 2015-11-26 | Flexible even temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205430849U true CN205430849U (en) | 2016-08-03 |
Family
ID=56535250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520956238.1U Active CN205430849U (en) | 2015-11-26 | 2015-11-26 | Flexible even temperature plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205430849U (en) |
| TW (1) | TWM548416U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109413932A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| CN109520340A (en) * | 2017-09-20 | 2019-03-26 | 新光电气工业株式会社 | Ring type heat pipe, the manufacturing method of ring type heat pipe, electronic equipment |
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
| WO2022121987A1 (en) * | 2020-12-11 | 2022-06-16 | 浙江大学 | Heterogeneous temperature equalizing device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI763989B (en) * | 2019-04-12 | 2022-05-11 | 雙鴻科技股份有限公司 | Flexible vapor chamber |
| TWI720865B (en) * | 2020-04-07 | 2021-03-01 | 奇鋐科技股份有限公司 | Heat dissipation connection structure of handheld device |
-
2015
- 2015-11-26 CN CN201520956238.1U patent/CN205430849U/en active Active
- 2015-12-28 TW TW104220964U patent/TWM548416U/en not_active IP Right Cessation
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413932A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| CN109520340A (en) * | 2017-09-20 | 2019-03-26 | 新光电气工业株式会社 | Ring type heat pipe, the manufacturing method of ring type heat pipe, electronic equipment |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN110418550A (en) * | 2019-06-25 | 2019-11-05 | 华为技术有限公司 | Soaking plate and folding terminal |
| WO2020259552A1 (en) * | 2019-06-25 | 2020-12-30 | 华为技术有限公司 | Heat equalising plate and folding terminal |
| CN110418550B (en) * | 2019-06-25 | 2021-06-01 | 华为技术有限公司 | Vapor chamber and folding terminal |
| WO2022121987A1 (en) * | 2020-12-11 | 2022-06-16 | 浙江大学 | Heterogeneous temperature equalizing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM548416U (en) | 2017-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170308 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Co-patentee after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-patentee before: Peng Ding Polytron Technologies Inc |
|
| CP03 | Change of name, title or address |