CN104349588A - Circuit board and manufacture method thereof - Google Patents
Circuit board and manufacture method thereof Download PDFInfo
- Publication number
- CN104349588A CN104349588A CN201310332300.5A CN201310332300A CN104349588A CN 104349588 A CN104349588 A CN 104349588A CN 201310332300 A CN201310332300 A CN 201310332300A CN 104349588 A CN104349588 A CN 104349588A
- Authority
- CN
- China
- Prior art keywords
- perforate
- layer
- electroconductive polymer
- circuit board
- plated metal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Disclosed is a circuit board. The circuit board comprises an insulation layer, a first conductive line layer and a second conductive line layer, wherein the first conductive line layer and the second conductive line layer are formed at the two opposite sides of the insulation layer, openings are formed in the circuit board, conductive polymer film layers, electroless plating metal layers and electroplating metals are successively formed from the inner walls of the openings towards the centers of the openings in the openings so as to form conductive holes. The conductive polymer film layers are directly formed on the inner walls of the openings, the electroless plating metal layers are formed between the conductive polymer film layers and the electroplating metals, and the first conductive line layer and the second conductive line layer electrically conduct each other through the conductive holes. The invention also provides a manufacture method of the circuit board.
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to a kind of circuit board and preparation method thereof.
Background technology
Along with electronic product is toward development that is miniaturized, high speed direction, circuit board is also from single-sided circuit board, double-sided PCB toward multilayer circuit board future development.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thus be widely used, see document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
In circuit board, usually need to make conductive hole to conduct two-layer or two-layer above conducting wire.In prior art, the manufacturing process of conductive hole generally includes following steps: in substrate, form hole; Carry out de-smear process in hole, the unnecessary glue slag stayed in pore forming process in hole is removed; The inwall in hole is repeatedly cleaned, microetch, the process such as activation and speedization, make the inwall in hole be formed with the crystal seed layer of electroless copper; Inwall in hole carries out electroless copper, thus forms chemical plating copper layer in hole.In above-mentioned manufacturing process, need the procedure for wet processing that carries out repeatedly, manufacturing process is loaded down with trivial details and cause a large amount of losses of water resources.In addition, in the process of electroless copper, usually adopt formaldehyde as reducing agent, and formaldehyde is carcinogenicity material, causes larger infringement to the health of site operation personnel, also larger to environmental nuisance.
Summary of the invention
Therefore, be necessary to provide a kind of manufacturing process simple and the circuit board manufacturing method that environmental pollution is less and circuit board.
A kind of circuit board, it comprises insulating barrier, first conductive circuit layer and the second conductive circuit layer, described first conductive circuit layer and the second conductive circuit layer are formed at the relative both sides of described insulating barrier, perforate is formed in described circuit board, electroconductive polymer layer is formed from the inwall of perforate successively to the center of perforate in described perforate, electroless plated metal layer and plated metal, form conductive hole, described electroconductive polymer rete is directly formed at the inwall of perforate, described electroless plated metal layer is formed between electroconductive polymer layer and plated metal, described first conductive circuit layer and the second conductive circuit layer are conducted mutually by described conductive hole.
A kind of circuit board manufacturing method, comprise step: provide substrate, described substrate comprises insulating barrier and the first copper foil layer; In substrate, form perforate, described perforate runs through described insulating barrier and the first copper foil layer; Adopt the inside of alkaline permanganate solution to perforate to process, make the oxidized removal of glue slag owing to producing when forming perforate in perforate, and the manganese dioxide inwall of perforate being adsorbed be reduced by alkalinity potassium permanganate and producing; By described substrate immersion in electroconductive polymer monomer, described manganese dioxide as catalyst, thus forms electroconductive polymer rete at the inwall of perforate; Electroless plated metal layer is formed at described electroconductive polymer film surface; Described substrate is electroplated, in perforate, forms plated metal; And described first copper foil layer is made formation first conductive circuit layer.
A kind of circuit board manufacturing method, comprise step: provide substrate, described substrate comprises insulating barrier and the first copper foil layer; In substrate, form perforate, described perforate runs through described insulating barrier and the first copper foil layer; Adopt the inside of alkaline permanganate solution to perforate to process, make the oxidized removal of glue slag owing to producing when forming perforate in perforate, and the manganese dioxide inwall of perforate being adsorbed be reduced by alkalinity potassium permanganate and producing; By described substrate immersion in electroconductive polymer monomer, described manganese dioxide as catalyst, thus forms electroconductive polymer rete at the inwall of perforate; Form metal palladium layers at electroconductive polymer film surface and form electroless plated metal layer on described metal palladium layers surface; Described substrate is electroplated, in perforate, forms plated metal; And described first copper foil layer is made formation first conductive circuit layer.
Circuit board that the technical program provides and preparation method thereof, by forming electroconductive polymer layer in perforate, utilize electroconductive polymer to have oxidation/reduction condition conversion and produce the characteristic of free electron, thus electroconductive polymer can be utilized as the metal ion in reducing agent reduction soluble metallic salt, thus in perforate, form electroless plated metal layer.In the technical program, electroless plated metal layer can replace chemical-copper-plating process of the prior art, thus can operating process be reduced, and need not the harmful substances such as formaldehyde be used, the efficiency of circuit board making can be improved, reduce the waste of resource, and reduce the pollution to environment.
Accompanying drawing explanation
Fig. 1 is the generalized section of the substrate that the technical program embodiment provides.
Fig. 2 is the generalized section after the substrate interior formation perforate of Fig. 1.
Fig. 3 is the partial enlarged drawing in the III region in Fig. 2.
Fig. 4 is the generalized section after the perforate interior formation electroconductive polymer layer of Fig. 3.
Fig. 5 is the generalized section after the electroconductive polymer layer surface formation electroless plated metal layer of Fig. 4.
Fig. 6 is the generalized section after the perforate interior formation plated metal of Fig. 5.
Fig. 7 is the generalized section of the circuit board that the technical program makes.
Main element symbol description
| Substrate | 110 |
| First copper foil layer | 111 |
| Insulating barrier | 112 |
| Second copper foil layer | 113 |
| Perforate | 114 |
| Electroconductive polymer rete | 120 |
| Electroless plated metal layer | 130 |
| Plated metal | 140 |
| Conductive hole | 101 |
| First conductive circuit layer | 151 |
| Second conductive circuit layer | 152 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, circuit board that the technical program provides and preparation method thereof is described in further detail.
The manufacture method of the circuit board that the technical program embodiment provides comprises the following steps:
The first step, refers to Fig. 1, provides substrate 110.
Described substrate 110 can be copper-clad base plate, also can for being formed with the circuit substrate of conducting wire.In the present embodiment, be described for double-sided copper-clad substrate for substrate 110.Described circuit substrate 110 comprises the first copper foil layer 111, insulating barrier 112 and the second copper foil layer 113.
Second step, sees also Fig. 2 and Fig. 3, in described substrate 110, form perforate 114.
Described perforate 114 can be blind hole, and namely perforate 114 is only formed in the first copper foil layer 111 and insulating barrier 112, and does not extend in the second copper foil layer 113.Described perforate 114 also can be through hole, and it runs through the first copper foil layer 111 of described circuit substrate 110, insulating barrier 112 and the second copper foil layer 113.In the present embodiment, be described for through hole for perforate 114.
When substrate 110 is the circuit substrate being formed with conducting wire, described perforate 114 can be blind hole, and the conducting wire formed is exposed from the bottom of blind hole.Perforate 114 also can be through hole.
Described perforate 114 can adopt the mode of machine drilling to be formed, and the mode of laser ablation also can be adopted to be formed.In the process forming perforate 114, the material of the original perforate part of part remains in perforate 114, or is adsorbed in the inwall of perforate 114, forms glue slag.
3rd step, adopts the inside of alkaline permanganate solution to perforate 114 to process, the glue slag in perforate 114 is removed, and the manganese dioxide inwall of perforate 114 being adsorbed be reduced by alkalinity potassium permanganate and producing.
Because alkalinity potassium permanganate has strong oxidizing property, process by adopting the inside of alkaline permanganate solution to perforate 114, glue slag in perforate 114 is due to oxidized and remove in perforate 114, simultaneously, alkaline permanganate solution is reduced to manganese dioxide, and is adsorbed in the inwall of perforate 114.
4th step, refers to Fig. 4, is soaked in electroconductive polymer monomer by described substrate 110, thus forms electroconductive polymer rete 120 at the inwall of perforate 114.
When described substrate 110 is soaked in electroconductive polymer monomer, manganese dioxide, as catalyst, makes electroconductive polymer monomer be polymerized, thus forms electroconductive polymer rete 120 at the inwall of perforate 114.
Described electroconductive polymer monomer is the monomer that the macromolecule formed after polymerization has conductivity.Described electroconductive polymer monomer is specifically as follows aniline, pyrroles or thiophene etc., also can be the derivative of aniline, azole derivatives or thiophene derivant etc., as 3, and 4-ethylene thiophene, 2,5-dimethoxy aniline etc.Electroconductive polymer monomer is generally liquid.
Electroconductive polymer rete 120 can be polyaniline, polypyrrole or polythiophene.Or the polymer of the derivative of aniline, azole derivatives or thiophene derivant.As Polyglycolic acid fibre or poly-2,5-dimethoxy aniline etc.
Because electroconductive polymer rete 120 is formed at the inwall of perforate 114, and be organic material, its adhesion in the insulating barrier 112 that perforate 114 inwall exposes is larger.
5th step, refers to Fig. 5, forms electroless plated metal layer 130 on described electroconductive polymer rete 120 surface.
Described substrate 110 is soaked in soluble metal salt solution, because the electroconductive polymer obtained after polymerization has the characteristic of oxidation/reduction condition conversion, in described electroconductive polymer oxidation/reduction condition conversion process, free electron can be discharged, thus the metal ion in soluble metal salt solution can be made to be reduced to metal simple-substance, form electroless plated metal layer 130 on described electroconductive polymer rete 120 surface.Soluble metal salt solution can be soluble copper salt solution, soluble silver salt solution or soluble palladium salting liquid etc.In the present embodiment, be described for copper-bath.After described substrate 110 is soaked in copper-bath, form electroless copper layer on described electroconductive polymer rete 120 surface.
6th step, refers to Fig. 6, electroplates described substrate 110, in perforate 114, form plated metal 140.
Because electroless plated metal layer 130 and electroconductive polymer rete 120 all have conductivity, therefore, when electroplating, the inwall electroless plated metal layer 130 of perforate 114 and electroconductive polymer rete 120 have good conductivity, thus plated metal 140 can be formed in perforate 114 fast, obtain conductive hole 101.
In this step, the surface of the first copper foil layer 111 and the second copper foil layer 113 can form plated metal simultaneously.Certainly, also before plating, plating resist barrier can be formed at the first copper foil layer 111 and the second copper foil layer 113 surface, the first copper foil layer 111 and the second copper foil layer 113 surface is blocked, only in perforate 114, forms plated metal 140.
7th step, refers to Fig. 7, and the first copper foil layer 111 is made formation first conductive circuit layer 151, the second copper foil layer 113 is made formation second conductive circuit layer 152, thus obtains circuit board 100.
Image transfer technique and etch process can be adopted, selective removal part first copper foil layer 111, to obtain the first conductive circuit layer 151, selective removal part second copper foil layer 113, to obtain the second conductive circuit layer 152, described first conductive circuit layer 151 and 152 layers, the second conducting wire are conducted mutually by conductive hole 101.
Further, the circuit board manufacturing method that the technical program provides, after the 4th step and before the 5th step, namely after the inwall of perforate 114 forms electroconductive polymer rete 120, electroconductive polymer rete 120 surface can also be included in and form a metal palladium layers.After the inwall of perforate 114 forms electroconductive polymer rete 120, substrate 110 can be soaked in soluble palladium salting liquid, make the palladium ion in soluble palladium salting liquid be reduced to Metal Palladium simple substance, and be adsorbed in electroconductive polymer rete 120 surface.Then, then after the substrate 110 being formed with metal palladium layers is soaked in soluble metal salt solution, electroless plated metal layer 130 is formed on described electroconductive polymer rete 120 surface.When forming electroless plated metal layer 130, the Metal Palladium on electroconductive polymer rete 120 surface can as catalyst, in described electroconductive polymer oxidation/reduction condition conversion process, can free electron be discharged, thus make the composition of the electroless plated metal layer formed more careful.Be understandable that, the circuit board manufacturing method that the technical program provides can also close insulating barrier and copper foil layer in the first conductive circuit layer 151 and/or the second conductive circuit layer 152 side pressure, and according to above-mentioned the step to the method for the 8th step, form conductive hole and conductive circuit layer, thus obtain more multi-layered circuit board.
See also Fig. 6 and Fig. 7, the technical program also provides a kind of circuit board 100, and it comprises insulating barrier 112, first conductive circuit layer 151 and the second conductive circuit layer 152.Form perforate 114 in described circuit board 100, described perforate 114 runs through the first conductive circuit layer 151, insulating barrier and the second conductive circuit layer 152.Be formed with electroconductive polymer rete 120, electroless plated metal layer 130 and plated metal 140 in described perforate 114, form conductive hole 101.Described electroconductive polymer rete 120 is directly formed at the inwall of perforate 114, and described electroless plated metal layer 130 is formed between electroconductive polymer rete 120 and plated metal 140.Described electroconductive polymer rete 120, electroless plated metal layer 130 and plated metal 140 are coaxially arranged.Described first conductive circuit layer 151 and the second conductive circuit layer 152 are formed at the relative both sides of insulating barrier 112, and the first conductive circuit layer 151 and the second conductive circuit layer 152 are by conductive hole 101 electric connection mutually.
Be understandable that, described conductive hole 101 also can only be formed in the first conductive circuit layer 151 and insulating barrier 112, and conductive hole 101 is conductive blind hole.Namely perforate 114 only runs through the first conductive circuit layer 151 and insulating barrier 112, part second conductive circuit layer 152 is exposed in perforate 114, and be connected with plated metal 140 with the electroconductive polymer rete 120 in perforate 114, electroless plated metal layer 130, thus make the first conductive circuit layer 151 and the second conductive circuit layer 152 by conductive hole 101 electric connection mutually.
In addition, between electroconductive polymer rete 120 and electroless plated metal layer 130, metal palladium layers can also be formed with.
Circuit board that the technical program provides and preparation method thereof, by forming electroconductive polymer layer in perforate, utilize electroconductive polymer to have oxidation/reduction condition conversion and produce the characteristic of free electron, thus electroconductive polymer can be utilized as the metal ion in reducing agent reduction soluble metallic salt, thus in perforate, form electroless plated metal layer.In the technical program, electroless plated metal layer can replace chemical-copper-plating process of the prior art, thus can operating process be reduced, and need not the harmful substances such as formaldehyde be used, the efficiency of circuit board making can be improved, reduce the waste of resource, and reduce the pollution to environment.
Further, owing to being formed with electroconductive polymer layer in the technical program between electroless plated metal layer and the inwall of perforate, because the adhesion of the inwall of electroconductive polymer layer and perforate is comparatively strong, thus the adhesion strength between the electroless plated metal layer of formation and perforate inwall can be strengthened.
Further, because electroconductive polymer layer itself has conductivity, when forming plated metal, electroplated metal layer and electroconductive polymer layer be combined with each other, and can improve the efficiency forming plated metal.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a circuit board, it comprises insulating barrier, first conductive circuit layer and the second conductive circuit layer, described first conductive circuit layer and the second conductive circuit layer are formed at the relative both sides of described insulating barrier, perforate is formed in described circuit board, electroconductive polymer rete is formed from the inwall of perforate successively to the center of perforate in described perforate, electroless plated metal layer and plated metal, form conductive hole, described electroconductive polymer rete is directly formed at the inwall of perforate, described electroless plated metal layer is formed between electroconductive polymer rete and plated metal, described first conductive circuit layer and the second conductive circuit layer are conducted mutually by described conductive hole.
2. circuit board as claimed in claim 1, is characterized in that, the material of described electroconductive polymer rete is the polymer of polyaniline, polypyrrole, polythiophene, the polymer of derivative of aniline, the polymer of Polypyrrole derivatives or thiophene derivant.
3. circuit board as claimed in claim 1, it is characterized in that, described conductive hole runs through the first conductive circuit layer, insulating barrier and the second conductive circuit layer.
4. circuit board as claimed in claim 1, it is characterized in that, described conductive hole runs through first conductive circuit layer and insulating barrier, and part second conductive circuit layer is exposed from described perforate inside.
5. circuit board as claimed in claim 1, it is characterized in that, be also formed with metal palladium layers in described perforate, described metal palladium layers is formed between electroless plated metal layer and electroconductive polymer rete, and contacts with electroconductive polymer layer with electroless plated metal layer.
6. a circuit board manufacturing method, comprises step:
There is provided substrate, described substrate comprises insulating barrier and the first copper foil layer;
In substrate, form perforate, described perforate runs through described insulating barrier and the first copper foil layer;
Adopt the inside of alkaline permanganate solution to perforate to process, make the oxidized removal of glue slag owing to producing when forming perforate in perforate, and the manganese dioxide inwall of perforate being adsorbed be reduced by potassium permanganate and producing;
By described substrate immersion in electroconductive polymer monomer, described manganese dioxide as catalyst, thus forms electroconductive polymer rete at the inwall of perforate;
Electroless plated metal layer is formed at described electroconductive polymer film surface;
Described substrate is electroplated, in perforate, forms plated metal; And
Described first copper foil layer is made formation first conductive circuit layer.
7. circuit board manufacturing method as claimed in claim 6, is characterized in that, described electroconductive polymer monomer is aniline, pyrroles, thiophene, the derivative of aniline, azole derivatives or thiophene derivant.
8. circuit board manufacturing method as claimed in claim 6, it is characterized in that, the method forming electroless plated metal layer at described electroconductive polymer film surface is: by described substrate immersion in soluble metal salt solution, the metal ion in soluble metal salt solution is made to be reduced to metal simple-substance, to form electroless plated metal layer at described electroconductive polymer film surface.
9. circuit board manufacturing method as claimed in claim 8, it is characterized in that, described soluble metallic salt is copper sulphate.
10. a circuit board manufacturing method, comprises step:
There is provided substrate, described substrate comprises insulating barrier and the first copper foil layer;
In substrate, form perforate, described perforate runs through described insulating barrier and the first copper foil layer;
Adopt the inside of alkaline permanganate solution to perforate to process, make the oxidized removal of glue slag owing to producing when forming perforate in perforate, and the manganese dioxide inwall of perforate being adsorbed be reduced by potassium permanganate and producing;
By described substrate immersion in electroconductive polymer monomer, described manganese dioxide as catalyst, thus forms electroconductive polymer rete at the inwall of perforate;
Metal palladium layers is formed at electroconductive polymer film surface
Electroless plated metal layer is formed on described metal palladium layers surface;
Described substrate is electroplated, in perforate, forms plated metal; And
Described first copper foil layer is made formation first conductive circuit layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310332300.5A CN104349588A (en) | 2013-08-02 | 2013-08-02 | Circuit board and manufacture method thereof |
| TW102129210A TW201515536A (en) | 2013-08-02 | 2013-08-14 | Circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310332300.5A CN104349588A (en) | 2013-08-02 | 2013-08-02 | Circuit board and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104349588A true CN104349588A (en) | 2015-02-11 |
Family
ID=52504093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310332300.5A Pending CN104349588A (en) | 2013-08-02 | 2013-08-02 | Circuit board and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104349588A (en) |
| TW (1) | TW201515536A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061138A (en) * | 2016-07-29 | 2016-10-26 | 维沃移动通信有限公司 | Preparation method of PCB and PCB |
| CN106163104A (en) * | 2016-08-30 | 2016-11-23 | 江门全合精密电子有限公司 | A kind of printed circuit board (PCB) using preventing leakage of tin via and preparation method thereof |
| CN107809852A (en) * | 2016-09-08 | 2018-03-16 | 鹏鼎控股(深圳)股份有限公司 | Without conductive line surfaces electro-plating method and circuit board obtained by this method |
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
| CN114126257A (en) * | 2020-08-27 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114501800A (en) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112911804A (en) * | 2021-01-13 | 2021-06-04 | 柏承科技(昆山)股份有限公司 | Film-stripping, glue-removing and copper-melting three-in-one process capable of preventing and removing glue pollution |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061138A (en) * | 2016-07-29 | 2016-10-26 | 维沃移动通信有限公司 | Preparation method of PCB and PCB |
| CN106163104A (en) * | 2016-08-30 | 2016-11-23 | 江门全合精密电子有限公司 | A kind of printed circuit board (PCB) using preventing leakage of tin via and preparation method thereof |
| CN107809852A (en) * | 2016-09-08 | 2018-03-16 | 鹏鼎控股(深圳)股份有限公司 | Without conductive line surfaces electro-plating method and circuit board obtained by this method |
| CN114126257A (en) * | 2020-08-27 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114126257B (en) * | 2020-08-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114501800A (en) * | 2020-10-27 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
| CN113518515B (en) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | Method for manufacturing broken joint metalized edge and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201515536A (en) | 2015-04-16 |
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Application publication date: 20150211 |