CN104349585B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN104349585B CN104349585B CN201310328970.XA CN201310328970A CN104349585B CN 104349585 B CN104349585 B CN 104349585B CN 201310328970 A CN201310328970 A CN 201310328970A CN 104349585 B CN104349585 B CN 104349585B
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- circuit board
- electroconductive polymer
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
Abstract
A kind of circuit board, its conducting wire for including substrate and being formed at substrate surface, the conducting wire includes conducting wire film and electroplated metal layer, the conducting wire film is formed between substrate and electroplated metal layer, the conducting wire film includes conductive polymer material and metal simple-substance, and the metal simple-substance is dispersed in the conductive polymer material.The present invention also provides the production method of the circuit board.
Description
Technical field
The present invention relates to circuit board making technology, more particularly to a kind of circuit board and preparation method thereof.
Background technology
As electronic product is toward miniaturization, the development in high speed direction, circuit board is also from single-sided circuit board, double-sided PCB
Develop toward multilayer circuit board direction.Multilayer circuit board refers to the circuit board with multilayer conductive circuit, it is with more wiring
Area, higher interconnection density, thus be widely used, referring to document Takahashi, A.Ooki, N.Nagai,
A.Akahoshi,H.Mukoh,A.Wajima,M.Res.Lab.,High density multilayer printed
Circuit board for HITAC M-880, IEEE Trans.on Components, Packaging, and
Manufacturing Technology,1992,15(4):418-425。
The following method of print circuit plates making generally use with refinement conducting wire：Insulated substrate is provided；Insulating
The surface of substrate forms conductive layer；Photoresist layer is formed on the surface of conductive layer；The photoresist layer is exposed
Light and development；The conductive layer is etched, obtains conducting wire；And the photoresist layer is removed.Above-mentioned
Production method in, it is necessary to using photoresist and the conductive layer of full wafer, it is also, treated in exposure, development and etching etc.
, it is necessary to corresponding chemical reagent and need substantial amounts of water resource to be cleaned in journey.So as to production method of the prior art
There is more serious pollution to environment, also, the production cost of circuit board is higher.
The content of the invention
Therefore, it is necessary to provide a kind of can reduce produces the circuit board manufacturing method of pollution and obtained circuit to environment
Plate.
A kind of circuit board, its conducting wire for including substrate and being formed at substrate surface, the conducting wire include conduction
Line film and electroplated metal layer, the conducting wire film are formed between substrate and electroplated metal layer, the conducting wire
Film includes conductive polymer material and metal simple-substance, and the metal simple-substance is dispersed in the conductive polymer material
It is interior.
A kind of production method of circuit board, including step：Electroconductive polymer monomer and soluble metal salt solution are provided；
The electroconductive polymer monomer and soluble metal salt solution are uniformly mixed to get presoma；Substrate is provided；Before described
Body is driven to be coated in the surface of substrate formation conducting wire pattern；Using conducting wire pattern described in ultraviolet light so that its is hard
Change so that the electroconductive polymer monomer polymerization obtains electroconductive polymer, and the metal ion of the metal salt is reduced to
Metal simple-substance, obtains conducting wire film；And form electroplated metal layer, the plating gold in the conducting wire film surface
Belong to layer with conducting wire film by forming conducting wire.
Circuit board that the technical program provides and preparation method thereof, by the monomer of electroconductive polymer and including metal ion
Predecessor coated substrates surface, and conducting wire film is become using ultraviolet light after-hardening.The conducting wire is thin
Film includes conductive polymer material and metal simple-substance, has good electric conductivity, can be used as follow-up directly in its surface shape
Into electroplated metal layer.Therefore, the production method for the circuit board that the technical program provides, when making conducting wire, it is not necessary into
The processing such as row exposure, development and etching, so as to avoid using substantial amounts of chemical reagent and need substantial amounts of water resource.So as to this
The circuit board manufacturing method that technical solution provides can reduce the pollution produced to environment, and reduce the production cost of circuit board.
Further, the formation of conducting wire film only needs to use ultraviolet light in the technical program, is handled without high-temperature baking,
The damage of the insulating layer in substrate is caused during so as to avoid high-temperature baking.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the substrate that the technical program embodiment provides.
Fig. 2 is that the substrate surface of Fig. 1 forms the diagrammatic cross-section after conducting wire pattern.
Fig. 3 is that the conducting wire pattern of Fig. 2 is obtained the section signal after conducting wire film by ultraviolet light after-hardening
Figure.
Fig. 4 is that the substrate surface of Fig. 3 forms the diagrammatic cross-section after plating barrier layer.
Fig. 5 is that the conducting wire film surface of Fig. 4 forms the diagrammatic cross-section after electroplated metal layer.
Fig. 6 is the diagrammatic cross-section for the circuit board that the technical program makes.
Main element symbol description
Substrate 110
Conducting wire pattern 120
Conducting wire film 121
Plating barrier layer 150
Opening 151
Electroplated metal layer 130
Conducting wire 140
Circuit board 100
Following embodiment will combine above-mentioned attached drawing and further illustrate the present invention.
Embodiment
Circuit board provided below in conjunction with accompanying drawings and embodiments the technical program and preparation method thereof is made further
Describe in detail.
The production method for the circuit board that the technical program embodiment provides comprises the following steps：
The first step, there is provided electroconductive polymer monomer and soluble metal salt solution.
The electroconductive polymer monomer is the conductive monomer of the macromolecule formed after polymerizeing.The electric conductivity is high
Molecule monomer is specifically as follows aniline, pyrroles or thiophene etc., or derivative, azole derivatives or the thiophene of aniline spread out
Biology etc., such as 3,4- ethylenes thiophene, 2,5- dimethoxy aniline etc..Electroconductive polymer monomer is usually liquid.
Soluble metal salt solution can be soluble copper salt solution, soluble silver salt solution or soluble palladium salting liquid
Deng.In the present embodiment, illustrated by taking copper-bath as an example.
Second step, presoma is uniformly mixed to get by the electroconductive polymer monomer and soluble metal salt solution.
In this step, mechanical agitation or other modes can be used so that electroconductive polymer monomer and soluble gold
Belong to salting liquid uniformly to mix.
3rd step, please refers to Fig.1, there is provided substrate 110.
The substrate 110 can be insulating substrate, or be already formed with the circuit substrate of conducting wire, the electricity
The side of base board is insulating substrate.The material of the insulating substrate can be exhausted to be commonly used to fabricate during circuit board making
The material of edge layer, such as polyimides.In the present embodiment, substrate 110 is illustrated exemplified by insulating substrate.
4th step, conducting wire pattern is formed referring to Fig. 2, being coated on the presoma on the surface of substrate 110
120。
In this step, the presoma can be coated with by the way of screen painting, inkjet printing or rotary coating
In in the surface of substrate 110 formation conducting wire pattern 120.The shape of the conducting wire pattern 120 and distribution to be formed with being intended to
Conducting wire distribution and shape it is identical.
5th step, referring to Fig. 3, being hardened using conducting wire pattern 120 described in ultraviolet light, it is thin to obtain conducting wire
Film 121.
It is irradiated by using ultraviolet light so that the conduction in presoma in the conducting wire pattern 120
Property high polymer monomer occur polymerisation, become electroconductive polymer, combine closely with the surface of substrate 110.In the conduction
During property high polymer monomer is polymerize, free electron can be produced, in the presoma in the conducting wire pattern 120
The metal ion of soluble metal salt solution combined with the free electron, be reduced to metal simple-substance, led obtained from
Metal simple-substance atom in electric line film 121 is connected with each other, further the conduction of the conducting wire pattern 120 after increase hardening
Performance.
Further, in the present embodiment, the wave-length coverage of the ultraviolet light used is 350 nanometer to 400 nanometers.Preferably
365 nanometers.When derivative, azole derivatives or the thiophene derivant using aniline are as electroconductive polymer monomer, such as
Reprimand electronics base is connected with the cyclic structure of fruit monomer, such as methoxyl group, can more contribute to monomer to provide electricity in polymerization
Son gives the metal ion of metal salt, in order to which metal ion is reduced to metal simple-substance.For example, it is 2 to work as electroconductive polymer monomer,
During 5- dimethoxy aniline, methoxyl group is connected on 2 and 5 positions of its phenyl ring, since methoxyl group has, reprimand is electro, so that
Monomer is accelerated to provide metal ion of the electronics to metal salt in polymerization, in order to which metal ion is reduced to metal simple-substance.
Further, since the electroconductive polymer obtained after polymerization has the characteristic of oxidation/reduction condition conversion, led described
In electrical oxidation polymer/reducing condition conversion process, free electron can be discharged, so as to further speed up metal from
Son is reduced to metal simple-substance.
The electroconductive polymer obtained in conducting wire film 121 can be polyaniline, polypyrrole or polythiophene.Or benzene
The polymer of the derivative of amine, azole derivatives or thiophene derivant.Such as Polyglycolic acid fibre or poly- 2,5- dimethoxies
Aniline etc..The metal simple-substance can be copper, silver or palladium etc..
6th step, also referring to Fig. 4 to Fig. 6, by the way of plating, forms on the surface of conducting wire film 121
Electroplated metal layer 130, the electroplated metal layer 130 collectively form conducting wire 140 with conducting wire film 121, obtain circuit
Plate 100.
Specifically, plating barrier layer 150 can be formed first on the surface of substrate 110, formed in the plating barrier layer 150
There is opening 151 corresponding with conducting wire film 121 so that conducting wire film 121 exposes from the opening 151.The electricity
Plating barrier layer 150 can be formed by the way of photoresist is printed.Then, by the way of plating, leading after curing
121 surface of electric line film forms electroplated metal layer 130.Since the conducting wire film 121 after hardening is conductive, so that
Conducting wire film 121 after can hardening carries out plating metal, forms electroplated metal layer 130.Finally, the plating resist is removed
Barrier 150.The electroplated metal layer 130 can be metal copper layer.
After this step, the step of forming soldermask layer on the surface of circuit board 100 can further include.
Referring to Fig. 6, the technical program also provides a kind of circuit board 100, it includes substrate 110 and is formed at substrate 110
The conducting wire 140 on surface.The conducting wire 140 includes conducting wire film 121 and electroplated metal layer 130.The conduction
Line film 121 is formed between substrate 110 and electroplated metal layer 130, and the conducting wire film 121 includes electric conductivity high score
Sub- material and metal simple-substance.The metal simple-substance is dispersed in the conductive polymer material.The electric conductivity high score
Son is used for bearing metal simple substance, and conducting wire film 121 is combined closely with substrate 110.The electric conductivity high score
Son can be polyaniline, polypyrrole or polythiophene.The either polymerization of the derivative of aniline, azole derivatives or thiophene derivant
Thing.Such as Polyglycolic acid fibre or poly- 2,5- dimethoxies aniline etc..The metal simple-substance can be copper, silver or palladium etc..
It is understood that the circuit board manufacturing method that the technical program provides can also be applied to the system of multilayer circuit board
Make, it is only necessary to insulating layer is pressed in 140 side of conducting wire, then, according to the method for making conducting wire 140, in insulating layer
Surface make conducting wire.
Circuit board that the technical program provides and preparation method thereof, by the monomer of electroconductive polymer and including metal ion
Predecessor coated substrates surface, and conducting wire film is become using ultraviolet light after-hardening.The conducting wire is thin
Film includes conductive polymer material and metal simple-substance, has good electric conductivity, can be used as follow-up directly in its surface shape
Into electroplated metal layer.Therefore, the production method for the circuit board that the technical program provides, when making conducting wire, it is not necessary into
The processing such as row exposure, development and etching, so as to avoid using substantial amounts of chemical reagent and need substantial amounts of water resource.So as to this
The circuit board manufacturing method that technical solution provides can reduce the pollution produced to environment, and reduce the production cost of circuit board.
Further, the formation of conducting wire film only needs to use ultraviolet light in the technical program, without high temperature
Baking is handled, and so as to avoid high-temperature baking when causes the damage of the insulating layer in substrate.
It is understood that for those of ordinary skill in the art, it can be conceived with the technique according to the invention and done
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (10)
1. a kind of circuit board, its conducting wire for including substrate and being formed at substrate surface, the conducting wire include conductor wire
Road film and electroplated metal layer, the conducting wire film are formed between substrate and electroplated metal layer, and the conducting wire is thin
Film includes conductive polymer material and metal copper simple substance, and the metal copper simple substance is dispersed in the electroconductive polymer material
In material.
2. circuit board as claimed in claim 1, it is characterised in that the electroconductive polymer is polyaniline, polypyrrole or poly-
Thiophene.
3. circuit board as claimed in claim 1, it is characterised in that the electroconductive polymer is the polymerization of anil
The polymer of thing, the polymer of azole derivatives or thiophene derivant.
4. circuit board as claimed in claim 1, it is characterised in that the electroconductive polymer for Polyglycolic acid fibre or
Poly- 2,5- dimethoxies aniline.
5. circuit board as claimed in claim 1, it is characterised in that the material of the electroplated metal layer is copper.
6. a kind of production method of circuit board, including step：
Electroconductive polymer monomer and soluble copper salting liquid are provided；
The electroconductive polymer monomer and soluble copper salting liquid are uniformly mixed to get presoma；
Substrate is provided；
The presoma is coated on and forms conducting wire pattern on the surface of substrate；
Using conducting wire pattern described in ultraviolet light so that it is hardened so that the electroconductive polymer monomer polymerization obtains
Electroconductive polymer, the metal ion of the soluble copper salting liquid are reduced to metal copper simple substance, obtain conducting wire film；
And
Electroplated metal layer is formed in the conducting wire film surface, the electroplated metal layer passes through composition with conducting wire film
Conducting wire.
7. the production method of circuit board as claimed in claim 6, it is characterised in that the electroconductive polymer monomer is benzene
Amine, pyrroles, thiophene, the derivative of aniline, azole derivatives or thiophene derivant.
8. the production method of circuit board as claimed in claim 6, it is characterised in that the electroconductive polymer monomer is 3,4-
Ethylene thiophene or 2,5- dimethoxy aniline.
9. the production method of circuit board as claimed in claim 6, it is characterised in that the wave-length coverage of the ultraviolet light is 350
Nanometer is to 400 nanometers.
10. the production method of circuit board as claimed in claim 6, it is characterised in that the presoma passes through screen painting, spray
The mode of ink printing or rotary coating is coated on the surface of substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328970.XA CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
| TW102128959A TWI531285B (en) | 2013-08-01 | 2013-08-13 | Circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328970.XA CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104349585A CN104349585A (en) | 2015-02-11 |
| CN104349585B true CN104349585B (en) | 2018-05-15 |
Family
ID=52504090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310328970.XA Active CN104349585B (en) | 2013-08-01 | 2013-08-01 | Circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104349585B (en) |
| TW (1) | TWI531285B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304661A (en) * | 2016-09-28 | 2017-01-04 | 东莞联桥电子有限公司 | A kind of processing technique of wiring board |
| CN109714902A (en) * | 2017-10-25 | 2019-05-03 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN109246925B (en) | 2018-08-28 | 2020-03-31 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of soft and hard board |
| CN109936926A (en) * | 2019-03-13 | 2019-06-25 | 江西沃格光电股份有限公司 | Single-sided flexible substrate fine-line and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101754585A (en) * | 2008-11-27 | 2010-06-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing conductive circuit |
| CN102870508A (en) * | 2011-04-26 | 2013-01-09 | 日本梅克特隆株式会社 | Method for producing transparent printed wiring board, and method for producing transparent touch panel |
| EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19822075C2 (en) * | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Process for the metallic coating of substrates |
| US7459519B2 (en) * | 2003-05-22 | 2008-12-02 | Panasonic Corporation | Method for manufacturing electrically conductive macromolecules and solid state electrolytic capacitor using electrically conductive macromolecules |
| CN100406613C (en) * | 2005-11-17 | 2008-07-30 | 上海交通大学 | Laser induced selective chemical plating process |
-
2013
- 2013-08-01 CN CN201310328970.XA patent/CN104349585B/en active Active
- 2013-08-13 TW TW102128959A patent/TWI531285B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101754585A (en) * | 2008-11-27 | 2010-06-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing conductive circuit |
| CN102870508A (en) * | 2011-04-26 | 2013-01-09 | 日本梅克特隆株式会社 | Method for producing transparent printed wiring board, and method for producing transparent touch panel |
| EP2566311A1 (en) * | 2011-09-02 | 2013-03-06 | Atotech Deutschland GmbH | Direct plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI531285B (en) | 2016-04-21 |
| TW201515535A (en) | 2015-04-16 |
| CN104349585A (en) | 2015-02-11 |
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Effective date of registration: 20170705 Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei, China Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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