CN201909500U - Air duct type semiconductor freezer - Google Patents
Air duct type semiconductor freezer Download PDFInfo
- Publication number
- CN201909500U CN201909500U CN2010206566867U CN201020656686U CN201909500U CN 201909500 U CN201909500 U CN 201909500U CN 2010206566867 U CN2010206566867 U CN 2010206566867U CN 201020656686 U CN201020656686 U CN 201020656686U CN 201909500 U CN201909500 U CN 201909500U
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- air duct
- cover plate
- type semiconductor
- duct type
- air
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Abstract
The utility model discloses an air duct type semiconductor freezer, belonging to the technical field of electric refrigeration, and aiming at solving the problems of unreasonable structure, higher temperature gradient in the freezer and slow initial refrigeration speed. The air duct type semiconductor freezer is formed by arranging a heat absorption device (3), an inner box (9) and a semiconductor refrigerating piece (2) on a radiator (1) by connecting pieces, wherein the inner box (9) is provided with an air duct cover plate (6), the upper part of the air duct cover plate is provided with a cold air inlet (7), and the lower part of the air duct cover plate is provided with a cold air outlet (8); and a minitype fan (4) which is consistent with a cold air flow path (5) is arranged between the air duct cover plate (6) and the inner box (9). The air duct type semiconductor freezer can be widely applied to refrigeration of a refrigerator.
Description
Technical field
The utility model relates to a kind of semiconductor refrigeration box, and concrete is a kind of air duct type semiconductor refrigeration box.
Background technology
In small-sized refrigerating box was used, semiconductor cooler had its very superior characteristics at present.But because unreasonable structure there is the slow deficiency of the bigger and initial refrigerating speed of thermograde in the case.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of rational in infrastructure, the fast air duct type semiconductor refrigeration box of the little and initial refrigerating speed of thermograde in the case.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions: the air duct type semiconductor refrigeration box comprises radiator, semiconductor chilling plate and heat absorption device, the air channel cover plate of upper and lower opening is housed on the interior case, is equipped with and the consistent mini-fan of cold wind glide path between air channel cover plate and the interior case.
The utility model also can be achieved through the following technical solutions: the top of described air channel cover plate has cold air inlet, and the bottom has the cold wind outlet.
The utility model also can be achieved through the following technical solutions: described mini-fan is installed on the cover plate of air channel.
Compared with prior art, the beneficial effects of the utility model are: rational in infrastructure, and the fast and energy-saving advantages of little, the initial refrigerating speed of thermograde in the case.
Description of drawings
Fig. 1 is that master of the present utility model looks schematic diagram.
Fig. 2 is the schematic side view of the utility model Fig. 1.
In the accompanying drawings: case in 1-radiator, 2-semiconductor chilling plate, 3-heat absorption device, 4-mini-fan, 5-cold wind glide path, 6-air channel cover plate, 7-cold air inlet, the outlet of 8-cold wind, the 9-.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions: the air duct type semiconductor refrigeration box is that heat absorption device 3, interior case 9 and semiconductor chilling plate 2 usefulness connectors are contained on the radiator 1, top is housed on the interior case 9 has the air channel cover plate 6 that cold air inlet 7 and bottom have cold wind outlet 8, the mini-fan 4 consistent with cold wind glide path 5 is housed between air channel cover plate 6 and the interior case 9.
In small-sized refrigerating box was used, semiconductor cooler had its very superior characteristics.But because structure, the thermograde in the case is bigger, and some thermally sensitive application seems that some is sorry.The utility model has changed the riding position of mini-fan, has solved the glide path of air-flow by the air channel, has dwindled the case internal difference in temperature, has accelerated initial refrigerating speed.The fan of routine has been moved on to the side from the dead ahead of heat absorption device, and simultaneously, the direction that has changed air-flow is by changing into along fan, heat absorption device, air outlet, chamber interior wall round the partial circulating of fan, turn-taking and get back to the systemic circulation of air inlet to fan.Reached and reduced the temperature difference and then purpose of energy saving.
Claims (3)
1. air duct type semiconductor refrigeration box, comprise radiator (1), semiconductor chilling plate (2) and heat absorption device (3), it is characterized in that: the air channel cover plate (6) of upper and lower opening is housed on the interior case (9), between air channel cover plate (6) and the interior case (9) mini-fan (4) consistent with cold wind glide path (5) is housed.
2. air duct type semiconductor refrigeration box as claimed in claim 1 is characterized in that: the top of air channel cover plate (6) has cold air inlet (7), and the bottom has cold wind outlet (8).
3. air duct type semiconductor refrigeration box as claimed in claim 1 or 2 is characterized in that: mini-fan (4) is installed on the air channel cover plate (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206566867U CN201909500U (en) | 2010-12-14 | 2010-12-14 | Air duct type semiconductor freezer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206566867U CN201909500U (en) | 2010-12-14 | 2010-12-14 | Air duct type semiconductor freezer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201909500U true CN201909500U (en) | 2011-07-27 |
Family
ID=44301701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010206566867U Expired - Fee Related CN201909500U (en) | 2010-12-14 | 2010-12-14 | Air duct type semiconductor freezer |
Country Status (1)
Country | Link |
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CN (1) | CN201909500U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104126568A (en) * | 2014-08-08 | 2014-11-05 | 济南鑫贝西生物技术有限公司 | Specimen refrigerated cabinet |
CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
CN105054812A (en) * | 2015-09-10 | 2015-11-18 | 东莞市金河田实业有限公司 | Oven with refrigerating and freshness keeping functions |
CN105962796A (en) * | 2016-07-25 | 2016-09-28 | 中山市广隆燃具电器有限公司 | Freshness preservation device of oven |
CN106419616A (en) * | 2016-08-31 | 2017-02-22 | 宁波方太厨具有限公司 | Oven with refrigeration freshness-retaining function |
-
2010
- 2010-12-14 CN CN2010206566867U patent/CN201909500U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
CN104329848B (en) * | 2014-03-28 | 2017-03-29 | 海尔集团公司 | Semiconductor freezer |
CN104126568A (en) * | 2014-08-08 | 2014-11-05 | 济南鑫贝西生物技术有限公司 | Specimen refrigerated cabinet |
CN105054812A (en) * | 2015-09-10 | 2015-11-18 | 东莞市金河田实业有限公司 | Oven with refrigerating and freshness keeping functions |
CN105962796A (en) * | 2016-07-25 | 2016-09-28 | 中山市广隆燃具电器有限公司 | Freshness preservation device of oven |
CN106419616A (en) * | 2016-08-31 | 2017-02-22 | 宁波方太厨具有限公司 | Oven with refrigeration freshness-retaining function |
CN106419616B (en) * | 2016-08-31 | 2019-06-28 | 宁波方太厨具有限公司 | A kind of oven with cold storing and fresh-keeping function |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: Hebei Hongjiu Rensheng Electronic Technologies Co., Ltd. Document name: Notification to Pay the Fees |
|
DD01 | Delivery of document by public notice |
Addressee: Liu Jinpo Document name: Notification of Termination of Patent Right |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20121214 |
|
CF01 | Termination of patent right due to non-payment of annual fee |