CN104238822A - Sensing electrode lamination structure, touch lamination structure and forming method thereof - Google Patents
Sensing electrode lamination structure, touch lamination structure and forming method thereof Download PDFInfo
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- CN104238822A CN104238822A CN201410495766.1A CN201410495766A CN104238822A CN 104238822 A CN104238822 A CN 104238822A CN 201410495766 A CN201410495766 A CN 201410495766A CN 104238822 A CN104238822 A CN 104238822A
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Abstract
The invention discloses a sensing electrode lamination structure. The sensing electrode lamination structure comprises a transparent patterning conductive layer and a transparent photographic insulation adhesive layer which is directly adhered on the transparent patterning conductive layer. The invention also discloses a touch stack layer structure, an electrode lamination structure and a method for forming the electrode lamination structure. The invention provides the novel sensing electrode lamination structure, the touch lamination structure and a method for forming the electrode lamination structure. The invention provides a product with ultrathin thickness which is made of an ultrathin transparent photographic insulation material. Since the thickness of the ultrathin product is minimized, the optical transparency is improved. The ultrathin insulation material is used as an insulation layer, so that the consumption of the optical cement is reduced, the production flow is shortened, and an effect for reducing the cost can be realized. In addition, since the thickness of the insulation layer is reduced, the overall optical transparency can be further improved.
Description
Technical field
The present invention relates to technical field of touch control, particularly relate to sensing electrode layered structure, touch-control layered structure and forming method thereof.
Background technology
By the laminated touch-control layered structure formed of sensing electrode, it is the excellent fix of action electronic device input mode.The practice of conventional touch layered structure is transparency conducting layer of being arranged in pairs or groups respectively by two-layer transparent insulating layer.By the time after transparent insulating layer collocation transparency conducting layer completes respectively, then with optics double faced adhesive tape, the thin film stack of two groups is attached to together, completes traditional touch-control layered structure, so be called Thin Films-Film (F-F) structure.
But, use optics double faced adhesive tape to be attached to together by the thin film stack of two groups, can the extra thickness increasing touch-control layered structure.For optical appearance, because product structure is thickening, optics transmittancy is and then deteriorated.Add double faced adhesive tape laminating process and can increase Making programme.So still need a kind of for material, flow process, equipment, manpower, the structure that all the novel touch-control of attainable cost reduction benefit is laminated.
Summary of the invention
Fundamental purpose of the present invention is the technical matters that the structure production cost of touch-control lamination in solution prior art is high.
For achieving the above object, the invention provides a kind of sensing electrode layered structure, comprise: a patterned transparent conductive layer; And a transparent photosensitive insulation adhesion layer, directly attach this pattern metal transparency conducting layer.
Preferably, this pattern metal transparency conducting layer is selected from the group of a metal and a transparent conductive material.
In addition, for achieving the above object, the present invention also provides a kind of touch-control stack layer structure, and comprise: a transparent base, it has relative two sides; A kind of described sensing electrode layered structure attaches this relative two sides; And a cover sheet, cover this sensing electrode layered structure of a slice, this sheet sensing electrode layered structure is folded between this transparent base and this cover sheet.
In addition, for achieving the above object, the present invention also provides a kind of touch-control stack layer structure, comprises: an inorganic transparent ground; First sensing electrode layered structure described in one, wherein this first sensing electrode layered structure attaches this inorganic transparent base material; And the second sensing electrode layered structure described in, this first sensing electrode layered structure is folded between this inorganic transparent base material and this second sensing electrode layered structure.
Preferably, the first patterned transparent conductive layer in this first sensing electrode layered structure, directly attaches the second transparent photosensitive insulation adhesion layer in this second sensing electrode layered structure.
In addition, for achieving the above object, the present invention also provides a kind of touch-control stack layer structure, comprises: an inorganic transparent ground; One ink layer, is positioned at the edge of the one side of this inorganic transparent ground, and defines an opening; One transparent adhesion layer, covers this ink layer and inserts this opening; And sensing electrode layered structure described in, be positioned on this transparent adhesion layer.
Preferably, this patterned transparent conductive layer in this sensing electrode layered structure directly contacts this transparent adhesion layer.
Preferably, this transparent photosensitive insulation adhesion layer in this sensing electrode layered structure directly contacts this transparent adhesion layer.
In addition, for achieving the above object, the present invention also provides a kind of method forming electrode layered structure, and comprise: provide an organic insulation base material, it is pasted with the first conductive layer of whole piece; This first conductive layer on this organic insulation base material of patterning, makes this first conductive layer become one first patterned conductive layer; There is provided a transparent photosensitive insulation adhesion layer, it is pasted with a pattern metal transparency conducting layer; This transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material, this first patterned conductive layer is folded between this organic insulation base material and this transparent photosensitive insulation adhesion layer, and obtains an electrode layered structure.
Preferably, with 0.2-0.5 meter/minute speed, continuously this transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material.
Preferably, use a plurality of assistor, this transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material, to eliminate at least one of one of this electrode layered structure bubble and a gauffer.
Preferably, the method of described formation electrode layered structure more comprises: carry out a metal routing processing procedure for this electrode layered structure, make this first patterned conductive layer and this pattern metal transparency conducting layer respectively with one of to be positioned on this ink layer the first metal routing and one second metal routing is electrically connected, and obtain a touch-control structure.
In addition, for achieving the above object, the present invention also provides a kind of electrode layered structure, comprises: an organic insulation base material; One first patterned conductive layer, is attached on this organic insulation base material; And a transparent photosensitive insulation adhesion layer, it is attached on this first patterned conductive layer, is pasted with again a pattern metal transparency conducting layer.
The present invention proposes a kind of sensing electrode layered structure of novelty, touch-control layered structure and the method forming electrode layered structure.The present invention proposes the product obtaining thickness ultrathin with the photosensitive insulation material of ultrathin transparent.This ultra-thin product, because thickness reduces to minimum, optical transmittance is promoted.Using ultrathin insulating material as insulation course, can reduce the use of optical cement, and shorten Making programme, attainable cost reduces the effect of benefit.In addition, because thickness of insulating layer reduces, overall optics penetration can also be promoted further.
In addition, such textural association, can shorten the production flow process of Thin Films-Film superthin structure, the Thin Films-Film structure providing high optical appearance, high optics penetrance ultra-thin and the solution of low cost.Also can adjust the Making programme of superthin structure, equipment mechanism increases assistor (supporting) and the mode reducing laminating speed, can make transparent insulating film smooth pan feeding before laminating, to reduce fold possibility occurrence.
Accompanying drawing explanation
Fig. 1 to Fig. 4 illustrates the key step that the present invention forms electrode layered structure method.
Fig. 2 A to Fig. 2 E series illustrates the possible mode of patterning first conductive layer.
Fig. 5 illustrates in electrode layered structure and carries out metal routing processing procedure.
The sensing electrode layered structure of the present invention that Fig. 6 illustrates.
Fig. 6 A and Fig. 6 B illustrates the special pattern that pattern metal transparency conducting layer has.
The touch-control stack layer structure of the present invention that Fig. 7 illustrates.
Fig. 8 illustrates the touch-control stack layer structure of the present invention's another kind.
Fig. 9 and Fig. 9 A illustrates sensing electrode layered structure can multiple different arrangement.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of sensing electrode layered structure of novelty, touch-control layered structure and the method forming electrode layered structure.From the design in product structure, use, so product can be reached subtract thick benefit because reduce one deck optics double faced adhesive tape.For optical appearance, because product structure is thinning, optics transmittancy can be promoted.Attach because cancelling traditional double faced adhesive tape again, its Making programme also shortens, and makes manufacturing process have more the advantage of optimization, for material, flow process, equipment, manpower, and the benefit of all attainable cost reductions.
First the present invention provides a kind of method forming electrode layered structure.Fig. 1 to Fig. 4 illustrates the key step that the present invention forms electrode layered structure method.First, as Fig. 1 illustrate, provide organic insulating substrate 110, it is pasted with the first conductive layer 111 of whole piece.Be pasted with the organic insulation base material 110 of whole piece first conductive layer 111, long paper strip (reel) can be into, and be conducive to Continuous maching.Organic insulation base material 110 is according to the application demand of different occasion, can be glass, polyester (PET), cyclic olefin polymer (COP) or polyimide (PI), also can be the combination between polyester (PET), cyclic olefin polymer (COP), polyimide (COP).Polyester is because good optical penetration and low thermal expansivity, and low price, be that excellent base material is selected.
The first conductive layer attached, preferably is metal, transparent conductive material or its combination.Metal can be gold, silver, copper, how rice metal, grid metal line etc.Transparent conductive material can be metal-doped oxide, carbon nanotube (carbon nanotube), electroconductive polymer or Graphene (Graphene) etc.Metal-doped oxide is such as the gallium zinc oxide (GZO), aluminium zinc oxide (AZO) etc. of indium tin oxide (ITO), indium tin oxide nanoparticle, indium-zinc oxide (IZO), non-indium.How rice metal can be Nai meter Yin.Grid metal line can be silver-colored Nanowire (silver nanowires).Electroconductive polymer is such as poly-fen (polythiophene), gathers and cough up (polypyrrole), polyaniline (polyaniline), polyacetylene (polyacetylene) etc.Indium tin oxide, has relatively low resistance ratio and relatively high light transmittance simultaneously, and weatherability is good simultaneously, is widely used transparent conductive material.
Secondly, the first conductive layer 111 on patterning organic insulation base material 110, makes the first conductive layer 111 become the first patterned conductive layer 112.The mode of patterning first conductive layer 111, can as Fig. 2 A to Fig. 2 E series illustrate.First, please refer to Fig. 2 A, provide be pasted with whole piece first conductive layer 111 organic insulation base material 110, first conductive layer 111 again by a transfer film 113 entirety cover.Transfer film 113 can be conventional positive photoresistance or negative photoresistance.Secondly, please refer to Fig. 2 B, after the first conductive layer 111 transfer printing transfer film 113, use light shield 114 to expose.Such as, use wavelength to be the conditions of exposure of 365 how rice, the predetermined pattern 115 on light shield 114 is transferred in the first conductive layer 111.Then, please refer to Fig. 2 C, first remove transfer film 113 and the potential transfer pattern 115 do not destroyed in the first conductive layer 111.Continue, please refer to Fig. 2 D, carry out development step, such as, use the sodium carbonate liquor of 1% to carry out development step, just can obtain presenting shift pattern 115 become the first patterned conductive layer 112.Afterwards, please refer to Fig. 2 E, can also baking procedure be carried out, such as the baking condition of erg-ten/square centimeter, toast the transfer pattern 115 of the first patterned conductive layer 112.Through above step, namely the predetermined pattern 115 on light shield 114 can be fixed in the first conductive layer 111.
Then, show as depicted in fig. 3, provide transparent photosensitive insulation adhesion layer 120 (TCTF), it is pasted with patterned transparent conductive layer 121.The material of transparent photosensitive insulation adhesion layer 120 can be the material such as acryl and/or epoxy resin.General resin, after adding corresponding emulsion, may be all the material of transparent photosensitive insulation adhesion layer.The patterned transparent conductive layer 121 attached can be metal, transparent conductive material or its combination, and detail section please refer to aforementioned.The method of patterned transparent conductive layer 121, the feasible program that can be illustrated with reference to earlier figures 2A to Fig. 2 E series.The pattern of the patterned transparent conductive layer 121 that transparent photosensitive insulation adhesion layer 120 attaches, the predetermined pattern 115 with the first patterned conductive layer 112, can be the same or different.
As previously mentioned, when being pasted with the organic insulation base material 110 of patterning first conductive layer 112, time all complete with the transparent photosensitive insulation adhesion layer 120 being pasted with patterned transparent conductive layer 121, transparent photosensitive insulation adhesion layer 120 can be pasted on organic insulation base material 110 by continuation.As Fig. 4 illustrate, in an embodiment of the present invention, abutted equipment 108 can be used, preferably uses together with assistor, such as a plurality of assistor 109, transparent photosensitive insulation adhesion layer 120 is pasted on organic insulation base material 110, therefore the first patterned conductive layer 112 is folded between organic insulation base material 110 and transparent photosensitive insulation adhesion layer 120, and obtains electrode layered structure 100.Specifically, be pasted with the transparent photosensitive insulation adhesion layer 120 of patterned transparent conductive layer 121, can be located at the side near assistor 109, the below of transparent photosensitive insulation adhesion layer 120 is then located at by organic insulation base material 110.
Because transparent photosensitive insulation adhesion layer 120 has stickiness, so organic insulation base material 110 can be attached on transparent photosensitive insulation adhesion layer 120 firmly.Assistor 109 contributes to having less bubble or gauffer in the electrode layered structure 100 reduced simultaneously, and preferably's assistor 109 can eliminate bubble or gauffer, so obtain smooth electrode layered structure 100 (showing as shown graphically in fig 5).Patterned transparent conductive layer in electrode layered structure 100 121 and patterning first conductive layer 112, namely through transparent photosensitive insulation adhesion layer 120, repeatedly right laminated on organic insulation base material 110.In another embodiment of the present invention, in order to reduce bubble or the gauffer of electrode layered structure 100 further, can also with lower feed rate, such as 0.2-0.5 meter/minute speed, continuously transparent photosensitive insulation adhesion layer 120 is pasted on organic insulation base material 110.One of feature of the present invention is, does not use optics double faced adhesive tape (not shown) to transparent photosensitive insulation adhesion layer 120 and the organic insulation base material 110 of fitting.
After transparent photosensitive insulation adhesion layer 120 is conformed to organic insulation base material 110, in another embodiment of the present invention, patterned transparent conductive layer in electrode layered structure 100 121 and patterning first conductive layer 112 can be carried out metal routing processing procedure again.Show as shown graphically in fig 5, the panel frame 130 with ink layer 139 is provided.Metal routing processing procedure is by patterned transparent conductive layer 121 insulated from each other and patterning first conductive layer 112, be electrically connected with touch-control integrated circuit (not shown) by the first metal routing 131 be located on the ink layer 139 of panel frame 130 and the second metal routing 132, make electrode layered structure 100 become touch control electrode in touch-control structure 101.In addition, electrode layered structure 100 can be fitted with panel frame 130 by transparent adhesion layer 144, and transparent adhesion layer 144 can be optical clear viscose (OCA), optical clear resin (OCR) or its combination.It should be noted that, the stacking order of the organic insulation base material 110 in electrode layered structure 100, patterning first conductive layer 112, transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121 can change, as long as patterning first conductive layer 112 does not directly contact each other with patterned transparent conductive layer 121 according to product estovers.For example, the stacking order of electrode layered structure 100 can as shown in Figure 5, from the bottom to top with the stacking order of organic insulation base material 110, patterning first conductive layer 112, transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121, superposition is on transparent adhesion layer 144.In addition, the order storehouse of patterned transparent conductive layer 121, transparent photosensitive insulation adhesion layer 120, organic insulation base material 110 and patterning first conductive layer 112 can also be used.Or, also can use the order storehouse of patterned transparent conductive layer 121, transparent photosensitive insulation adhesion layer 120, patterning first conductive layer 112 and organic insulation base material 110.
Moreover, according to another preferred embodiment of the present invention, after the method for making that Fig. 3 illustrates, can obtain the present invention's opinion as Fig. 6 the sensing electrode layered structure 103 that illustrates.The sensing electrode layered structure 103 that the present invention advocated is applicable in contact panel, can as the use of touch control electrode.The sensing electrode layered structure 103 of the present invention, as Fig. 6 illustrate, comprise transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121.Namely pattern metal transparency conducting layer 121 is directly attached on transparent photosensitive insulation adhesion layer 120 via the adhesion of transparent photosensitive insulation adhesion layer 120.
The material of transparent photosensitive insulation adhesion layer 120 can be the material such as acryl and/or epoxy resin.General resin, after adding corresponding emulsion, may be all the material of transparent photosensitive insulation adhesion layer.The material of metallic transparent conductive layer 121 can metal, transparent conductive material or its combination.Metal can be gold, silver, copper, how rice metal, grid metal line etc.Transparent conductive material can be metal-doped oxide, carbon nanotube, electroconductive polymer or Graphene etc.Metal-doped oxide is such as the gallium zinc oxide, aluminium zinc oxide etc. of indium tin oxide, indium tin oxide nanoparticle, indium-zinc oxide, non-indium.How rice metal can be Nai meter Yin.Grid metal line can be silver-colored Nanowire.Electroconductive polymer is such as poly-fen, poly-cough up, polyaniline, polyacetylene etc.Indium tin oxide, has relatively low resistance ratio and relatively high light transmittance simultaneously, and weatherability is good simultaneously, is widely used transparent conductive material.
In an embodiment of the present invention, pattern metal transparency conducting layer 121 can have the special pattern of patterning.This special pattern can be as Fig. 6 the strip that illustrates or lattice-shaped, as Fig. 6 A the rectangle that illustrates, as Fig. 6 B the rhombus that illustrates, or its combination.In order to reduce the thickness of contact panel, the thickness of pattern metal transparency conducting layer can be 0.1 micron to 10 microns.On the other hand, the thickness of transparent photosensitive insulation adhesion layer can be then 1 micron to 50 microns, be preferably 2 to 10 microns.
After above method, show as depicted in fig. 7, above-mentioned sensing electrode layered structure 103 can also be used in a touch-control stack layer structure, and obtains the touch-control stack layer structure 105 that the present invention advocates.The touch-control stack layer structure 105 of the present invention, comprises the aforementioned sensing electrode layered structure 103 of transparent base 138, two panels and cover sheet 139.Transparent base 138 can be inorganic or organic transparent base, and has two relative interareas, i.e. the first interarea 133 and the second interarea 134.Inorganic transparent base can be glass, and organic transparent base can be polyethylene terephthalate.
Two panels sensing electrode layered structure 103 is attached on the relative two sides of transparent base 138 133/134 respectively, and its mode attached can be directly attach transparent base 138 with patterned transparent conductive layer 121 or directly connect with transparent photosensitive insulation adhesion layer 120 to attach transparent base 138.Directly attach transparent base 138 for patterned transparent conductive layer 121 in the figure 7, cover sheet 139 can cover sensing electrode layered structure 103.The material of cover sheet 139 can be glass or polyethylene terephthalate film, is preferably glass.Due to the protection of cover sheet 139, the sensing electrode layered structure 103 of at least a slice can be folded between transparent base 138 and cover sheet 139.
After above method, show as depicted in figure 8, aforementioned sensing electrode layered structure 103 can also be used among another touch-control stack layer structure 106.Touch-control stack layer structure 106 of the present invention, comprises transparent base 138, the first aforementioned sensing electrode layered structure 103 and one second sensing electrode layered structure 104.First sensing electrode layered structure 103 has the first photosensitive insulation adhesion layer 120 that attached to the first patterned transparent conductive layer 121.Second sensing electrode layered structure 104 has the second photosensitive insulation adhesion layer 122 that attached to the second patterned transparent conductive layer 123.First sensing electrode layered structure 103 and the second sensing electrode layered structure 104 from the bottom to top storehouse on transparent base 138, it should be noted that: do not limit with the first photosensitive insulation adhesion layer 120 or with the first patterned transparent conductive layer 121 directly contact transparent base 138 in the first sensing electrode layered structure 103, do not limit with the second photosensitive insulation adhesion layer 122 or with the second patterned transparent conductive layer 123 directly contact the first sensing electrode layered structure 103 in second sensing electrode layered structure 104, but the first patterned transparent conductive layer 121 need be avoided directly to contact with the second patterned transparent conductive layer 123.For example, its arrangement mode can as shown in Figure 8, directly be attached on transparent base 138 with the transparent photosensitive insulation adhesion layer 120 of first in the first sensing electrode layered structure 103, the second photosensitive insulation adhesion layer 122 is directly attached in the first patterned transparent conductive layer 121.
The material of the first photosensitive insulation adhesion layer 120 and the second photosensitive insulation adhesion layer 122 can be the material such as acryl and/or epoxy resin.General resin, after adding corresponding emulsion, may be all the material of transparent photosensitive insulation adhesion layer.The material of the first patterned transparent conductive layer 121 and the second patterned transparent conductive layer 123 can be identical or different, and its material can be metal, transparent conductive material or its combination.Metal can be gold, silver, copper, how rice metal, grid metal line etc.Transparent conductive material can be metal-doped oxide, carbon nanotube, electroconductive polymer or Graphene etc.Metal-doped oxide is such as the gallium zinc oxide, aluminium zinc oxide etc. of indium tin oxide, indium tin oxide nanoparticle, indium-zinc oxide, non-indium.How rice metal can be Nai meter Yin.Grid metal line can be silver-colored Nanowire.Electroconductive polymer is such as poly-fen, poly-cough up, polyaniline, polyacetylene etc.Indium tin oxide, has relatively low resistance ratio and relatively high light transmittance simultaneously, and weatherability is good simultaneously, is widely used transparent conductive material.
Transparent base 138 can be inorganic material, such as glass.On the one hand, show as depicted in figure 8, transparent base 138 has two relative interareas, i.e. the first interarea 133 and the second interarea 134.First sensing electrode layered structure 103 is positioned on the identical interarea of transparent base 138 with the second sensing electrode layered structure 104 simultaneously.Such as, the first sensing electrode layered structure 103 and the second sensing electrode layered structure 104 are positioned on the first interarea 133 simultaneously.That is, the first sensing electrode layered structure 103 can be considered as being folded between transparent base 138 and the second sensing electrode layered structure 104.
On the other hand, the first patterned transparent conductive layer 121 in first sensing electrode layered structure 103, then by the adhesion of the second transparent photosensitive insulation adhesion layer 122, directly can attach on the second transparent photosensitive insulation adhesion layer 122 in the second sensing electrode layered structure 104.First patterned transparent conductive layer 121 and the second patterned transparent conductive layer 123 can have the pattern of special design independently.This special pattern can be as Fig. 6 the strip that illustrates, as Fig. 6 A the rectangle that illustrates, as Fig. 6 B the rhombus that illustrates, or its combination.First patterned transparent conductive layer 121 is not necessarily identical with the pattern of the second patterned transparent conductive layer 123.
After above method, invention further provides in a kind of touch-control stack layer structure 107.Please refer to Fig. 5 and Fig. 9, touch-control stack layer structure 107, except comprising inorganic transparent ground 140 and aforementioned electrode layered structure 100, more comprises ink layer 143.Inorganic transparent ground 140 has two relative interareas, i.e. the first interarea 141 and the second interarea 142.Second interarea 142 touches for user thus sends operational order.Inorganic transparent ground 140 can be glass.Organic insulating substrate 110, patterning first conductive layer 112, transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121 is comprised in electrode layered structure 100.Ink layer 143, is also called black matrix" (black matrix), and the edge 145 along the first interarea 141 of inorganic transparent ground 140 is arranged, and defines inorganic transparent ground 140 not by opening 146 that ink layer 143 hides.In the present embodiment, the first transparent photosensitive insulation adhesion layer 120 is directly pasted to the inorganic transparent ground 140 with ink layer 143.And ink layer 143 can block the periphery cabling be communicated with the first patterned transparent conductive layer 121.
In electrode layered structure 100, the stacking order of organic insulation base material 110, patterning first conductive layer 112, transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121 can change, as long as patterning first conductive layer 112 does not directly contact with patterned transparent conductive layer 121 according to product estovers.For example, in an embodiment of the present invention, as Fig. 9 illustrate, the stacking order of electrode layered structure 100 can from the bottom to top with the stacking order of organic insulation base material 110, patterning first conductive layer 112, transparent photosensitive insulation adhesion layer 120 and patterned transparent conductive layer 121, and the patterned transparent conductive layer 121 in making is the transparent adhesion layer 144 of contact directly.In another embodiment of the present invention, as Fig. 9 A illustrate, the stacking order of electrode layered structure 100 can from the bottom to top with the stacking order of patterned transparent conductive layer 121, photosensitive insulation adhesion layer 120, transparent organic insulation base material 110 and patterning first conductive layer 112.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize instructions of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (13)
1. a sensing electrode layered structure, is characterized in that, described sensing electrode layered structure comprises:
One patterned transparent conductive layer; And
One transparent photosensitive insulation adhesion layer, directly attaches this pattern metal transparency conducting layer.
2. sensing electrode layered structure as claimed in claim 1, it is characterized in that, this pattern metal transparency conducting layer is selected from the group of a metal and a transparent conductive material.
3. a touch-control stack layer structure, is characterized in that, described touch-control stack layer structure comprises:
One transparent base, it has relative two sides;
A kind of sensing electrode layered structure as claimed in claim 1 attaches this relative two sides; And
One cover sheet, covers this sensing electrode layered structure of a slice, this sheet sensing electrode layered structure is folded between this transparent base and this cover sheet.
4. a touch-control stack layer structure, is characterized in that, described touch-control stack layer structure comprises:
One inorganic transparent ground;
One first sensing electrode layered structure as claimed in claim 1, wherein this first sensing electrode layered structure attaches this inorganic transparent base material; And
One second sensing electrode layered structure as claimed in claim 1, makes this first sensing electrode layered structure be folded between this inorganic transparent base material and this second sensing electrode layered structure.
5. touch-control stack layer structure as claimed in claim 4, is characterized in that, the first patterned transparent conductive layer in this first sensing electrode layered structure, directly attaches the second transparent photosensitive insulation adhesion layer in this second sensing electrode layered structure.
6. a touch-control stack layer structure, is characterized in that, described touch-control stack layer structure comprises:
One inorganic transparent ground;
One ink layer, is positioned at the edge of the one side of this inorganic transparent ground, and defines an opening;
One transparent adhesion layer, covers this ink layer and inserts this opening; And
A sensing electrode layered structure as claimed in claim 1, is positioned on this transparent adhesion layer.
7. touch-control stack layer structure as claimed in claim 6, it is characterized in that, this patterned transparent conductive layer in this sensing electrode layered structure directly contacts this transparent adhesion layer.
8. touch-control stack layer structure as claimed in claim 6, it is characterized in that, this transparent photosensitive insulation adhesion layer in this sensing electrode layered structure directly contacts this transparent adhesion layer.
9. form a method for electrode layered structure, it is characterized in that, the method for described formation electrode layered structure comprises:
There is provided an organic insulation base material, it is pasted with the first conductive layer of whole piece;
This first conductive layer on this organic insulation base material of patterning, makes this first conductive layer become one first patterned conductive layer;
There is provided a transparent photosensitive insulation adhesion layer, it is pasted with a pattern metal transparency conducting layer;
This transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material, this first patterned conductive layer is folded between this organic insulation base material and this transparent photosensitive insulation adhesion layer, and obtains an electrode layered structure.
10. the as claimed in claim 9 method forming electrode layered structure, is characterized in that, with 0.2-0.5 meter/minute speed, continuously this transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material.
11. methods forming electrode layered structure as claimed in claim 9, it is characterized in that, use a plurality of assistor, this transparent photosensitive insulation adhesion layer is pasted on this organic insulation base material, to eliminate at least one of one of this electrode layered structure bubble and a gauffer.
12. methods forming electrode layered structure as claimed in claim 9, it is characterized in that, the method for described formation electrode layered structure more comprises:
One metal routing processing procedure is carried out for this electrode layered structure, make this first patterned conductive layer and this pattern metal transparency conducting layer respectively with one of to be positioned on this ink layer the first metal routing and one second metal routing is electrically connected, and obtain a touch-control structure.
13. 1 kinds of electrode layered structures, is characterized in that, described electrode layered structure comprises:
One organic insulation base material;
One first patterned conductive layer, is attached on this organic insulation base material; And
One transparent photosensitive insulation adhesion layer, it is attached on this first patterned conductive layer, is pasted with again a pattern metal transparency conducting layer.
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| CN201410495766.1A CN104238822A (en) | 2014-09-24 | 2014-09-24 | Sensing electrode lamination structure, touch lamination structure and forming method thereof |
| TW103138702A TWI628564B (en) | 2014-09-24 | 2014-11-07 | Sensor electrode stack structure, touch sensor stack structure and method for forming electrode stack structure |
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| CN112397528A (en) * | 2019-08-16 | 2021-02-23 | 新唐科技股份有限公司 | Optical sensing filter and forming method thereof |
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| CN103092390A (en) * | 2011-10-27 | 2013-05-08 | 瀚宇彩晶股份有限公司 | Touch sensing device and manufacturing method thereof |
| CN103543867A (en) * | 2012-07-12 | 2014-01-29 | 和鑫光电股份有限公司 | flexible touch screen |
| CN103576977A (en) * | 2012-08-09 | 2014-02-12 | 纬创资通股份有限公司 | Touch panel and manufacturing method thereof |
| CN103823585A (en) * | 2012-11-16 | 2014-05-28 | 杰圣科技股份有限公司 | Manufacturing method of touch panel |
| CN203596005U (en) * | 2013-07-29 | 2014-05-14 | 胜华科技股份有限公司 | Touch panel and touch display panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397528A (en) * | 2019-08-16 | 2021-02-23 | 新唐科技股份有限公司 | Optical sensing filter and forming method thereof |
| CN112397528B (en) * | 2019-08-16 | 2023-09-29 | 新唐科技股份有限公司 | Optical sensing filter and forming method thereof |
| CN111309175A (en) * | 2020-01-19 | 2020-06-19 | 业成科技（成都）有限公司 | Touch panel, preparation method thereof and touch display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201612705A (en) | 2016-04-01 |
| TWI628564B (en) | 2018-07-01 |
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