CN103823585A - Manufacturing method of touch panel - Google Patents
Manufacturing method of touch panel Download PDFInfo
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- CN103823585A CN103823585A CN201310281871.0A CN201310281871A CN103823585A CN 103823585 A CN103823585 A CN 103823585A CN 201310281871 A CN201310281871 A CN 201310281871A CN 103823585 A CN103823585 A CN 103823585A
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- contact panel
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- conducting layer
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- 238000005530 etching Methods 0.000 description 2
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- 238000004544 sputter deposition Methods 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
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- PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 description 1
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- FWLGASJILZBATH-UHFFFAOYSA-N gallium magnesium Chemical compound [Mg].[Ga] FWLGASJILZBATH-UHFFFAOYSA-N 0.000 description 1
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- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
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- 238000003475 lamination Methods 0.000 description 1
- LFKMKZZIPDISEK-UHFFFAOYSA-L magnesium;4-carboxy-2,6-dihydroxyphenolate Chemical compound [Mg+2].OC1=CC(C([O-])=O)=CC(O)=C1O.OC1=CC(C([O-])=O)=CC(O)=C1O LFKMKZZIPDISEK-UHFFFAOYSA-L 0.000 description 1
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Images
Abstract
The manufacturing method of the touch panel comprises the steps of providing a substrate, and sequentially forming a transparent conducting layer and a metal layer on the substrate. Patterning the transparent conductive layer and the metal layer, forming a plurality of sensing series and a plurality of peripheral circuits with the metal layer on the metal layer, baking the metal layer and the transparent conductive layer, and removing the metal layer on the plurality of sensing series. The metal layer on the sensing series can be removed after patterning, and then the metal layer and the transparent conductive layer are baked.
Description
Technical field
The present invention is a kind of manufacture method of contact panel, especially a kind ofly provides the manufacture method that electric conductivity is good and optical effect is good.
Background technology
In the market of various consumption electronic products now, the interface tool that the portable electronic products such as personal digital assistant (PDA), mobile phone (mobile Phone), notebook computer (notebook) and panel computer (tablet PC) use touch panel (touch panel) to link up as its data all widely.Because the design of current electronic product is all take light, thin, short, little as direction, therefore on product, hold input media as traditional in keyboard, mouse etc. without sufficient space, especially under the drive of panel computer demand of stressing human oriented design, touch panel has suddenly become one of crucial spare part.And touch panel can be done, multi-level menu designing requirement, also can have the mode of operation of the hommization such as function and handwriting input of keyboard, mouse etc. except meeting simultaneously.
And contact panel generally can be divided into soft and rigid panel, rigid panel utilizes the transparent conductive panel of glass substrate and transparency conducting layer formed thereon composition bottom, the transparent conductive panel on top is transparent conductive film, being used for the automatically controlled circuit of control operation action lays respectively at the surrounding of top and the bottom transparent conductive panel, then by winding displacement and control IC and operate with touch control manner for user.Soft panel utilizes light-permeable PET plastic base, transparency conducting layer and transparent conductive film to form respectively the transparent conductive panel of top and the bottom.Contact panel can be divided into according to manner of execution difference: resistance-type, condenser type, acoustic wave, optical guided wave formula, loading varying type etc.
Traditionally, first the metal level on base material is carried out to first gold-tinted processing procedure, to form the perimeter circuit that is positioned at base material surrounding, then transparency conducting layer is carried out to second gold-tinted processing procedure.Because transparency conducting layer is mostly non-crystalline type structure; too high sheet resistance value can cause the obstruction of sensing signal transmission; in order further to reduce this high impedance value; conventionally can utilize such as elargol print process, molybdenum/aluminium/molybdenum sputtering method or copper plating/sputtering method etc. to increase layer, thickening method, on the automatically controlled circuit of transparency conducting layer, form one and be used for falling low-impedance low-impedance electronic control circuit layer.But, in the face of increasingly microminiaturized circuit linewidth requirements, cause and make degree of difficulty lifting and reduce and produce yield, easily there is the situations such as impedance inequality, broken string or short circuit in circuit.
Summary of the invention
The object of the present invention is to provide the contact panel manufacture method that a kind of electric conductivity is good and optical effect is good.
For reaching above-mentioned object, the manufacture method of contact panel of the present invention includes: substrate is provided, forms successively transparency conducting layer and metal level on substrate.Patterned transparent conductive layer and metal level, form plural sensing serials and the plural perimeter circuit on it with metal level.Baking metal level and transparency conducting layer, finally remove the metal level in plural sensing serials.
For reaching above-mentioned object, the present invention also provides the manufacture method of another kind of contact panel to include: substrate is provided, forms successively transparency conducting layer and metal level on substrate.Patterned transparent conductive layer and metal level, form plural sensing serials and the plural perimeter circuit on it with metal level, removes the metal level in plural sensing serials, finally toasts metal level and transparency conducting layer.
For reaching above-mentioned object, the method that the present invention carries out baking is heat convection type, heat radiation type or hot conduction-type.
The time of above-mentioned execution baking is 10 minutes to 120 minutes.
The temperature of above-mentioned execution baking is that 130 degree Celsius are to 180 degree Celsius.
For reaching above-mentioned object, the present invention carries out abovementioned steps and all adopts volume to volume processing procedure.
Accompanying drawing explanation
Figure 1 shows that the process block diagram of the manufacture method of contact panel that first embodiment of the invention provides.
Fig. 2 a to Fig. 2 g is depicted as the structural representation of the manufacture method of contact panel in first embodiment of the invention.
Figure 3 shows that the process block diagram of the manufacture method of contact panel that second embodiment of the invention provides.
Fig. 4 a to Fig. 4 g is depicted as the structural representation of the manufacture method of contact panel in second embodiment of the invention.
Fig. 5 a and Fig. 5 b are depicted as the structural representation of one embodiment of the invention contact panel.
Figure number explanation:
Substrate 210,410,510
Transparency conducting layer 211,411
Metal level 212,412
Plural number sensing serials 220,420,
First direction plural number sensing serials 521
Second direction plural number sensing serials 522
Plural number perimeter circuit 230,430,530
Following layer 540
Photoresist layer 250,450.
Embodiment
Please refer to shown in Fig. 2 a to Fig. 2 g, for the manufacture method of contact panel that first embodiment of the invention provides, first it comprise the following steps:, the step as shown in S110, one substrate 210 is provided, and the material of substrate 210 for example can be PET, TAC, glass, PMMA, ARTON.Then, on substrate 210, form successively transparency conducting layer 211 and metal level 212, as shown in Figure 2 a.Wherein, the method for formation transparency conducting layer 211 and metal level 212 for example can be volume to volume physical vapour deposition (PVD) (PVD), volume to volume chemical vapor deposition (CVD), volume to volume plating or volume to volume coating process etc.Transparency conducting layer 211 for example can be metal oxide, Nai meter Yin line or how rice conducting metal, metal oxide for example can be tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), cadmium tin (cadmium tin oxide, CTO), aluminum zinc oxide (aluminum zinc oxide, AZO), indium oxide zinc-tin (indium tin zinc oxide, ITZO), zinc paste (zinc oxide), cadmium oxide (cadmium oxide), hafnia (hafnium oxide, HfO), indium oxide gallium zinc (indium gallium zinc oxide, InGaZnO), indium oxide gallium zinc-magnesium (indium gallium zinc magnesium oxide, InGaZnMgO), indium oxide gallium magnesium (indium gallium magnesium oxide, or indium oxide gallium aluminium (indium gallium aluminum oxide InGaMgO), InGaAlO) etc.).Metal level 212 for example can be at least one deck conductive metal layer, or multilayer conductive metal level.Its material can be conducting metal or the electrical conductivity alloies such as aldary, aluminium alloy, gold, silver, aluminium, copper, molybdenum.The structure of multilayer conductive metal level, for example can be the stack architecture of molybdenum layer/aluminium lamination/molybdenum layer, or can be one or more materials of conducting metals such as being selected from aldary, aluminium alloy, gold, silver, aluminium, copper, molybdenum or electrical conductivity alloy and the multilayer conductive metal-layer structure of storehouse.Then, the step as shown in S120, patterned transparent conductive layer 211 and metal level 212, form and have metal level 212 plural sensing serials 220 and plural perimeter circuit 230 thereon.The method of patterning for example can adopt gold-tinted micro-photographing process.First carry out first gold-tinted micro-photographing process, sequentially carry out light blockage coating or the attaching of solid-state photoresistance, light shield aligning (mask aligning), exposure (exposure), photoresistance development (developing photoresist), etching (etching) and stripping (stripping) to remove photoresistance, as shown in Fig. 2 b to Fig. 2 e.Then, the step as shown in S130, has metal level 212 plural sensing serials 220 and plural perimeter circuit 230 thereon and toasts forming.Wherein, the plural sensing serials 220 and the plural perimeter line 230 that after baking metal level 212 and transparency conducting layer 211 patternings, form, as shown in Fig. 2 f.In a preferred embodiment, can utilize heat convection type, heat radiation type or hot conduction-type to toast, wherein, while baking, can to Celsius 200 temperature of spending, toast at least 10 minutes to 120 minutes in 100° centigrade, but baking temperature is take 130 degree Celsius to 180 degree Celsius as good, take 150 degree Celsius to 175 degree Celsius as best.Come, the step as shown in S140, carries out second gold-tinted micro-photographing process again, removes metal level in plural sensing serials 220 to complete contact panel, as shown in Figure 2 g.Wherein, the mode that removes metal level for example can be gold-tinted micro-photographing process or laser etch process.Plural number sensing serials 220 for example can comprise plural first direction tandem (not shown) and plural second direction tandem (not shown) interlaced and be electrically insulated each other, in known techniques, for example can be and use one side bridge formation wire (SITO), cross-over connection wire, increase insulation assembly or design conducting bridge ... etc. method.Certainly, the method for above-mentioned patterning also can be laser etch process or other printing skill, but is not limited to this.Substrate used in the present invention has the characteristic of pliability and bendability, and therefore, it is for example volume to volume gold-tinted processing procedure, volume to volume laser etch process or volume to volume printing skill that fabrication steps of the present invention all can adopt volume to volume process technique.
Please refer to shown in Fig. 4 a to Fig. 4 g, is the manufacture method of contact panel that second embodiment of the invention provides, and first it comprise the following steps:, step as shown in S210, one substrate 410 is provided, on substrate 410, forms successively transparency conducting layer 411 and metal level 412, as shown in Fig. 4 a.The mode that wherein forms transparency conducting layer 411 and metal level 412 for example can be volume to volume physical vapour deposition (PVD) (PVD), volume to volume chemical vapor deposition (CVD), volume to volume plating, volume to volume coating process etc., as shown in Fig. 4 a.Then, the step as shown in S220, the transparency conducting layer 411 on patterned substrate 410 and metal level 412, form and have metal level 412 plural sensing serials 420 and plural perimeter circuit 430 thereon, as shown in Fig. 4 b to Fig. 4 e.Come, the step as shown in S230, removes the metal level in plural sensing serials 420 again.Wherein, the mode that removes metal level for example can be gold-tinted micro-photographing process or laser etch process, as shown in Fig. 4 f.Finally, the step as shown in S240, toasts the metal level of the plural sensing serials 420 of patterned rear formation and plural perimeter circuit 430 and transparency conducting layer to complete contact panel, as shown in Fig. 4 g.In a preferred embodiment, can utilize heat convection type, heat radiation type or hot conduction-type to toast.Wherein, while baking, can to Celsius 200 temperature of spending, toast at least 10 minutes to 120 minutes in 100° centigrade, but baking temperature is take 130 degree Celsius to 180 degree Celsius as good, spends 175 degree extremely Celsius as best take Celsius 150.
Please refer to shown in Fig. 5 a, is the structural representation of one embodiment of the invention.Utilize method of the present invention, make one and there is first direction plural number sensing serials and make a substrate with second direction plural number sensing serials, with following layer, two substrates are pasted to form the change contact panel of structure of multilayer mutually.Be illustrated as follows embodiment.First, provide two substrates 510, the step as shown in S110, forms transparency conducting layer and metal level (not shown) thereon successively to two substrates 510 respectively.Then, step as shown in S120, respectively two substrates 510 are carried out to patterned transparent conductive layer and metal level, formation has metal level first direction plural number sensing serials 521 and plural perimeter circuit 530 thereon, and formation has metal level second direction plural number sensing serials 522 and plural perimeter circuit 530 thereon.Come, the step as shown in S130, toasts two substrates 510 respectively again.Then, the step as shown in S140, removes the metal level in first direction plural number sensing serials 521 and second direction plural number sensing serials 522 to two substrates 510 respectively.Finally, two substrates 510 are pasted fixing for completing contact panel mutually by following layer 540.Wherein, following layer 540 for example can be the composition of optical cement or glue or other high molecular polymer.Certainly in another embodiment, the step of S130 to S140 can also be replaced as the step of S230 to S240.
Please refer to shown in Fig. 5 b, is the structural representation of one embodiment of the invention.Utilize method of the present invention, can make the substrate with first direction plural number sensing serials and second direction plural number sensing serials to upper and lower surface respectively, form the contact panel of single layer structure.Be illustrated as follows embodiment.First, provide a substrate 510, the step as shown in S110, forms respectively transparency conducting layer and metal level successively in the upper and lower surperficial (not shown) of substrate 510.Then, step as shown in S120, the transparency conducting layer on the upper and lower surface to substrate 510 and metal level carry out patterning respectively, formation has first direction thereon of metal level plural number sensing serials 521 and plural perimeter circuit 530 in the upper surface of substrate 510, and forms and have second direction plural number sensing serials 522 thereon of metal level and plural perimeter circuit 530 in the lower surface of substrate 510.Come, the step as shown in S130, has first direction thereon of metal level plural number sensing serials 521 and second direction plural number sensing serials 522 and plural perimeter circuit 530 and toasts forming again.Then, the step as shown in S140, removes metal level in first direction plural number sensing serials 521 and second direction plural number sensing serials 522 for completing contact panel.Certainly in another embodiment, the step of S130 to S140 can also be replaced as the step of S230 to S240.
In this, the present invention carries out after baking procedure, the transparency conducting layer of noncrystalline matter (amorphous) can be converted into crystalline (crystal) conductive layer, can improve transparency and the light transmittance of transparency conducting layer, preferably optical effect is provided.And can reduce transparency conducting layer resistance value and promote electric conductivity and obtain preferably touch-control sensitivity.And the above-mentioned fabrication steps of the present invention comprises patterning, removes the step such as metal level and baking, all adopts volume to volume continous way process technique, can improve the disappearance that known sheet procedure for producing cannot high-speed and continuous be produced.
Claims (10)
1. a manufacture method for contact panel, is characterized in that, comprises the following steps:
One substrate is provided, on this substrate, forms successively a transparency conducting layer and a metal level;
This transparency conducting layer of patterning and this metal level, form plural sensing serials and the plural perimeter circuit on it with this metal level;
Toast this metal level and this transparency conducting layer; And
Remove this metal level in those sensing serials.
2. the manufacture method of contact panel as claimed in claim 1, is characterized in that, the method for carrying out this baking is heat convection type, heat radiation type or hot conduction-type.
3. the manufacture method of contact panel as claimed in claim 1, is characterized in that, the time of carrying out this baking is 10 minutes to 120 minutes.
4. the manufacture method of contact panel as claimed in claim 1, is characterized in that, the temperature of carrying out this baking is that 130 degree Celsius are to 180 degree Celsius.
5. as the manufacture method of the contact panel of claim 1 to 4, it is characterized in that, carry out abovementioned steps and all adopt volume to volume processing procedure.
6. a manufacture method for contact panel, is characterized in that, comprises the following steps:
One substrate is provided, on this substrate, forms successively a transparency conducting layer and a metal level;
This transparency conducting layer of patterning and this metal level, form plural sensing serials and the plural perimeter circuit on it with this metal level;
Remove this metal level in those sensing serials; And
Toast this metal level and this transparency conducting layer.
7. the manufacture method of contact panel as claimed in claim 6, is characterized in that, the method for carrying out this baking is heat convection type, heat radiation type or hot conduction-type.
8. the manufacture method of contact panel as claimed in claim 6, is characterized in that, the time of carrying out this baking is 10 minutes to 120 minutes.
9. the manufacture method of contact panel as claimed in claim 6, wherein, the temperature of carrying out this baking is that 130 degree Celsius are to 180 degree Celsius.
10. as the manufacture method of the contact panel of claim 6 to 9, it is characterized in that, carry out abovementioned steps and all adopt volume to volume processing procedure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101143029 | 2012-11-16 | ||
| TW101143029A TW201421302A (en) | 2012-11-16 | 2012-11-16 | Touch panel manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN103823585A true CN103823585A (en) | 2014-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310281871.0A Pending CN103823585A (en) | 2012-11-16 | 2013-07-05 | Manufacturing method of touch panel |
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| CN (1) | CN103823585A (en) |
| TW (1) | TW201421302A (en) |
Cited By (1)
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| CN104238822A (en) * | 2014-09-24 | 2014-12-24 | 业成光电（深圳）有限公司 | Sensing electrode lamination structure, touch lamination structure and forming method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI503728B (en) * | 2013-12-12 | 2015-10-11 | Rtr Tech Technology Co Ltd | Touch panel and manufacturing method |
| CN104808861B (en) | 2015-05-08 | 2018-10-30 | 上海中航光电子有限公司 | array substrate, display panel and display device |
| TWI652608B (en) | 2018-03-29 | 2019-03-01 | 富晶通科技股份有限公司 | Touch module and manufacturing method thereof |
| CN111782086B (en) * | 2020-07-10 | 2022-05-06 | 业成科技（成都）有限公司 | Touch panel and manufacturing method thereof |
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| TWI628564B (en) * | 2014-09-24 | 2018-07-01 | 業成光電（深圳）有限公司 | Sensor electrode stack structure, touch sensor stack structure and method for forming electrode stack structure |
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Application publication date: 20140528 |