CN104181454A - Test method for flexible circuit board anti-winding performance - Google Patents
Test method for flexible circuit board anti-winding performance Download PDFInfo
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- CN104181454A CN104181454A CN201310199012.7A CN201310199012A CN104181454A CN 104181454 A CN104181454 A CN 104181454A CN 201310199012 A CN201310199012 A CN 201310199012A CN 104181454 A CN104181454 A CN 104181454A
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Abstract
The invention discloses a test method for Flexible Printed Circuit FPC anti-winding performance. The method comprises the following steps that routine quality inspection is performed on an extracted flexible circuit board sample, a high temperature test is performed on the flexible circuit board sample, an anti-winding performance test is performed on the flexible circuit board sample, and then routine quality inspection is performed on the flexible circuit board sample. With adoption of the method, potential defects in anti-winding performance of the flexible circuit board sample can be exposed in a short period of time, the product is improved by research personnel by aiming at weak points in design, and finally the reliable flexible circuit board product is provided for clients.
Description
Technical field
The present invention relates to a kind of flexible PCB (Flexible Printed Circuit, FPC) method of testing of antientangling, be particularly related to a kind of flexible circuit board antientangling method of testing that is widely used in liquid crystal display (Liquid Crystal Display, LCD).
Background technology
Flexible PCB is in widespread use of all trades and professions, and it is important electronics interface components, is the supporter of electronic devices and components, and at various electric equipments, for example LCD plays key effect.Because factors such as being subject to working environment, use habit affects, flexible PCB may occur becoming fragile after long-term use, ossifing causes flexible PCB easily to occur that circuit cracking, fracture etc. are extremely, flexible PCB cannot carry out normal data transportation work, has finally caused electrical part or equipment normally to work.For flexible PCB after long-term use, deteriorated and prolonged and repeated folding based on base material quality around impact, easily there is cracking in flexible PCB, even fracture etc. is abnormal, general LCD manufacturer to potential this type of flexible PCB antientangling defect of product not fast and effectively method of testing detect.
Summary of the invention
Given this, be necessary to provide a kind of and can effectively investigate fast the method for testing of flexible PCB antientangling defect.
A method of testing for flexible PCB antientangling, comprises the steps:
The flexible PCB sample of extraction is carried out to Ordinary fruit quality inspection;
Described flexible PCB sample is carried out to temperature stress test;
Described flexible PCB sample is carried out to anti-flexing test;
Again described flexible PCB sample is carried out to Ordinary fruit quality inspection;
In above-mentioned arbitrary step, if occur, meet the abnormal of exception condition, stop test.
Therein in an embodiment, described temperature stress test sets the test that the high low temperature board of test parameter carries out flexible PCB sample for using.
In an embodiment, the probe temperature of described temperature stress test is 65～75 ° of C therein, and the test duration is 200～300 hours.
Therein in an embodiment, after described temperature stress is completed, described flexible PCB is placed on and standingly under normal temperature environment is no less than 2 hours.
In an embodiment, described anti-flexing test, for carrying out bending extension test to described flexible PCB therein.
In an embodiment, described anti-flexing test, for being used the anti-flexing testing tool of flexible PCB to test described flexible PCB therein.
In an embodiment, described bending extension test, comprises the steps: therein
The broadside of fixing described flexible PCB is in fixed position;
Another broadside and the sports equipment of described flexible PCB are fixed;
Opening movement equipment moves back and forth.
Therein in an embodiment, described in the motion amplitude that moves back and forth should be in setting range.
The method of testing of above-mentioned flexible PCB antientangling, by adopting the method for in the short time, flexible PCB being carried out high temperature ageing and the test of anti-flexing, simulation flexible PCB is through the long-term ageing process of using, expose the defect of flexible PCB antientangling, for the thin spot in design, product is improved, make flexible PCB after long-term use, still there is higher quality level, can meet the demand that client uses, reduce after-sales service cost, make product there is the higher market competitiveness, improve the popularity of brand.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of one embodiment of the invention;
Fig. 2 is the motion process figure of an embodiment of anti-flexing test.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the process flow diagram of one embodiment of the invention, comprising:
Step S110: the flexible PCB sample of extraction is carried out to Ordinary fruit quality inspection.
By extracting flexible PCB sample, be placed on the environment that illumination is 190～210lux, whether sample for reference outward appearance there is cut, cracking phenomena, and by the signal control circuit of draw samples and LCD and thin film transistor (TFT) (Thin Film Transistor, TFT) connection, switches on power and signal carries out the picture quality detection of LCD routine.The object of carrying out Ordinary fruit quality inspection is to confirm the front situation of flexible PCB sample test, warranty test validity.
Step S120: described flexible PCB sample is carried out to temperature stress test.
After Ordinary fruit quality checks, described flexible PCB sample is carried out to temperature stress test: flexible PCB sample levels is positioned over to high low temperature board the inside, Temperature of Warm Case is adjusted into 65～75 ° of C, test duration is 200～300 hours, start incubator and carry out temperature stress test, simulation flexible PCB sample ageing process.In other embodiments, temperature stress test can also realize by other means under different conditions, the test mode that for example lasting intensification, lasting cooling or the cooling that heats up have concurrently.
Temperature stress is completed, and flexible PCB sample is taken out, and places standing minimum 2 hours at normal temperatures, and flexible PCB sample is carried out to Ordinary fruit quality inspection, and the abnormal and defect situation that may occur is recorded.
Step S130: described flexible PCB sample is carried out to anti-flexing test.
After flexible PCB sample is carried out to Ordinary fruit quality inspection, flexible PCB sample is carried out to anti-flexing test, the process of the long-time bending of simulation flexible PCB sample.
Incorporated by reference to Fig. 2.
One broadside of fixing flexible circuit board is in fixed position A, another broadside of flexible PCB and sports equipment are fixed together and are still in initial position O, then opening movement equipment, the broadside that flexible PCB and sports equipment are fixed together moves back and forth under the drive of sports equipment between B, C two positions, thereby the continuous bending of flexible PCB is stretched, with this, simulate the process of the long-time bending damage of flexible PCB sample.The motion amplitude of sports equipment is set in setting range, guarantees that flexible PCB can not cause flexible PCB to damage or compress and excessively cause flexible PCB to damage because stretching transition causes tightening.
In other embodiments, can also use the anti-flexing testing tool of flexible PCB to carry out anti-flexing test to flexible PCB.
Step S140: again described flexible PCB sample is carried out to Ordinary fruit quality inspection.
Anti-flexing is completed; flexible PCB sample is taken out; flexible PCB sample is carried out to outward appearance and electrical property inspection, the flexible PCB cracking, fracture that after test, may occur etc. extremely or LCD picture disply there is block defect, without exception records such as picture, picture are abnormal, get off.
In above-mentioned arbitrary step, if occur, meet the abnormal of exception condition, stop test.
In other embodiments, the order of step S120 and S130 can be changed, and can the anti-flexing of advanced row test, then carries out temperature stress test.
The method of testing of above-mentioned flexible PCB antientangling, by adopting the method for in the short time, flexible PCB being carried out high temperature ageing and the test of anti-flexing, simulation flexible PCB is through the long-term ageing process of using, expose the defect of flexible PCB antientangling, for the thin spot in design, product is improved, make flexible PCB after long-term use, still there is higher quality level, can meet the demand that client uses, reduce after-sales service cost, make product there is the higher market competitiveness, improve the popularity of brand.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a method of testing for flexible PCB antientangling, is characterized in that, comprises the steps:
The flexible PCB sample of extraction is carried out to Ordinary fruit quality inspection;
Described flexible PCB sample is carried out to temperature stress test;
Described flexible PCB sample is carried out to anti-flexing test;
Again described flexible PCB sample is carried out to Ordinary fruit quality inspection;
In above-mentioned arbitrary step, if occur, meet the abnormal of exception condition, stop test.
2. the method for testing of flexible PCB antientangling according to claim 1, is characterized in that, the test of described temperature stress sets the test that the high low temperature board of test parameter carries out flexible PCB sample for using.
3. the method for testing of flexible PCB antientangling according to claim 2, is characterized in that, the probe temperature of described temperature stress test is 65～75 ° of C, and the test duration is 200～300 hours.
4. the method for testing of flexible PCB antientangling according to claim 1, is characterized in that, also comprises: after described temperature stress is completed, described flexible PCB is placed on and standingly under normal temperature environment is no less than 2 hours.
5. the method for testing of flexible PCB antientangling according to claim 1, is characterized in that, described anti-flexing test, for carrying out bending extension test to described flexible PCB.
6. the method for testing of flexible PCB antientangling according to claim 5, is characterized in that, described anti-flexing test, for being used the anti-flexing testing tool of flexible PCB to test described flexible PCB.
7. the method for testing of flexible PCB antientangling according to claim 6, is characterized in that, described bending extension test, comprises the steps:
Fixing described flexible PCB broadside is in fixed position;
Another broadside of described flexible PCB and sports equipment are fixed;
Opening movement equipment moves back and forth.
8. the method for testing of flexible PCB antientangling according to claim 7, is characterized in that, described in the motion amplitude that moves back and forth in setting range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310199012.7A CN104181454A (en) | 2013-05-24 | 2013-05-24 | Test method for flexible circuit board anti-winding performance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310199012.7A CN104181454A (en) | 2013-05-24 | 2013-05-24 | Test method for flexible circuit board anti-winding performance |
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| CN104181454A true CN104181454A (en) | 2014-12-03 |
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| CN201310199012.7A Pending CN104181454A (en) | 2013-05-24 | 2013-05-24 | Test method for flexible circuit board anti-winding performance |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106680542A (en) * | 2015-11-06 | 2017-05-17 | 财团法人工业技术研究院 | Circuit board clamping and stretching device and control method thereof |
| CN113295546A (en) * | 2021-05-10 | 2021-08-24 | 武汉精测电子集团股份有限公司 | FPC microcircuit bending damage degree verification method and device and electronic equipment |
| CN114692557A (en) * | 2022-06-01 | 2022-07-01 | 深圳市鄱阳科技有限公司 | Flexible circuit board manufacturing performance monitoring and analyzing method and system |
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| CN106680542B (en) * | 2015-11-06 | 2019-04-12 | 财团法人工业技术研究院 | Circuit board clamping and stretching device and control method thereof |
| CN113295546A (en) * | 2021-05-10 | 2021-08-24 | 武汉精测电子集团股份有限公司 | FPC microcircuit bending damage degree verification method and device and electronic equipment |
| CN114692557A (en) * | 2022-06-01 | 2022-07-01 | 深圳市鄱阳科技有限公司 | Flexible circuit board manufacturing performance monitoring and analyzing method and system |
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Application publication date: 20141203 |
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