TW200801531A - Prober for electronic device testing on large area substrates - Google Patents
Prober for electronic device testing on large area substratesInfo
- Publication number
- TW200801531A TW200801531A TW096117479A TW96117479A TW200801531A TW 200801531 A TW200801531 A TW 200801531A TW 096117479 A TW096117479 A TW 096117479A TW 96117479 A TW96117479 A TW 96117479A TW 200801531 A TW200801531 A TW 200801531A
- Authority
- TW
- Taiwan
- Prior art keywords
- large area
- prober
- area substrates
- displays
- electronic device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Crystal (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80359506P | 2006-05-31 | 2006-05-31 | |
US82190406P | 2006-08-09 | 2006-08-09 | |
US11/746,530 US7786742B2 (en) | 2006-05-31 | 2007-05-09 | Prober for electronic device testing on large area substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200801531A true TW200801531A (en) | 2008-01-01 |
TWI339730B TWI339730B (en) | 2011-04-01 |
Family
ID=39142022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096117479A TWI339730B (en) | 2006-05-31 | 2007-05-16 | Prober for electronic device testing on large area substrates |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007322428A (en) |
KR (2) | KR101088566B1 (en) |
CN (1) | CN101082637B (en) |
TW (1) | TWI339730B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421513B (en) * | 2009-10-27 | 2014-01-01 | Top Eng Co Ltd | Array substrate inspection apparatus and method |
US8907277B2 (en) | 2008-03-07 | 2014-12-09 | Carl Zeiss Microscopy, Llc | Reducing particle implantation |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2180327A1 (en) * | 2008-10-21 | 2010-04-28 | Applied Materials, Inc. | Apparatus and method for active voltage compensation |
CN101943744A (en) * | 2009-07-06 | 2011-01-12 | 应用材料股份有限公司 | Dry high-potential tester and solar simulation tool |
KR101784024B1 (en) * | 2010-01-08 | 2017-10-10 | 포톤 다이나믹스, 인코포레이티드 | Automatic probe configuration station and method therefor |
KR101129195B1 (en) * | 2010-12-20 | 2012-03-27 | 주식회사 탑 엔지니어링 | Array test apparatus |
KR101191343B1 (en) * | 2010-12-30 | 2012-10-16 | 주식회사 탑 엔지니어링 | Array test apparatus |
KR101234088B1 (en) * | 2010-12-30 | 2013-02-19 | 주식회사 탑 엔지니어링 | Array test apparatus |
CN102621731B (en) * | 2012-04-17 | 2014-11-19 | 深圳市华星光电技术有限公司 | Voltage application device of liquid crystal substrate |
CN105358959A (en) * | 2013-07-22 | 2016-02-24 | 应用材料公司 | Apparatus and method for processing a large area substrate |
US9472410B2 (en) * | 2014-03-05 | 2016-10-18 | Applied Materials, Inc. | Pixelated capacitance controlled ESC |
JP2017003484A (en) | 2015-06-12 | 2017-01-05 | 株式会社ジャパンディスプレイ | Inspection device for display device, inspection method of mother substrate for display device, and display device |
JP2017096949A (en) | 2015-11-24 | 2017-06-01 | フォトン・ダイナミクス・インコーポレーテッド | System and method for electrical inspection of flat panel display device using cell contact probing pads |
KR102612272B1 (en) * | 2016-12-15 | 2023-12-11 | 세메스 주식회사 | Probe module and array tester including the same |
TWI718610B (en) * | 2018-08-09 | 2021-02-11 | 日商歐姆龍股份有限公司 | Probe unit |
CN108982931A (en) * | 2018-09-21 | 2018-12-11 | 京东方科技集团股份有限公司 | Probe unit, probe jig |
CN112285446B (en) * | 2019-07-12 | 2024-05-31 | 瑞昱半导体股份有限公司 | Test system, transmitting device and receiving device for executing various tests |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3592831B2 (en) * | 1996-02-26 | 2004-11-24 | 株式会社日本マイクロニクス | Probe unit and adjustment method thereof |
JPH11174108A (en) * | 1997-12-12 | 1999-07-02 | Dainippon Printing Co Ltd | Inspecting apparatus for electrode wiring |
US6744268B2 (en) * | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
JP4790997B2 (en) * | 2004-03-26 | 2011-10-12 | 株式会社日本マイクロニクス | Probe device |
JP2006085235A (en) | 2004-09-14 | 2006-03-30 | Agilent Technol Inc | Mobile operation device and method for controlling mobile operation device |
-
2007
- 2007-05-16 TW TW096117479A patent/TWI339730B/en active
- 2007-05-23 KR KR1020070050207A patent/KR101088566B1/en active IP Right Grant
- 2007-05-28 CN CN2007101052709A patent/CN101082637B/en active Active
- 2007-05-29 JP JP2007141890A patent/JP2007322428A/en active Pending
-
2009
- 2009-10-23 KR KR1020090101382A patent/KR20090120444A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8907277B2 (en) | 2008-03-07 | 2014-12-09 | Carl Zeiss Microscopy, Llc | Reducing particle implantation |
TWI477771B (en) * | 2008-03-07 | 2015-03-21 | Carl Zeiss Microscopy Llc | Reducing particle implantation |
TWI421513B (en) * | 2009-10-27 | 2014-01-01 | Top Eng Co Ltd | Array substrate inspection apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
JP2007322428A (en) | 2007-12-13 |
CN101082637A (en) | 2007-12-05 |
KR20090120444A (en) | 2009-11-24 |
KR101088566B1 (en) | 2011-12-05 |
CN101082637B (en) | 2012-01-18 |
TWI339730B (en) | 2011-04-01 |
KR20070115639A (en) | 2007-12-06 |
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