CN104164081A - High performance, flame-retardant and heat conductive nano composite plastic material - Google Patents

High performance, flame-retardant and heat conductive nano composite plastic material Download PDF

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Publication number
CN104164081A
CN104164081A CN201410258166.3A CN201410258166A CN104164081A CN 104164081 A CN104164081 A CN 104164081A CN 201410258166 A CN201410258166 A CN 201410258166A CN 104164081 A CN104164081 A CN 104164081A
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CN
China
Prior art keywords
parts
heat conductive
plastic material
nano
composite plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410258166.3A
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Chinese (zh)
Inventor
魏欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU XINRUN PLASTIC Co Ltd
Original Assignee
JIANGSU XINRUN PLASTIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU XINRUN PLASTIC Co Ltd filed Critical JIANGSU XINRUN PLASTIC Co Ltd
Priority to CN201410258166.3A priority Critical patent/CN104164081A/en
Publication of CN104164081A publication Critical patent/CN104164081A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Abstract

The invention discloses a high performance, flame-retardant and heat conductive nano composite plastic material. The nano composite plastic material comprises the following raw materials by weight:90-100 parts of nylon 6, 5-25 parts of polyphenylene sulfide, 40-80 parts of nano zinc oxide powder, 40-80 parts of nano aluminium oxide powder, 20-30 parts of nano titanium dioxide powder, 5-10 parts of polytetrafluoroethylene, 20-30 parts of glass fibers, 35-45 parts of ceramic fibers, 20-35 parts of asbestos fibers, 3-6 parts of 1,4-di-sec-butyl benzene, 2-6 parts of diatomite and 2-3 parts of a filler. By filling zinc oxide and aluminium oxide having relatively high heat conductivity, as fillers, in a polyphenylene sulfide phase to form a heat conductive channel, a three continuous phase heat conductive network structure is formed on basis of a nylon 6/polyphenylene sulfide blend bi-continuous phase structure. Since the heat conductive channel is only needed to form in one phase of a polymer, the use amount of heat conductive filler can be reduced; and the problems of reduced mechanical properties and processing difficulties brought by over large filling content of a conventional filling type heat conductive polymer.

Description

A kind of high-performance refractory heat conducting nano complex plastic material
Technical field:
The invention belongs to plastic cement technical field, relate in particular to heat conduction plastic material technical field, be specifically related to a kind of high-performance refractory heat conducting nano complex plastic material.
Background technology:
Traditional plastics mostly are thermal insulation material, and along with the fast development of circuit card large scale integration and micro-packaging technology, electronic devices and components volume constantly dwindles, and packing density is more and more higher, and power is in continuous increase, and thermal value also increases thereupon.Therefore, heat radiation becomes a major issue in electronic industry.
There is metal, pottery and the carbon material of excellent heat conductivity performance, due to the problem such as electrical insulating property, machine-shaping property are poor and cost is higher, be difficult to adapt to the needs of present technical development.Typical heat-conducting plastic thermal conductivity scope is 1-20w/mk, and some grade can reach 100w/mk.This numerical value is approximately 5-100 times of conventional plastic, and the thermal conductivity of general plastics only has 0.2w/mk, and the thermal conductivity of some cast aluminium alloys is 50-100w/mk.
Compared with traditional thermally conductive material, nylon has good tensile strength and resistance to deflection energy, but shock resistance is poor, and plastics have inflammable feature.Heat-conducting plastic combines the simplification of plastic shaping and excellent thermal conductivity, can provide larger design freedom for research staff, and the weight of product is little.But heat-conducting plastic is difficult to have simultaneously, heat conductivility is high, insulation, and excellent mechanical property, be difficult to meet the actual needs that use, and plastics is inflammable, easily cause potential safety hazard.
Summary of the invention:
The object of the invention is to for deficiency of the prior art, a kind of high-performance refractory heat conducting nano complex plastic material is provided.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of high-performance refractory heat conducting nano complex plastic material, according to weight part meter, comprises the raw material of following weight part:
Further, a kind of high-performance refractory heat conducting nano complex plastic material, according to weight part meter, comprises the raw material of following weight part:
Further, described glass fibre, ceramic fiber and fibrous magnesium silicate are that length is the short fiber of 3.5～4mm.
Further, described weighting agent is the one in calcium carbonate, talcum powder or barium sulfate.
Beneficial effect of the present invention: the thermal conductivity of the present invention using Nano-sized Alumina Powder, nano zine oxide powder and nano titanium dioxide powder as heat conductive filler product is good, and mechanical property is also good; , heat conduction plastic material of the present invention have dispersion of materials evenly, good mechanical property, good heat conductivity and the feature such as flame retardant properties is good, and production efficiency is high
Embodiment:
Below in conjunction with specific embodiment, technical scheme of the present invention is elaborated.
Embodiment 1
A kind of high-performance refractory heat conducting nano complex plastic material, according to weight part meter, comprises the raw material of following weight part:
Wherein, glass fibre, ceramic fiber and fibrous magnesium silicate are that length is the short fiber of 3.5～4mm.
Embodiment 2
A kind of high-performance refractory heat conducting nano complex plastic material, according to weight part meter, comprises the raw material of following weight part:
Embodiment 3
。

Claims (4)

1. a high-performance refractory heat conducting nano complex plastic material, is characterized in that: according to weight part meter, comprise the raw material of following weight part:
。
2. a kind of high-performance refractory heat conducting nano complex plastic material according to claim 1, is characterized in that: according to weight part meter, comprise the raw material of following weight part:
。
3. a kind of high-performance refractory heat conducting nano complex plastic material according to claim 1, is characterized in that: described glass fibre, ceramic fiber and fibrous magnesium silicate is that length is the short fiber of 3.5～4mm.
4. a kind of high-performance refractory heat conducting nano complex plastic material according to claim 1, is characterized in that: described weighting agent is the one in calcium carbonate, talcum powder or barium sulfate.
CN201410258166.3A 2014-06-09 2014-06-09 High performance, flame-retardant and heat conductive nano composite plastic material Pending CN104164081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410258166.3A CN104164081A (en) 2014-06-09 2014-06-09 High performance, flame-retardant and heat conductive nano composite plastic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410258166.3A CN104164081A (en) 2014-06-09 2014-06-09 High performance, flame-retardant and heat conductive nano composite plastic material

Publications (1)

Publication Number Publication Date
CN104164081A true CN104164081A (en) 2014-11-26

Family

ID=51908075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410258166.3A Pending CN104164081A (en) 2014-06-09 2014-06-09 High performance, flame-retardant and heat conductive nano composite plastic material

Country Status (1)

Country Link
CN (1) CN104164081A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104829998A (en) * 2015-04-11 2015-08-12 安徽中威光电材料有限公司 Teflon-based light ageing-resistant dissipation material for LED light source and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101717579A (en) * 2009-10-30 2010-06-02 华南理工大学 Filling-type thermal-conducting electric-insulating polyphenyl thioether and polyamide blended alloy and preparation method thereof
CN102304284A (en) * 2011-08-22 2012-01-04 金发科技股份有限公司 Heat-conductive resin composition and preparation method thereof
EP2471868A1 (en) * 2010-12-31 2012-07-04 Cheil Industries Inc. Polyamide resin composition
CN103183956A (en) * 2011-12-30 2013-07-03 第一毛织株式会社 Thermoplastic resin composition having improved thermal conductivity and articles thereof
CN103254422A (en) * 2013-05-20 2013-08-21 金发科技股份有限公司 Polyamide resin and polyamide composition composed thereof
CN103342890A (en) * 2013-07-03 2013-10-09 徐常威 Wear-resisting and flame-retardant heat conductive plastic material and preparation method thereof
CN103725004A (en) * 2013-12-06 2014-04-16 四川大学 Polyphenylene sulfide-based heat conducting composite material and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101717579A (en) * 2009-10-30 2010-06-02 华南理工大学 Filling-type thermal-conducting electric-insulating polyphenyl thioether and polyamide blended alloy and preparation method thereof
EP2471868A1 (en) * 2010-12-31 2012-07-04 Cheil Industries Inc. Polyamide resin composition
CN102304284A (en) * 2011-08-22 2012-01-04 金发科技股份有限公司 Heat-conductive resin composition and preparation method thereof
CN103183956A (en) * 2011-12-30 2013-07-03 第一毛织株式会社 Thermoplastic resin composition having improved thermal conductivity and articles thereof
CN103254422A (en) * 2013-05-20 2013-08-21 金发科技股份有限公司 Polyamide resin and polyamide composition composed thereof
CN103342890A (en) * 2013-07-03 2013-10-09 徐常威 Wear-resisting and flame-retardant heat conductive plastic material and preparation method thereof
CN103725004A (en) * 2013-12-06 2014-04-16 四川大学 Polyphenylene sulfide-based heat conducting composite material and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104829998A (en) * 2015-04-11 2015-08-12 安徽中威光电材料有限公司 Teflon-based light ageing-resistant dissipation material for LED light source and preparation method thereof

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Application publication date: 20141126