CN202656536U - Structure for adding metal layers in composite case - Google Patents
Structure for adding metal layers in composite case Download PDFInfo
- Publication number
- CN202656536U CN202656536U CN 201220145620 CN201220145620U CN202656536U CN 202656536 U CN202656536 U CN 202656536U CN 201220145620 CN201220145620 CN 201220145620 CN 201220145620 U CN201220145620 U CN 201220145620U CN 202656536 U CN202656536 U CN 202656536U
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- China
- Prior art keywords
- composite
- metal level
- metal layers
- layer
- metal
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- Expired - Lifetime
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a structure for adding metal layers in a composite case. The structure comprises a composite layer, at least one position of the inside and the surface of the composite layer is provided with at least one metal layer, the thickness of each metal layer is larger than 0mm and smaller than 10mm, the metal layers are made of one of copper, aluminum and ferrum, and the composite layer is made of one of carbon fiber composite materials, glass fiber composite materials and plastics. The metal layers are added in the composite case, so that the composite case not only keeps the advantages of fine anti-radiation effect, high strength, small thickness, light weight, corrosion resistance, high temperature resistance, attractive appearance and the like of composite materials, but also overcomes the shortcomings of poor electrical conductivity and heat dissipation effects.
Description
Technical field
The present invention relates to a kind of shell mechanism of electronic product, specifically relate to a kind of in electronic product composite casing or the surface increase the shell mechanism of metal level.
Background technology
The shell of traditional electronic product adopts plastic material to make, and product surface has unsmooth, thus before baking vanish, need repeatedly polish the requirement that the program of processing reaches housing face-plate, the processing more complicated, and shielding property is not good.Also have on the market some by the shell that metal material is made, the shell of this metalloid material is not easy to break, and is fixing but the shell of metal material needs in the metal punching, reduced the intensity of shell, and improved thickness and the weight of shell.Also have on the market some shells made from composites such as carbon fiber or glass fibres, the shell that this type of composite is made has the advantages such as intensity height, thin thickness, quality be light, corrosion-resistant, also have good shielding property, but its electric conductivity and radiating effect are not good.
Summary of the invention
In order to overcome defects, the invention provides a kind of composite casing increases the structure of metal level, use the advantages such as electronic product enclosure of the present invention has intensity height, thin thickness, quality is light, corrosion-resistant, shielding property is good, and have good electric conductivity and thermal diffusivity.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of composite casing increases the structure of metal level, comprises composite layer, and in the described composite layer and surperficial at least one place is provided with metal level.
As a further improvement on the present invention, the thickness of described metal level is greater than 0mm and less than 10mm.
As a further improvement on the present invention, the quantity of described metal level is at least one deck.
As a further improvement on the present invention, the material of described metal level is a kind of in copper, aluminium and the ferrous metal.
As a further improvement on the present invention, described composite layer is a kind of in carbon fibre composite, glass fiber compound material and the plastic cement.
The invention has the beneficial effects as follows: the present invention fully combines has the intensity height, thin thickness, quality is light, corrosion-resistant, composite casing and the metal of the advantages such as shielding property is good have electric conductivity and the good characteristic of thermal diffusivity, by in the composite casing or the surface increase electric conductivity and the thermal diffusivity that metal level improves the composite casing, so that this composite casing has not only kept the radiation-proof effect of composite is good, intensity is high, thin thickness, quality is light, corrosion-resistant, the advantage such as high temperature resistant and attractive in appearance has also overcome composite casing electric conductivity and the not good defective of radiating effect by increasing metal level.
Description of drawings
Fig. 1 is structural representation of the present invention (setting up metal level in the composite layer);
Fig. 2 is another structural representation of the present invention (metal level is set up on the composite layer surface);
1---composite layer 2---metal level
The specific embodiment
A kind of composite casing increases the structure of metal level, as shown in Figure 1, comprises composite layer, and in the described composite layer and surperficial at least one place is provided with metal level.The thickness of described metal level is greater than 0mm and less than 10mm, and the quantity of described metal level is at least one deck.The material of described metal level is a kind of in copper, aluminium and the ferrous metal.Described composite layer is a kind of in carbon fibre composite, glass fiber compound material and the plastic cement.
In addition, described composite can also be the non-metal-matrix composites such as other resin-based, rubber-based, ceramic base, graphite-based, carbon back.
Above embodiment is with reference to accompanying drawing; to a preferred embodiment of the present invention will be described in detail; those skilled in the art is by carrying out modification or the change on the various forms to above-described embodiment, but do not deviate from the situation of essence of the present invention, all drops within protection scope of the present invention.
Claims (5)
1. the structure of a composite casing increase metal level comprises composite layer, it is characterized in that: in the described composite layer and surperficial at least one place is provided with metal level.
2. composite casing according to claim 1 increases the structure of metal level, and it is characterized in that: the thickness of described metal level is greater than 0mm and less than 10mm.
3. composite casing according to claim 1 increases the structure of metal level, and it is characterized in that: the quantity of described metal level is at least one deck.
4. composite casing according to claim 1 increases the structure of metal level, it is characterized in that: the material of described metal level is a kind of in copper, aluminium and the ferrous metal.
5. composite casing according to claim 1 increases the structure of metal level, it is characterized in that: described composite layer is a kind of in carbon fibre composite, glass fiber compound material and the plastic cement.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220145620 CN202656536U (en) | 2012-04-09 | 2012-04-09 | Structure for adding metal layers in composite case |
| TW102206306U TWM477122U (en) | 2012-04-09 | 2013-04-08 | Composite material housing structure with metal structure |
| TW102206309U TWM465754U (en) | 2012-04-09 | 2013-04-08 | Composite material-made case with increasing metal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220145620 CN202656536U (en) | 2012-04-09 | 2012-04-09 | Structure for adding metal layers in composite case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202656536U true CN202656536U (en) | 2013-01-09 |
Family
ID=47451466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220145620 Expired - Lifetime CN202656536U (en) | 2012-04-09 | 2012-04-09 | Structure for adding metal layers in composite case |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202656536U (en) |
| TW (2) | TWM477122U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358617A (en) * | 2012-04-09 | 2013-10-23 | 昆山同寅兴业机电制造有限公司 | Structure with metal layer added to composite material shell |
| CN107793979A (en) * | 2016-09-06 | 2018-03-13 | 比亚迪股份有限公司 | A kind of phase transformation glue and housing and its preparation method and application |
| CN110856391A (en) * | 2019-11-25 | 2020-02-28 | 惠州市中为柔性光电子智能制造研究院有限公司 | Structure for adding metal layer to composite material casing |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869767B (en) * | 2014-02-26 | 2019-01-25 | 深圳富泰宏精密工业有限公司 | The portable electronic device of casing and the application casing |
| CN106988499A (en) * | 2017-05-23 | 2017-07-28 | 河北天森建工集团有限公司 | A kind of heat insulation plate for building |
-
2012
- 2012-04-09 CN CN 201220145620 patent/CN202656536U/en not_active Expired - Lifetime
-
2013
- 2013-04-08 TW TW102206306U patent/TWM477122U/en unknown
- 2013-04-08 TW TW102206309U patent/TWM465754U/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358617A (en) * | 2012-04-09 | 2013-10-23 | 昆山同寅兴业机电制造有限公司 | Structure with metal layer added to composite material shell |
| CN107793979A (en) * | 2016-09-06 | 2018-03-13 | 比亚迪股份有限公司 | A kind of phase transformation glue and housing and its preparation method and application |
| CN110856391A (en) * | 2019-11-25 | 2020-02-28 | 惠州市中为柔性光电子智能制造研究院有限公司 | Structure for adding metal layer to composite material casing |
| CN110856391B (en) * | 2019-11-25 | 2021-05-07 | 惠州市中为柔性光电子智能制造研究院有限公司 | Structure for adding metal layer to composite material casing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM477122U (en) | 2014-04-21 |
| TWM465754U (en) | 2013-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200525 Address after: Suzhou City, Jiangsu province 215313 city town of Kunshan city week Caimao Road No. 2 Patentee after: KUNSHAN FANHONG SURFACE TREAT Co.,Ltd. Address before: Suzhou City, Jiangsu province 215313 city town of Kunshan city week Caimao Road No. 2 Patentee before: Kunshan Tong-yin Industrial Electronic Making Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130109 |