CN104112594A - Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor - Google Patents
Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor Download PDFInfo
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- CN104112594A CN104112594A CN201310342102.7A CN201310342102A CN104112594A CN 104112594 A CN104112594 A CN 104112594A CN 201310342102 A CN201310342102 A CN 201310342102A CN 104112594 A CN104112594 A CN 104112594A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 139
- 239000004020 conductor Substances 0.000 claims abstract description 133
- 239000000919 ceramic Substances 0.000 claims abstract description 108
- 239000003990 capacitor Substances 0.000 claims abstract description 99
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Provided is a multi-layer ceramic capacitor. The multi-layer ceramic capacitor comprises a ceramic body, a first capacitor part, a second capacitor part, a first inner connection conductor, a second inner connection conductor, and first to fourth outer electrodes. The ceramic body includes a dielectric layer, and has a first side surface and a second side surface that are opposite to each other. The first capacitor part includes a first inner electrode that is exposed from the first side surface, and a second inner electrode that is exposed from the second side surface. The second capacitor part includes a third inner electrode exposed from the first side surface and a fourth inner electrode exposed from the second side surface. The first and second inner connection conductors are exposed from the first and second side surfaces. The first to fourth outer electrodes are formed on the first and second side surfaces, and are electrically connected with the first to fourth inner electrodes and the first and second inner connection conductors. The first capacitor part and the second capacitor part are in series connection with the first inner connection conductor and the second inner connection conductor respectively.
Description
The cross reference of related application
The application requires the priority of the korean patent application No.10-2013-0044156 submitting to Department of Intellectual Property of Korea S on April 22nd, 2013, open the application that is integrated into by reference of this application.
Technical field
The present invention relates to the plate of multilayer ceramic capacitor and the described multilayer ceramic capacitor of installation.
Background technology
Multilayer ceramic capacitor, a kind of multilayer sheet type (chip) electronic component, be mounted in the chip capacitor for charging and discharging on the printed circuit board (PCB) of the such as various electronic products of display device, computer, smart phone, mobile phone etc., described display device is for example liquid crystal display (LCD), plasma display panel (PDP) etc.
Because, the advantage such as capacitance high, easy installation little such as size that this multilayer ceramic capacitor (MLCC) has, so it can be used as the parts in various electronic equipments.
Multilayer ceramic capacitor can have such structure, and multiple dielectric layers internal electrode different with polarity is alternately stacking, and dielectric layer is inserted between internal electrode.
Especially, at the power-supply device of the CPU for computer (CPU), in the process that low pressure is provided, because the quick variation of load current can produce voltage noise.
Therefore, such multilayer ceramic capacitor is widely used in power-supply device to suppress this voltage noise as decoupling capacitance device.
Because its operating frequency increases, should there is low equivalent series inductance (ESL) for the multilayer ceramic capacitor of decoupling zero.Carry out the research for reducing this ESL.
Further, for power is provided more reposefully, should there is controlled esr (ESR) characteristic for the multilayer ceramic capacitor of decoupling zero.
When the ESR of multilayer ceramic capacitor value is during lower than desired level, due to the ESL of capacitor and the plane capacitance of microprocessor package (plane capacitance) and the Impedance Peak producing at parallel resonance frequency place may increase, and the impedance meeting at the resonance series frequency place of capacitor extremely reduces.
Therefore,, for making user can realize smooth impedance operator in distribution system, should easily be controlled for the ESR characteristic of the multilayer ceramic capacitor of decoupling zero.
About the control of ESR characteristic, can consider to use and there is high-resistance material in outside and internal electrode.According to correlation technique, the measurement of change material as above can provide high ESR characteristic in keeping low ESL structure.
But, in outer electrode, using thisly there is high-resistance material in the situation that, can produce the hot localised points that causes current crowding effect (current crowding effect) because of pin hole (pin hole).Further, using thisly have high-resistance material in the situation that in internal electrode, in order to make described material mate to realize high capacitance with ceramic material, the material that forms internal electrode also should be continued to change.
Therefore, there is above-mentioned defect because existing for controlling the measurement of ESR, so still need the controlled multilayer ceramic capacitor of ESR to study.
In addition, according to as the fast-developing recent trend of the mobile terminals such as tablet personal computer (PC), super, microprocessor has been transformed into the product of miniaturization and high integration.
Therefore, the area of printed circuit board (PCB) has reduced, and the installing space of decoupling capacitance device is also restricted, correspondingly, and the multilayer ceramic capacitor that still need to can be mounted on limited installing space.
Correlation technique document
(patent file 1) Japanese patent application publication No. No.2012-138415
Summary of the invention
One aspect of the present invention provides multilayer ceramic capacitor and the plate of described multilayer ceramic capacitor has been installed.
According to an aspect of the present invention, a kind of multilayer ceramic capacitor is provided, and described multilayer ceramic capacitor comprises: comprise multiple dielectric layers and have the first and second first type surfaces respect to one another, the first and second side surfaces respect to one another and the ceramic body of the first and second end faces of opposition each other; Be formed at the first capacitor part in described ceramic body and be formed at the second capacitor part in described ceramic body, described the first capacitor part comprise first internal electrode with the lead-in wire that is exposed to the first side surface and second internal electrode with the lead-in wire that is exposed to the second side surface, described the second capacitor part comprise have be exposed to the first side surface and with the 3rd internal electrode of the isolated lead-in wire of lead-in wire of the first internal electrode and have be exposed to the second side surface and and the 4th internal electrode of the isolated lead-in wire of lead-in wire of the second internal electrode; Be formed in described ceramic body and be exposed to the first and second inner connecting conductors of the first and second side surfaces; And be formed on the first and second side surfaces of described ceramic body and be electrically connected to first to fourth outer electrode of described first to fourth internal electrode and the first and second inner connecting conductors, wherein the first and second capacitor parts are connected with the first and second inner connecting conductors respectively.
The first and second outer electrodes can be configured on the first side surface of described ceramic body separated from one another, and the third and fourth outer electrode can be configured on the second side surface of described ceramic body separated from one another.
The installed surface of multilayer ceramic capacitor can be the first or second side surface of described ceramic body.
The lead-in wire of described the first internal electrode can be connected with the first outer electrode, the lead-in wire of the second internal electrode can be connected with the 4th outer electrode, the lead-in wire of the 3rd internal electrode can be connected with the second outer electrode, and the lead-in wire of the 4th internal electrode can be connected with the 3rd outer electrode.
The first inner connecting conductors can be connected with the first internal electrode and be passed through the 3rd outer electrode by the first outer electrode and be connected with the 4th internal electrode.
The second inner connecting conductors can be connected with the second internal electrode and be passed through the second outer electrode by the 4th outer electrode and be connected with the 3rd internal electrode.
First and the 3rd internal electrode can be separated from one another on the individual layer in the cross section of described ceramic body on grow-cross direction, and second and the 4th internal electrode can be separated from one another on another individual layer in the cross section of described ceramic body on grow-cross direction.
The lead-in wire of the first internal electrode can be connected on the first outer electrode, the lead-in wire of the second internal electrode can be connected on the 3rd outer electrode, the lead-in wire of the 3rd internal electrode can be connected on the second outer electrode, and the lead-in wire of the 4th internal electrode can be connected on the 4th outer electrode.
The first inner connecting conductors can be connected on the first internal electrode and by the 4th outer electrode and be connected on the 4th internal electrode by the first outer electrode.
The second inner connecting conductors can be connected to the second internal electrode and be connected to the 3rd internal electrode by the second outer electrode by the 3rd outer electrode.
Multilayer ceramic capacitor can further comprise: be formed at the 3rd capacitor part in ceramic body and be formed at the 4th capacitor part in ceramic body, described the 3rd capacitor part comprises the 5th internal electrode that is exposed to the first side surface and the 6th internal electrode that is exposed to the second side surface, described the 4th capacitor part comprises the 7th and the 8th internal electrode, wherein the 5th and the 7th internal electrode is separated from one another on the individual layer in the cross section of described ceramic body on grow-cross direction, and the 6th and the 8th internal electrode separated from one another on another individual layer in the cross section of described ceramic body on grow-cross direction.
The 5th internal electrode can be connected with the first outer electrode, and the 6th internal electrode can be connected with the 3rd outer electrode, and the 7th internal electrode can be connected with the second outer electrode, and the 8th internal electrode can be connected with the 4th outer electrode.
According to a further aspect in the invention, a kind of multilayer ceramic capacitor is provided, described multilayer ceramic capacitor comprises: ceramic body, and described ceramic body comprises multiple dielectric layers and has the first and second first type surfaces, each other the first and second side surfaces of opposition and first and second end faces that oppose each other of opposition each other; Be exposed to the first side surface and on grow-cross direction separated from one another first, the 3rd on the individual layer in the cross section of described ceramic body, the 5th and the 7th internal electrode, and be exposed to the second side surface and separated from one another second, the 4th on another individual layer in the cross section of described ceramic body, the 6th and the 8th internal electrode on grow-cross direction; Be formed in ceramic body and be exposed to the first to the 4th inner connecting conductors of the first and second side surfaces; And be formed at the first to the 8th outer electrode being electrically connected on the first and second side surfaces and with the first to the 8th internal electrode and first to fourth inner connecting conductors, wherein the first and second internal electrodes, the third and fourth internal electrode, the 5th and the 6th internal electrode and the 7th and the 8th internal electrode form respectively first, second, third and the 4th capacitor part, the first and second capacitor parts are connected with the first and second inner connecting conductors respectively, and the third and fourth capacitor part is connected with the third and fourth inner connecting conductors respectively.
First to fourth outer electrode can be configured on the first side surface of ceramic body separated from one another, and the 5th to the 8th outer electrode can be configured on the second side surface of ceramic body separated from one another.
The installed surface of multilayer ceramic capacitor can be the first or second side surface of ceramic body.
The first, the 3rd, the 5th, the 7th, second, the 4th, the 6th, the 8th internal electrode can be connected with the first to the 8th outer electrode respectively.
The first inner connecting conductors can be connected with the first internal electrode and be passed through the 6th outer electrode by the first outer electrode and be connected with the 4th internal electrode.
The second inner connecting conductors can be connected with the second internal electrode and be passed through the second outer electrode by the 5th outer electrode and be connected with the 3rd internal electrode.
The 3rd inner connecting conductors can be connected with the 5th internal electrode and be passed through the 8th outer electrode by the 3rd outer electrode and be connected with the 8th internal electrode.
The 4th inner connecting conductors can be connected with the 6th internal electrode and be passed through the 4th outer electrode by the 7th outer electrode and be connected with the 7th internal electrode.
According to a further aspect in the invention, a kind of multilayer ceramic capacitor is provided, described multilayer ceramic capacitor comprises: ceramic body, and described ceramic body comprises multiple dielectric layers and has the first and second first type surfaces respect to one another, each other the first and second side surfaces of opposition and the first and second end faces that oppose each other; Be formed at the first capacitor part in ceramic body and be formed at the second capacitor part in ceramic body, described the first capacitor part comprises that first internal electrode with the lead-in wire that is exposed to the second side surface and second internal electrode with the lead-in wire that is exposed to the first side surface, described the second capacitor part comprise having and is exposed to the second side surface and with the 3rd internal electrode of the isolated lead-in wire of lead-in wire of the first internal electrode with have and be exposed to the first side surface the 4th internal electrode with the isolated lead-in wire of lead-in wire of the second internal electrode; Be formed in ceramic body and be exposed to the first to the 3rd inner connecting conductors of the first and second side surfaces; And be formed on the first and second side surfaces of ceramic body and the first to the 6th outer electrode being electrically connected with first to fourth internal electrode and the first to the 3rd inner connecting conductors, wherein the first capacitor part is connected with the first and second inner connecting conductors, and the second capacitor part with second and the 3rd inner connecting conductors connect.
The first to the 3rd outer electrode can be configured on the first side surface of ceramic body separated from one another, and the 4th to the 6th outer electrode can be configured on the second side surface of ceramic body separated from one another.
The installed surface of multilayer ceramic capacitor can be the first or second side surface of described ceramic body.
The lead-in wire of the first internal electrode can be connected with the 4th outer electrode, the lead-in wire of the second internal electrode can be connected with the second outer electrode, the lead-in wire of the 3rd internal electrode can be connected with the 5th outer electrode, and the lead-in wire of the 4th internal electrode can be connected with the 3rd outer electrode.
The first inner connecting conductors can be connected with the first outer electrode, and is connected with the first internal electrode by the 4th outer electrode.
The second inner connecting conductors can be connected with the second internal electrode and be passed through the 5th outer electrode by the second outer electrode and be connected with the 3rd internal electrode.
The 3rd inner connecting conductors can be connected with the 6th outer electrode, and is connected with the 4th internal electrode by the 3rd outer electrode.
According to another aspect of the present invention, provide a kind of plate that multilayer ceramic capacitor is installed, described plate comprises: printed circuit board (PCB), has the first and second electrode pads on described printed circuit board (PCB); And the multilayer ceramic capacitor being arranged on described printed circuit board (PCB) as above.
Brief description of the drawings
Above-mentioned and other side of the present invention, feature and other advantages are from being more clearly understood detailed description with the accompanying drawing subsequently, wherein:
Fig. 1 is the perspective view of the multilayer ceramic capacitor of first embodiment of the invention;
Fig. 2 is the plane graph that the first and second inner connecting conductors that are applied to the multilayer ceramic capacitor shown in Fig. 1 are shown;
Fig. 3 is the plane graph that first to fourth internal electrode using together with the first and second inner connecting conductors shown in Fig. 2 is shown;
Fig. 4 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Fig. 1;
Fig. 5 is the plane graph that the first and second inner connecting conductors that can be used for multilayer ceramic capacitor are second embodiment of the invention shown;
Fig. 6 is the plane graph that first to fourth internal electrode using together with the first and second inner connecting conductors shown in Fig. 5 is shown;
Fig. 7 is the equivalent circuit diagram of multilayer ceramic capacitor second embodiment of the invention;
Fig. 8 is the plane graph illustrating according to first and second inner connecting conductors that can be used for multilayer ceramic capacitor of the 3rd execution mode of the present invention;
Fig. 9 illustrates the first plane graph to the 8th internal electrode using together with the first and second inner connecting conductors shown in Fig. 8;
Figure 10 is according to the equivalent circuit diagram of the multilayer ceramic capacitor of the 3rd execution mode of the present invention;
Figure 11 is according to the perspective view of the multilayer ceramic capacitor of four embodiment of the invention;
Figure 12 is the plane graph that first to fourth inner connecting conductors that is applied to the multilayer ceramic capacitor shown in Figure 11 is shown;
Figure 13 illustrates the first plane graph to the 8th internal electrode using together with first to fourth inner connecting conductors shown in Figure 12;
Figure 14 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 11;
Figure 15 is according to the perspective view of the multilayer ceramic capacitor of the 5th execution mode of the present invention;
Figure 16 illustrates the first plane graph to the 3rd inner connecting conductors that is applied to the multilayer ceramic capacitor shown in Figure 15;
Figure 17 illustrates the plane graph to first to fourth internal electrode using together with the 3rd inner connecting conductors with first shown in Figure 16;
Figure 18 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 15;
Figure 19 is the perspective view that the multilayer ceramic capacitor shown in the Fig. 1 being arranged on printed circuit board (PCB) is shown; And
Figure 20 is the curve chart that the impedance between embodiments of the invention and comparative example is compared.
Embodiment
Hereinafter, with reference to the accompanying drawings the preferred embodiment of the present invention is described in detail.
But the present invention can be accomplished in several ways, and should not be construed as limited to the execution mode of after this enumerating.Natch, the execution mode providing thoroughly and is completely disclosed the present invention, and has given full expression to scope of the present invention to those skilled in the art.
In accompanying drawing, in order to show clear may amplification the shape and size of element, and will indicate same or analogous element with same or analogous Reference numeral from start to finish.
Define hexahedral direction with clear description embodiments of the present invention.L shown in accompanying drawing, W and T refer to respectively length direction, Width and thickness direction.Herein, thickness direction can be the direction that dielectric layer is piled up.
multilayer ceramic capacitor
Hereinafter, describe embodiments of the present invention in detail in connection with accompanying drawing.
Fig. 1 is the perspective view of the multilayer ceramic capacitor of first embodiment of the invention.
Fig. 2 is the plane graph that the first and second inner connecting conductors that are applied to the multilayer ceramic capacitor described in Fig. 1 are shown.
Fig. 3 illustrates and the plane graph of first to fourth internal electrode using together with the first and second inner connecting conductors described in Fig. 2.
Referring to figs. 1 to Fig. 3, multilayer ceramic capacitor 100 according to the embodiment of the present invention can comprise ceramic body 110, and described ceramic body 110 comprises multiple dielectric layers 111 and has the first and second first type surfaces respect to one another, the first and second side surfaces respect to one another and the first and second end faces respect to one another.
In the present embodiment, ceramic body 110 has the first first type surface 5 respect to one another and the second first type surface 6, and by the first side surface 3 connected to one another the first and second first type surfaces and the second side surface 4 and the first end face 1 and the second end face 2.
The shape of ceramic body 110 is not particularly limited, but can be hexahedron as shown in the figure.
Can form ceramic body 110 by stacking multiple dielectric layers, and multiple internal electrode 121 to 124(is first to fourth internal electrode successively) can be configured to separated from one anotherly, and dielectric layer is between internal electrode.
Multiple dielectric layers 111 of configuration ceramic body 110 can be the states of sintering integrated so that cannot confirm the border between adjacent dielectric each other.
The ceramic green sheet (green sheet) that can comprise ceramic powder, organic solvent and organic bond (binder) by sintering forms dielectric layer 111.Can be by based on barium titanate (BaTiO
3) material, based on strontium titanates (SrTiO
3) material etc. be used as the ceramic powder of high k material.But ceramic powder is not limited to this.
Multilayer ceramic capacitor 100 can comprise the first capacitor part being formed in ceramic body 110, described the first capacitor part comprises first internal electrode 121 with the lead-in wire 121a that is exposed to the first side surface 3 and second internal electrode 122 with the lead-in wire 122a that is exposed to the second side surface 4, multilayer ceramic capacitor 100 also comprises the second capacitor part, described the second capacitor part comprises having and is exposed to the first side surface 3 and with the 3rd internal electrode 123 of the separated lead-in wire of the lead-in wire 121a of the first internal electrode 123a with have and be exposed to the second side surface 4 and the 4th internal electrode 124 of the separated lead-in wire of the lead-in wire 122a 124a of the second internal electrode.
According to the embodiment of the present invention, available packages forms the first internal electrode 121 to the 4th internal electrode 124 containing the conducting resinl of conducting metal.
Electric conducting material can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy, but is not limited to this.
Can be by the printing process such as method for printing screen or gravure process, by using conducting resinl to print interior electrode layer on the ceramic green sheet of configuration dielectric layer.
The ceramic green sheet that is printed with interior electrode layer thereon can be replaced sintering and stacking to form ceramic body.
In addition, multilayer ceramic capacitor 100 can comprise and is formed in ceramic body 110 and is exposed to the first side surface 3 and the first inner connecting conductors 125 of the second side surface 4 and the second inner connecting conductors 126.
The first inner connecting conductors 125 and the second inner connecting conductors 126 can be made with the conducting resinl that for example comprises the conducting metal that is similar to first to fourth internal electrode 121 to 124, but are not limited to this.
Described conducting metal can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy, but is not limited to this.
In addition, multilayer ceramic capacitor 100 can comprise first to fourth outer electrode 131 to 134, and described first to fourth outer electrode 131 to 134 is formed on the first and second side surfaces 3 and 4 of ceramic body 110 and is electrically connected with first to fourth internal electrode 121 to 124 and the first and second inner connecting conductors 125 and 126.
The first and second outer electrodes 131 and 132 are layout separated from one another on the first side surface 3 of ceramic body 110, and the third and fourth outer electrode 133 and 134 layout separated from one another on the second side surface 4 of ceramic body 110.
According to this execution mode of the present invention, the installed surface of multilayer ceramic capacitor 100 can be the first or second side surface 3 or 4 of ceramic body 110.
In other words, can be by right angle setting according to the multilayer ceramic capacitor of this execution mode of the present invention, but be not limited to this.Multilayer ceramic capacitor can be installed in a variety of forms.
Therefore can be, the third and fourth outer electrode 133 and 134 at the outer electrode for contact the first and second electrode pads on the plate of multilayer ceramic capacitor are installed of describing subsequently.
According to this execution mode of the present invention, can understand, except the third and fourth outer electrode 133 and 134 of the outside terminal that is used as being connected with power line, two outer electrodes 131 and 132 are used as the outer electrode of controlling ESR.
But, because be used as the third and fourth outer electrode of outside terminal be pick out at random with suitably for obtaining the ESR characteristic of expectation, so the third and fourth outer electrode is not confined to this especially.
As mentioned above, first and second outer electrodes 131 and 132 that can be used as the outer electrode for controlling ESR can be the contactless terminals that is free of attachment to power line, and they are placed on the upper surface of multilayer ceramic capacitor based on installation direction.
In other words, according to the embodiment of the present invention, because contactless terminal the first and second outer electrodes 131 and 132 are placed on the upper surface of multilayer ceramic capacitor instead of on side surface, so in the time being mounted onboard, contactless terminal can not hinder size and dwindle, and this miniaturization for product is an advantage.
First to fourth outer electrode 131 to 134 can be formed by the conducting resinl that contains conducting metal.
Described conducting metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy, but is not limited to this.
Described conducting resinl can further comprise insulating material.Described insulating material can be for example glass, but is not limited to this.
The method that forms first to fourth outer electrode 131 to 134 is not particularly limited.In other words, can on ceramic body, form first to fourth outer electrode 131 to 134 by methods such as printing process, dipping method, galvanoplastic.
Multilayer ceramic capacitor 100 is to have four terminal capacitance devices of four outer electrodes altogether, but the present invention is not limited to this.
Hereinafter, about the configuration of multilayer ceramic capacitor 100 according to the embodiment of the present invention, describe internal electrodes 121 to 124, inner connecting conductors 125 and 126 and outer electrode 131 to 134 in detail with reference to accompanying drawing 2 and 3.
Be formed at the first capacitor part in ceramic body 110 and comprise and there is the first internal electrode 121 of the lead-in wire 121a that is exposed to the first side surface 3 and there is the second internal electrode of the lead-in wire 122a that is exposed to the second side surface 4, and form electric capacity.
In addition, the second capacitor part comprises to have and is exposed to the first side surface 3 and with the 3rd internal electrode 123 of the separated lead-in wire of the lead-in wire 121a of the first internal electrode 123a with have and be exposed to the second side surface 4 the 4th internal electrode 124 with the separated lead-in wire of the lead-in wire 122a 124a of the second internal electrode, and forms electric capacity.
The lead-in wire 121a of the first internal electrode can be connected with the first outer electrode 131, the lead-in wire 122a of the second internal electrode can be connected with the 4th outer electrode 134, the lead-in wire 123a of the 3rd internal electrode can be connected with the second outer electrode 132, and the lead-in wire 124a of the 4th internal electrode can be connected with the 3rd outer electrode 133, but the invention is not restricted to this.
The first and second capacitor parts can be formed among ceramic body 110 and have no particular limits, and for realize target capacitance, can stacking multiple the first and second capacitor parts.
According to the embodiment of the present invention, in described multilayer ceramic capacitor 100, the first and second capacitor parts can be connected in parallel with each other.
First to fourth internal electrode 121 to 124 can alternately be arranged with the first and second inner connecting conductors 125 together with 126, and dielectric layer 111 inserts between internal electrode.
In Fig. 2, shown the first and second inner connecting conductors 125 and 126, their quantity is respectively one, but can be provided multiple.
Similarly, shown first to fourth internal electrode 121 to 124 in Fig. 3, their quantity is respectively one, but can be provided multiple.
Meanwhile, internal electrode and inner connecting conductors can be stacking according to the order shown in Fig. 2 and Fig. 3, or stacking with other order if necessary.
For example, the first and second inner connecting conductors 125 and 126 can be disposed between the first and second capacitor parts or can be separated from one another.
Especially, by changing width, length and the number of plies of the first and second inner connecting conductors 125 and 126, can accurately control the ESR characteristic of expectation.
According to the embodiment of the present invention, the first inner connecting conductors 125 can be connected with the first internal electrode 121 and be connected with the 4th internal electrode 124 by the 3rd outer electrode 133 by the first outer electrode 131.
In addition, the second inner connecting conductors can be connected with the second internal electrode 122 and be connected with the 3rd internal electrode 123 by the second outer electrode 132 by the 4th outer electrode 134.
The pattern form of the first and second inner connecting conductors 125 and 126 shown in Fig. 2 is only example according to the embodiment of the present invention, and the first and second inner connecting conductors 125 and 126 can have multiple patterns shape to control ESR.
For example, the first and second inner connecting conductors 125 and 126 have and the identical pattern form of first to fourth internal electrode 121 to 124 shown in Fig. 3.
According to the embodiment of the present invention, the first and second inner connecting conductors 125 and 126 can be controlled the ESR of multilayer ceramic capacitor.
In other words, comprise the first and second internal electrodes 121 and the first capacitor part of 122 and comprise that the third and fourth internal electrode 123 can as described belowly be connected in parallel with the second capacitor part of 124.
In addition, the first and second capacitor parts can be connected with the first and second inner connecting conductors 125 and 126.
Due to above-mentioned connected mode, the ESR of multilayer ceramic capacitor can be controlled by the first and second inner connecting conductors 125 and 126.
In addition, in the present embodiment, the third and fourth outer electrode 133 and 134 outside terminals that can be used as for being connected with power line.For example, the 3rd outer electrode 133 can be connected with power line, and the 4th outer electrode 134 can be connected with ground.
Meanwhile, except the third and fourth outer electrode 133 and 134, the first and second outer electrodes 131 and 132 can be used as for controlling ESR and being understood to the outer electrode of contactless terminal.
Fig. 4 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Fig. 1.
With reference to figure 4, comprise the first capacitor part of the first and second internal electrodes 121 and 122 and comprise that the second capacitor part of the third and fourth internal electrode 123 and 124 can be connected in parallel with each other.
In addition, the first and second capacitor parts can be connected with the first and second inner connecting conductors 125 and 126.
As mentioned above, multilayer ceramic capacitor according to the embodiment of the present invention can have two kinds of resistors and two kinds of capacitors, and their values are separately all controlled.
Multilayer ceramic capacitor according to the embodiment of the present invention has said structure, it comprises internal electrode 121 to 124, inner connecting conductors 125 and 126 and outer electrode 131 and 134, so can be easy in wider frequency range, reduce and control group, and owing to having reduced number of elements compared with existing structure, installing space and manufacturing cost reduced.
In addition,, because capacitor is by right angle setting, so size is dwindled the obstruction that is not subject to contactless terminal, this is also conducive to the miniaturization of product.
Fig. 5 is the plane graph that the first and second inner connecting conductors that can be used for multilayer ceramic capacitor are second embodiment of the invention shown.
Fig. 6 is the plane graph that first to fourth internal electrode using together with the first and second inner connecting conductors shown in Fig. 5 is shown.
Fig. 7 is the equivalent circuit diagram of multilayer ceramic capacitor second embodiment of the invention.
With reference to figure 5 to 7, multilayer ceramic capacitor is according to the embodiment of the present invention characterised in that, in the multilayer ceramic capacitor of above-mentioned first embodiment of the invention, on grow-cross direction in the cross section of ceramic body 110, first and the 3rd internal electrode 121 ' and 123 ' be formed on individual layer separated from one another, and second and the 4th internal electrode 122 ' and 124 ' be formed on another individual layer separated from one another.
Second embodiment of the invention, lead-in wire 121 ' a of the first internal electrode can be connected with the first outer electrode 131, lead-in wire 122 ' a of the second internal electrode can be connected with the 3rd outer electrode 133, lead-in wire 123 ' a of the 3rd internal electrode can be connected with the second outer electrode 132, and the lead-in wire 124 ' a of the 4th internal electrode can be connected with the 4th outer electrode 134.
According to this execution mode of the present invention, the first inner connecting conductors 125 ' can be connected with the first internal electrode 121 ' and be passed through the 4th outer electrode 134 by the first outer electrode 131 and be connected with the 4th internal electrode 124 '.
According to this execution mode of the present invention, the second inner connecting conductors 126 ' can be connected with the second internal electrode 122 ' and be passed through the second outer electrode 132 by the 3rd outer electrode 133 and be connected with the 3rd internal electrode 123 '.
Can be connected in parallel to each other with reference to figure 7, the first and second inner connecting conductors 125 ' and 126 '.
Further, comprise the first capacitor part of the first and second internal electrodes 121 ' and 122 ' and comprise that the second capacitor part of the third and fourth internal electrode 123 ' and 124 ' can connect with the first and second inner connecting conductors 125 ' and 126 '.
Because the multilayer ceramic capacitor of other features of multilayer ceramic capacitor second embodiment of the invention and first embodiment of the invention is identical, so omit detailed description.
Fig. 8 is the plane graph illustrating according to first and second inner connecting conductors that can be used for multilayer ceramic capacitor of the 3rd execution mode of the present invention.
Fig. 9 illustrates the first plane graph to the 8th internal electrode using together with the first and second inner connecting conductors shown in Fig. 8.
Figure 10 is according to the equivalent circuit diagram of the multilayer ceramic capacitor of the 3rd execution mode of the present invention.
With reference to figure 8 to 10, be characterised in that according to the multilayer ceramic capacitor of the 3rd execution mode of the present invention, further comprise at the multilayer ceramic capacitor of above-mentioned first embodiment of the invention the 3rd capacitor part and the 4th capacitor part that are formed in ceramic body 110, on grow-cross direction in the cross section of ceramic body 110, described the 3rd capacitor part comprises the 5th internal electrode 11 that is exposed to the first side surface 3 and the 6th internal electrode 12 that is exposed to the second side surface 4, described the 4th capacitor part comprises the 7th and the 8th internal electrode 13 and 14, wherein the 5th and the 7th internal electrode 11 and 13 is formed on individual layer separated from one another, the the 6th and the 8th internal electrode 12 and 14 is formed on another individual layer separated from one another.
According to this execution mode of the present invention, the first internal electrode 11 can be connected with the first outer electrode 131, the 6th internal electrode 12 can be connected with the 3rd outer electrode 133, the 7th internal electrode 13 can be connected with the second outer electrode 132, and the 8th internal electrode 14 can be connected with the 4th outer electrode 134.
According to this execution mode of the present invention, the first internal electrode 121 " lead-in wire 121 " a can be connected with the first outer electrode 131, the second internal electrode 122 " lead-in wire 122 " a can be connected with the 3rd outer electrode 133, the 3rd internal electrode 123 " lead-in wire 123 " a can be connected with the second outer electrode 132, and the 4th internal electrode 124 " lead-in wire 124 " a can be connected with the 4th outer electrode 134.
According to this execution mode of the present invention, the first inner connecting conductors 125 " can pass through the first outer electrode 131 and the first internal electrode 121 " be connected and pass through the 4th outer electrode 134 and the 4th internal electrode 124 " be connected.
According to this execution mode of the present invention, the second inner connecting conductors 126 " can pass through the 3rd outer electrode 133 and the second internal electrode 122 " be connected and pass through the second outer electrode 132 and the 3rd internal electrode 123 " be connected.
With reference to Figure 10, the first and second inner connecting conductors 125 " and 126 " can be connected in parallel with each other.
In addition, first to fourth capacitor part can be connected in parallel to each other.
In addition, comprise the first and second internal electrodes 121 " and 122 " the first capacitor part, comprise the third and fourth internal electrode 123 " and 124 " the second capacitor part, comprise the 3rd capacitor part of the 5th and the 6th internal electrode 11 and 12 and comprise the 7th and the 8th internal electrode the 4th capacitor part can with the first and second inner connecting conductors 125 " and 126 " connect.
Because identical according to the multilayer ceramic capacitor of other features of the multilayer ceramic capacitor of the 3rd execution mode of the present invention and first embodiment of the invention, so omit, its details is described.
Figure 11 is according to the perspective view of the multilayer ceramic capacitor of four embodiment of the invention.
Figure 12 is the plane graph that first to fourth inner connecting conductors that is applicable to the multilayer ceramic capacitor shown in Figure 11 is shown.
Figure 13 illustrates the first plane graph to the 8th internal electrode using together with first to fourth inner connecting conductors shown in Figure 12.
Figure 14 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 11.
With reference to figures 11 to 14, can comprise according to the multilayer ceramic capacitor 200 of the 4th execution mode of the present invention: ceramic body 210, described ceramic body 210 comprises multiple dielectric layers and has the first and second first type surfaces 5 respect to one another and 6, the first and second side surfaces 3 respect to one another and 4 and the first and second end faces 1 and 2 respect to one another; Be exposed to the first side surface 3 and on grow-cross direction, on the individual layer in the cross section of ceramic body 210, be formed separated from one another first, the 3rd, the 5th and the 7th internal electrode 221,223,225 and 227, and be exposed to the second side surface 4 and on grow-cross direction, on another individual layer in the cross section of ceramic body 210, be formed separated from one another second, the 4th, the 6th and the 8th internal electrode 222,224,226 and 228; Be formed in ceramic body 210 and be exposed to first to fourth inner connecting conductors 241 to 244 of the first and second side surfaces 3 and 4; And the first to the 8th outer electrode the 231 to 238, described first to the 8th outer electrode 231 to 238 being formed on the first and second side surfaces 3 and 4 of ceramic body 210 is electrically connected with the first to the 8th internal electrode 221 to 228 and first to fourth inner connecting conductors 241 to 244.The first and second internal electrodes 221 and 222, the third and fourth internal electrode 223 and 224, the 5th and the 6th internal electrode 225 and 226 and the 7th and the 8th internal electrode 227 and 228 form respectively first, second, third and the 4th capacitor part.The first and second capacitor parts are connected with the first and second inner connecting conductors 241 and 242 respectively, and the third and fourth capacitor part is connected with the third and fourth inner connecting conductors 243 and 244 respectively.
According to this execution mode of the present invention, first to fourth outer electrode 231 to 234 is configured to each interval on the first side surface 3 of ceramic body and arranges, and arranges and the 5th to the 8th outer electrode 235 to 238 is configured to each interval on the second side surface 4 of ceramic body.
According to this execution mode of the present invention, the installed surface of multilayer ceramic capacitor 200 can be the first or second side surface 3 or 4 of ceramic body 210.
According to this execution mode of the present invention, first, the 3rd, the 5th, the 7th, second, the 4th, the 6th can sequentially be connected with 238 with the first to the 8th outer electrode 231,232,233,234,235,236,237 respectively with 228 with the 8th internal electrode 221,223,225,227,222,224,226.
According to this execution mode of the present invention, the first inner connecting conductors 241 can be connected with the first internal electrode 221 and be passed through the 6th outer electrode 236 by the first outer electrode 231 and be connected with the 4th internal electrode 224.
According to this execution mode of the present invention, the second inner connecting conductors 242 can be connected with the second internal electrode 222 and be passed through the second outer electrode 232 by the 5th outer electrode 235 and be connected with the 3rd internal electrode 223.
According to this execution mode of the present invention, the 3rd inner connecting conductors 243 can be connected with the 5th internal electrode 225 and be passed through the 8th outer electrode 238 by the 3rd outer electrode 233 and be connected with the 8th internal electrode 228.
According to this execution mode of the present invention, the 4th inner connecting conductors 244 can be connected with the 6th internal electrode 226 and be passed through the 4th outer electrode 234 by the 7th outer electrode 237 and be connected with the 7th internal electrode 227.
With reference to Figure 14, the first and second inner connecting conductors 241 and 242 and third and fourth inner connecting conductors 243 and 244 can be connected in parallel with each other respectively.
In addition, first to fourth capacitor part can be connected in parallel to each other.
Further, comprise the first capacitor part of the first and second internal electrodes 221 and 222 and comprise that the second capacitor part of the third and fourth internal electrode 223 and 224 can connect with the first and second inner connecting conductors 241 and 242.
In addition, comprise the 3rd capacitor part of the 5th and the 6th internal electrode 225 and 226 and comprise that the 4th capacitor part of the 7th and the 8th internal electrode 227 and 228 can connect with the third and fourth inner connecting conductors 243 and 244.
Because identical with the multilayer ceramic capacitor of first embodiment of the invention described above according to other features of the multilayer ceramic capacitor of the 4th execution mode of the present invention, so omit detailed description.
Figure 15 is according to the perspective view of the multilayer ceramic capacitor of the 5th execution mode of the present invention.
Figure 16 illustrates the first plane graph to the 3rd inner connecting conductors that is applicable to the multilayer ceramic capacitor shown in Figure 15.
Figure 17 illustrates the plane graph to first to fourth internal electrode using together with the 3rd inner connecting conductors with first shown in Figure 16.
Figure 18 is the equivalent circuit diagram of the multilayer ceramic capacitor shown in Figure 15.
With reference to Figure 15 to Figure 18, can comprise according to the multilayer ceramic capacitor 300 of the 5th execution mode of the present invention: ceramic body 310, described ceramic body comprises multiple dielectric layers 311 and has the first and second first type surfaces 5 respect to one another and 6, the first and second side surfaces 3 respect to one another and 4 and the first and second end faces 1 and 2 respect to one another, be formed at the first capacitor part and the second capacitor part in ceramic body 310, described the first capacitor part comprises first internal electrode 321 with the lead-in wire 321a that is exposed to the second side surface 4 and the second internal electrode 322a with the lead-in wire 322a that is exposed to the first side surface 3, described the second capacitor part comprises having and is exposed to the second side surface 4 and with the 3rd internal electrode 323 of the separated lead-in wire of the lead-in wire 321a of the first internal electrode 323a with have and be exposed to the first end face 3 the 4th internal electrode 324 with the separated lead-in wire of the lead-in wire 322a 324a of the second internal electrode, be formed in ceramic body 310 and be exposed to the first to the 3rd inner connecting conductors 325 to 327 of the first and second side surfaces 3 and 4, and be formed at the first to the 6th outer electrode 331 to 336 on the first and second side surfaces 3 and 4 of ceramic body 310, described outer electrode 331 to 336 is electrically connected with first to fourth internal electrode 321 to 324 and the first to the 3rd inner connecting conductors 325 to 327, wherein the first capacitor part is connected with the first and second inner connecting conductors 325 and 326, and the second capacitor part with second and the 3rd inner connecting conductors 326 and 327 connect.
According to this execution mode of the present invention, the first to the 3rd outer electrode 331 to 333 can be arranged in each interval on the first side surface 3 of ceramic body and arrange, and the 4th to the 6th outer electrode 334 to 336 can be arranged in each interval on the second side surface 4 of ceramic body and arranges.
According to this execution mode of the present invention, the installed surface of multilayer ceramic capacitor 300 can be the first or second side surface 3 or 4 of ceramic body.
According to this execution mode of the present invention, the lead-in wire 321a of the first internal electrode 321 can be connected with the 4th outer electrode 334, the lead-in wire 322a of the second internal electrode 322 can be connected with the second outer electrode 332, the lead-in wire 323a of the 3rd internal electrode 323 can be connected with the 5th outer electrode 335, and the lead-in wire 324a of the 4th internal electrode 324 can be connected with the 3rd outer electrode 333.
According to this execution mode of the present invention, the first inner connecting conductors 325 can be connected to the first outer electrode 331 and can be connected to the first internal electrode 321 by the 4th outer electrode 334.
According to this execution mode of the present invention, the second inner connecting conductors 326 can be connected to the second internal electrode 322 and be connected to the 3rd internal electrode 323 by the 5th outer electrode 335 by the second outer electrode 332.
According to this execution mode of the present invention, the first inner connecting conductors 327 can be connected to the 6th outer electrode 336 and be connected to the 4th internal electrode 324 by the 3rd outer electrode 333.
With reference to Figure 18, the first to the 3rd inner connecting conductors 325 to 327 can be connected in parallel to each other.
In addition the first capacitor part that, comprises the first and second internal electrodes 321 and 322 can be connected with the first and second inner connecting conductors 325 and 326.
In addition, comprise the third and fourth internal electrode 323 and 324 the second capacitor part can with second and the 3rd inner connecting conductors 326 and 327 connect.
Because identical with the multilayer ceramic capacitor of first embodiment of the invention according to other features of the multilayer ceramic capacitor of the 5th execution mode of the present invention, so omit detailed description.
for the plate of multilayer ceramic capacitor is installed
Figure 19 is the perspective view that the multilayer ceramic capacitor shown in the Fig. 1 being arranged on printed circuit board (PCB) is shown.
With reference to Figure 19, the plate 400 for multilayer ceramic capacitor 100 is installed according to the embodiment of the present invention comprises printed circuit board (PCB) 410, multilayer ceramic capacitor 100 is vertically mounted on described printed circuit board (PCB) 410, and plate 400 also comprises and being formed on printed circuit board (PCB) 410 and the first and second electrode pads 421 and 422 separated from one another.
In the case, by scolder 430, multilayer ceramic capacitor 100 is electrically connected with printed circuit board (PCB) 410, now the third and fourth outer electrode 133 contacts with 422 with the first and second electrode pads 421 respectively with 134.
Except above description, omit with the multilayer ceramic capacitor feature of above-mentioned first embodiment of the invention and describe the feature description repeating.
Figure 20 is the curve chart that the impedance between embodiments of the invention and comparative example is compared.
With reference to Figure 20, can understand, with in comparative example according to compared with the multilayer ceramic capacitor of correlation technique, the impedance in multilayer ceramic capacitor is according to the embodiment of the present invention smooth and is reduced in wide frequency ranges more.
As previously mentioned, according to the embodiment of the present invention, multilayer ceramic capacitor can have two kinds of resistors and capacitor, and these resistors and capacitor value is separately controlled.
Therefore, with compared with the structure of correlation technique, be easy to according to the embodiment of the present invention reduce in wider frequency range and control group, and because component number has reduced, so installing space and manufacturing cost can reduce.
In addition, because described capacitor is by right angle setting, therefore size is dwindled the obstruction that is not subject to contactless terminal, and this aspect miniaturization of product is being an advantage.
Although illustrated and described the present invention in conjunction with execution mode, it is obvious to the skilled person that and under the prerequisite that does not depart from the spirit and scope of the present invention that appended claims limits, can make amendment and variation.
Claims (28)
1. a multilayer ceramic capacitor, described multilayer ceramic capacitor comprises:
Ceramic body, described ceramic body comprises multiple dielectric layers and has the first first type surface respect to one another and the second first type surface, the first side surface respect to one another and the second side surface and the first end face respect to one another and the second end face;
Be formed at the first capacitor part in described ceramic body and be formed at the second capacitor part in described ceramic body, described the first capacitor part comprises first internal electrode with the lead-in wire that is exposed to described the first side surface and second internal electrode with the lead-in wire that is exposed to described the second side surface, described the second capacitor part comprises having and is exposed to described the first side surface and with the 3rd internal electrode of the separated lead-in wire of described lead-in wire of described the first internal electrode with have and be exposed to described the second side surface the 4th internal electrode with the separated lead-in wire of described lead-in wire of described the second internal electrode,
Be formed in described ceramic body and be exposed to the first inner connecting conductors and second inner connecting conductors of described the first side surface and the second side surface; And
Be formed at the first outer electrode to the four outer electrodes on described the first side surface and second side surface of described ceramic body, described the first outer electrode to the four outer electrodes and described the first internal electrode to the four internal electrodes and described the first inner connecting conductors and the second inner connecting conductors are electrically connected
Wherein said the first capacitor part and the second capacitor part are connected in series with described the first inner connecting conductors and the second inner connecting conductors respectively.
2. multilayer ceramic capacitor according to claim 1, wherein said the first outer electrode and the second outer electrode are arranged on described first side surface of described ceramic body separated from one another, and
Described the 3rd outer electrode and the 4th outer electrode are arranged on described second side surface of described ceramic body separated from one another.
3. multilayer ceramic capacitor according to claim 1, the installed surface of wherein said multilayer ceramic capacitor is described the first side surface or second side surface of described ceramic body.
4. multilayer ceramic capacitor according to claim 1, the described lead-in wire of wherein said the first internal electrode is connected with described the first outer electrode,
The described lead-in wire of described the second internal electrode is connected with described the 4th outer electrode,
The described lead-in wire of described the 3rd internal electrode is connected with described the second outer electrode, and
The described lead-in wire of described the 4th internal electrode is connected with described the 3rd outer electrode.
5. multilayer ceramic capacitor according to claim 4, wherein said the first inner connecting conductors is connected with described the first internal electrode by described the first outer electrode and is connected with described the 4th internal electrode by described the 3rd outer electrode.
6. multilayer ceramic capacitor according to claim 4, wherein said the second inner connecting conductors is connected with described the second internal electrode by described the 4th outer electrode and is connected with described the 3rd internal electrode by described the second outer electrode.
7. multilayer ceramic capacitor according to claim 1, wherein said the first internal electrode and the 3rd internal electrode are formed on length-cross direction separated from one another on the individual layer in the cross section of described ceramic body, and
Described the second internal electrode and the 4th internal electrode are formed on described length-cross direction separated from one another on the list of another in the described cross section of described ceramic body.
8. multilayer ceramic capacitor according to claim 7, the described lead-in wire of wherein said the first internal electrode is connected on described the first outer electrode,
The described lead-in wire of described the second internal electrode is connected on described the 3rd outer electrode,
The described lead-in wire of described the 3rd internal electrode is connected on described the second outer electrode, and
The described lead-in wire of described the 4th internal electrode is connected on described the 4th outer electrode.
9. multilayer ceramic capacitor according to claim 7, wherein said the first inner connecting conductors is connected to described the first internal electrode and is connected to described the 4th internal electrode by described the 4th outer electrode by described the first outer electrode.
10. multilayer ceramic capacitor according to claim 7, wherein said the second inner connecting conductors is connected on described the second internal electrode and by described the second outer electrode and is connected on described the 3rd internal electrode by described the 3rd outer electrode.
11. multilayer ceramic capacitors according to claim 7, this multilayer ceramic capacitor further comprises:
Be formed at the 3rd capacitor part in described ceramic body and be formed at the 4th capacitor part in described ceramic body, described the 3rd capacitor part comprises the 5th internal electrode that is exposed to described the first side surface and the 6th internal electrode that is exposed to described the second side surface, described the 4th capacitor part comprises the 7th internal electrode and the 8th internal electrode
Wherein said the 5th internal electrode and the 7th internal electrode are formed on described length-cross direction separated from one another on the individual layer in the described cross section of described ceramic body, and
Described the 6th internal electrode and the 8th internal electrode are formed on described length-cross direction separated from one another on another individual layer in the described cross section of described ceramic body.
12. multilayer ceramic capacitors according to claim 11, wherein said the 5th internal electrode is connected to described the first outer electrode,
Described the 6th internal electrode is connected to described the 3rd outer electrode,
Described the 7th internal electrode is connected to described the second outer electrode, and
Described the 8th internal electrode is connected to described the 4th outer electrode.
13. 1 kinds of multilayer ceramic capacitors, described multilayer ceramic capacitor comprises:
Ceramic body, described ceramic body comprises multiple dielectric layers and has the first first type surface respect to one another and the second first type surface, the first side surface respect to one another and the second side surface and the first end face respect to one another and the second end face;
Be exposed to described the first side surface and be formed on length-cross direction the first internal electrode, the 3rd internal electrode, the 5th internal electrode and the 7th internal electrode separated from one another on the individual layer in the cross section of described ceramic body, and be exposed to described the second side surface and be formed on described length-cross direction the second internal electrode, the 4th internal electrode, the 6th internal electrode and the 8th internal electrode separated from one another on another individual layer in the described cross section of described ceramic body;
Be formed in described ceramic body and be exposed to the first inner connecting conductors to the four inner connecting conductors of described the first side surface and the second side surface; And
Be formed at the first outer electrode to the eight outer electrodes on described the first side surface and second side surface of described ceramic body, described the first outer electrode to the eight outer electrodes are electrically connected with described the first internal electrode to the eight internal electrodes and described the first inner connecting conductors to the four inner connecting conductors
Wherein said the first internal electrode and the second internal electrode, described the 3rd internal electrode and the 4th internal electrode, described the 5th internal electrode and the 6th internal electrode and described the 7th internal electrode and the 8th internal electrode form respectively the first capacitor part, the second capacitor part, the 3rd capacitor part and the 4th capacitor part, described the first capacitor part and the second capacitor part are connected with described the first inner connecting conductors and the second inner connecting conductors respectively, described the 3rd capacitor part and the 4th capacitor part are connected with described the 3rd inner connecting conductors and the 4th inner connecting conductors respectively.
14. multilayer ceramic capacitors according to claim 13, wherein said the first outer electrode to the four outer electrodes are arranged on described first side surface of described ceramic body separated from one another, and
Described the 5th outer electrode to the eight outer electrodes are arranged on described second side surface of described ceramic body separated from one another.
15. multilayer ceramic capacitors according to claim 13, the installed surface of wherein said multilayer ceramic capacitor is described the first side surface or second side surface of described ceramic body.
16. multilayer ceramic capacitors according to claim 13, wherein said the first internal electrode, the 3rd internal electrode, the 5th internal electrode, the 7th internal electrode, the second internal electrode, the 4th internal electrode, the 6th internal electrode and the 8th internal electrode are connected with described the first outer electrode to the eight outer electrodes respectively.
17. multilayer ceramic capacitors according to claim 13, wherein said the first inner connecting conductors is connected with described the first internal electrode by described the first outer electrode and is connected with described the 4th internal electrode by described the 6th outer electrode.
18. multilayer ceramic capacitors according to claim 13, wherein said the second inner connecting conductors is connected with described the second internal electrode by described the 5th outer electrode and is connected with described the 3rd internal electrode by described the second outer electrode.
19. multilayer ceramic capacitors according to claim 13, wherein said the 3rd inner connecting conductors is connected with described the 5th internal electrode by described the 3rd outer electrode and is connected with described the 8th internal electrode by described the 8th outer electrode.
20. multilayer ceramic capacitors according to claim 13, wherein said the 4th inner connecting conductors is connected with described the 6th internal electrode by described the 7th outer electrode and is connected with described the 7th internal electrode by described the 4th outer electrode.
21. 1 kinds of multilayer ceramic capacitors, described multilayer ceramic capacitor comprises:
Ceramic body, described ceramic body comprises multiple dielectric layers and has the first first type surface respect to one another and the second first type surface, the first side surface respect to one another and the second side surface and the first end face respect to one another and the second end face;
Be formed at the first capacitor part in described ceramic body and be formed at the second capacitor part in described ceramic body, described the first capacitor part comprises first internal electrode with the lead-in wire that is exposed to described the second side surface and second internal electrode with the lead-in wire that is exposed to described the first side surface, described the second capacitor part comprises having and is exposed to described the second side surface and with the 3rd internal electrode of the separated lead-in wire of described lead-in wire of described the first internal electrode with have and be exposed to described the first side surface the 4th internal electrode with the separated lead-in wire of described lead-in wire of described the second internal electrode,
Be formed in described ceramic body and be exposed to the first inner connecting conductors to the three inner connecting conductors of described the first side surface and the second side surface; And
Be formed on described first side surface of described ceramic body and the second side surface and the first outer electrode to the six outer electrodes that are electrically connected with described the first internal electrode to the four internal electrodes and described the first inner connecting conductors to the three inner connecting conductors,
Wherein said the first capacitor part is connected with described the first inner connecting conductors and the second inner connecting conductors, and
Described the second capacitor part is connected with described the second inner connecting conductors and the 3rd inner connecting conductors.
22. multilayer ceramic capacitors according to claim 21, wherein said the first outer electrode to the three outer electrodes are arranged on described first side surface of described ceramic body separated from one another, and
Described the 4th outer electrode to the six outer electrodes are arranged on described second side surface of described ceramic body separated from one another.
23. multilayer ceramic capacitors according to claim 21, the installed surface of wherein said multilayer ceramic capacitor is described the first side surface or second side surface of described ceramic body.
24. multilayer ceramic capacitors according to claim 21, the described lead-in wire of wherein said the first internal electrode is connected to described the 4th outer electrode,
The described lead-in wire of described the second internal electrode is connected to described the second outer electrode,
The described lead-in wire of described the 3rd internal electrode is connected to described the 5th outer electrode, and
The described lead-in wire of described the 4th internal electrode is connected to described the 3rd outer electrode.
25. multilayer ceramic capacitors according to claim 21, wherein said the first inner connecting conductors is connected to described the first outer electrode, and is connected to described the first internal electrode by described the 4th outer electrode.
26. multilayer ceramic capacitors according to claim 21, wherein said the second inner connecting conductors is connected with described the second internal electrode by described the second outer electrode and is connected with described the 3rd internal electrode by described the 5th outer electrode.
27. multilayer ceramic capacitors according to claim 21, wherein said the 3rd inner connecting conductors is connected to described the 6th outer electrode, and is connected with described the 4th internal electrode by described the 3rd outer electrode.
28. 1 kinds for installing the plate of multilayer ceramic capacitor, and described plate comprises:
Printed circuit board (PCB) has the first electrode pad and the second electrode pad on described printed circuit board (PCB); And
Be arranged on described printed circuit board (PCB) according to the described multilayer ceramic capacitor described in arbitrary claim in claim 1 to 27.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020130044156A KR101514514B1 (en) | 2013-04-22 | 2013-04-22 | Multi-layered ceramic capacitor and board for mounting the same |
| KR10-2013-0044156 | 2013-04-22 |
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| CN104112594A true CN104112594A (en) | 2014-10-22 |
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| CN201310342102.7A Active CN104112594B (en) | 2013-04-22 | 2013-08-07 | Multi-layer ceramic capacitor and plate for mounting multi-layer ceramic capacitor |
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| JP (1) | JP5815607B2 (en) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702432A (en) * | 2014-12-15 | 2016-06-22 | 三星电机株式会社 | electronic component and board having the same |
| CN106470528A (en) * | 2015-08-20 | 2017-03-01 | 罗伯特·博世有限公司 | It is particularly useful for the construction package of the electronics of transmission mechanism control module |
| CN109300690A (en) * | 2017-07-25 | 2019-02-01 | 三星电机株式会社 | Combined electronical assembly and plate with combined electronical assembly |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102450593B1 (en) | 2016-04-27 | 2022-10-07 | 삼성전기주식회사 | Capacitor Component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397965A (en) * | 2001-07-16 | 2003-02-19 | Tdk株式会社 | Ceramic electronic device with multi-terminal and multiple layers |
| US20090139757A1 (en) * | 2007-11-30 | 2009-06-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor and circuit board device including the same |
| US20100109804A1 (en) * | 2007-05-03 | 2010-05-06 | Thomas Feichtinger | Electrical Multilayer Component |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3907599B2 (en) * | 2003-03-07 | 2007-04-18 | Ｔｄｋ株式会社 | Multilayer capacitor |
| JP4293560B2 (en) * | 2006-07-12 | 2009-07-08 | Ｔｄｋ株式会社 | Multilayer capacitor array |
| KR100809239B1 (en) * | 2006-12-29 | 2008-03-07 | 삼성전기주식회사 | Multilayer capacitor array |
| US7388738B1 (en) * | 2007-03-28 | 2008-06-17 | Tdk Corporation | Multilayer capacitor |
| JP4525773B2 (en) * | 2007-05-22 | 2010-08-18 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| KR100925623B1 (en) * | 2007-08-31 | 2009-11-06 | 삼성전기주식회사 | Multilayer Chip Capacitor, Circuit Board Apparatus Having the Capacitor, and Circuit Board |
| KR100925603B1 (en) * | 2007-09-28 | 2009-11-06 | 삼성전기주식회사 | Multilayer capacitor |
| JP5282634B2 (en) * | 2008-06-25 | 2013-09-04 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
| JP5152278B2 (en) * | 2010-08-31 | 2013-02-27 | Ｔｄｋ株式会社 | Manufacturing method of laminated electronic component and laminated electronic component |
-
2013
- 2013-04-22 KR KR1020130044156A patent/KR101514514B1/en active IP Right Grant
- 2013-07-19 JP JP2013150227A patent/JP5815607B2/en active Active
- 2013-08-07 CN CN201310342102.7A patent/CN104112594B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397965A (en) * | 2001-07-16 | 2003-02-19 | Tdk株式会社 | Ceramic electronic device with multi-terminal and multiple layers |
| US20100109804A1 (en) * | 2007-05-03 | 2010-05-06 | Thomas Feichtinger | Electrical Multilayer Component |
| US20090139757A1 (en) * | 2007-11-30 | 2009-06-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor and circuit board device including the same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702432A (en) * | 2014-12-15 | 2016-06-22 | 三星电机株式会社 | electronic component and board having the same |
| CN105702432B (en) * | 2014-12-15 | 2020-01-03 | 三星电机株式会社 | Electronic component and board having the same |
| CN106470528A (en) * | 2015-08-20 | 2017-03-01 | 罗伯特·博世有限公司 | It is particularly useful for the construction package of the electronics of transmission mechanism control module |
| CN106470528B (en) * | 2015-08-20 | 2021-09-07 | 罗伯特·博世有限公司 | Electronic assembly for a transmission control module |
| CN109300690A (en) * | 2017-07-25 | 2019-02-01 | 三星电机株式会社 | Combined electronical assembly and plate with combined electronical assembly |
| CN109300690B (en) * | 2017-07-25 | 2020-09-08 | 三星电机株式会社 | Composite electronic component and board having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140126083A (en) | 2014-10-30 |
| JP2014216638A (en) | 2014-11-17 |
| JP5815607B2 (en) | 2015-11-17 |
| CN104112594B (en) | 2017-05-03 |
| KR101514514B1 (en) | 2015-04-22 |
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