CN106470528B

CN106470528B - Electronic assembly for a transmission control module

Info

Publication number: CN106470528B
Application number: CN201610689457.7A
Authority: CN
Inventors: U.利斯科夫
Original assignee: Robert Bosch GmbH
Current assignee: Robert Bosch GmbH
Priority date: 2015-08-20
Filing date: 2016-08-19
Publication date: 2021-09-07
Anticipated expiration: 2036-08-19
Also published as: CN106470528A; DE102015215942A1; FR3040237A1

Abstract

In an electronic assembly (1) for a transmission control module, comprising at least one carrier circuit board (2), at least two ceramic capacitors (5) mechanically fastened to a mounting side (3) of the carrier circuit board (2) and having at least two terminals (6, 7) which are electrically conductively connected to the carrier circuit board (2), namely a first terminal (6) and a second terminal (7), it is proposed that at least one of the terminals (6, 7) of the first ceramic capacitor (5) is electrically conductively connected to one of the two terminals (6, 7) of the second ceramic capacitor (5) and to the carrier circuit board (2) via at least one contact circuit board (10) having conductor tracks (11).

Description

Electronic assembly for a transmission control module

Technical Field

The invention relates to an electronic assembly for a transmission control module having the features according to the invention.

Background

In motor vehicle technology, electronic control modules are used which are mounted on the transmission for actuating the transmission. The circuit board of the Control module can have actuators, sensors, plugs, at least one encapsulated controller (TCU), and other components. The capacitor is of particular interest here as a component on a circuit board. A common connection arrangement of capacitors on a circuit board consists in: the terminals of the capacitor are soldered to the terminals of the conductor lines of the circuit board. The capacitor is thereby electrically and mechanically connected to the circuit board. The connection of the capacitor to other capacitors or other electrical or electronic components takes place via conductor tracks of the circuit board. By means of temperature changes or oscillating movements of the circuit board, tensile, compressive and shearing forces can be transmitted from the circuit board to the capacitor via the soldering points, via which the capacitor is soldered to the circuit board. In power electronics, capacitors with a high stability with respect to such loads, for example electrolytic capacitors (Eikos), are therefore generally used.

Disclosure of Invention

According to the invention, an electronic assembly for a transmission control module is proposed. The structural assembly comprises at least one carrier circuit board, at least two ceramic capacitors mechanically fastened on the assembly side of said carrier circuit board with at least two connections, a first connection and a second connection conductively connected to the carrier circuit board. According to the invention, at least one of the terminals of the first ceramic capacitor is electrically conductively connected to one of the two terminals of the second ceramic capacitor and to the carrier board via at least one contact board having conductor tracks.

Advantages of the invention

The electronic assembly according to the invention has the advantage over the prior art that, by means of the electrical connection of the capacitor to the carrier board by means of the contact board, a direct connection of each connection of the capacitor by means of a hard soldering point on the carrier board is no longer required. In this way, tensile, compressive and shearing forces, which are generated, for example, by temperature changes or vibration movements, can be advantageously compensated in the carrier board by contacting the circuit board. Thereby, the force is not transmitted to the capacitor and the capacitor is thus not subjected to a particular mechanical load. In this way, a capacitor which is not characterized by a particularly high stability with respect to mechanical loads can advantageously also be used as a capacitor in the electronic component according to the invention. Thereby, ceramic capacitors, such as ceramic multilayer capacitors (MLCCs) which are sensitive and brittle with respect to mechanical loads, can advantageously be employed also in thermally loaded environments. Such ceramic capacitors are distinguished over other capacitors in that they advantageously require a small installation space. The use of ceramic capacitors on circuit boards can thus advantageously reduce the overall installation space required for the circuit board.

Further advantageous embodiments and variants of the invention are achieved by the features specified in the preferred exemplary embodiments and further exemplary embodiments.

In particular, it is advantageous if at least two ceramic capacitors each have a body with two end faces facing away from one another and one or more side faces connecting the end faces, wherein the first connection and the second connection are designed as face contacts at the end faces of the ceramic capacitors facing away from one another, and the longitudinal axis of the ceramic capacitor is defined by a straight line running perpendicularly through the end faces. It is particularly advantageous if at least one contact circuit board is oriented perpendicularly to the straight line. This has the advantage that the electronic component can thus be shaped particularly easily, compactly and clearly and can be produced economically advantageously and simply by standard methods.

It is particularly advantageous if the material of the carrier circuit board and the material of the contact circuit board have coefficients of thermal expansion matched to one another. If the coefficients of thermal expansion are matched to one another, it can advantageously be achieved that the carrier board and the contact board, when the temperature changes, extend relative to one another in such a way that no additional mechanical loads are transmitted to the ceramic capacitor by tensile, compressive or shearing forces occurring between the carrier board and the contact board. This has the advantage that the mechanical load onto the ceramic capacitor is reduced.

In a particularly advantageous manner, the thermal expansion coefficients of the contact circuit boards of the carrier circuit board can be adapted in that the carrier circuit board and the contact circuit board are partially or completely made of the same material and thus have the same thermal expansion coefficient. The extension of the space which thereby advantageously carries the circuit board and the contact circuit board also changes in the same dimension when the temperature changes, so that no additional mechanical loads are applied to the ceramic capacitor by the temperature change.

The mechanical load on the ceramic capacitor can be further reduced in that the carrier circuit board and/or the contact circuit board is designed as a flexible circuit board. The circuit board can thus advantageously be moved, bent and to some extent slightly extended and can thus advantageously serve as a buffer and balance tensile, compressive and shearing forces which occur in the carrier or contact circuit board, for example by temperature changes or vibrational movements, so that these forces are not transmitted to the ceramic capacitors and the latter are thus advantageously protected from additional loads.

In particular, it is advantageous if at least two ceramic capacitors are connected in parallel with one another, and first connections formed on the ceramic capacitors and/or second connections formed on the ceramic capacitors are connected to one another in an electrically conductive manner via conductor tracks of at least one contact circuit board. An advantageously high total capacitance can thus be achieved by the parallel capacitors and at the same time avoid: tensile, compressive or shear forces generated in the carrier board, for example by temperature changes or vibrational movements, are transmitted to the capacitors.

In particular, it is advantageous if at least one contact circuit board has at least one contact point at which the contact circuit board is in electrically conductive contact with a connecting element, wherein the connecting element is electrically conductively connected to the carrier circuit board and is preferably arranged on the carrier circuit board. The contact circuit board can thus be connected to the carrier circuit board in an electrically conductive manner via the connecting element. The connecting element can thus advantageously bridge the distance between the carrier board and the contact board, for example, and a high degree of freedom of the geometric arrangement of the ceramic capacitors on the carrier board is achieved.

The mechanical load on the ceramic capacitor can advantageously be further reduced by the connecting element being spring-elastically formed. The connecting element is thus flexible and can thus advantageously be used as a buffer and to compensate for tensile, compressive and shearing forces in the carrier circuit board, for example, which are generated by temperature changes or vibrational movements, so that these forces are advantageously not transmitted to the ceramic capacitors, and the ceramic capacitors are thus advantageously protected from additional mechanical loads.

In a particularly advantageous embodiment, the contact printed circuit board comprises a plurality of conductor lines, at which a terminal of the ceramic capacitor is electrically conductively connected to the conductor lines at a terminal point, wherein the conductor lines are jointly electrically contacted in common with the connecting element at a common contact point, and wherein at least two arbitrary conductor lines of the contact printed circuit board from the contact point to the respective terminal point have the same length.

Thus, conductor lines of the same length from the contact points to the respective terminal points also have the same ohmic resistance and the same alternating current resistance, which can prove to be a great advantage, for example, in a buffer capacitor or a tamper-resistant capacitor. In conductor lines of the same length, in particular of the same resistance, the connected capacitors can also be loaded with the same strength and correspondingly age at the same rate, which can lead to a maximization of the service life of the overall system.

In a particularly advantageous manner, the at least two ceramic capacitors are mechanically connected to the carrier circuit board by means of a bond coat. The adhesive coating serves as an advantageously cost-effective and simple medium for mechanically connecting the ceramic capacitor to the carrier board.

Drawings

Embodiments of the invention are illustrated in the drawings and are explained in detail in the following description. The figure is as follows:

figure 1 shows a top view of a first embodiment of an electronic structural assembly according to the invention,

figure 2 shows a front view of a first embodiment of an electronic structural component according to the invention,

figure 3 shows a side view of a first embodiment of an electronic structural component according to the invention,

figure 4 shows a top view of a second embodiment of an electronic structural component according to the invention,

figure 5 shows a top view of a third embodiment of an electronic structural component according to the invention,

figure 6 shows a front view of a second and a third embodiment of an electronic structural assembly according to the invention,

figure 7 shows a side view of a second and a third embodiment of an electronic structural assembly according to the invention,

figure 8 shows a schematic representation of the connection of a ceramic capacitor in a second and third embodiment of an electronic structural component according to the invention,

figure 9 shows a schematic representation of a contact circuit board used in a second embodiment of the electronic structural assembly according to the invention and in a third embodiment of the electronic structural assembly according to the invention,

figure 10 shows a top view of a fourth embodiment of an electronic structural component according to the invention,

figure 11 shows a schematic representation of the connection of a ceramic capacitor in a fourth embodiment of an electronic structural component according to the invention,

figure 12 shows a top view of a fifth embodiment of an electronic structural component according to the invention,

figure 13 shows a top view of a sixth embodiment of an electronic structural assembly according to the invention,

figure 14 shows a top view of a seventh embodiment of an electronic structural component according to the invention,

figure 15 shows a front view of a seventh embodiment of an electronic structural component according to the invention,

figure 16 shows a side view of a seventh embodiment of an electronic structural component according to the invention,

fig. 17 shows a schematic representation of the connection of a ceramic capacitor in a seventh exemplary embodiment of an electronic component according to the invention.

Detailed Description

Fig. 1 shows a top view of a first exemplary embodiment of an electronic assembly 1 according to the invention. In this exemplary embodiment, two ceramic capacitors 5 and two

terminals

6, 7 each, i.e. a first terminal 6 and a second terminal 7 each, are arranged on the carrier circuit board 2. The first connections 6 of the two ceramic capacitors 5 and the second connections 7 of the two ceramic capacitors 5 are electrically conductively connected to one another via in each case one contact circuit board 10.

The ceramic capacitor 5 is made at least partially of ceramic and can be configured, for example, as a ceramic multilayer capacitor (MLCC). The ceramic capacitors are sensitive, for example, to mechanical loads, which can be generated, for example, by tensile, compressive and shear forces in the carrier circuit board 2, which are generated by temperature changes or by vibrational movements. The ceramic capacitors 5 have, for example, in each case one body 9 with two end faces 14 facing away from one another. The end faces 14 are connected to one another via four side faces 16 in this embodiment, so that the ceramic capacitor 5 has a square shape with rectangular end faces 14 in this embodiment. The ceramic capacitor 5 can of course also have other shapes and be of cylindrical design, for example, so that the two circular surfaces are connected to one another as end faces 14 by tubular side faces 16. In this embodiment, the end faces 14 of the ceramic capacitors 5 face away from each other. The first terminal 6 and the second terminal 7 are in this exemplary embodiment designed as surface contacts at the end face 14 of the ceramic capacitor 5.

The ceramic capacitors 5 are arranged, for example, on the carrier circuit board 2 and are connected to one another in an electrically conductive manner in fig. 1 by means of two contact circuit boards 10. The electrical connection of the contact circuit board 10 to the carrier circuit board 2 is not shown in the first embodiment. The carrier circuit board 2 and the contact circuit board 10 are two circuit boards, wherein within the framework of the invention, a circuit board is understood to be a plate-like component that can be used as a carrier for electronic structures, such as conductor tracks, contact terminals, etc. In this example, the circuit board is, for example, a circuit board in the FR4 embodiment or a higher-level embodiment, i.e., a circuit board formed from a glass fiber-reinforced epoxy resin, for example. The circuit board can of course also be, for example, an HDI circuit board (High Density Interconnect circuit board), LTCC (low temperature co-fired ceramic), flexible circuit board (FPC = flexible printed circuit board) or other suitable circuit board. Particularly advantageously, the contact circuit board 10 can be configured as a flexible circuit board. The contact circuit board 10, which is designed as a flexible circuit board, can in this case also be made of the same material as the carrier circuit board 2, for example. Thus, for example, the inflexible and rigid carrier circuit board 2 in the FR4 embodiment can be combined with a flexible contact circuit board 10, the core of which is made of a thick FR4 material of, for example, twenty to two hundred micrometers. In such a flexible contact circuit board 10, for example, copper conductor tracks can be attached to a thick core of, for example, twenty to two hundred micrometers. The copper areas not contacted can be covered, for example, by solder resist. In principle, polyimide films, polyamide films or cables provided with conductor tracks can also be used as flexible contact circuit board 10.

In the first exemplary embodiment, the

terminals

6, 7 of the ceramic capacitor 5 are connected to one another in an electrically conductive manner via two contact circuit boards 10. The contact circuit board 10 in the first exemplary embodiment is oriented perpendicularly to the longitudinal axis of the ceramic capacitor 5. The longitudinal axis is defined here as a straight line G which runs perpendicularly through the end face 14 of the respective ceramic capacitor 5. The

terminals

6, 7 of the ceramic capacitor 5 are in this exemplary embodiment designed as surface contacts and are electrically conductively connected to the conductor track 11 by means of a respective terminal point 15 of the conductor track 11 of the contact circuit board 10. The electrically conductive connection is thus, for example, a soldered connection.

Fig. 2 shows a front view of a first exemplary embodiment of an electronic assembly 1 according to the invention. The contact circuit board 10 and the carrier circuit board 2 are made of materials with matched coefficients of thermal expansion in this embodiment. In the context of the present application, coefficients of thermal expansion that are matched to one another are understood to be coefficients of thermal expansion that differ from one another by at most ten percent, in particular by at most five percent, preferably in particular by at most one percent. The contact circuit board 10 and the carrier circuit board 2 can in this case also be made, for example, partially or completely, of the same material in order to have expansion coefficients matched to one another. Thus, the contact circuit board 10 and the carrier circuit board 2 have thermal expansions matched to one another in the case of a temperature change in this exemplary embodiment, and therefore no mechanical load is applied to the ceramic capacitor 5 by the different thermal expansions of the contact circuit board 10 and the carrier circuit board 2.

Fig. 3 shows a side view of a first exemplary embodiment of an electronic assembly 1 according to the invention. The ceramic capacitors 5 are fastened to the carrier circuit board 2 in this exemplary embodiment by means of a respective adhesive coating 8. The adhesive coating 8 can in this case be attached in a hardened state, for example by material bonding, to the carrier circuit board 2 and to the body 9 of the ceramic capacitor 5. The bond coat 8 is designed here, for example, in such a way that differential thermal expansion of the ceramic capacitor 5 and of the carrier board 2 cannot also lead to a tensioning of the ceramic capacitor 5 and thus to an additional mechanical loading of the ceramic capacitor 5. In this exemplary embodiment, this is achieved in that the adhesive coating 8, which is arranged at least partially between the ceramic capacitor 5 and the carrier circuit board 2, for example, is designed in the smallest possible area. In this exemplary embodiment, the ceramic capacitors 5 are thus mechanically fastened to the carrier board 2, but are not connected to it at all over the surface, so that tensile, compressive or shearing forces, which are generated in the carrier board 2, for example by temperature changes or vibrational movements, are not transmitted to the ceramic capacitors 5. The adhesive coating 8 can, for example, advantageously also not be in direct contact with the

terminals

6, 7, which are embodied as surface contacts in this exemplary embodiment. The ceramic capacitor 5 can of course also be fastened to the carrier circuit board 2 by means of other fastening means. Furthermore, in this exemplary embodiment, as shown in fig. 3, the contact circuit board 10 is spaced apart from the carrier circuit board 2 in such a way that tensile, compressive and shearing forces occurring in the carrier circuit board 2 cannot be transmitted to the contact circuit board 10 and thus to the ceramic capacitors 5.

Fig. 4 shows a top view of a second exemplary embodiment of an electronic assembly 1 according to the invention. In contrast to the first exemplary embodiment, the electronic assembly 1 of the second exemplary embodiment comprises four ceramic capacitors 5 which are mechanically fastened to the carrier circuit board 2 and are electrically conductively connected to one another and to the carrier circuit board 2 via the contact circuit board 10. The ceramic capacitors 5 are connected in an electrically conductive manner, for example, via connection points 15 of the conductor tracks 11 of the contact printed circuit board 10, which are not shown in fig. 4. The contact circuit board 10 in this exemplary embodiment has contact points 12, at which it is electrically conductively connected to a connecting element 13, which is arranged on the carrier circuit board 2 and is electrically conductively connected to the carrier circuit board 2. The connecting element 13 is configured in this embodiment as a pin. In order to reduce the transmission of tensile, compressive and shearing forces occurring in the carrier board 2 to the ceramic capacitors 5, the connecting elements 13 can be designed, for example, also in a spring-elastic manner. As is shown in fig. 5 with the aid of a third exemplary embodiment of the electronic assembly according to the invention, connecting pieces 19 can be arranged between the different connecting elements 13, which connect the connecting elements 13 from one another. In the exemplary embodiment illustrated in fig. 4 and in fig. 5, four ceramic capacitors 5 are arranged, for example, parallel to one another and spaced apart from one another on the carrier circuit board 2. The contact circuit board 10 is in this exemplary embodiment oriented perpendicularly to a straight line G which runs perpendicularly through the end face 14 of the ceramic capacitor 5 and defines the longitudinal axis of the ceramic capacitor 5. The

terminals

6, 7 of the ceramic capacitor 5 are again designed as surface contacts in this exemplary embodiment and are electrically conductively connected to a respective terminal point 15 of the conductor track 11. The electrically conductive connection between the contact circuit board 10 and the ceramic capacitor 5 and between the contact circuit board 10 and the connecting element 13 can be a soldered connection, for example. The four ceramic capacitors 5 are connected in parallel, for example, in the second and third exemplary embodiments (as shown in the schematic circuit diagram in fig. 8). They can of course also be connected to one another in any other way, in each case as required by the respective application. In the second and third exemplary embodiments (as shown in fig. 6), the ceramic capacitors 5 are arranged on the mounting side 3 of the printed circuit board 2 and are mechanically fastened to this mounting side, for example by means of a respective adhesive coating 8. The adhesive coating 8 is thereby adhesively attached, for example, as shown in fig. 7, to the mounting side 3 of the printed circuit board 2 and to the body 9 of the respective ceramic capacitor 5. The adhesive coating 8 is designed, for example, in such a way that it is not in direct contact with the

terminals

6, 7 of the ceramic capacitor 5, for example, and therefore only minimally transmits tensile, compressive or shearing forces, which are generated in the carrier board 2, for example, by temperature changes or vibration movements, to the ceramic capacitor 5. In order to further reduce the load applied from the carrier circuit board 2 to the ceramic capacitor 5, the adhesive coating 8 can, for example, also be designed in the smallest possible area.

The contact circuit board 10 and the carrier circuit board 2 are made of materials with thermal expansion coefficients matched to one another, for example, so that they undergo thermal expansion matched to one another when the temperature changes, and thus no additional load is applied to the ceramic capacitor 5 by tensioning.

An example of a contact circuit board for use in the second embodiment or in the third embodiment is schematically illustrated in fig. 9. The contact circuit board 10 comprises, for example, four conductor tracks 11, at which one

terminal

6, 7 of the ceramic capacitor 5 can be connected in an electrically conductive manner to one of the conductor tracks 11 at a terminal point 15. In this case, the four conductor lines 11 can be jointly electrically contacted jointly with the connecting element 13, for example at a common contact point 12. The four conductor lines 11 of the contact circuit board 10 thus have the same length, for example, from the contact points 12 to the corresponding connection points 15. In this way, by using the contact circuit board 10 for the electrically conductive contacting of the ceramic capacitors 5, in any spatial arrangement of the ceramic capacitors 5 on the carrier circuit board 2, a desired length ratio of the conductor lines 11 to one another can be achieved by targeted guidance of the conductor lines 11 on the contact circuit board 10. For example, the same length and thus the same inductance of the conductor lines 11 can thus be achieved.

Fig. 10 shows a top view of a fourth exemplary embodiment of an electronic assembly 1 according to the invention. Fig. 11 shows a schematic circuit diagram associated therewith. In the fourth embodiment, the ceramic capacitors 5 are connected in parallel with each other via the contact circuit board 10. The contact circuit board 10 is connected to the carrier circuit board 2 in an electrically conductive manner via four connecting elements 13, which are embodied as pins, for example. In this exemplary embodiment, a particularly compact arrangement of the ceramic capacitors 5 on the carrier circuit board 2 is achieved, in which the ceramic capacitors 5 are arranged parallel to one another and are partially in direct contact with one another at the side faces 16 of the ceramic capacitors 5. For example, a particularly high stability and a compact design of the electronic assembly 1 can be achieved.

In order to protect the ceramic capacitors 5 and the soldered connections from the surrounding aggressive medium and mechanical loads, the intermediate space between the ceramic capacitors 5 can be filled with a filler 17. This is illustrated in fig. 13 by means of a sixth exemplary embodiment of the electronic component according to the invention. Such a filling can, as in the fifth exemplary embodiment shown in fig. 12 by means of the electronic assembly according to the invention, also surround the capacitor, for example, in all directions, except for the respective electrical and mechanical connection points.

Fig. 14 shows a top view of a seventh embodiment of a structural assembly for electronics. Fig. 15 shows a front view of a seventh exemplary embodiment of an electronic assembly 1 according to the invention. Fig. 16 shows a side view of a seventh exemplary embodiment of an electronic assembly 1 according to the invention. As in the previous exemplary embodiments, the ceramic capacitor 5 also has a body 9 in the seventh exemplary embodiment, each with two end faces 14 facing away from one another and four side faces 16 connecting the end faces 14. The first terminal 6 and the second terminal 7 are also designed as surface contacts in the seventh exemplary embodiment at end faces 14 of the ceramic capacitor 5 facing away from each other. In contrast to the previous exemplary embodiment, ceramic capacitor 5 is arranged in this exemplary embodiment relative to carrier board 2 in such a way that the longitudinal axis of ceramic capacitor 5 (which is defined by a straight line G running perpendicularly through end face 14) is oriented perpendicularly to carrier board 2. The

terminals

6, 7, which are designed as surface contacts at the end faces 14 of the ceramic capacitors 5, are in electrically conductive contact with the carrier board 2, for example, directly via a solder connection at the solder points 18, and are simultaneously mechanically connected to the carrier board. By means of this direct connection of the

terminals

6, 7 to the carrier circuit board 2, in this embodiment, an additional mechanical connection can be dispensed with, for example, by means of the adhesive coating 8. Furthermore, it is possible to connect only the

terminals

6, 7 of each capacitor, for example, in an electrically conductive manner, for example, via a solder connection, to only one contact circuit board 10 at the further solder points 18. Such a contact circuit board 10 can be arranged parallel to the carrier circuit board 2 and opposite it, for example. In the seventh exemplary embodiment, the connecting element 13 is designed as an electrically conductive block which is soldered, for example, to the carrier circuit board 2 and to the contact circuit board 10. In this exemplary embodiment, the contact circuit board 10 is designed, for example, as a flexible circuit board, so that, for example, forces and stresses occurring in the carrier circuit board 2 can be compensated by the flexible contact circuit board 10.

Of course, further embodiments and mixed forms of the embodiments presented are also possible.

Claims

1. An electronic assembly (1) for a transmission control module, comprising at least one carrier circuit board (2), at least two ceramic capacitors mechanically fastened to a mounting side (3) of the carrier circuit board (2) and having at least two terminals, a first terminal and a second terminal, which are electrically conductively connected to the carrier circuit board (2),

characterized in that at least one of the terminals of the first ceramic capacitor is electrically conductively connected to one of the two terminals of the second ceramic capacitor and to the carrier board (2) via at least one contact board (10) having conductor tracks (11), the at least one contact board (10) having at least one contact point (12) at which the at least one contact board (10) is electrically conductively contacted to a connecting element (13), wherein the connecting element (13) is electrically conductively connected to the carrier board (2), the at least one contact board (10) comprising a plurality of conductor tracks (11) at which in each case one terminal of the ceramic capacitor is electrically conductively connected to a conductor track (11) at a terminal point (15), wherein the conductor tracks (11) are jointly electrically contacted jointly with the connecting element (13) at the common contact point (12), and wherein at least two arbitrary conductor lines (11) of the at least one contact circuit board (10) from the contact points (12) to the respective terminal points (15) have the same length.

2. An electronic component assembly according to claim 1, characterized in that at least two ceramic capacitors each have a body (9) with two end faces (14) facing away from each other and one or more side faces (16) connecting the end faces (14), wherein the first and second connections are designed as face contacts at the end faces (14) of the ceramic capacitors facing away from each other, and the longitudinal axis of the ceramic capacitors is defined by a straight line (G) running perpendicularly through the end faces (14), and the at least one contact circuit board (10) is oriented perpendicularly to the straight line (G).

3. Electronic component assembly according to claim 1 or 2, characterized in that the material of the carrier circuit board (2) and the material of the at least one contact circuit board (10) have a coefficient of thermal expansion matched to one another.

4. Electronic component assembly according to claim 1 or 2, characterized in that the carrier circuit board (2) and the at least one contact circuit board (10) are at least partially or completely made of the same material.

5. The electronic component assembly according to claim 1 or 2, characterized in that the carrier circuit board (2) and/or the at least one contact circuit board (10) is designed as a flexible circuit board.

6. The electronic component assembly according to claim 1 or 2, characterized in that the at least two ceramic capacitors are at least partially connected in parallel to one another, and in that first connections formed at the ceramic capacitors are electrically conductively connected to one another via conductor tracks (11) of the at least one contact circuit board (10) and/or second connections formed at the ceramic capacitors are electrically conductively connected to one another via first connections formed at the ceramic capacitors and/or via second connections formed at the ceramic capacitors.

7. An electronic constructional assembly as claimed in claim 1, characterized in that the connecting element (13) is spring-elastic.

8. An electronic component according to claim 1 or 2, characterized in that the at least two ceramic capacitors are mechanically connected to the carrier circuit board (2) by means of an adhesive coating (8).

9. The electronic component assembly according to claim 1, characterized in that the connecting element (13) is arranged on the carrier circuit board (2).