CN104164684A - Method for plating nickel on surface of oxygen-free copper - Google Patents
Method for plating nickel on surface of oxygen-free copper Download PDFInfo
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- CN104164684A CN104164684A CN201410255499.0A CN201410255499A CN104164684A CN 104164684 A CN104164684 A CN 104164684A CN 201410255499 A CN201410255499 A CN 201410255499A CN 104164684 A CN104164684 A CN 104164684A
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- free copper
- copper matrix
- nickel
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Abstract
The invention discloses a method for plating nickel on a surface of oxygen-free copper. The method comprises the steps of carrying out sand-blasting treatment on the surface of an oxygen-free copper substrate; then carrying out pre-treatment; carrying activating treatment on the surface of a steel plate by using an acidic or alkaline solution; and then electroplating. By controlling alternative changes of the size of current density to carry out the electroplating, the thickness of a surface plated coating of an obtained product is uniform, and the obtained product has high quality and very good market prospects.
Description
Technical field
The present invention relates to a kind of electric plating method, particularly a kind of method of oxygen free copper plating nickel on surface.
Background technology
In modern industry is produced; Metal plating is applied widely by people; chemical industry application specializes in chemistry nickel-plating technology replaces expensive non-corrosive metal to solve etching problem; to improve the purity of chemical products; protection of the environment; improve the reliability of processing safety and production and transport, thereby obtain more favourable Technological Economy competitive capacity.The metallic nickel plated layer that people are familiar with and often use, generally can be used as intermediate deposit (skin mostly is chromium coating) or the overlay coating of copper or copper iron-based body, to improve the protective of base metal and ornamental.There is the poor defect of dispersive ability in prior art nickel-phosphorus alloy coating, it is the problem of low current density district plating leakage, and in existing electronickelling, adopt constant current density to electroplate, what current density directly affected is exactly coating deposition rate, and current density is large, sedimentation velocity is fast, otherwise slow, but current density large after, coating can be more coarse, even can burn, affect outward appearance and antiseptic property.Therefore how to improve electroplating efficiency and improve electroplating quality and become a very large problem.
Summary of the invention
For addressing the above problem, the invention discloses a kind of method of oxygen free copper plating nickel on surface.
In order to achieve the above object, the invention provides following technical scheme: a kind of method of oxygen free copper plating nickel on surface, comprises the steps:
(1), with 120～160 object quartz sands, sandblasting is carried out in oxygen-free copper matrix surface;
(2), oxygen-free copper matrix is immersed and goes to soak 3-6min in the alkaline cleaning fluid of PH 10-12, carry out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with clear water;
(3), oxygen-free copper matrix is immersed in acid solvent and cleaned, remove its surperficial oxide film, after pickling, steel plate is put into clear water and clean up;
(4), will carry out activation treatment through step 3 oxygen-free copper matrix after treatment, after being disposed, rinse well with clear water again;
(5), oxygen-free copper matrix being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 120 g/L-250 g/L single nickel salts, concentration be that 280 g/L-360g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 15 g/L-25 g/L is the boric acid of 20 g/L, described solution temperature is 35-70 DEG C, the density of electric current is to replace between 5-10 A/dm2 and 40-55A/dm2, alternate frequency is 20-30 time, wherein the time between low current and high electric current compares for 1:2-2:3, and electroplating time is 15min-20min;
(6), by the oxygen-free copper matrix deionized water rinsing in step 5;
(7), the oxygen-free copper matrix in step 6 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 480-600 DEG C.
As a modification of the present invention, the concentration ratio between described single nickel salt and described single nickel salt nickel sulfamic acid is 1:2-2:3.
As a modification of the present invention, the acid solvent in described step 3 be the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1-1:2.
As a modification of the present invention, the step of in step 4, oxygen-free copper matrix being carried out to activation treatment, for oxygen-free copper matrix is put into stearic acid, is soaked in the mixing solutions of Sodium dodecylbenzene sulfonate, and wherein soak time is 5-8min.
A kind of steel plate nickel plating process provided by the invention, with low cost, operation steps is simple, and the efficiency of nickel plating is high, and the nickel dam of the product of the nickel plating obtaining is even, corrosion-resistant, wearability, coating surface is smooth, is difficult for cracking, and has wide market outlook.
Embodiment
Below with reference to specific embodiment, technical scheme provided by the invention is elaborated, should understands following embodiment and only be not used in and limit the scope of the invention for the present invention is described.
Embodiment 1:
A method for oxygen free copper plating nickel on surface, comprises the steps:
(1), with 120 object quartz sands, sandblasting is carried out in oxygen-free copper matrix surface;
(2), oxygen-free copper matrix is immersed and goes to soak 3min in the alkaline cleaning fluid of PH 10, carry out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with clear water;
(3), oxygen-free copper matrix is immersed to the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is that 1:1 removes its surperficial oxide film, after pickling, steel plate is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 oxygen-free copper matrix after treatment, oxygen-free copper matrix is put into stearic acid, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 5min, after being disposed, rinses well with clear water again;
(5), oxygen-free copper matrix being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 140 g/L single nickel salts, concentration be that 280 g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 15 g/L is the boric acid of 20 g/L, described solution temperature is 35 DEG C, the density of electric current is to replace between 5 A/dm2 and 40A/dm2, alternate frequency is 20 times, wherein the time between low current and high electric current compares for 1:2, and electroplating time is 15min;
(6), by the oxygen-free copper matrix deionized water rinsing in step 5;
(7), the oxygen-free copper matrix in step 6 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 480 DEG C.
As a modification of the present invention, the step of in step 4, oxygen-free copper matrix being carried out to activation treatment, for oxygen-free copper matrix is put into stearic acid, is soaked in the mixing solutions of Sodium dodecylbenzene sulfonate, and wherein soak time is 5-8min.
Embodiment 2:
A method for oxygen free copper plating nickel on surface, comprises the steps:
(1), with 140 object quartz sands, sandblasting is carried out in oxygen-free copper matrix surface;
(2), oxygen-free copper matrix is immersed and goes to soak 4min in the alkaline cleaning fluid of PH 11, carry out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with clear water;
(3), oxygen-free copper matrix is immersed to the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is that 1:1.5 removes its surperficial oxide film, after pickling, steel plate is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 oxygen-free copper matrix after treatment, oxygen-free copper matrix is put into stearic acid, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 7min, after being disposed, rinses well with clear water again;
(5), oxygen-free copper matrix being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 180 g/L single nickel salts, concentration be that 300g/L single nickel salt nickel sulfamic acid, concentration are that nickelous chloride, the concentration of 20 g/L is the boric acid of 20 g/L, described solution temperature is 55 DEG C, the density of electric current is to replace between 7 A/dm2 and 45A/dm2, alternate frequency is 25 times, wherein the time between low current and high electric current compares for 3:5, and electroplating time is 18min;
(6), by the oxygen-free copper matrix deionized water rinsing in step 5;
(7), the oxygen-free copper matrix in step 6 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 520 DEG C.
Embodiment 3:
A method for oxygen free copper plating nickel on surface, comprises the steps:
(1), with 160 object quartz sands, sandblasting is carried out in oxygen-free copper matrix surface;
(2), oxygen-free copper matrix is immersed and goes to soak 6min in the alkaline cleaning fluid of PH 12, carry out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with clear water;
(3), oxygen-free copper matrix is immersed to the mixture of rare nitric acid and dilute sulphuric acid, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is that 1:2 removes its surperficial oxide film, after pickling, steel plate is put into clear water and cleans up;
(4), will carry out activation treatment through step 3 oxygen-free copper matrix after treatment, after being disposed, rinse well with clear water again;
(5), oxygen-free copper matrix being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 240 g/L single nickel salts, concentration be that 360g/L single nickel salt nickel sulfamic acid, concentration are that nickelous chloride, the concentration of 25 g/L is the boric acid of 20 g/L, described solution temperature is 70 DEG C, the density of electric current is to replace between 10 A/dm2 and 55A/dm2, alternate frequency is 30 times, wherein the time between low current and high electric current compares for 2:3, and electroplating time is 20min;
(6), by the oxygen-free copper matrix deionized water rinsing in step 5;
(8), the oxygen-free copper matrix in step 6 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 600 DEG C.
A kind of steel plate nickel plating process provided by the invention, with low cost, operation steps is simple, and the efficiency of nickel plating is high, and the nickel dam of the product of the nickel plating obtaining is even, corrosion-resistant, wearability, coating surface is smooth, is difficult for cracking, and has wide market outlook.
The disclosed technique means of the present invention program is not limited only to the disclosed technique means of above-mentioned embodiment, also comprises the technical scheme being made up of above technical characterictic arbitrary combination.
Claims (4)
1. a method for oxygen free copper plating nickel on surface, is characterized in that: comprise the steps:
(1), with 120～160 object quartz sands, sandblasting is carried out in oxygen-free copper matrix surface;
(2), oxygen-free copper matrix is immersed and goes to soak 3-6min in the alkaline cleaning fluid of PH 10-12, carry out surface cleaning, remove surperficial greasy dirt, after electrolysis, rinse with clear water;
(3), oxygen-free copper matrix is immersed in acid solvent and cleaned, remove its surperficial oxide film, after pickling, steel plate is put into clear water and clean up;
(4), will carry out activation treatment through step 3 oxygen-free copper matrix after treatment, after being disposed, rinse well with clear water again;
(5), oxygen-free copper matrix being put into electroplating solution electroplates, described electroplating solution comprises following composition: concentration be 120 g/L-250 g/L single nickel salts, concentration be that 280 g/L-360g/L single nickel salt nickel sulfamic acids, concentration are that nickelous chloride, the concentration of 15 g/L-25 g/L is the boric acid of 20 g/L, described solution temperature is 35-70 DEG C, the density of electric current is to replace between 5-10 A/dm2 and 40-55A/dm2, alternate frequency is 20-30 time, wherein the time between low current and high electric current compares for 1:2-2:3, and electroplating time is 15min-20min;
(6), by the oxygen-free copper matrix deionized water rinsing in step 5;
(7), the oxygen-free copper matrix in step 6 is sent in the baking oven of vacuum and is dried, the temperature of baking oven is controlled at 480-600 DEG C.
2. the method for a kind of oxygen free copper plating nickel on surface according to claim 1, is characterized in that: the concentration ratio between described single nickel salt and described single nickel salt nickel sulfamic acid is 1:2-2:3.
3. the method for a kind of oxygen free copper plating nickel on surface according to claim 1, is characterized in that: the mixture for rare nitric acid and dilute sulphuric acid of the acid solvent in described step 3, wherein the concentration ratio between rare nitric acid and dilute sulphuric acid is 1:1-1:2.
4. the method for a kind of oxygen free copper plating nickel on surface according to claim 1, it is characterized in that: the step of in step 4, oxygen-free copper matrix being carried out to activation treatment is for to put into stearic acid by steel plate, in the mixing solutions of Sodium dodecylbenzene sulfonate, soak, wherein soak time is 5-8min.
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| CN201410255499.0A CN104164684B (en) | 2014-06-11 | 2014-06-11 | A kind of method of oxygen-free copper plating nickel on surface |
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| CN201410255499.0A CN104164684B (en) | 2014-06-11 | 2014-06-11 | A kind of method of oxygen-free copper plating nickel on surface |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106929888A (en) * | 2017-05-03 | 2017-07-07 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructured nickel |
| CN109267115A (en) * | 2018-10-29 | 2019-01-25 | 江西凤凰光学科技有限公司 | A kind of copper components nickel plating process |
| CN109351290A (en) * | 2018-12-06 | 2019-02-19 | 中石化炼化工程（集团）股份有限公司 | Prevent backstop, its preparation process and the air inlet feed distributor of slurry oil adverse current |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106929888A (en) * | 2017-05-03 | 2017-07-07 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructured nickel |
| CN106929888B (en) * | 2017-05-03 | 2018-12-14 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructure nickel |
| CN109267115A (en) * | 2018-10-29 | 2019-01-25 | 江西凤凰光学科技有限公司 | A kind of copper components nickel plating process |
| CN109351290A (en) * | 2018-12-06 | 2019-02-19 | 中石化炼化工程（集团）股份有限公司 | Prevent backstop, its preparation process and the air inlet feed distributor of slurry oil adverse current |
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| CN104164684B (en) | 2018-05-22 |
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