CN104072684A - Manufacturing method of resin for high-frequency copper clad plates - Google Patents
Manufacturing method of resin for high-frequency copper clad plates Download PDFInfo
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- CN104072684A CN104072684A CN201410300727.1A CN201410300727A CN104072684A CN 104072684 A CN104072684 A CN 104072684A CN 201410300727 A CN201410300727 A CN 201410300727A CN 104072684 A CN104072684 A CN 104072684A
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- resin
- clad plate
- copper clad
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- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention discloses a manufacturing method of a resin for high-frequency copper clad plates, which comprises the following steps: adding toluene and benzoperoxide into a reaction kettle, and dissolving by stirring; adding polyphenylether and allyl bisphenol A, heating the reaction kettle to 90 DEG C, and reacting for 60 minutes; adding dicumyl peroxide and triallyl cyanate, and continuing reaction for 90 minutes while keeping the temperature at 90 DEG C; and after the reaction time finishes, immediately starting a cooler to cool to 50 DEG C below. The prepared resin effectively lowers the dielectric constant and dielectric loss of the copper clad plate, wherein the dielectric constant is lowered from 4.8 to 3.4, and the dielectric loss is lowered from 0.02 to 0.01 below. The resin is suitable for requirements of high-frequency electronic materials. The manufacturing technique is suitable for the existing copper clad plate production technique, and reduces the equipment investment. The copper clad plate has better processibility than other high-frequency plates.
Description
Technical field
The present invention relates to the making method of resin for a kind of high-frequency copper-clad plate.
Background technology
Along with electronics, the particularly high frequencyization of communication field development, copper-clad plate must have the requirement that lower specific inductivity could meet high frequency.General epoxy resin-matrix copper-clad plate can not meet higher requirement.Both at home and abroad all in the exploitation of carrying out high-frequency copper-clad plate, the resin material that can be used in high-frequency copper-clad plate manufacture mainly contains teflon resin, cyanate ester resin, polyphenylene oxide resin and Special Ring epoxy resins etc. at present.
The copper-clad plate of ordinary epoxy resin base due to specific inductivity and dielectric loss large, can not meet the requirement of high-frequency data transmission at all, can form the overheated and serious signal distortion phenomenon of circuit, cause high-frequency data bust this.In order to reduce specific inductivity and the dielectric loss of copper-clad plate, must to select applicable material and carry out modification, just can be applied to the manufacture of high-frequency copper-clad plate.
Summary of the invention
The object of the invention is to solve ordinary epoxy resin base copper-clad plate specific inductivity and dielectric loss large, can not meet the problem of high-frequency data transmission at all.
The technical solution used in the present invention is: the making method of resin for a kind of high-frequency copper-clad plate, and described step is as follows:
A, toluene and benzoyl peroxide are added to reactor stirring and dissolving;
B, add polyphenylene oxide and allyl group dihydroxyphenyl propane, and temperature of reaction kettle is warming up to after 90 ℃, react 60 minutes;
C, add dicumyl peroxide and triallyl cyanate, temperature keeps 90 ℃, continues reaction 90 minutes;
After d, reaction times complete, open cold radiator cooler cools to below 50 ℃ immediately.
As a further improvement on the present invention, described step a to d Raw toluene, benzoyl peroxide, polyphenylene oxide, allyl group dihydroxyphenyl propane, dicumyl peroxide and triallyl cyanate in mass ratio: 300-500 part: 5.0-10.0:100:10.0-15.0:8.0-12.0:50-70.
The invention has the beneficial effects as follows:
1, effectively reduce specific inductivity and the dielectric loss of copper-clad plate, its medium dielectric constant microwave medium is reduced to 3.4 from 4.8, and dielectric loss is reduced to below 0.01 from 0.02;
2, adapt to the requirement of electronic material high frequency; Manufacturing process is applicable to existing copper-clad plate production technique, has reduced equipment investment;
3, have than the better processibility of other high frequency plates.
Embodiment
Embodiment 1
:
A making method for resin for high-frequency copper-clad plate, described step is as follows:
A, 300 parts of toluene and 5 parts of benzoyl peroxides are added to reactor stirring and dissolving;
B, add 100 parts of polyphenylene oxide and 10 parts of allyl group dihydroxyphenyl propanes, and temperature of reaction kettle is warming up to after 90 ℃, react 60 minutes;
C, add 8 parts of dicumyl peroxides and 50 parts of triallyl cyanates, temperature keeps 90 ℃, continues reaction 90 minutes;
After d, reaction times complete, open cold radiator cooler cools to below 50 ℃ immediately.
Embodiment 2:
A making method for resin for high-frequency copper-clad plate, described step is as follows:
A, 500 parts of toluene and 10 parts of benzoyl peroxides are added to reactor stirring and dissolving;
B, add 100 parts of polyphenylene oxide and 15 parts of allyl group dihydroxyphenyl propanes, and temperature of reaction kettle is warming up to after 90 ℃, react 60 minutes;
C, add 12 parts of dicumyl peroxides and 70 parts of triallyl cyanates, temperature keeps 90 ℃, continues reaction 90 minutes;
After d, reaction times complete, open cold radiator cooler cools to below 50 ℃ immediately.
Embodiment 3:
A making method for resin for high-frequency copper-clad plate, described step is as follows:
A, 450 parts of toluene and 8 parts of benzoyl peroxides are added to reactor stirring and dissolving;
B, add 100 parts of polyphenylene oxide and 12 parts of allyl group dihydroxyphenyl propanes, and temperature of reaction kettle is warming up to after 90 ℃, react 60 minutes;
C, add 10 parts of dicumyl peroxides and 65 parts of triallyl cyanates, temperature keeps 90 ℃, continues reaction 90 minutes;
After d, reaction times complete, open cold radiator cooler cools to below 50 ℃ immediately
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken possessing at affiliated technical field those of ordinary skill, can also under the prerequisite that does not depart from aim of the present invention, make a variety of changes.
Claims (2)
1. the making method of resin for high-frequency copper-clad plate, is characterized in that: described step is as follows:
A, toluene and benzoyl peroxide are added to reactor stirring and dissolving;
B, add polyphenylene oxide and allyl group dihydroxyphenyl propane, and temperature of reaction kettle is warming up to after 90 ℃, react 60 minutes;
C, add dicumyl peroxide and triallyl cyanate, temperature keeps 90 ℃, continues reaction 90 minutes;
After d, reaction times complete, open cold radiator cooler cools to below 50 ℃ immediately.
2. the making method of resin for a kind of high-frequency copper-clad plate according to claim 1, is characterized in that described step a to d Raw toluene, benzoyl peroxide, polyphenylene oxide, allyl group dihydroxyphenyl propane, dicumyl peroxide and triallyl cyanate in mass ratio: 300-500 part: 5.0-10.0:100:10.0-15.0:8.0-12.0:50-70.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410300727.1A CN104072684A (en) | 2014-06-30 | 2014-06-30 | Manufacturing method of resin for high-frequency copper clad plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410300727.1A CN104072684A (en) | 2014-06-30 | 2014-06-30 | Manufacturing method of resin for high-frequency copper clad plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104072684A true CN104072684A (en) | 2014-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410300727.1A Pending CN104072684A (en) | 2014-06-30 | 2014-06-30 | Manufacturing method of resin for high-frequency copper clad plates |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108727800A (en) * | 2018-05-21 | 2018-11-02 | 高斯贝尔数码科技股份有限公司 | A kind of composition of high-frequency microwave copper-clad plate |
| CN111718659A (en) * | 2020-07-08 | 2020-09-29 | 铜陵华科电子材料有限公司 | Preparation method of modified polybutadiene glue for producing high-frequency copper-clad plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103818054A (en) * | 2014-03-18 | 2014-05-28 | 铜陵浩荣电子科技有限公司 | Technology for producing high-frequency microwave copper-clad plate with dielectric constant of 3.4 |
| CN103834155A (en) * | 2014-03-18 | 2014-06-04 | 铜陵浩荣电子科技有限公司 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
| CN103865221A (en) * | 2014-03-18 | 2014-06-18 | 铜陵浩荣电子科技有限公司 | Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid |
-
2014
- 2014-06-30 CN CN201410300727.1A patent/CN104072684A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103818054A (en) * | 2014-03-18 | 2014-05-28 | 铜陵浩荣电子科技有限公司 | Technology for producing high-frequency microwave copper-clad plate with dielectric constant of 3.4 |
| CN103834155A (en) * | 2014-03-18 | 2014-06-04 | 铜陵浩荣电子科技有限公司 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
| CN103865221A (en) * | 2014-03-18 | 2014-06-18 | 铜陵浩荣电子科技有限公司 | Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108727800A (en) * | 2018-05-21 | 2018-11-02 | 高斯贝尔数码科技股份有限公司 | A kind of composition of high-frequency microwave copper-clad plate |
| CN111718659A (en) * | 2020-07-08 | 2020-09-29 | 铜陵华科电子材料有限公司 | Preparation method of modified polybutadiene glue for producing high-frequency copper-clad plate |
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Application publication date: 20141001 |
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