CN103834155A - Preparation method of resin glue liquid for producing high-frequency copper-clad plate - Google Patents
Preparation method of resin glue liquid for producing high-frequency copper-clad plate Download PDFInfo
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- CN103834155A CN103834155A CN201410099163.XA CN201410099163A CN103834155A CN 103834155 A CN103834155 A CN 103834155A CN 201410099163 A CN201410099163 A CN 201410099163A CN 103834155 A CN103834155 A CN 103834155A
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- clad plate
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Abstract
The invention discloses a method for preparing a resin glue liquid for producing a high-frequency copper-clad plate. The resin glue liquid consists of methylbenzene, allyl bisphenol A, polyphenyl ether, benzoyl peroxide, triallyl cyanate ester, dicumyl peroxide, decabromodiphenylethane and antimonous oxide at a weight ratio of (320-325):(1.45-1.50):(95.0-100.0):(2.30-2.33):(17.40-17.45):(50.0-50.5):(15.5-15.9):(5.9-6.0). Polyphenyl ether resin is thermoplastic resin but has a quite high glass transition temperature (260 DEG C), and is equivalent to polyimide resin in heat resistance so as to ensure that the resin glue liquid can be applied in a severe environment with quite high requirements on heat resistance.
Description
Technical field
The present invention relates to a kind of method of producing resin adhesive liquid used for the preparation of high-frequency copper-clad plate, relate in particular to specific inductivity 3.4 high frequency microwave copper-clad plates.
Background technology
Specific inductivity 3.4 high frequency microwave copper-clad plates are base mateirals of high information quantity transmission, communication, are also one of necessary materials, and it is by the woven fiber glass prepreg of dipping low-k resin polyphenylene oxide, the high-performance that Copper Foil is composited through high pressure-temperature, the matrix material of high technology content.
The resin system that can be used in high frequency communication field has polytetrafluoroethylene (PTFE), polyphenylene oxide, cyanate ester resin, and both at home and abroad currently available products is mainly taking PTFE and polyphenylene oxide resin system as main.High-frequency copper-clad plate now on sale is mainly taking teflon resin matrix as main both at home and abroad, but metallization process complexity in hole when PTFE resin matrix has very large defect to be wiring board making, qualification rate is low, critical defect be metallic copper and hole wall poor adhesive force, easily come off, thereby cause in hole circuit to disconnect.
Summary of the invention
The object of this invention is to provide a kind of method of the resin adhesive liquid for the preparation of high-frequency copper-clad plate.
The technical solution used in the present invention is: for the production of the preparation method of the resin adhesive liquid of high-frequency copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
320-325：1.45-1.50：95.0-100.0：2.30-2.33：17.40-17.45：50.0-50.5：15.5-15.9：5.9-6.0；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; Solution temperature is warming up to after 90 DEG C to insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 90 DEG C, continues reaction 1.5 hours; Immediately resin temperature is cooled to below 60 DEG C completing after the reaction times; Finally add composite flame-retardant agent TDE and antimonous oxide, stir, be i.e. this resin adhesive liquid of system.
Optimize, toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
322：1.46：99：2.31：17.42：50.2：15.7：5.95。
Optimize, toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
323：1.48：97：2.32：17.43：50.4：15.8：6.0。
Optimize, toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
325：1.50：100.0：2.33：17.45：50.5：15.9：6.0。
The invention has the beneficial effects as follows: polyphenylene oxide resin is thermoplastic resin, but there is very high glass transition temp (260 DEG C), thermotolerance and polyimide resin are suitable, thereby ensure that it can be applied in heat-resisting exigent severe environment, this advantage is unique in Dielectric Materials at Radio Frequencies, compared with this tetrafluoroethylene high frequency material more with application (25 DEG C of Tg values), advantages.
Embodiment
Embodiment 1:
For the production of the preparation method of the resin adhesive liquid of high-frequency copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
320：1.45：95.0：2.30：17.40：50.0：15.5：5.9；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; Solution temperature is warming up to after 90 DEG C to insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 90 DEG C, continues reaction 1.5 hours; Immediately resin temperature is cooled to below 60 DEG C completing after the reaction times; Finally add composite flame-retardant agent TDE and antimonous oxide, stir, be i.e. this resin adhesive liquid of system.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Embodiment 2:
For the production of the preparation method of the resin adhesive liquid of high-frequency copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
322：1.47：97.0：2.32：17.43：50.4：15.5：5.98；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; Solution temperature is warming up to after 90 DEG C to insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 90 DEG C, continues reaction 1.5 hours; Immediately resin temperature is cooled to below 60 DEG C completing after the reaction times; Finally add composite flame-retardant agent TDE and antimonous oxide, stir, be i.e. this resin adhesive liquid of system.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Embodiment 3:
For the production of the preparation method of the resin adhesive liquid of high-frequency copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
325：?1.50：?100.0：?2.33：?17.45：?50.5：?15.9：?6.0；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; Solution temperature is warming up to after 90 DEG C to insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 90 DEG C, continues reaction 1.5 hours; Immediately resin temperature is cooled to below 60 DEG C completing after the reaction times; Finally add composite flame-retardant agent TDE and antimonous oxide, stir, be i.e. this resin adhesive liquid of system.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken possessing at affiliated technical field those of ordinary skill, can also under the prerequisite that does not depart from aim of the present invention, make a variety of changes.
Claims (4)
1. for the production of the preparation method of the resin adhesive liquid of high-frequency copper-clad plate, it is characterized in that: comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
320-325：1.45-1.50：95.0-100.0：2.30-2.33：17.40-17.45：50.0-50.5：15.5-15.9：5.9-6.0；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; Solution temperature is warming up to after 90 DEG C to insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 90 DEG C, continues reaction 1.5 hours; Immediately resin temperature is cooled to below 60 DEG C completing after the reaction times; Finally add composite flame-retardant agent TDE and antimonous oxide, stir, be i.e. this resin adhesive liquid of system.
2. the preparation method of the resin adhesive liquid for the production of high-frequency copper-clad plate according to claim 1, is characterized in that:
Toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
322：1.46：99：2.31：17.42：50.2：15.7：5.95。
3. the preparation method of the resin adhesive liquid for the production of high-frequency copper-clad plate according to claim 1, it is characterized in that described toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
323：1.48：97：2.32：17.43：50.4：15.8：6.0。
4. the preparation method of the resin adhesive liquid for the production of high-frequency copper-clad plate according to claim 1, it is characterized in that described toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE and antimonous oxide, described each component ratio is by weight:
325：1.50：100.0：2.33：17.45：50.5：15.9：6.0。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099163.XA CN103834155A (en) | 2014-03-18 | 2014-03-18 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410099163.XA CN103834155A (en) | 2014-03-18 | 2014-03-18 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
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| CN103834155A true CN103834155A (en) | 2014-06-04 |
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| CN201410099163.XA Pending CN103834155A (en) | 2014-03-18 | 2014-03-18 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104072684A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacturing method of resin for high-frequency copper clad plates |
| CN105199296A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Preparation method of resin gel for producing copper-clad plate |
| CN106273823A (en) * | 2016-08-04 | 2017-01-04 | 陈毅忠 | A kind of preparation method of environmental protection flame retardant copper-clad plate |
| CN106633553A (en) * | 2016-12-31 | 2017-05-10 | 铜陵华科电子材料有限公司 | Resin material formula of polytetrafluoroethylene high-frequency microwave copper cladded plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382312A2 (en) * | 1989-02-08 | 1990-08-16 | Asahi Kasei Kogyo Kabushiki Kaisha | A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| CN103102484A (en) * | 2013-01-22 | 2013-05-15 | 广东生益科技股份有限公司 | Crosslinkable polyphenyl ether resin, preparation method and use thereof |
-
2014
- 2014-03-18 CN CN201410099163.XA patent/CN103834155A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382312A2 (en) * | 1989-02-08 | 1990-08-16 | Asahi Kasei Kogyo Kabushiki Kaisha | A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| CN103102484A (en) * | 2013-01-22 | 2013-05-15 | 广东生益科技股份有限公司 | Crosslinkable polyphenyl ether resin, preparation method and use thereof |
Non-Patent Citations (1)
| Title |
|---|
| 辜信实: "《印制电路用覆铜箔层压板（第二版）》", 30 May 2013, article ""印制电路用覆铜箔层压板（第二版）"" * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104072684A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacturing method of resin for high-frequency copper clad plates |
| CN105199296A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Preparation method of resin gel for producing copper-clad plate |
| CN106273823A (en) * | 2016-08-04 | 2017-01-04 | 陈毅忠 | A kind of preparation method of environmental protection flame retardant copper-clad plate |
| CN106273823B (en) * | 2016-08-04 | 2018-06-26 | 信丰普源电子材料有限公司 | A kind of preparation method of environmental protection flame retardant copper-clad plate |
| CN106633553A (en) * | 2016-12-31 | 2017-05-10 | 铜陵华科电子材料有限公司 | Resin material formula of polytetrafluoroethylene high-frequency microwave copper cladded plate |
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Application publication date: 20140604 |