CN104063296B - Veneer condition detection method in place and device - Google Patents
Veneer condition detection method in place and device Download PDFInfo
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- CN104063296B CN104063296B CN201410309584.0A CN201410309584A CN104063296B CN 104063296 B CN104063296 B CN 104063296B CN 201410309584 A CN201410309584 A CN 201410309584A CN 104063296 B CN104063296 B CN 104063296B
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Abstract
The present invention, which provides a kind of veneer condition detection method in place and device, method, to be included：N+m connector in first feature board is sequentially connected in series, and by the connector grounds of the n-th+m in the first feature board, either connector is chosen from the preceding n connector of the first feature board, a low speed signal backflow ground pin is selected on the connector of selection, and new signal in place is defined as, it is hanging processing or GND by the pin definitions corresponding to new signal in place on backboard；The new signal that plugs steady in place between signal and n-th of connector and (n+1)th connector is connected；Judge whether first feature board is in place according to the first signal PS1 in place in first feature board, the present invention solves the compatibling problem that the first feature board and the second backboard detect in place, the first feature board in the prior art and the first backboard is also overcome to increase the workload and complexity of software or logic when detecting in place simultaneously, and the problem of the complexity of increase hardware design.
Description
Technical field
The present invention relates to a kind of veneer technology, more particularly to a kind of veneer condition detection method in place and device.
Background technology
Veneer detection signal in place is normally provided to system or this plate is used to judge whether veneer plugs steady, by judging veneer
Whether plug steady to determine whether act in next step with single board communication or to Board Power up etc..
In the prior art veneer in position detecting method as shown in figure 1, mainly use " bow " type detection scheme in place, its
In, each 1~n of connector series windings are connected together, and last connector n is grounded in feature board, the male and female of a pair of connectors
Head on the feature board and backboard, increases detection signal in place on 1~n of connector of backboard respectively, then with software or patrols
The level for obtaining detection signal (the connector signal Con1PS0 and Con1PS1 in place in such as Fig. 1) in place is collected, according to inspection in place
Survey whether the electrical level judging of signal is in place, and 1~n of connector is detected by the detection in place 1 shown in Fig. 1, when existing work(
, need to be in the company newly increased in order to detect connector n+1, it is necessary to increase connector n+1 when energy plate needs to upgrade to the first feature board
Connecing increases a new detection signal in place on device n+1, in the prior art, a kind of method 2 pairs of companies of detection in place as shown in Figure 1
Meet device n+1 to be detected, another kind is by the way that connector n and connector n+1 are cascaded, and final connector n+1 is in function
It is grounded in plate, 1~n+1 of connector by detecting 1 detection in place.
However, the first detection method of prior art can realize New function plate (increase connector n+1 feature board)
It is compatible with old backboard (backboard for not increasing connector n+1) detection mode in place, but because adding new detection in place 2, need
Want software or logic to make an amendment, can so add the workload and complexity of software or logic, while also increase hardware and set
The complexity of meter, and second of detection method does not need software or logic to make an amendment, but when New function plate is inserted into old backboard, nothing
Method is detected in place to old backboard, that is, can not be compatible when New function plate detects in place with old backboard the problem of occurs.
The content of the invention
The present invention provides a kind of veneer condition detection method in place and device, solves the first feature board and second back of the body
The compatibling problem that plate detects in place, at the same also overcome increase when the first feature board detects in place with the first backboard in the prior art it is soft
The workload and complexity of part or logic, and the problem of the complexity of increase hardware design.
In a first aspect, the present invention provides a kind of veneer condition detection method in place, including：
N+m connector in first feature board is sequentially connected in series, and the n-th+m in first feature board connectors are connect
Ground GND, wherein, preceding n connector is the connector included on the second feature board in first feature board, and the n is just whole
Number, the m are the integer more than or equal to 1；
Either connector is chosen from the preceding n connector of first feature board, one is selected on the connector of selection
Root low speed signal backflow ground pin, and be new signal PSnew in place by low speed signal backflow ground pin definitions, by described in
Pin definitions corresponding to PSnew on backboard are hanging processing NC or GND；
The signal PSn_PS (n+1) that plugs steady between the PSnew and n-th of connector and (n+1)th connector is connected；
Judge whether first feature board is in place according to the first signal PS1 in place in first feature board.
In the first possible implementation of first aspect, the backboard includes the first backboard and the second backboard, institute
State the first backboard and include n+m connector, the second backboard includes n connector.
According to the first possible implementation of first aspect, in second of possible implementation of first aspect
In, when first feature board and first backboard cooperation, by the pin definitions corresponding to the PSnew on the first backboard
For hanging processing NC.
According to the first possible implementation of first aspect, in the third possible implementation of first aspect
In, when first feature board and second backboard cooperation, by the pin definitions corresponding to the PSnew on the second backboard
For GND.
According to first aspect, first aspect the first to the third any possible implementation, the of first aspect
It is described that first function is judged according to the first signal PS1 in place in first feature board in four kinds of possible implementations
Whether plate is in place, including：
If the PS1 in first feature board is low level, judge that first feature board is in place；
If the PS1 in first feature board is high level, judge that first feature board is not in place.
According to first aspect, first aspect the first to the 4th kind of any possible implementation, the of first aspect
In five kinds of possible implementations, on the link of the PSnew connect 0ohm-100ohm in any resistance resistance.
Second aspect, the present invention provide a kind of veneer condition checkout gear in place, including：
Processing module, for n+m connector in the first feature board to be sequentially connected in series, and by first feature board
N+m connector ground GND, wherein, preceding n connector is the connection included on the second feature board in first feature board
Device, the n are positive integer, and the m is the integer more than or equal to 1；
Module is chosen, for choosing either connector from the preceding n connector of first feature board, in the company of selection
Connect and a low speed signal backflow ground pin is selected on device；
Definition module, the low speed signal backflow ground pin definitions for the selection module to be chosen are new letter in place
Number PSnew, the pin definitions corresponding to the PSnew on backboard are hanging processing NC or GND；
Link block, for signal will to be plugged steady between the PSnew and n-th of connector and (n+1)th connector
PSn_PS (n+1) is connected；
Judge module, for judging that first feature board is according to the first signal PS1 in place in first feature board
It is no in place.
In the first possible implementation of second aspect, the backboard includes the first backboard and the second backboard, institute
State the first backboard and include n+m connector, the second backboard includes n connector.
According to the first possible implementation of second aspect, in second of possible implementation of second aspect
In, the definition module is specifically used for：It is when first feature board and first backboard coordinate, the PSnew is corresponding
The first backboard on pin definitions be hanging processing NC.
According to the first possible implementation of second aspect, in the third possible implementation of second aspect
In, the definition module is specifically used for：It is when first feature board and second backboard coordinate, the PSnew is corresponding
The second backboard on pin definitions be GND.
According to second aspect, second aspect the first to the third any possible implementation, the of second aspect
In four kinds of possible implementations, the judge module is specifically used for：If the PS1 in first feature board is low electricity
It is flat, then judge that first feature board is in place；
If the PS1 in first feature board is high level, judge that first feature board is not in place.
According to second aspect, second aspect the first to the 4th kind of any possible implementation, the of second aspect
In five kinds of possible implementations, on the link of the PSnew connect 0ohm-100ohm in any resistance resistance.
Veneer provided in an embodiment of the present invention condition detection method in place and device, by this method solve the first function
The compatibling problem that plate and the second backboard detect in place, at the same also overcome in the prior art the first feature board examined in place with the first backboard
The workload and complexity of software or logic need to be increased during survey, and the problem of the complexity of increase hardware design.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is veneer condition detection method structural representation in place in the prior art；
Fig. 2 is the schematic flow sheet of veneer of the present invention condition detection method embodiment one in place；
Fig. 3 is the structural representation A of veneer of the present invention condition detection method embodiment one in place；
Fig. 4 is the structural representation B of veneer of the present invention condition detection method embodiment one in place；
Fig. 5 is the schematic flow sheet of veneer of the present invention condition detection method embodiment two in place；
Fig. 6 is the structural representation of veneer of the present invention condition detection method embodiment two in place；
Fig. 7 is the structural representation of veneer of the present invention condition detection method embodiment three in place；
Fig. 8 is the structural representation of veneer of the present invention condition checkout gear embodiment in place.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 2 is the schematic flow sheet of veneer of the present invention condition detection method embodiment one in place, and Fig. 3 is that veneer of the present invention exists
The structural representation A, Fig. 4 of position condition detection method embodiment one are veneer of the present invention condition detection method embodiment one in place
Structural representation B, in the present invention, back panel connector and function connector for substrate are a pair of connectors, the female position of a pair of connectors
In on backboard, male is located on feature board, increases signal in place (Present Signal, abbreviation on back panel connector：PS),
When feature board connector male head insert back panel connector female in, obtain a detection signal, by judging detection signal in place
Whether electrical level judging feature board plugs steady on backboard, finally decides whether upper electricity or communicates, in the present embodiment, as in Figure 2-4,
This method includes：
Step 201, n+m connector in the first feature board be sequentially connected in series, and by the n-th+m in first feature board
Connector ground.
In the present embodiment, as shown in figure 3, including n+m connector, the first function in the first feature board and the first backboard
In plate in n+m connector, preceding n connector is the connector included on the second feature board (referring to Fig. 7), from connector n+1
It is newly-increased connector to connector n+m, i.e. n+m connectors on the first feature board plate are connected by n on the second feature board
Device and increased m connector composition are connect, accordingly, n+m connector in the first backboard is also (referring to figure by the second backboard
6) n connector on and increased m connector composition, as shown in figure 3, by the connector 1 in the first feature board to connection
Device n+m is sequentially connected in series together, and the n-th+m connectors are grounded (Ground, abbreviation in the first feature board：GND), when the first work(
When energy plate is inserted into the first backboard, the connector on connector and the first backboard on the first feature board corresponds, final composition
One complete detection link in place, detection in place is unified to be detected using the first signal PS1 in place corresponding to connector 1.
Step 202, either connector is chosen from the preceding n connector of the first feature board, selected on the connector of selection
A low speed signal backflow ground pin is selected, and the low speed signal is flowed back into ground pin definitions as new signal in place, will be newly in place
Pin definitions corresponding to signal on backboard are hanging processing or GND.
In the present embodiment, either connector is chosen from the preceding n connector of the first feature board, for example, can be such as Fig. 3
Shown selection connector n, selection connector 2 that can also be as shown in Figure 4, to being selected from preceding n connector in the present embodiment
The connector taken is not any limitation as, as shown in figure 3, choosing connector n from preceding n connector, one is selected from connector n
Low speed signal backflow ground pin, by the pin definitions for new in place signal (Present Signa new, referred to as：PSnew),
Pin corresponding to PSnew on backboard can be defined as hanging processing (Non Connection, abbreviation：NC), can also define
For GND, with specific reference to backboard type corresponding to the first feature board, wherein the backboard includes the first backboard and the second backboard, institute
State the first backboard and include n+m connector, the second backboard includes n connector, will when the first feature board inserts the second backboard
Pin definitions corresponding to PSnew on the second backboard are GND (being specifically shown in embodiment two), when the first feature board inserts the first backboard
(as shown in Figure 3), it is NC by the pin definitions corresponding to PSnew on the first backboard, in the present embodiment, optionally, PSnew's
The resistance for any resistance in 0ohm-100ohm of being connected on link, for example, the 0ohm resistances that can be connected on PSnew link
Resistance, the resistance for the 33ohm resistances that can also connect, be not any limitation as in the present embodiment.
Step 203, signal PSn_PS (n+1) phase will be plugged steady between PSnew and n-th of connector and (n+1)th connector
Even.
In the present embodiment, as shown in Figure 3 and Figure 4, signal will be plugged steady between PSnew and connector n and connector n+1
PSn_PS (n+1) connects together, in the present embodiment, between any one or two of connector all in the presence of one plug steady signal PS (i-1) _
Psi (wherein 2≤i≤n+m), for example, if connector 1 plugs steady, the first signal PS1 in place can be defeated after connector 1
Go out PS1_PS2, PS1_PS2 continues to detect by connection 2, if not plugging steady, will not export and plug steady signal PS2_PS3, first
Position signal PS1 level values change, and system is not in place according to the change arbitration functions plate of the first signal PS1 level values in place.
Step 204, according to the first signal in place in the first feature board judge whether first feature board is in place.
In the present embodiment, as shown in Figure 3 or Figure 4, detection in place is unified to use the first signal in place corresponding to connector 1
PS1 is detected, and the first signal PS1 in place passes through in 1~connector of connector n+m, Fig. 3 or Fig. 4, first corresponding to PSnew
The pin definitions of backboard are NC, and NC pins do not work vacantly, after all n+m connectors all plug steady, the first signal in place
PS1 is pulled to the GND of the connector n+m lower ends in the first feature board, and the first signal PS1 in place level value is changed into low level,
Indicator function plate has plugged steady (in place), when there is connector not plug steady in n+m connector, then the first signal PS1 level values in place
It is not in place on the first backboard for high level, the first feature board of instruction.
When the first feature board inserts the second backboard, now the pin definitions of the second backboard corresponding to PSnew are GND, connection
1~connector of device n is grounded in the second backboard by PSnew pins plug steady detection in place, in the present embodiment, the first function
Plate can insert the first backboard and be detected in place, and a detection signal in place is only needed in detection process, can also insert the
Two backboards are detected in place, and when the first feature board is inserted in the second backboard, can realize detection mode compatibling problem in place.
Veneer condition detection method in place provided in an embodiment of the present invention, by by the connector in the first feature board successively
Series connection, while a new signal in place is set on the either connector of the first feature board, and backboard corresponding to new signal in place
Pin definitions are hanging processing or ground connection, solve the compatibling problem that the first feature board and the second backboard detect in place, also simultaneously
The first feature board in the prior art and the first backboard is overcome to increase the workload and complexity of software or logic when detecting in place, with
And the problem of increasing the complexity of hardware design.
Fig. 5 is the schematic flow sheet of veneer of the present invention condition detection method embodiment two in place, and Fig. 6 is that veneer of the present invention exists
The structural representation of position condition detection method embodiment two, in the present embodiment, progress is coordinated with the first feature board and the second backboard
Illustrated exemplified by detection in place, method includes：
Step 501, n+m connector in the first feature board be sequentially connected in series, and by the n-th+m in first feature board
Connector ground.
In the present embodiment, as shown in fig. 6, including n+m connector in the first feature board, n are included in the second backboard
Connector, wherein the preceding n connector in the first feature board is the connector on the second feature board (referring to Fig. 7), connector n+1
It is newly-increased new connector to connector n+m, n+m connector in the first feature board is sequentially connected in series together, and the n-th+m is individual
Connector is grounded in the first feature board, when the first feature board is inserted on the second backboard, the preceding n connector in the first feature board
Corresponded with n in the second backboard even machine.
Step 502, either connector is chosen from the preceding n connector of first feature board, in the connector of selection
Upper piece low speed signal backflow ground pin of selection, and be PSnew by low speed signal backflow ground pin definitions, by PSnew pairs
The pin definitions on the second backboard answered are GND.
In the present embodiment, either connector is chosen in the preceding n connector out of first feature board, connector can be chosen
1, connector 2 can also be chosen, can also choose connector n, in the present embodiment, as shown in fig. 6, choosing connector n, is being connected
Low speed signal backflow ground pin is chosen in device n, is PSnew, optionally, PSnew by low speed signal backflow ground pin definitions
Link on can connect the resistance of any resistance in 0ohm-100ohm, for example, the 20ohm resistances that can be connected on PSnew link
The resistance of value, the resistance for the 80ohm resistances that can also connect, the pin definitions of the second backboard corresponding to PSnew pins are GND.
Step 503, signal PSn_PS (n+1) phase will be plugged steady between PSnew and n-th of connector and (n+1)th connector
Even.
In the present embodiment, signal PSn_PS (n+1) will be plugged steady between PSnew and connector n and connector n+1 and is mutually connected in one
Rise, when between connector n and connector n+1 plug steady signal PSn_PS (n+1) output when, by PSnew pins second the back of the body
It is grounded in plate.
Step 504, according to the first signal in place in the first feature board judge whether first feature board is in place.
In the present embodiment, carried out as shown in fig. 6, detection in place is unified using the corresponding to connector 1 first signal PS1 in place
Detection in place, the first signal PS1 in place are typically pulled up by 4.7K, after all n connectors all plug steady, plug steady signal PSn_
PS (n+1) is grounded by PSnew pins in the second backboard, i.e., the first signal PS1 in place pulled down to GND in the second backboard,
First signal PS1 level value changes in place are low level, and the first feature board of instruction has plugged steady on the second backboard, when n connection
There is connector not plug steady in device, then the first signal PS1 level values in place are high level, and the first feature board of instruction is on the second backboard
It is not in place.
Veneer condition detection method in place provided in an embodiment of the present invention, by the way that new and old connector is serially connected, simultaneously
One new signal in place is set on any old connector of the first feature board, and the pin of old backboard is determined corresponding to new signal in place
Justice is ground connection, solves the compatibling problem that the first feature board detects in place with old backboard.
Fig. 7 is the structural representation of veneer of the present invention condition detection method embodiment three in place, in the base of above-described embodiment
It is to insert exemplified by the second feature board detect in place to be said by the first backboard used in embodiment one on plinth, in the present embodiment
Bright, as shown in fig. 7, including n+m connector in the first backboard, preceding n connector is the connector on the second backboard, is connected
Device n+1 to connector n+m is newly-increased new connector, includes n connector in the second feature board, n-th of connector is second
It is grounded in feature board, according to embodiment one, the NC pins in the first backboard can be arranged in the connector of any first backboard,
In the present embodiment, no matter which connector NC pins are arranged in the first backboard, but the NC pins pair in the first backboard
Signal is GND in the second feature board answered, in the present embodiment, as shown in fig. 7, the NC pins in the first backboard are arranged on first back of the body
In connector n in plate, signal is GND in the second feature board corresponding to NC pins, when the second feature board is inserted in the first backboard,
If after n connector all plugs steady, the first signal PS1 in place is pulled in the second feature board and is grounded, NC pins do not act as vacantly
With in the present embodiment, the first feature board is inserted in the first backboard, the first feature board is inserted in the second backboard and examined in place realizing
On the basis of survey, also achieve in actual application, when the second backboard is not in production, the second feature board can not be carried out
Under the detection case of position, it can also be inserted on the second feature board using the first backboard and be detected in place, be i.e. the first backboard and second
It is also compatible that feature board, which carries out detection in place,.
Three kinds of scenes corresponding to above-described embodiment one, two and embodiment three (the first feature board and the first backboard coordinate, and first
Feature board and the second backboard coordinate, and the second feature board and the first backboard coordinate), it can be judged by same signal in place
Whether feature board plugs steady in place, it is not necessary to increases extra detection signal in place, so overcoming the first function in the prior art
Increase the workload and complexity of software or logic, and the complexity of increase hardware design when plate and the first backboard detect in place
The problem of.
Fig. 8 is the structural representation of veneer of the present invention condition checkout gear embodiment in place, as shown in figure 8, veneer is in place
Condition checkout gear 80 includes：Processing module 801, choose module 802, definition module 803, link block 804, judge module
805。
Wherein, processing module 801, for n+m connector in the first feature board to be sequentially connected in series, and by first work(
N-th+m connector ground GND in energy plate, wherein, preceding n connector is to be included on the second feature board in first feature board
Connector, the n is positive integer, and the m is the integer more than or equal to 1；
Module 802 is chosen, for choosing either connector from the preceding n connector of first feature board, is being chosen
Connector on selection piece low speed signal backflow ground pin.
Definition module 803, the low speed signal backflow ground pin definitions for the selection module to be chosen are newly to exist
Position signal PSnew, the pin definitions corresponding to the PSnew on backboard are hanging processing NC or GND；
Link block 804, for signal will to be plugged steady between the PSnew and n-th of connector and (n+1)th connector
PSn_PS (n+1) is connected；
Judge module 805, for judging first feature board according to the first signal in place in first feature board
It is whether in place.
The equipment of above-described embodiment, for performing the technical scheme of embodiment of the method one shown in Fig. 1, its realization principle and skill
Art effect is similar, and here is omitted.
Veneer condition checkout gear in place provided in an embodiment of the present invention, by processing module by the company in the first feature board
Connect device to be serially connected, while one new signal in place is set on the either connector of the first feature board by choosing module, and newly
The pin definitions of backboard are hanging processing or ground connection corresponding to signal in place, solve the first feature board and are examined in place with the second backboard
The compatibling problem of survey, while also overcome the first feature board in the prior art and the first backboard to increase software or logic when detecting in place
Workload and complexity, and increase hardware design complexity the problem of.
Further, on the basis of the present embodiment, the definition module 803 is specifically used for：By corresponding to the PSnew
Pin definitions on first backboard are the NC, wherein, first backboard includes n+m connector, first feature board
N+m interior connector corresponds with n+m connector in first backboard.
Further, on the basis of the present embodiment, the backboard includes the first backboard and the second backboard, first back of the body
Plate includes n+m connector, and the second backboard includes n connector.
Further, on the basis of the present embodiment, the definition module 803 is specifically used for：When first feature board
It is hanging processing NC by the pin definitions corresponding to the PSnew on the first backboard when coordinating with first backboard.
Further, on the basis of the present embodiment, the definition module 803 is specifically used for：When first feature board
It is GND by the pin definitions corresponding to the PSnew on the second backboard when coordinating with second backboard.
Further, on the basis of the present embodiment, the judge module 805 is specifically used for：If first feature board
The first interior signal PS1 in place is low level, then judges that first feature board is in place；
If the first signal PS1 in place in first feature board is high level, judge that first feature board does not exist
Position.
Further, on the basis of the present embodiment, any resistance in series connection 0ohm-100ohm on the link of the PSnew
The resistance of value.
The equipment of the present embodiment, it can be used for performing the technical scheme that the inventive method embodiment one, two or three is provided,
Its implementing principle and technical effect is similar, and here is omitted.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above-mentioned each method embodiment can lead to
The related hardware of programmed instruction is crossed to complete.Foregoing program can be stored in a computer read/write memory medium.The journey
Sequence upon execution, execution the step of including above-mentioned each method embodiment；And foregoing storage medium includes：ROM, RAM, magnetic disc or
Person's CD etc. is various can be with the medium of store program codes.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (6)
1. a kind of veneer condition detection method in place, it is characterised in that methods described includes：
N+m connector in first feature board is sequentially connected in series, and by the connector grounds of the n-th+m in first feature board
GND, wherein, preceding n connector is the connector included on the second feature board in first feature board, and the n is positive integer,
The m is the integer more than or equal to 1；
Either connector is chosen from the preceding n connector of first feature board, selection one is low on the connector of selection
Fast signal backflow ground pin, and the low speed signal is flowed back into ground pin definitions as new signal PSnew in place, described PSnew pairs
The backboard answered includes the first backboard and the second backboard, and first backboard includes n+m connector, and second backboard includes n
Individual connector, when first feature board and first backboard cooperation, by the pipe corresponding to the PSnew on the first backboard
Pin is defined as vacantly handling NC, when first feature board and second backboard cooperation, by second corresponding to the PSnew
Pin definitions on backboard are GND；
The signal PSn_PS (n+1) that plugs steady between the PSnew and n-th of connector and (n+1)th connector is connected；
Judge whether first feature board is in place according to the first signal PS1 in place in first feature board.
2. according to the method for claim 1, it is characterised in that described according to the first signal in place in first feature board
PS1 judges whether first feature board is in place, including：
If the PS1 in first feature board is low level, judge that first feature board is in place；
If the PS1 in first feature board is high level, judge that first feature board is not in place.
3. method according to claim 1 or 2, it is characterised in that connect 0ohm-100ohm on the link of the PSnew
In any resistance resistance.
A kind of 4. veneer condition checkout gear in place, it is characterised in that including：
Processing module, for n+m connector in the first feature board to be sequentially connected in series, and by the n-th+m in first feature board
Individual connector ground GND, wherein, preceding n connector is the connector that includes on the second feature board in first feature board, institute
It is positive integer to state n, and the m is the integer more than or equal to 1；
Module is chosen, for choosing either connector from the preceding n connector of first feature board, in the connector of selection
Upper piece low speed signal backflow ground pin of selection；
Definition module, the low speed signal backflow ground pin definitions for the selection module to be chosen are new signal in place
PSnew, backboard corresponding to the PSnew include the first backboard and the second backboard, and first backboard includes n+m connector,
Second backboard includes n connector, when first feature board and first backboard cooperation, by described PSnew pairs
The pin definitions on the first backboard answered are hanging processing NC, will when first feature board and second backboard cooperation
Pin definitions corresponding to the PSnew on the second backboard are GND；
Link block, for signal PSn_PS will to be plugged steady between the PSnew and n-th of connector and (n+1)th connector
(n+1) it is connected；
Judge module, for according to the first signal PS1 in place in first feature board judge first feature board whether
Position.
5. device according to claim 4, it is characterised in that the judge module is specifically used for：If first function
The PS1 in plate is low level, then judges that first feature board is in place；
If the PS1 in first feature board is high level, judge that first feature board is not in place.
6. the device according to claim 4 or 5, it is characterised in that connect 0ohm-100ohm on the link of the PSnew
In any resistance resistance.
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|---|---|---|---|---|
| CN105656710A (en) * | 2014-11-25 | 2016-06-08 | 中兴通讯股份有限公司 | Method for detecting single board, hardware device and system |
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| CN110083498A (en) * | 2019-05-07 | 2019-08-02 | 威创集团股份有限公司 | A kind of condition checkout gear of processor veneer and a kind of detection method |
| CN117054858B (en) * | 2023-10-11 | 2024-01-16 | 井芯微电子技术(天津)有限公司 | Three-state configuration pin implementation method and IO device in chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379330A (en) * | 2001-04-06 | 2002-11-13 | 华为技术有限公司 | Method for testing single board presence |
| CN1457118A (en) * | 2002-05-09 | 2003-11-19 | 华为技术有限公司 | Plate card position inspecting method |
| CN1540891A (en) * | 2003-04-23 | 2004-10-27 | 华为技术有限公司 | Method and system for testing functional board being on site |
| CN200966066Y (en) * | 2006-03-03 | 2007-10-24 | 中兴通讯股份有限公司 | A circuit for detecting the single board operating in its place |
| CN101222732A (en) * | 2008-01-22 | 2008-07-16 | 中兴通讯股份有限公司 | State control signal testing device |
| CN103399254A (en) * | 2013-08-21 | 2013-11-20 | 迈普通信技术股份有限公司 | Board in-situ detection method and device |
-
2014
- 2014-06-30 CN CN201410309584.0A patent/CN104063296B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379330A (en) * | 2001-04-06 | 2002-11-13 | 华为技术有限公司 | Method for testing single board presence |
| CN1457118A (en) * | 2002-05-09 | 2003-11-19 | 华为技术有限公司 | Plate card position inspecting method |
| CN1540891A (en) * | 2003-04-23 | 2004-10-27 | 华为技术有限公司 | Method and system for testing functional board being on site |
| CN200966066Y (en) * | 2006-03-03 | 2007-10-24 | 中兴通讯股份有限公司 | A circuit for detecting the single board operating in its place |
| CN101222732A (en) * | 2008-01-22 | 2008-07-16 | 中兴通讯股份有限公司 | State control signal testing device |
| CN103399254A (en) * | 2013-08-21 | 2013-11-20 | 迈普通信技术股份有限公司 | Board in-situ detection method and device |
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