CN104047006A - Method for removing oxide film from surface of copper - Google Patents
Method for removing oxide film from surface of copper Download PDFInfo
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- CN104047006A CN104047006A CN201410283895.4A CN201410283895A CN104047006A CN 104047006 A CN104047006 A CN 104047006A CN 201410283895 A CN201410283895 A CN 201410283895A CN 104047006 A CN104047006 A CN 104047006A
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- copper
- oxide film
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Abstract
The invention discloses a method for removing an oxide film from the surface of copper and belongs to the technical field of metal cleaning. The method for removing the oxide film from the surface of copper has the advantages that the oxide film removal effect is good and the production cost is low. The method sequentially comprises the following steps: (1) uniformly mixing 1 part (by weight) of oxide film removing agent and 3-10 parts (by weight) of water, so as to obtain a mixed solution for removing the oxide film from the surface of copper; (2) soaking copper needing oxide film removal in the mixed solution for removing the oxide film from the surface of copper, obtained in the step (1), for 20-50 seconds in a shaking manner; (3) taking out soaked copper, and cleanly washing with water.
Description
Technical field
The present invention relates to a kind of method of copper removal surface film oxide, specifically, relate to a kind of method of removing brass, red copper surface oxide film, belong to metal cleaning technical field.
Background technology
Oxide film is that iron and steel at high temperature oxygenizement occurs and the corrosion product that forms, is made up of iron protoxide, Z 250, ferric oxide.Be from inside to outside: iron protoxide, Z 250, ferric oxide.Wherein iron protoxide short texture, a little less than provide protection, and Z 250, ferric oxide compact structure have better protecting.
Be oxidized membranous crisply, there is no extensibility, under mechanical effect and under hot-work effect, be easy to produce be full of cracks and depart from.Ferric oxide and iron protoxide generate ironic hydroxide under water effect, oxide film is expanded and chap, and even come off.
On original oxide film, always exist the crackle that deeply reaches matrix, when ionogen is poured into after crackle, iron and oxide film form galvanic cell.Oxide film is negative electrode, and iron is as anode and accelerated corrosion, and therefore the area of oxide film is larger, and the corrosion speed of steel substrate is faster, corrodes more serious.Therefore, before plating, the oxide film of metallic surface to be removed.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of removal oxide film effective, the method for the low copper removal surface film oxide of production cost.
For this reason, technical scheme provided by the invention is such: the method for this copper removal surface film oxide, comprises the steps: successively
1) 1 weight part deoxidation film and 3-10 weight parts water are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) 20-50 second in the mixed solution of described copper removal surface film oxide;
3) copper after soaking is taken out to washing totally;
Wherein: every liter of deoxidation film contains following component: hydrochloric acid 200-500g, oxalic acid 30-50g, fatty alcohol-polyoxyethylene ether 5-10g, alkylphenol polyoxyethylene 1-2g, thiocarbamide 2-5g, disodium ethylene diamine tetraacetate 5-10g, urotropine 5-10g, cresol sulfonic acid 60-100g, gelatin 5-10g, β mono-naphthols 2-5g, surplus is water.
Further, the method for above-mentioned copper removal surface film oxide, every liter of deoxidation film contains following component: hydrochloric acid 300-400g, oxalic acid 35-45g, fatty alcohol-polyoxyethylene ether 6-9g, alkylphenol polyoxyethylene 1.5g, thiocarbamide 3-4g, disodium ethylene diamine tetraacetate 6-9g, urotropine 6-9g, cresol sulfonic acid 70-90g, gelatin 6-9g, β mono-naphthols 3-4g, surplus is water.
Compared with prior art, technical scheme tool provided by the invention has the following advantages:
Technical scheme provided by the invention can be removed the oxide film on copper surface fast, simple to operate, removes oxide film effective, and production cost is low, and the finished product rate of gained is high.
Embodiment
Below in conjunction with concrete enforcement, claim of the present invention is described in further detail, the amendment of anyone limited number of time making within the scope of the claims in the present invention, still within claim protection domain of the present invention.
Embodiment 1
The method of a kind of copper removal surface film oxide provided by the invention, the method comprises the steps: successively
1) 1 weight part deoxidation film and 3 weight parts waters are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) in the mixed solution of described copper removal surface film oxide 20 seconds;
3) copper after soaking is taken out to washing totally.
Every liter of the present invention's deoxidation film used is containing following component: hydrochloric acid 500g, oxalic acid 50g, fatty alcohol-polyoxyethylene ether 10g, alkylphenol polyoxyethylene 1g, thiocarbamide 2g, disodium ethylene diamine tetraacetate 10g, urotropine 5g, cresol sulfonic acid 100g, gelatin 10g, β mono-naphthols 2g.
Embodiment 2
The method of another kind of copper removal surface film oxide provided by the invention, the method comprises the steps: successively
1) 1 weight part deoxidation film and 5 weight parts waters are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) in the mixed solution of described copper removal surface film oxide 30 seconds;
3) copper after soaking is taken out to washing totally.
Every liter of the present invention's deoxidation film used is containing following component: hydrochloric acid 200g, oxalic acid 30g, fatty alcohol-polyoxyethylene ether 5g, alkylphenol polyoxyethylene 2g, thiocarbamide 2g, disodium ethylene diamine tetraacetate 10g, urotropine 10g, cresol sulfonic acid 700g, gelatin 10g, β mono-naphthols 5g.
Embodiment 3
The method of another kind of copper removal surface film oxide provided by the invention, the method comprises the steps: successively
1) 1 weight part deoxidation film and 7 weight parts waters are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) in the mixed solution of described copper removal surface film oxide 50 seconds;
3) copper after soaking is taken out to washing totally.
Every liter of the present invention's deoxidation film used is containing following component: hydrochloric acid 300g, oxalic acid 40g, fatty alcohol-polyoxyethylene ether 8g, alkylphenol polyoxyethylene 2g, thiocarbamide 5g, disodium ethylene diamine tetraacetate 7g, urotropine 8g, cresol sulfonic acid 80, gelatin 7g, β mono-naphthols 4g.
Embodiment 4
The method of another kind of copper removal surface film oxide provided by the invention, the method comprises the steps: successively
1) 1 weight part deoxidation film and 10 weight parts waters are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) in the mixed solution of described copper removal surface film oxide 40 seconds;
3) copper after soaking is taken out to washing totally.
Every liter of the present invention's deoxidation film used is containing following component: hydrochloric acid 200g, oxalic acid 30g, fatty alcohol-polyoxyethylene ether 10g, alkylphenol polyoxyethylene 1g, thiocarbamide 5g, disodium ethylene diamine tetraacetate 5g, urotropine 10g, cresol sulfonic acid 60g, gelatin 10g, β mono-naphthols 5g.
In embodiment 1 to 4, the preparation method of any one deoxidation film is as follows:
1) take each component by above-mentioned total mass number;
2) by step 1) component that takes puts into flask, adds water to 1L, then stirs at normal temperatures and mixes for 5 minutes, obtains deoxidation film.
Claims (2)
1. a method for copper removal surface film oxide, is characterized in that, the method comprises the steps: successively
1) 1 weight part deoxidation film and 3-10 weight parts water are mixed, obtain the mixed solution of copper removal surface film oxide;
2) the copper shake that needs oxide film dissolving is immersed in to step 1) 20-50 second in the mixed solution of described copper removal surface film oxide;
3) copper after soaking is taken out to washing totally;
Wherein: every liter of deoxidation film contains following component: hydrochloric acid 200-500g, oxalic acid 30-50g, fatty alcohol-polyoxyethylene ether 5-10g, alkylphenol polyoxyethylene 1-2g, thiocarbamide 2-5g, disodium ethylene diamine tetraacetate 5-10g, urotropine 5-10g, cresol sulfonic acid 60-100g, gelatin 5-10g, β mono-naphthols 2-5g, surplus is water.
2. the method for copper removal surface film oxide according to claim 1, is characterized in that, every liter of deoxidation film contains following component: hydrochloric acid 300-400g, oxalic acid 35-45g, fatty alcohol-polyoxyethylene ether 6-9g, alkylphenol polyoxyethylene 1.5g, thiocarbamide 3-4g, disodium ethylene diamine tetraacetate 6-9g, urotropine 6-9g, cresol sulfonic acid 70-90g, gelatin 6-9g, β mono-naphthols 3-4g, surplus is water.
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CN201410283895.4A CN104047006A (en) | 2014-06-23 | 2014-06-23 | Method for removing oxide film from surface of copper |
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CN201410283895.4A CN104047006A (en) | 2014-06-23 | 2014-06-23 | Method for removing oxide film from surface of copper |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104450277A (en) * | 2014-11-27 | 2015-03-25 | 镇江润德节能科技有限公司 | Preparation method for electroplating cleaning degreasing agent |
CN108866596A (en) * | 2017-05-12 | 2018-11-23 | 昆山汉鼎精密金属有限公司 | It removes differential arc oxidation film layer medicament, remove micro-arc oxidation films layer method |
Citations (6)
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CN86103745A (en) * | 1986-05-26 | 1987-12-02 | 国营锦山机械厂 | The pickling solution of copper and copper alloy |
JP4009590B2 (en) * | 2001-07-13 | 2007-11-14 | 特定非営利活動法人病院地域医療推進協議会 | Method for removing oxide film on the surface of processed copper products |
CN102296303A (en) * | 2011-08-31 | 2011-12-28 | 蚌埠市钰诚五金工贸有限公司 | Comprehensive pretreatment agent |
CN103173774A (en) * | 2011-12-21 | 2013-06-26 | 谢柳芳 | Industrial rust remover |
CN103590056A (en) * | 2012-08-14 | 2014-02-19 | 苏州一方金属表面处理科技有限公司 | Cold-rolled sheet detergent |
CN103590052A (en) * | 2012-08-14 | 2014-02-19 | 苏州一方金属表面处理科技有限公司 | Environment-friendly cleaning liquid for cold-rolled sheet |
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2014
- 2014-06-23 CN CN201410283895.4A patent/CN104047006A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86103745A (en) * | 1986-05-26 | 1987-12-02 | 国营锦山机械厂 | The pickling solution of copper and copper alloy |
JP4009590B2 (en) * | 2001-07-13 | 2007-11-14 | 特定非営利活動法人病院地域医療推進協議会 | Method for removing oxide film on the surface of processed copper products |
CN102296303A (en) * | 2011-08-31 | 2011-12-28 | 蚌埠市钰诚五金工贸有限公司 | Comprehensive pretreatment agent |
CN103173774A (en) * | 2011-12-21 | 2013-06-26 | 谢柳芳 | Industrial rust remover |
CN103590056A (en) * | 2012-08-14 | 2014-02-19 | 苏州一方金属表面处理科技有限公司 | Cold-rolled sheet detergent |
CN103590052A (en) * | 2012-08-14 | 2014-02-19 | 苏州一方金属表面处理科技有限公司 | Environment-friendly cleaning liquid for cold-rolled sheet |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104450277A (en) * | 2014-11-27 | 2015-03-25 | 镇江润德节能科技有限公司 | Preparation method for electroplating cleaning degreasing agent |
CN108866596A (en) * | 2017-05-12 | 2018-11-23 | 昆山汉鼎精密金属有限公司 | It removes differential arc oxidation film layer medicament, remove micro-arc oxidation films layer method |
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Application publication date: 20140917 |