CN104012190B - 用于在两个板形的导体线路区段之间建立的高频电连接的方法以及所属的高频电连接结构 - Google Patents
用于在两个板形的导体线路区段之间建立的高频电连接的方法以及所属的高频电连接结构 Download PDFInfo
- Publication number
- CN104012190B CN104012190B CN201280063609.2A CN201280063609A CN104012190B CN 104012190 B CN104012190 B CN 104012190B CN 201280063609 A CN201280063609 A CN 201280063609A CN 104012190 B CN104012190 B CN 104012190B
- Authority
- CN
- China
- Prior art keywords
- conductor line
- section
- plate
- seaming
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
- H01R43/048—Crimping apparatus or processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
- B21D39/03—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding
- B21D39/031—Joining superposed plates by locally deforming without slitting or piercing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/06—Riveted connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/182—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for flat conductive elements, e.g. flat cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011122037.6 | 2011-12-22 | ||
DE102011122037A DE102011122037A1 (de) | 2011-12-22 | 2011-12-22 | Verfahren zur Herstellung einer elektrischen Hochfrequenz-Verbindung zwischen zwei Plattenabschnitten sowie eine zugehörige elektrische Hochfrequenz-Verbindung |
PCT/EP2012/005036 WO2013091784A1 (de) | 2011-12-22 | 2012-12-06 | Verfahren zur herstellung einer elektrischen hochfrequenz -verbindung zwischen zwei plattenförmigen leiterbahnabschnitten sowie eine zugehörige elektrische hochfrequenz -verbindung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104012190A CN104012190A (zh) | 2014-08-27 |
CN104012190B true CN104012190B (zh) | 2017-06-09 |
Family
ID=47561504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280063609.2A Active CN104012190B (zh) | 2011-12-22 | 2012-12-06 | 用于在两个板形的导体线路区段之间建立的高频电连接的方法以及所属的高频电连接结构 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140374154A1 (zh) |
EP (1) | EP2796017B1 (zh) |
CN (1) | CN104012190B (zh) |
DE (1) | DE102011122037A1 (zh) |
WO (1) | WO2013091784A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014216518A1 (de) * | 2014-08-20 | 2016-02-25 | Robert Bosch Gmbh | Elektronische Steuereinheit sowie Moldwerkzeug und Verfahren zum Herstellen einer elektronischen Steuereinheit |
CN104853541A (zh) * | 2015-06-01 | 2015-08-19 | 天津大学 | 一种聚合物薄膜电路板与电子元器件的互连方法 |
DE102015117687A1 (de) | 2015-10-16 | 2017-05-04 | Kathrein Werke Kg | Intermodulationsfreier elektrischer Kontakt für HF-Anwendungen |
FR3065330B1 (fr) * | 2017-04-13 | 2019-05-03 | Tyco Electronics France Sas | Outil pour souder un conducteur electrique avec un dispositif de connexion |
JP6891763B2 (ja) * | 2017-11-08 | 2021-06-18 | トヨタ自動車株式会社 | 車両用接合構造 |
CN107994340B (zh) * | 2017-11-28 | 2021-11-02 | 维沃移动通信有限公司 | 铝合金电池盖、加工方法及电子设备 |
BE1025953B1 (nl) * | 2018-01-24 | 2019-08-27 | Orfit Industries | Immobilisatie element met profiel voorzien van protrusies |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6243946B1 (en) * | 1996-04-12 | 2001-06-12 | Yamaichi Electronics Co., Ltd. | Method of forming an interlayer connection structure |
CN1358117A (zh) * | 1999-06-25 | 2002-07-10 | 托克斯普莱索技术两合公司 | 一种用于层叠板材互相联接的方法和装置 |
CN1437285A (zh) * | 2002-02-08 | 2003-08-20 | W·C·贺利氏股份有限及两合公司 | 构成两个金属结构的电接触的方法 |
TWI254103B (en) * | 2002-10-15 | 2006-05-01 | Fraunhofer Ges Forschung | Method and apparatus for assembling at least two components |
Family Cites Families (23)
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US3579809A (en) * | 1968-12-13 | 1971-05-25 | Frantz Mfg Co | Method of joining sheets of rigid deformable material |
US4202750A (en) * | 1977-02-22 | 1980-05-13 | The Continental Group, Inc. | Container anode |
DE3575386D1 (de) * | 1984-03-22 | 1990-02-22 | Eckold Vorrichtung | Durchsetzfuegeverfahren. |
US5121299A (en) * | 1989-12-29 | 1992-06-09 | International Business Machines Corporation | Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
DE9114122U1 (de) * | 1991-11-13 | 1993-04-01 | Eckold GmbH & Co KG, 3424 St. Andreasberg | Vorrichtung zum Fügen von Blechteilen |
DE4240970A1 (de) * | 1992-12-05 | 1994-06-09 | Eckold Vorrichtung | Verfahren zum Fügen von flächig aufeinanderliegenden Blechen, Blechteilen oder Platten |
US5436411A (en) * | 1993-12-20 | 1995-07-25 | Lsi Logic Corporation | Fabrication of substrates for multi-chip modules |
DE4431274C2 (de) | 1994-09-02 | 1998-08-06 | Giersiepen Gira Gmbh | Verfahren zum Herstellen eines Elektro-Installationsgerätes sowie Elektro-Installationsgerät |
JP3290041B2 (ja) * | 1995-02-17 | 2002-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 多層プリント基板、多層プリント基板の製造方法 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
DE19929778B4 (de) * | 1998-09-07 | 2006-04-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum dynamischen Verbinden von plattenförmigen Bauteilen |
EP1045201A1 (de) * | 1999-04-12 | 2000-10-18 | Siteco Beleuchtungstechnik GmbH | Befestigung eines elektrischen Bauteils an einer Leuchte |
DE29912797U1 (de) * | 1999-07-22 | 1999-12-23 | Wilhelm Pudenz GmbH, 27243 Dünsen | Elektrotechnische Baueinheit |
US20020166843A1 (en) * | 2001-05-14 | 2002-11-14 | Pei-Chung Wang | Method for electrical resistance welding thin metal sheets together for automotive vehicle structures |
FR2891324B1 (fr) * | 2005-09-26 | 2011-02-18 | Valeo Systemes Thermiques | Dispositif d'assemblage entre deux plaques stratifiees composees d'une couche de resine interposee entre deux toles metalliques |
DE102005047975B4 (de) | 2005-10-06 | 2012-03-22 | Kathrein-Werke Kg | Antenne mit zumindest einem Strahler und einem Speisenetzwerk |
US7358924B2 (en) | 2005-10-07 | 2008-04-15 | Kathrein-Werke Kg | Feed network, and/or antenna having at least one antenna element and a feed network |
KR20090108693A (ko) * | 2007-02-13 | 2009-10-16 | 인벤티오 아게 | 두꺼운 판금을 클린칭하기 위한 방법과 공구, 및 그 공구의 용도 |
DE102007024711B4 (de) * | 2007-05-25 | 2020-12-10 | Tox Pressotechnik Gmbh & Co. Kg | Vorrichtung und Verfahren zum Clinchen von Bauteilen |
DE102007032142A1 (de) * | 2007-06-30 | 2009-01-02 | Robert Bosch Gmbh | Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls |
US20100083480A1 (en) * | 2008-10-06 | 2010-04-08 | Gm Global Technology Operations, Inc. | Method of Friction-Assisted Clinching |
US8024848B2 (en) * | 2008-10-08 | 2011-09-27 | GM Global Technology Operations LLC | Double-action clinching method |
US8966734B2 (en) * | 2011-09-23 | 2015-03-03 | GM Global Technology Operations LLC | Method of joining magnesium |
-
2011
- 2011-12-22 DE DE102011122037A patent/DE102011122037A1/de not_active Withdrawn
-
2012
- 2012-12-06 CN CN201280063609.2A patent/CN104012190B/zh active Active
- 2012-12-06 WO PCT/EP2012/005036 patent/WO2013091784A1/de active Application Filing
- 2012-12-06 US US14/368,236 patent/US20140374154A1/en not_active Abandoned
- 2012-12-06 EP EP12815991.0A patent/EP2796017B1/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6243946B1 (en) * | 1996-04-12 | 2001-06-12 | Yamaichi Electronics Co., Ltd. | Method of forming an interlayer connection structure |
CN1358117A (zh) * | 1999-06-25 | 2002-07-10 | 托克斯普莱索技术两合公司 | 一种用于层叠板材互相联接的方法和装置 |
CN1437285A (zh) * | 2002-02-08 | 2003-08-20 | W·C·贺利氏股份有限及两合公司 | 构成两个金属结构的电接触的方法 |
TWI254103B (en) * | 2002-10-15 | 2006-05-01 | Fraunhofer Ges Forschung | Method and apparatus for assembling at least two components |
Also Published As
Publication number | Publication date |
---|---|
WO2013091784A1 (de) | 2013-06-27 |
US20140374154A1 (en) | 2014-12-25 |
CN104012190A (zh) | 2014-08-27 |
EP2796017B1 (de) | 2016-10-19 |
EP2796017A1 (de) | 2014-10-29 |
DE102011122037A1 (de) | 2013-06-27 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190220 Address after: Rosenheim Patentee after: KATHREIN-WERKE KG Address before: Rosenheim Patentee before: KATHREIN-WERKE KG |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210408 Address after: Stockholm, Sweden Patentee after: Telefonaktiebolaget LM Ericsson (publ) Address before: Stockholm, Sweden Patentee before: Ericsson AB Effective date of registration: 20210408 Address after: Stockholm, Sweden Patentee after: Ericsson AB Address before: Rosenheim Patentee before: KATHREIN-WERKE KG |