CN103999484B - 作为声学设备中的屏障的嵌入式电介质和制造方法 - Google Patents

作为声学设备中的屏障的嵌入式电介质和制造方法 Download PDF

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CN103999484B
CN103999484B CN201180074631.2A CN201180074631A CN103999484B CN 103999484 B CN103999484 B CN 103999484B CN 201180074631 A CN201180074631 A CN 201180074631A CN 103999484 B CN103999484 B CN 103999484B
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J·B·斯切赫
P·范凯塞尔
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Abstract

麦克风基体包括多个金属层和多个内芯板层。所述多个内芯板层中的每一个布置在所述多个金属层中选择的一些金属层之间。电介质薄膜布置在所述多个金属层中选择的其他一些金属层之间。端口贯穿金属层和内芯板层，但是不贯穿电介质薄膜。所述电介质薄膜具有压紧部分和未压紧部分。所述未压紧部分延伸跨过所述端口，并且所述压紧部分与所述多个金属层中选择的其他一些金属层接触。薄膜的所述压紧部分有效地用作无源电子元件，并且所述未压紧部分有效地用作防止至少某些外部碎屑来回穿过所述端口的屏障。

Description

作为声学设备中的屏障的嵌入式电介质和制造方法
技术领域
本申请涉及声学设备，更具体地涉及这些设备的构造。
背景技术
各种类型的声学设备(例如，麦克风和接收器)已经使用了多年。在这些设备中，不同的电子元件被一起容纳在壳体或者组件内。例如，麦克风通常包括振膜和背板(除了其他元件之外)，并且这些元件一起置于壳体内。其他类型的声学设备(例如，接收器)可以包括其他类型的元件。
声学设备通常具有允许声音进入到壳体的内部(或者从所述内部离开)的端口。例如，麦克风可以具有允许声音从外部进入并对进入的声音进行放大的端口。在另一个例子中，扬声器通常包括允许声音从壳体的内部离开的端口。无论声音的传播方向如何，与该端口相关的一个问题是：尽管它们允许声音进入到设备(或者从设备离开)，但它们也可能允许碎屑进入到声学设备内部。例如，如果用在助听器中，则可允许耳垢或者其他类型的碎屑通过端口进入到设备。除了固体碎屑之外，还能够允许各种类型的液体进入到设备的内部。所有这些类型的材料可能损害声学设备和/或对声学设备的工作产生不利的影响。
现有的***已经有时在端口上使用屏障，以防止碎屑或者其他异物经由端口进入到声学设备的内部。在一个现有的例子中，将金属滤网置于端口之上。不幸的是，金属滤网会对声学设备增加气流阻力。增加的气流阻力劣化了设备的性能，从而用户对这些现有的***产生了不满。
附图说明
为了更全面地理解本公开，应当参考下面的详细描述和附图，其中：
图1包括根据本发明的各种实施方式的电介质薄膜层的底视图；
图2包括根据本发明的各种实施方式的、具有图1的电介质薄膜层的声学设备沿示出的线A-A的侧面剖视图；
图3包括示出根据本发明的各种实施方式的、一种类型的膨体聚四氟乙烯(ePTFE)材料的***损失的示意图；
图4包括示出根据本发明的各种实施方式的、麦克风基体的各个层的表；
图5包括示出根据本发明的各种实施方式的、用于制作麦克风基体的流程图。
本领域技术人员将会理解，为了简单清楚的目的而示出了图中的元件。还应该理解的是，可以以特定的发生顺序来描述或者说明某些动作和/或步骤，同时本领域技术人员将会理解实际上并不需要这种特定的顺序。还应当理解的是，除非本文提出的特定含义之外，本文所使用的术语和表述具有如在它们相应的研究和学习的各个领域中赋予该术语和表述的一般含义。
具体实施方式
提供了具有同时作为电介质层和入口屏障的薄膜的声学设备。如此配置的设备是可制造的，防止外界物质进入到该设备，同时不会增加或者显著地增加设备的声阻。另外，本文描述的设备为无源电子元件(例如，电容器)提供了电介质层。
在一个方面，声学设备(例如，麦克风)的基体(或者电路板或者基板)包括多层的各种材料。所述层包括至少一些金属层和至少一些内芯板层。电介质薄膜夹在这些层的某些层之间。端口贯穿这些层，但是所述电介质薄膜延伸跨过所述端口。所述电介质薄膜的一部分是压紧的，并且该压紧部分可以用作电容器。未压紧部分跨过所述端口并用作屏障。所述电介质薄膜由任何合适的材料(例如，膨体聚四氟乙烯(ePTFE))或者其他高分子薄膜构成。材料的其他例子是可能的。在使用合适大小(例如，直径大于约1.0mm)的端口时，所述电介质薄膜对进入(或者离开)设备的声音提供很少的声阻。
所述电介质薄膜的压紧部分具有足以使该部分用作电容器的增加的介电常数。因此，单个电介质薄膜同时作为屏障和无源电子元件。另外，有足够的声学/声音流以使得电介质薄膜不作为声阻。
在很多的这些实施方式中，麦克风基体包括多个金属层和多个内芯板层。所述多个内芯板层中的每一个布置在所述多个金属层中选择的一些金属层之间。电介质薄膜布置在所述多个金属层中选择的其他一些金属层之间。端口贯穿金属层和内芯板层，但是不贯穿电介质薄膜。所述电介质薄膜具有压紧部分和未压紧部分。所述未压紧部分延伸跨过所述端口，并且所述压紧部分与所述多个金属层中选择的其他一些金属层接触。所述薄膜的所述压紧部分有效地用作无源电子元件，并且所述未压紧部分有效地用作防止至少某些外部碎屑来回穿过所述端口的屏障。
现在参考图1和图2，描述了具有电介质薄膜102的声学设备100的一个例子。设备100包括盖子或者容器104、电介质薄膜102、第一内芯板层106、第二内芯板层108、第一金属层110、第二金属层112、第三金属层114、第四金属层116、换能器118、集成电路120、阻焊层122、焊盘124和声学端口126。
盖子或者罩子104由任何合适的材料(例如，金属或者硬塑料)构造。电介质薄膜102包括未压紧区域132和压紧区域134。压紧区域134总体上位于电介质层102直接夹在其他相邻层之间(即，与这些相邻层接触)的地方。未压紧区域132总体上位于电介质层102延伸跨过端口126的地方(即，层102不直接与相邻层接触的地方)。对层102进行压紧(通过使其在相邻层之间受到挤压并保持在相邻层之间)改变了压紧区域的介电常数值，与未压紧区域相比，增加了介电常数值，从而使电介质适合用作电容器。电容器的电极通过电镀通孔过孔垂直地电连接到合适的金属层和导线。
在一个例子中，层102是膨胀的特氟龙(Teflon)膨体聚四氟乙烯(ePTFE)膜。由于其低密度性(例如，大于70％的体积是空气)，该膜是相对的声学上透明的。现在参考图3，针对两个ePTFE膜(NTF1026和NTF1033)，示出了两种ePTFE的***损失(声音渗透性)。
在一个例子中，第一内芯板层106和第二内芯板层108由玻璃增强层压板构造。内芯板层106和108的目的是提供机械刚性和金属层之间的电绝缘性。
第一金属层110、第二金属层112、第三金属层114和第四金属层116由合适的金属(例如，铜)构造。这些层的目的是提供导电通路和布线功能。例如，层110可以是布线和焊线层。层112可以是普通的电容接地。层114可以用于信号电极。层116可以用于用户的焊盘。如图4所示，示出了提出的麦克风基体金属层叠的一个例子。有两个内芯板层(C1和C2)和四个金属层(1，2，3和4)以及电介质层(D)。包括了这些层的成分(描述)、厚度、公差和其他信息。如所示出的，金属层由子部分构成。可以将这些层一起称为麦克风基体(或者电路板)。应当理解的是，本文所描述的示例性的基体仅是一个例子，并且可以根据特定用户的需要或者特定***的要求而改变基体的数量、类型、配置、材料和其他方面。
作为电容器，由未压紧的ePTFE构成的层102的固有的低介电常数(k＝1.3)可能在获得有用的电容器方面存在问题。在某些方面，未压紧的ePTFE提供作为嵌入式电介质薄膜仅约10％的每单位面积电容。然而，因为ePTFE的压缩特性，能够在层压工艺期间将它压缩至接近块体密度(除了在声学端口孔处的保持未压紧的材料之外)，以产生当前材料的约20％的每单位面积电容。
换能器118包括各种元件，例如，MEMS芯片(die)、振膜、电荷板等。换能器用于将声能转换为发送到集成电路120的电信号。阻焊层122的功能是保护并绝缘下面的金属导线并防止焊料迁移。焊盘116提供基体和最终PCB组件之间的电连接和机械连接。
在图1和图2的***的工作的一个例子中，电介质薄膜102的压紧部分132具有足以使该部分用作电容器的增加的介电常数，而未压紧部分134作为端口126中的屏障。因此，单个电介质薄膜102同时作为屏障和无源电子元件。此外，具有足够的声学/声音流以使得电介质薄膜102不充当声阻，从而对设备100的工作产生很少影响或者没有不利的影响。
现在参考图5，描述了用于制作麦克风基体的工艺的一个例子。在步骤502，将金属化层蚀刻到顶部内芯板和底部内芯板上。在步骤504，使用机械钻孔机钻出通过顶部内芯板和底部内芯板的声学端口孔。在步骤506，在顶部内芯板和底部内芯板之间进行ePTFE膜的层压。这会生成具有嵌入式电介质和屏障的多层PCB。
在步骤508，使用机械钻孔机钻出用于电连接金属导线和层的电镀通孔(PTH)过孔。在步骤510，对电路板应用铜滚镀。铜滚镀的目的是涂覆过孔的内壁以使得它们在轴向方向上导电。在步骤512，对顶部阻焊层和底部阻焊层进行印刷并随后进行固化。在步骤514，应用ENIG表面处理(finish)以提供耐腐蚀、可引线结合并且可软焊的表面。
因此，提供了使用ePTFE或者其他类似的材料同时作为声学设备(例如，麦克风)中的入口屏障和无源电子元件的方法。可以根据本方法将基于氟聚合物的膜(例如，ePTFE)直接嵌入到多层基体中，这与避免该方面的现有的方法相反。另外，与直觉相悖并与现有的方法形成鲜明对比的是，本方法的ePTFE材料用于无源电子元件中以提供本文所描述的各种优点。
本文描述了本发明的优选实施方式，包括发明者已知的实现本发明的最佳模式。应当理解，示出的实施方式仅是示例性的，不应将其作为本发明的范围的限制。

Claims (12)

1.一种麦克风基体，所述基体包括：
多个金属层；
多个内芯板层，所述多个内芯板层中的每一个布置在所述多个金属层中选择的一些金属层之间；
电介质薄膜，其布置在所述多个金属层中选择的其他一些金属层之间；
端口，其贯穿所述金属层和所述内芯板层，但是不贯穿所述电介质薄膜；
使得所述电介质薄膜具有压紧部分和未压紧部分，所述未压紧部分延伸跨过所述端口，并且所述压紧部分与所述多个金属层中选择的所述其他一些金属层接触；
使得所述薄膜的所述压紧部分有效地用作无源电子元件，并且所述未压紧部分有效地用作防止至少某些外部碎屑来回穿过所述端口的屏障。
2.根据权利要求1所述的基体，其中，所述压紧部分的介电常数值与所述未压紧部分的介电常数值不同。
3.根据权利要求1所述的基体，其中，所述薄膜包括膨胀特氟龙膨体聚四氟乙烯(ePTFE)膜。
4.根据权利要求1所述的基体，其中，所述电子元件包括电容器。
5.根据权利要求1所述的基体，其中，所述端口具有大于1.0mm的直径的尺寸。
6.一种麦克风，所述麦克风包括：
基体，所述基体包括：
-多个金属层；
-多个内芯板层，所述多个内芯板层中的每一个布置在所述多个金属层中选择的一些金属层之间；
-电介质薄膜，其布置在所述多个金属层中选择的其他一些金属层之间；
-端口，其贯穿所述金属层和所述内芯板层，但是不贯穿所述电介质薄膜；
-使得所述电介质薄膜具有压紧部分和未压紧部分，所述未压紧部分延伸跨过所述端口，并且所述压紧部分与所述多个金属层中选择的所述其他一些金属层接触；
-使得所述薄膜的所述压紧部分有效地用作无源电子元件，并且所述薄膜的所述未压紧部分有效地用作防止至少某些外部碎屑来回穿过所述端口的屏障；
换能器，其布置在所述基体上方、与所述基体连接、并且与所述端口连通，所述换能器被配置为将从所述端口接收到的声能转换为电能。
7.根据权利要求6所述的麦克风，所述麦克风还包括附着到所述基体的盖子，所述盖子覆盖所述换能器。
8.根据权利要求6所述的麦克风，所述麦克风还包括连接到所述换能器的放大器。
9.根据权利要求6所述的麦克风，其中，所述压紧部分的介电常数值与所述未压紧部分的介电常数值不同。
10.根据权利要求6所述的麦克风，其中，所述薄膜包括膨胀特氟龙膨体聚四氟乙烯(ePTFE)膜。
11.根据权利要求6所述的麦克风，其中，所述电子元件包括电容器。
12.根据权利要求6所述的麦克风，其中，所述端口具有大于1.0mm的直径的尺寸。
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