Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
In embodiments of the present invention, by deposited on substrates polycrystalline silicon membrane, and on polycrystalline silicon membrane, form silicon carbide film layer, thus, form the protecting film in order to protect display floater. Owing to the scratch resistance capability of the silicon carbide film layer of described protecting film is relatively strong, explosion-proof capabilities is better, therefore, it can the protecting film as display floater.
Below by specific embodiment, the solution of the present invention being described in detail, the present invention includes but are not limited to: following example.
As it is shown in figure 1, the first structural representation of a kind of film for providing in the embodiment of the present invention, described film, for being attached to the outermost layer of display floater, plays the effect of protection display floater. Specifically, described film includes: base material 101; It is arranged on the first rete 102 of the first surface of described base material, wherein, described first rete 102 comprises: near the first polycrystalline silicon membrane 1021 of described base material, and the first silicon carbide film layer 1022 being positioned on described first polycrystalline silicon membrane 1021 away from described base material 101.
Preferably, described film is not limited to the structure shown in Fig. 1, it is also possible to for the third structure shown in the second structure as shown in Figure 2 or Fig. 3.
As in figure 2 it is shown, described film includes: base material 101; It is arranged on the first rete 102 of the first surface of described base material, it is arranged on the second rete 103 of the second surface of described base material 101, wherein, described second surface and described first surface are oppositely arranged, described second rete 103 comprises: near the second polycrystalline silicon membrane 1031 of described base material 101, and the second silicon carbide film layer 1032 being positioned on described second polycrystalline silicon membrane 1031 away from described base material 101.
As it is shown on figure 3, described film includes: base material 101; Being arranged on the first rete 102 of the first surface of described base material, be arranged on the second rete 104 of the second surface of described base material 101, wherein, described second surface and described first surface are oppositely arranged, and described second rete 104 is described second polycrystalline silicon membrane.
In the structure of three of the above film, described base material 101 is transparent flexible organic polymer material. In the present embodiment alternatively, the material of described base material 101 can be politef (PET), but the present invention is not limited to this material. Wherein, optionally, the thickness range of described base material 101 is 0.05mm��0.15mm.
Alternatively, in described first rete 102 and described second rete 103, described polycrystalline silicon membrane directly contacts with described silicon carbide film layer.
In the structure of above-mentioned three kinds of films, in the first rete 102 on base material 101, described first polycrystalline silicon membrane 1021 has microprism array structure, and in the second rete 103, described second polycrystalline silicon membrane 1031 can also have microprism array structure. As shown in Figure 4, for the first rete 102, each described micro-prism structure is all with surface that self contacts with base material 101 for benchmark, the micro-prism structure that height is 20��50 microns to self structure highest point, wherein, the cross section figure of each micro-prism structure can be triangle as shown in Figure 4, it is also possible to be trapezoidal, semicircle etc., the concrete shape of described sectional view is not limited by the present invention, as long as have reflection or the effect of refraction light; And described micro-prism structure extends along the horizontal or vertical direction on this surface on the surface of base material 101, and then, multiple adjacent micro-prism structures together form described microprism array structure.
In embodiments of the present invention, described microprism array structure can use as optical prism thin film, especially for OLED display panel, according to geometric optical theory, the blood circulation that emergent ray is constituted through described film, make light can be accumulated to greatest extent and launch, as shown in Figure 5, assume that light enters described microprism array structure, when emergent ray 1 is when first micro-prism structure place outgoing, refraction action due to micro-prism structure so that major part light is all refracted between light 1 and light 2; Even if light offsets, all right light 4 in Fig. 5 of emergent ray, enter another adjacent micro-prism structure, re-start the operations such as the reflection of light, refraction, thus reaching to increase the effect of display floater brightness. It addition, the first silicon carbide film layer 1022 on described first polycrystalline silicon membrane 1021, and the second silicon carbide film layer 1032 on described second polycrystalline silicon membrane 1031; Owing to the Mohs' hardness of carborundum is 9.5 grades, being only second to diamond (10 grades) the hardest in the world, therefore, the hardness of carborundum is very big, has good resistance to marring; And, carborundum is a kind of quasiconductor, has excellent heat conductivility. Comprehensive factors above, the first rete being made up of polycrystalline silicon membrane and silicon carbide film layer has a good resistance to marring, and its thinner thickness, it is suitable for the outermost protecting film as display floater.
Based on a kind of film that above-described embodiment provides, the embodiment of the present invention additionally provides a kind of display floater, including film involved in above-described embodiment, in order to as protecting film, to be attached to the outermost of described display floater, with scratch resistance, protects display floater.
Alternatively, described display floater also includes: first substrate; The second substrate being oppositely arranged with first substrate; Wherein, described film is arranged at outside described first substrate.
Alternatively, described display floater also includes: be arranged on the polaroid between described film and described first substrate.
Alternatively, described display floater also includes: be arranged on the liquid crystal layer between described first substrate and described second substrate, or, it is arranged on the luminescent device on described second substrate.
Alternatively, described display floater also includes: touch screen. Wherein, touch screen has various structures, it is possible between two substrates, or is integrated on first substrate or second substrate, or on-cell structure etc.
Such as: for display panels, first substrate and second substrate are oppositely arranged; First substrate is array base palte, and second substrate is color membrane substrates, or, first substrate is color membrane substrates, and second substrate is array base palte. And, the outside of array base palte and color membrane substrates is provided with polaroid. Polaroid outside color membrane substrates is between color membrane substrates and described film.
For OLED display panel, first substrate is same with second substrate to be oppositely arranged; First substrate is oled substrate, when being not provided with colored hair photosphere on described oled substrate, then described second substrate is color membrane substrates, when being provided with colored hair photosphere on described oled substrate, then described second substrate is encapsulated layer; Or, second substrate is oled substrate, when being not provided with colored hair photosphere on described oled substrate, then described first substrate is color membrane substrates, when being provided with colored hair photosphere on described oled substrate, then described first substrate is encapsulated layer. And, color membrane substrates or can be provided with polaroid outside encapsulated layer, to obtain line polarized light.
Described display floater can be the display floaters such as OLED, LCD, and the type of the display floater that described film is applied is not made concrete restriction by the present invention, further, it is also possible to as the outermost layer protecting film in other devices. Describe in detail for OLED display panel below.
As shown in Figure 6, for the structural representation of OLED display panel in the embodiment of the present invention, it should be noted that, following example only introduce main functional film layer, other base film layer existing are not described by the present invention, but the film layer structure of display floater involved in the present invention is not limited to content below.
Described display floater specifically includes that oled substrate 201; Being positioned at the luminescent layer 202 on described oled substrate 201, described luminescent layer 202 is not completely covered described oled substrate 201, and the non-display area outside the surrounding of described oled substrate 201 exposes viewing area; TP layer 203 between described luminescent layer 202 and described oled substrate 201; Being bundled in the flexible PCB 204 on described oled substrate 201, wherein, described flexible PCB 204 is integrated with TP drive circuit and TFT drive circuit; It is positioned at the encapsulated layer 205 on described TP layer 203, wherein, described encapsulated layer 205 includes the non-display area outside described viewing area and viewing area, and is coated with sealed plastic box 205 ', and described sealed plastic box 205 ' is for fitting together described encapsulated layer 205 with the para-position of described oled substrate 201; It is positioned at the polaroid 206 on described encapsulated layer 205; It is positioned at the scratch resistance film 207 on described polaroid 206. Wherein, described scratch resistance film 207 is the film in the embodiment of the present invention, this scratch resistance film 207 is made up of three retes, include under upper: the first rete being made up of silicon carbide film layer and polycrystalline silicon membrane, the base material being made up of transparent PET material, the second rete being made up of polycrystalline silicon membrane and silicon carbide film layer.The first rete being made up of polycrystalline silicon membrane and silicon carbide film layer has a good resistance to marring, and its thinner thickness, it is possible to the thickness of thinning display floater, it is suitable for the outermost protecting film as display floater.
Additionally, the embodiment of the present invention additionally provides a kind of display device, including the display floater described in above-described embodiment, meanwhile, described display device also includes other apparatus structures existing, for instance, backlight module etc.
Based on a kind of design identical for the film protecting display floater provided with above example, the embodiment of the present invention additionally provides a kind of method preparing film, is described in detail below by way of specific embodiment, but the invention is not limited in following example.
As it is shown in fig. 7, a kind of method flow schematic diagram preparing film provided for the embodiment of the present invention, it is shown that method comprises the following steps:
Step 301 a: base material is provided.
Step 302: form the first rete at least one surface of described base material. Wherein, the process forming described first rete is: form polycrystalline silicon membrane at least one surface of base material; On at least one polycrystalline silicon membrane, form silicon carbide film layer.
Preferably, form the process of described first rete, particularly as follows: concurrently form polycrystalline silicon membrane on two surfaces of base material, at least one polycrystalline silicon membrane, form silicon carbide film layer; Or form polycrystalline silicon membrane on a wherein surface of base material, on described polycrystalline silicon membrane, form silicon carbide film layer.
Preferably, described formation silicon carbide film layer, specifically include: utilize laser-induced chemical gas-phase deposition to form described silicon carbide film layer.
In concrete preparation process, it is possible to select suitable membrane structure according to demand, for instance, preparation membrane structure as shown in Figure 2. First, it is provided that a base material, described base material can be transparent flexible parent metal, for instance PET. Then, deposit one layer of non-crystalline silicon on the upper and lower surface of described base material simultaneously, utilize induced with laser or high-temperature annealing process forms polycrystalline silicon membrane; After defining polycrystalline silicon membrane, with noble gases such as argon for carrier, with the mixture containing carbon or derivant for raw material, it is thermal source heating (temperature is 350 DEG C �� 17 DEG C) by laser instrument, utilize the Inert gas molecule absorption to specific wavelength laser, thus causing the laser induced breakdown of gas molecule, thus, utilize pyrolysis, photosensitization and laser-induced chemical vapour deposition mode to form silicon carbide film layer. By above induced with laser chemical vapor deposition mode, can accurately control the response magnitude of polysilicon and carbon raw material, and, described in the purity of silicon carbide film layer that is prepared from is higher, optical transmittance is up to more than 98%, shore intensity, between 7��9, has good intensity and resistance to marring.
Although preferred embodiments of the present invention have been described, but those skilled in the art are once know basic creative concept, then these embodiments can be made other change and amendment. So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, the present invention can be carried out various change and modification without deviating from the spirit and scope of the present invention by those skilled in the art. So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.