CN103887294A - LED light-emitting device and manufacture method thereof - Google Patents
LED light-emitting device and manufacture method thereof Download PDFInfo
- Publication number
- CN103887294A CN103887294A CN201210559668.0A CN201210559668A CN103887294A CN 103887294 A CN103887294 A CN 103887294A CN 201210559668 A CN201210559668 A CN 201210559668A CN 103887294 A CN103887294 A CN 103887294A
- Authority
- CN
- China
- Prior art keywords
- led
- carrier
- led light
- wafer
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to the LED light-emitting technology and specifically provides an LED light-emitting device and a manufacture method thereof. The LED light-emitting device comprises the following parts: an LED light-emitting mechanism which comprises LED chips and is capable of emitting light omni-directionally; a package structure member which is a transparent body and is wrapped outside the LED light-emitting mechanism; and a pair of electrodes which are electrically connected with the LED light-emitting mechanism and extend to the outer side of the package structure member. Besides, the invention also provides the manufacture method of the LED light-emitting device. According to the LED light-emitting device provided or manufactured in the invention, not only the light-emitting efficiency of the LED light-emitting device can be improved, but also the production of heat can be reduced; and therefore, the LED light-emitting device has the advantages of being high in light-emitting efficiency, high in reliability, and long in usage life and the like.
Description
Technical field
The present invention relates to LED luminescence technology, be specifically related to a kind of LED light-emitting device and manufacture method thereof.
Background technology
LED (Light Emitting Diode, light-emitting diode), because of plurality of advantages such as it has energy-saving and environmental protection, lightweight, the life-span is long, volume is little, stable performances, has been applied to a lot of fields.Especially at lighting field, LED is more and more widely used especially, and is regarded as one of principal light source of following illumination.
The encapsulation of existing LED light-emitting device, normally on metallic support or metal substrate, penetrate PPA (Polyphthalamide, polyphthalamide) or engineering plastics, form an optics bowl cup, in optics bowl cup, fix one or more LED wafers, and make multiple LED wafer series/parallels by plain conductor in optics bowl cup inside, then in optics bowl cup, fill the colloid that is mixed with fluorescent material.Adopt the LED light-emitting device of this packing forms, the light sending because of metallic support or the light tight LED of the making wafer of metal substrate itself can not see through support or substrate outwards be exported, and this causes the light extraction efficiency of this LED light-emitting device lower; And the light of output can not produce a large amount of heat and LED wafer without independent passage of heat in optics bowl cup, this heat that LED wafer is produced is too concentrated, and then causes the reliability of LED to be linear rule declining.In fact, the light output variable of existing LED light-emitting device only accounts for its energy-producing 20%-30%, and the energy of remaining 70%-80% is all used for producing heat and fails to be utilized.Therefore, how to improve LED light-emitting device light extraction efficiency, strengthen its application function and extend its useful life and just become people's problem demanding prompt solution.
Summary of the invention
For addressing the above problem, the invention provides a kind of LED light-emitting device, it not only can improve the light extraction efficiency of LED light-emitting device, and can reduce the generation of heat, thereby has that light extraction efficiency is high, reliability is high and the feature such as long service life.
For addressing the above problem, the present invention also provides a kind of manufacture method of LED light-emitting device, adopts the LED light-emitting device that obtains of the method to have that light extraction efficiency is high, reliability is high and the feature such as long service life.
For this reason, the invention provides a kind of LED light-emitting device, it comprises: LED lighting means, and it comprises LED wafer and energy is omnibearing luminous; Encapsulating structure part, it is the transparent body and the periphery that is coated on described LED lighting means; And pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure part.
Wherein, described LED lighting means comprises multiple LED wafers of electric connection, and in described multiple LED wafers, the LED wafer in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes.
Wherein, described LED lighting means also comprises carrier, and described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier.
Wherein, between the loading end of described carrier and the faying face of described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or on non-binding of described LED wafer, being formed with the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
Wherein, the even thickness of described the first adhesive layer and/or described the second adhesive layer.
Wherein, in described the first adhesive layer and/or in described the second adhesive layer, also include fluorescent material.
Wherein, described encapsulating structure part envelope described carrier loading end wafer calmodulin binding domain CaM and on the described LED wafer fixed.
Wherein, in the cross section of the length direction perpendicular to described carrier, the coated angle of described encapsulating structure part take central angle as 360 degree is by completely coated in circumferential direction to described carrier and described LED wafer.
Wherein, in the cross section of the length direction perpendicular to described carrier, the setting position of described LED lighting means departs from described encapsulating structure Jian center.
Wherein, described pair of electrodes is the electrode slice of pair of metal, and be provided with electrode slice assembly section at the two ends of described carrier, described in each, in electrode slice assembly section, be provided with position limiting structure, described electrode slice is positioned in described electrode slice assembly section by means of described position limiting structure.
Wherein, on the fitting surface of described electrode slice and/or in the electrode slice assembly section of described carrier, be provided with close-fitting groove, described close-fitting groove is V-shaped, " Y " shape, "-" shape, "+" shape, " * " shape, " well " shape, " mouth " shape or " work " shape; And/or be provided with the mark that is used to indicate electrode slice polarity in the region that extends in described encapsulating structure part outside on described electrode slice.
Wherein, the surface of described carrier is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, is translucent body from the appearance with the carrier in described alligatoring reflector.
Wherein, the material of described encapsulating structure part comprises one or more in silica gel, silicones, epoxy resin and modified resin; And the material of described carrier comprises the one in glass, pottery and plastics.
Wherein, described encapsulating structure part and/or described carrier also include fluorescent material.
Wherein, described multiple LED wafers are all blue light wafer, or are all the arbitrary visible ray wafer beyond blue light, or are the combination of blue light wafer and other visible ray wafer.
As another scheme, the present invention also provides a kind of manufacture method of LED light-emitting device,, form encapsulating structure part transparent and that can be coated described LED lighting means in the periphery of LED lighting means, and making the pair of electrodes being electrically connected with described LED lighting means extend to the outside of described encapsulating structure part, described LED lighting means comprises LED wafer and energy is omnibearing luminous.
Wherein, the quantity of described LED wafer is multiple, described multiple LED wafers are electrically connected to each other and make described LED lighting means, and make the LED wafer in current delivery upstream/downstream in described multiple LED wafer respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes.
Wherein, the quantity of described LED wafer is multiple, described multiple LED wafers are fixed on the loading end of carrier, then described multiple LED wafers are electrically connected to each other and make described LED lighting means, and make the LED wafer in current delivery upstream/downstream in described multiple LED wafer respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes, the material of described carrier comprises the one in glass, pottery and plastics.
Wherein, between the loading end of described carrier and/or the faying face of described LED wafer, form the first transparent adhesive layer, and described LED wafer is fixed on the loading end of described carrier via described the first adhesive layer, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or on non-binding of described LED wafer, forming the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
Wherein, make to comprise fluorescent material in described the first adhesive layer and/or in described the second adhesive layer.
Wherein, make described encapsulating structure part envelope described carrier loading end wafer calmodulin binding domain CaM and on the described LED wafer fixed.
Wherein, in the cross section of the length direction perpendicular to described carrier, form described encapsulating structure part, make its coated angle take central angle as 360 degree by completely coated in circumferential direction to described carrier and described LED wafer.
Wherein, the position of described LED lighting means can be set like this, make in the cross section of the length direction perpendicular to described carrier, described LED lighting means departs from described encapsulating structure Jian center.
The manufacture method of LED light-emitting device provided by the invention also comprises: roughening treatment is carried out in the surface of carrier, its surface is formed be the alligatoring reflector of concaveconvex structure, making with the carrier in described alligatoring reflector is translucent body from the appearance.
With respect to prior art, the present invention has following beneficial effect:
In LED light-emitting device provided by the invention, LED lighting means can be omnibearing luminous, and the peripheral encapsulating structure part that is coated on this LED lighting means is the transparent body, therefore can to realize multidimensional luminous for this LED light-emitting device, this not only can improve the light extraction efficiency of LED light-emitting device, and can reduce and produce the bad phenomenon such as a large amount of heat because light output variable is few described in background technology, thereby improve this LED light-emitting device reliability, extend its useful life.
In a preferred embodiment of LED light-emitting device provided by the invention, be the transparent body for the carrier that carries LED wafer, and the surface at this transparent body is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, this not only can strengthen reflection of light and further improve light extraction efficiency, but also can be by making binding agent be filled to the adhesion that strengthens LED wafer and carrier in concaveconvex structure.
Similarly, in the manufacture method of LED light-emitting device provided by the invention, because LED lighting means used can be omnibearing luminous, and form encapsulating structure part transparent and that can be coated this LED lighting means in the periphery of this LED lighting means, therefore, it is luminous that the LED light-emitting device that adopts the method manufacture to obtain can be realized multidimensional, this not only can improve the light extraction efficiency of this LED light-emitting device, and can reduce and produce the bad phenomenon such as a large amount of heat because light output variable is few described in background technology, thereby improve the reliability of this LED light-emitting device, extend its useful life.
In a preferred embodiment of manufacture method provided by the invention, because LED lighting means used comprises the transparent carrier for carrying LED wafer, and roughening treatment is carried out in the surface of this transparent body makes its formation be the alligatoring reflector of concaveconvex structure, this not only can make to adopt LED light-emitting device that the method manufacture obtains further to improve light extraction efficiency because of light reflection enhancement, but also can make this LED light-emitting device because binding agent can be filled in concaveconvex structure, the adhesion between LED wafer and carrier be strengthened.
Accompanying drawing explanation
The front view of the LED light-emitting device that Figure 1A provides for first embodiment of the invention;
Figure 1B is the profile of the carrier in LED light-emitting device shown in Figure 1A;
The end view of the LED light-emitting device that Fig. 1 C provides for first embodiment of the invention;
The vertical view of the LED light-emitting device that Fig. 2 provides for first embodiment of the invention;
Fig. 3 A is the end view of the electrode slice in the LED light-emitting device that first embodiment of the invention is shown provides and the annexation between carrier;
Fig. 3 B is the partial enlarged drawing of Fig. 3 A;
Fig. 4 A is the vertical view of the electrode slice in the LED light-emitting device that first embodiment of the invention is shown provides and the annexation between carrier;
Fig. 4 B is the partial enlarged drawing of electrode slice in Fig. 4 A;
The index path of the LED light-emitting device that Fig. 4 C provides for first embodiment of the invention;
The front view of the another kind of encapsulating structure part in the LED light-emitting device that Fig. 4 D provides for first embodiment of the invention;
The front view of another the encapsulating structure part in the LED light-emitting device that Fig. 4 E provides for first embodiment of the invention;
The front view of the LED light-emitting device that Fig. 5 A provides for second embodiment of the invention;
The index path of the LED light-emitting device that Fig. 5 B provides for second embodiment of the invention;
The end view of the LED light-emitting device that Fig. 6 A provides for third embodiment of the invention;
The front view of the LED light-emitting device that Fig. 6 B provides for third embodiment of the invention;
Fig. 6 C is the front view of sealing position of encapsulating structure part;
The front view of the LED light-emitting device that Fig. 7 A provides for fourth embodiment of the invention;
The index path of the LED light-emitting device that Fig. 7 B provides for fourth embodiment of the invention;
The vertical view of the LED light-emitting device that Fig. 8 provides for fifth embodiment of the invention; And
The flow chart of the manufacture method of the LED light-emitting device that Fig. 9 provides for sixth embodiment of the invention.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, further describe and be used for implementing optimal way of the present invention below in conjunction with accompanying drawing.But embodiment shown below, is for the technical thought of LED light-emitting device provided by the invention and manufacture method thereof is specialized, not for invention thinking of the present invention is limited.And, each member size shown in the drawings and position relationship etc., just be only that explanation is more clear and definite amplifies exaggeration to some extent in order to make, and be not intended to limit actual member size and proportionate relationship.
The invention provides a kind of LED light-emitting device, it comprises following assembly: comprise LED wafer LED lighting means that can be omnibearing luminous, be coated on the transparent encapsulating structure part of this LED lighting means periphery and be electrically connected and extend to the pair of electrodes of encapsulating structure part outside with this LED lighting means.And the quantity of the LED wafer in LED lighting means can be one or more.
Wherein, LED lighting means can comprise multiple LED wafers of electric connection, and in described multiple LED wafers, LED wafer in the upstream of current delivery is connected with the positive electrode in above-mentioned pair of electrodes, is connected with the negative electrode in above-mentioned pair of electrodes in the LED wafer in the downstream of current delivery.The so-called LED wafer in the upstream of current delivery refers to that LED wafer that first electric current flows through in these LED wafers; The so-called LED wafer in the downstream of current delivery refers to that LED wafer that electric current is finally flowed through in these LED wafers.In fact in the upstream of current delivery/LED wafer and the LED wafer setting position physically inconsistent in downstream, that is, in these LED wafers, may not be geographically, upstream in current delivery/downstream in the LED wafer at two ends.Only have in the time that described multiple LED wafers are electrically connected by wire successively according to its setting position, the LED wafer in the upstream of current delivery and the LED wafer in the downstream of current delivery are just those two wafers in end in described multiple LED wafer.And above-mentioned electrode can be wire, stick electrode, shape electrode (referred to as electrode slice) in the form of sheets etc., just can adopt as long as can realize the conductor of the electric connection between LED wafer and the power supply in LED lighting means, and needn't limit its shape.
In actual applications, LED lighting means also comprises transparent carrier, and described one or described multiple LED wafer that LED lighting means comprises are arranged on the loading end of this carrier.So-called loading end refer on this carrier for the surface of LED wafer is set.Preferably, the surface of carrier is formed with through roughening treatment the alligatoring reflector that is concaveconvex structure, is translucent from the appearance with the carrier in the alligatoring reflector of concaveconvex structure.
In LED light-emitting device provided by the invention, because LED lighting means can be omnibearing luminous, and the peripheral encapsulating structure part that is coated on this LED lighting means is the transparent body, therefore can to realize multidimensional luminous for this LED light-emitting device, this not only can improve the light extraction efficiency (in fact, the light extraction efficiency of LED light-emitting device provided by the invention exceeds 30%-50% than the light extraction efficiency of existing LED light-emitting device) of LED light-emitting device; And can reduce and produce the bad phenomenon such as a large amount of heat because light output variable is few described in background technology, thereby improve this LED light-emitting device reliability, extend its useful life.
It is pointed out that in the application so-called omnibearing luminous referring to, this LED lighting means itself is done as a wholely can export the light that the LED wafer that comprised by it sends to all directions.That is to say, in the time that LED lighting means does not comprise carrier, the so-called omnibearing luminous light directly being sent to all directions by LED wafer that refers to; In the time that LED lighting means comprises carrier, so-called omnibearing luminous refer to the light directly being sent to all directions by LED wafer and sent by LED wafer and see through carrier and the light exported.In the application, in the time that explanation is omnibearing luminous, can ignore set wire stopping luminous light path in LED lighting means.
The first embodiment
See also Figure 1A to Fig. 4 E, wherein show the structure of the LED light-emitting device that first embodiment of the invention provides.LED light-emitting device 10 in the present embodiment comprises: carrier 11, multiple LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and encapsulating structure part 13.And the LED lighting means in the present embodiment comprises carrier 11, multiple LED wafer 12 and is connected to the plain conductor 18 between multiple LED wafers 12.
In the present embodiment, carrier 11 is the transparent base being formed by glass, pottery, plastic or other material.The surface of carrier 11 forms and has the alligatoring reflector 28 of concaveconvex structure through roughening treatment, and this makes carrier 11 body that is translucent from the appearance, as shown in Figure 1B.And in the longitudinal section in alligatoring reflector 28 (, the cross section obtaining perpendicular to paper direction), the shape of the bossing in concaveconvex structure can be semicircle, ellipse, zigzag, triangle etc.The light that LED wafer 12 can be sent by the alligatoring reflector 28 with concaveconvex structure reflects, and carries out light beam mutual coupling, evenly soft with the light that this LED light-emitting device 10 is exported.In actual applications, can, according to the ray structure of different LED wafer 12, alligatoring in various degree be carried out in each surface of carrier 11, make it have different concaveconvex structure shapes, the recessed degree of depth and height of projection etc.
In the present embodiment, multiple LED wafers 12 are realized and being electrically connected by plain conductor 18, for example, and series, parallel or series-parallel connection, and between the loading end of carrier 11 and the faying face of LED wafer 12, be formed with the first transparent adhesive layer 15.Particularly, in the region fitting with multiple LED wafers 12 on the loading end in alligatoring reflector 28, and/or apply the first binding agent in the region fitting with alligatoring reflector 28 on multiple LED wafers 12, and multiple LED wafers 12 are fitted with alligatoring reflector 28 and realize the fixing of LED wafer 12.Be appreciated that, because the surface of carrier 11 is formed with the alligatoring reflector 28 with concaveconvex structure, therefore the first adhesive layer 15 can be filled in the recess in alligatoring reflector 28, thereby can strengthen the snap-in force between the first adhesive layer 15 and carrier 11, and then increase the adhesion between LED wafer 12 and carrier 11, strengthen the reliability of these LED light-emitting device 10 entirety with this.In addition, in the non-fit area on the loading end in alligatoring reflector 28 and in the non-fit area on LED wafer 12 surfaces, apply the second adhesive layer 16.Wherein, the two mixes the first adhesive layer 15 and the second adhesive layer 16 by transparent adhesive tape and fluorescent material, and material and the mixing ratio etc. of the two selected transparent adhesive tape can be identical or different.
In actual applications, in the time of light-emitting device that LED light-emitting device 10 is ordinary monochromatic light, multiple LED wafers 12 are all corresponding common monochromatic LED wafer 12, and for example, multiple LED wafers 12 are all blue light wafer or are all the arbitrary visible ray wafer beyond blue light.In the time that LED light-emitting device 10 is the light-emitting device of high light efficiency, high color rendering index (CRI), multiple LED wafers 12 comprise the LED wafer 12a of blue light and the LED wafer 12b of redness (or yellow) light, and between red (or yellow) LED wafer 12b of light and the LED wafer 12a of blue light apart from one another by and distribution equably, example as shown in Figure 2, the LED wafer 12b of a redness (or yellow) light is set, to realize sufficient mixed light at interval of the LED wafer 12a of two continuous blue lights.Be uniformly distributed and refer to regular distribution in this what is called, for example, two, an interval blue led wafer and redness (or yellow) light LED wafer is set; And so-called regular distribution is not limited to above-mentioned distribution and interval mode, but can adjusts and set according to actual conditions.
In the present embodiment, pair of electrodes sheet (20a, 20b) is as the positive/negative electrode of LED light-emitting device 10, be separately positioned on the two ends of carrier 11 and be arranged on LED wafer 12 on the two ends of carrier 11 at a distance of 0.5mm at least, and realize and being electrically connected with LED wafer 12 by plain conductor 18.For ease of the polarity at identification LED light-emitting device 10 two ends, front and/or the back side at pair of electrodes sheet (20a, 20b) are provided with the positive pole mark (21) that is labeled as "+" and the negative pole mark (22) that is labeled as "-", as shown in Figure 2.And, in the assembly area of pair of electrodes sheet (20a, 20b), form the groove shape close-fitting structure 30 of " X " shape, as shown in Fig. 4 A and 4B, to make partial fixing thing (26a, 26b) be filled in the groove of close-fitting structure 30 and in the recess in alligatoring reflector 28, to strengthen the bond strength of pair of electrodes sheet (20a, 20b) and carrier 11 in assembling process.Wherein, fixture (26a, 26b) can adopt the materials such as the elargol of high temperature resistant and high-viscosity glue, tin cream or high heat conduction high adhesion, and the thickness of fixture (26a, 26b) between carrier 11 and electrode slice (20a, 20b) is at least more than 0.5mm.As for the shape of close-fitting structure 30, can certainly be designed to the shapes such as " V ", " Y ", "-", "+", " * ", " well ", " mouth ", " work " font, do not do concrete restriction at this.
In addition, for more accurately, more quickly electrode slice (20a, 20b) is positioned and assembled, the electrode slice assembly area on carrier 11 is provided with for spacing position limiting structure, for example, terraced steps 27 shown in Fig. 3 A and Fig. 3 B.Certainly, also can adopt the position limiting structure of other shape or form, not do concrete restriction at this.
In the present embodiment, encapsulating structure part 13 is arranged on the loading end side in the alligatoring reflector 28 of carrier 11, for the assembly area on carrier 11, LED wafer 12 and electrode slice (20a, 20b) is enveloped.Encapsulating structure part 13 is the transparent body, and its material can be one or more in the materials such as silica gel, silicones, epoxy resin and modified resin, and it can be semicircle, oval, square etc. perpendicular to the cross sectional shape on electrode slice (20a, 20b) bearing of trend, as shown in Figure 1A.
In the present embodiment, as shown in Figure 4 C, owing to being coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material in the region fitting in multiple LED wafers 12 and alligatoring reflector 28, and in non-fit area on the loading end in alligatoring reflector 28 and be coated with the second adhesive layer 16 that comprises transparent adhesive tape and fluorescent material in the non-fit area on LED wafer 12 surfaces, therefore, a part of light 100a that LED wafer 12 sends can see through transparent the first adhesive layer 15 and carrier 11 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can see through transparent the second adhesive layer 16 and encapsulating structure part 13 and output to the outside of this LED light-emitting device 10, thereby it is luminous to realize multidimensional, and in the time that LED wafer 12 is blue-ray LED wafer, adopt above-mentioned encapsulating structure, can make the surrounding of each blue-ray LED wafer 12 be coated with equably the mixed layer of transparent adhesive tape and fluorescent material, and its a part of light 100a sending is by exciting the fluorescent material in the first adhesive layer 15 also to see through the first adhesive layer 15 and carrier 11 and outwards export white light, another part light 100b that it sends is by exciting the fluorescent material in the second adhesive layer 16 also to see through the second adhesive layer 16 and encapsulating structure part 13 and outwards export white light, thereby can outwards export uniform white light.
It should be noted that, in the present embodiment, the external diameter of the surperficial external diameter that the loading end with carrier 11 of encapsulating structure part 13 is relative and the loading end of carrier 11 equates, , on the loading end of carrier 11, the projected outline of encapsulating structure part 13 overlaps completely with the profile of the loading end of carrier 11, but the present invention is not limited thereto, in actual applications, as shown in Fig. 4 D and 4E, also can make the relative surperficial external diameter L of the loading end with carrier 11 of encapsulating structure part 13 be greater than the D outer diameter of the loading end of carrier 11, can also make the relative surperficial external diameter L ' of the loading end with carrier 11 of encapsulating structure part 13 be less than the D outer diameter of the loading end of carrier 11, as long as encapsulating structure part 13 can envelope carrier 11 loading end wafer calmodulin binding domain CaM and on fixing LED wafer 12.
The second embodiment
Refer to Fig. 5 A and Fig. 5 B, the structure of the LED light-emitting device that shown in it, second embodiment of the invention provides.Be similar to aforementioned the first embodiment, the LED light-emitting device 10 that the second embodiment provides comprises carrier 11, multiple LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and the encapsulating structure part 13 for coated carrier 11, multiple LED wafer 12, pair of electrodes sheet (20a, 20b) and plain conductor 18.And the LED lighting means in the present embodiment comprises carrier 11, multiple LED wafer 12 and is connected to the plain conductor 18 between multiple LED wafers 12.
Wherein, the generation type in the alligatoring reflector 28 on the material of carrier 11 and surface thereof and face shaping, electric connection mode, the cross sectional shape of encapsulating structure part 13 etc. of multiple LED wafer 12 each other and between LED wafer 12 and electrode slice (20a, 20b) are all similar to aforementioned the first embodiment, do not repeat them here.
Describe the part that the second embodiment is different from the first embodiment below in detail.
In a second embodiment, encapsulating structure part 13 is the transparent body, and its material is the mixture of transparent adhesive tape and fluorescent material, is similar to the second adhesive layer in aforementioned the first embodiment.And, only in the region fitting with alligatoring reflector 28 in the region fitting with multiple LED wafers 12 on the loading end in alligatoring reflector 28 and/or on multiple LED wafers 12, apply the first adhesive layer 15, and not in the non-fit area on the loading end in alligatoring reflector 28 and/or apply again the second adhesive layer 16 in the non-fit area on LED wafer 12 surfaces.
In the present embodiment, as shown in Figure 5 B, owing to being coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material in the region fitting in multiple LED wafers 12 and alligatoring reflector 28, and encapsulating structure part 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, a part of light 100a that LED wafer 12 sends can see through transparent the first adhesive layer 15 and carrier 11 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can output to through transparent encapsulating structure part 13 outside of this LED light-emitting device 10, thereby it is luminous to realize multidimensional, and in the time that LED wafer 12 is blue-ray LED wafer, its a part of light 100a sending is by exciting the fluorescent material in the first adhesive layer 15 also to see through the first adhesive layer 15 and carrier 11 and outwards export white light, another part light 100b that it sends outwards exports white light by the fluorescent material in excite encapsulated structural member 13 and through encapsulating structure part 13, thereby can outwards export uniform white light.
The 3rd embodiment
See also Fig. 6 A to 6C, the structure of the LED light-emitting device that shown in it, third embodiment of the invention provides.Be similar to aforementioned the first embodiment, the LED light-emitting device 10 that the 3rd embodiment provides comprises carrier 11, multiple LED wafer 12, pair of electrodes sheet (20a, 20b), plain conductor 18 and the encapsulating structure part 13 for coated carrier 11, multiple LED wafer 12, pair of electrodes sheet (20a, 20b) and plain conductor 18.And the LED lighting means in the present embodiment comprises carrier 11, multiple LED wafer 12 and is connected to the plain conductor 18 between multiple LED wafers 12.
In the present embodiment, electric connection mode between the generation type in the alligatoring reflector 28 on the material of carrier 11 and surface thereof and face shaping, multiple LED wafer 12 and between LED wafer 12 and electrode slice etc. is all similar to aforementioned the first embodiment, does not repeat them here.
Describe the part that the 3rd embodiment is different from the first embodiment below in detail.
In the 3rd embodiment, in the region fitting with alligatoring reflector 28 in the region fitting with multiple LED wafers 12 on the loading end in alligatoring reflector 28 and/or on multiple LED wafers 12, apply the first adhesive layer 15 that only comprises transparent adhesive tape, and not in the non-fit area on the loading end in alligatoring reflector 28 and/or apply again the second adhesive layer 16 that comprises transparent adhesive tape and fluorescent material in the non-fit area on LED wafer 12 surfaces.The material of encapsulating structure part 13 is transparent adhesive tape and phosphor mixture, is similar to the second binding agent in aforementioned the first embodiment; And, encapsulating structure part 13 is along the circle that is shaped as in the cross section obtaining perpendicular to electrode slice (20a, 20b) bearing of trend,, in the plane perpendicular to electrode slice (20a, 20b) bearing of trend, encapsulating structure part 13 with the coverage of 360 ° of central angles (, coated angle take central angle as 360 degree) by completely coated in circumferential direction the device district of carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, 20b), as shown in Fig. 6 B and 6C.
In the present embodiment, as shown in Figure 6B, because encapsulating structure part 13 is perpendicular to electrode slice (20a, 20b) the interior coverage with 360 ° of central angles of the plane of bearing of trend is by carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, device district 20b) is completely coated, and encapsulating structure part 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15, carrier 11 and encapsulating structure part 13 and output to the outside of this LED light-emitting device 10, and another part light 100b that LED wafer 12 sends can output to through transparent encapsulating structure part 13 outside of this LED light-emitting device 10, thereby it is luminous to realize multidimensional, and in the time that LED wafer 12 is blue-ray LED wafer, its a part of light 100a sending is by exciting the fluorescent material in the first adhesive layer 15 and encapsulating structure part 13 and outwards exporting white light through the first adhesive layer 15, carrier 11 and encapsulating structure part 13, another part light 100b that it sends outwards exports white light by the fluorescent material in excite encapsulated structural member 13 and through encapsulating structure part 13, thereby can outwards export uniform white light.
Further, excite the color of the light that the fluorescent material in circular encapsulating structure part 13 sends inconsistent for the power of the light (100a, 100b) that prevents from sending because of the different light-emitting areas of LED wafer 12 is different, seal position (to encapsulating structure part 13 in the present embodiment, the setting position of the setting position of LED lighting means or LED wafer 12) do to limit as follows: make 1/2 the eccentric position of LED lighting means in encapsulating structure part 13,, make the top light emitting face of LED wafer 12 be positioned at the center of encapsulating structure part 13, as shown in Figure 6 C.Certainly,, in the time that the color of the light that will send changes, sealing position and can doing as required corresponding trickle adjustment of its encapsulating structure part 13, does not do clear and definite restriction at this.
The 4th embodiment
See also Fig. 7 A and 7B, the structure of the LED light-emitting device that shown in it, fourth embodiment of the invention provides.The LED light-emitting device that the 4th embodiment provides is similar to aforementioned the 3rd embodiment, the difference of the two is only the shape difference of encapsulating structure part 13, and the encapsulating structure part 13 in the 4th embodiment is square along being shaped as of the cross section obtaining perpendicular to electrode slice (20a, 20b) bearing of trend.
In fact, the cross sectional shape of encapsulating structure part 13 can also be the shapes such as ellipse, rhombus, as long as this encapsulating structure part 13 can the coverage with 360 ° of central angles be coated the device district of carrier 11, LED wafer 12, plain conductor 18 and electrode slice (20a, 20b) completely in the plane perpendicular to electrode slice (20a, 20b) bearing of trend.
The 5th embodiment
Refer to Fig. 8, the structure of the LED light-emitting device that shown in it, fifth embodiment of the invention provides.The difference of the 5th embodiment and aforementioned each embodiment is: in the present embodiment, the width of carrier 11 is wider, the many rows of device LED wafer 12 on carrier 11, the device mode of each row LED wafer 12 is similar to aforementioned each embodiment, and respectively arrange LED wafer 12 and carry out the electric connection of series/parallel by the plain conductor 18 being electrically connected, finally be connected to electrode slice (20a, 20b) by the LED wafer 12 that is arranged on carrier 11 two ends via plain conductor 18, so that realize external electric connection.
In actual applications, length and the width of the carrier 11 in LED light-emitting device 10 are not construed as limiting, and are also not construed as limiting for the row of the LED wafer 12 of device on carrier 11.
In addition,, as another scheme, the present invention also provides a kind of manufacture method of LED light-emitting device.Wherein, form encapsulating structure part transparent and that can be coated LED lighting means in the periphery of LED lighting means, and making the pair of electrodes being electrically connected with this LED lighting means extend to the outside of encapsulating structure part, described LED lighting means energy is omnibearing luminous and can comprise individual or multiple LED wafers.
When the quantity of LED wafer is multiple, described multiple LED wafers are electrically connected to each other and make described LED lighting means, and make the LED wafer in current delivery upstream/downstream in described multiple LED wafer respectively with the corresponding connection of positive electrode/negative electrode in above-mentioned pair of electrodes.And, when needs manufacture is when being useful on the LED light-emitting device of carrier of bearing wafer, described multiple LED wafers need to be fixed on the loading end of carrier, then described multiple LED wafers are electrically connected to each other to make described LED lighting means.
The 6th embodiment
Refer to Fig. 9, and please again consult Figure 1A to Fig. 4 E, in order to manufacture the LED light-emitting device in aforementioned the first embodiment, first in step 610, roughening treatment is carried out in the surface of carrier 11, its surface being formed with and being the alligatoring reflector 28 of concaveconvex structure, is translucent body thereby make with the carrier 11 in this alligatoring reflector 28 from the appearance.
As for material, the luminous light path of prepared LED light-emitting device etc. of carrier in the present embodiment 11, LED wafer 12, the first adhesive layer 15 and the second adhesive layer 16, be all similar to described in aforementioned the first embodiment, do not repeat them here.
In the manufacture method of the LED light-emitting device providing at the present embodiment, because LED lighting means used can be omnibearing luminous, and form encapsulating structure part transparent and that can be coated this LED lighting means in the periphery of this LED lighting means, therefore, it is luminous that the LED light-emitting device that adopts the method manufacture to obtain can be realized multidimensional, this not only can improve the light extraction efficiency of this LED light-emitting device, and can reduce and produce the bad phenomenon such as a large amount of heat because light output variable is few described in background technology, thereby improve the reliability of this LED light-emitting device, extend its useful life.
Please again consult Fig. 6 A to Fig. 7 B, in order to manufacture the LED light-emitting device in aforementioned the 3rd embodiment or the 4th embodiment, can between the loading end of carrier 11 and the faying face of LED wafer 12, form the first transparent adhesive layer 15, and LED wafer 12 is fixed on the loading end of carrier 11 via the first adhesive layer 15; Then form encapsulating structure part 13, make this encapsulating structure part 13 in circumferential direction by completely coated to carrier 11 and LED wafer 12,, in the cross section of the length direction perpendicular to described carrier, the coated angle of this encapsulating structure part 13 take central angle as 360 degree is by completely coated in circumferential direction to described carrier and described LED wafer, as shown in Fig. 6 A to Fig. 7 B.
Please again consult Fig. 6 C, in the time manufacturing LED light-emitting device, the position of LED lighting means can be set like this, make in the cross section of the length direction perpendicular to carrier 11, LED lighting means departs from encapsulating structure Jian13 center.
Be understandable that, in actual applications, can determine whether according to actual needs the surface of carrier to carry out roughening treatment.And, can carry out following selection depending on concrete condition: whether the non-binding region on the loading end of carrier applies the first adhesive layer, whether apply the second adhesive layer in the non-binding district of LED wafer, whether make encapsulating structure part complete encapsulation vehicle and LED wafer in circumferential direction, and whether make to comprise fluorescent material in the first adhesive layer, the second adhesive layer, encapsulating structure part and/or carrier.In addition, although the LED light-emitting device in aforementioned each embodiment includes carrier, but also can not comprise in actual applications carrier, but directly multiple or 1 LED wafer are placed in encapsulating structure body, and when the quantity of LED wafer is while being multiple, can by wire, described multiple LED wafers be electrically connected in advance, then the described multiple LED wafers (being similar to common bangle) that connect are fixed in encapsulating structure body, for example first be fixed in a part of spherical crown plane in encapsulating structure part, reprocessing forms another part spherical crown of encapsulating structure part.
The illustrative embodiments that will also be appreciated that above execution mode to be only used to principle of the present invention is described and to adopt, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (24)
1. a LED light-emitting device, is characterized in that, comprising:
LED lighting means, it comprises LED wafer and energy is omnibearing luminous;
Encapsulating structure part, it is the transparent body and the periphery that is coated on described LED lighting means; And
Pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure part.
2. LED light-emitting device according to claim 1, it is characterized in that, described LED lighting means comprises multiple LED wafers of electric connection, and in described multiple LED wafers, the LED wafer in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes.
3. LED light-emitting device according to claim 1 and 2, is characterized in that, described LED lighting means also comprises carrier, and described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier.
4. LED light-emitting device according to claim 3, it is characterized in that, between the loading end of described carrier and the faying face of described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or
On non-binding of described LED wafer, be formed with the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
5. LED light-emitting device according to claim 4, is characterized in that, the even thickness of described the first adhesive layer and/or described the second adhesive layer.
6. LED light-emitting device according to claim 4, is characterized in that, in described the first adhesive layer and/or in described the second adhesive layer, also includes fluorescent material.
7. LED light-emitting device according to claim 3, is characterized in that, described encapsulating structure part envelope described carrier loading end wafer calmodulin binding domain CaM and on the described LED wafer fixed.
8. LED light-emitting device according to claim 7, it is characterized in that, in the cross section of the length direction perpendicular to described carrier, the coated angle of described encapsulating structure part take central angle as 360 degree is by completely coated in circumferential direction to described carrier and described LED wafer.
9. LED light-emitting device according to claim 8, is characterized in that, in the cross section of the length direction perpendicular to described carrier, the setting position of described LED lighting means departs from described encapsulating structure Jian center.
10. LED light-emitting device according to claim 3, it is characterized in that, described pair of electrodes is the electrode slice of pair of metal, and be provided with electrode slice assembly section at the two ends of described carrier, described in each, in electrode slice assembly section, be provided with position limiting structure, described electrode slice is positioned in described electrode slice assembly section by means of described position limiting structure.
11. LED light-emitting devices according to claim 10, it is characterized in that, on the fitting surface of described electrode slice and/or in the electrode slice assembly section of described carrier, be provided with close-fitting groove, described close-fitting groove is V-shaped, " Y " shape, "-" shape, "+" shape, " * " shape, " well " shape, " mouth " shape or " work " shape; And/or
In the region that extends in described encapsulating structure part outside on described electrode slice, be provided with the mark that is used to indicate electrode slice polarity.
12. according to the LED light-emitting device described in any one in claim 4 to 11, it is characterized in that, the surface of described carrier is formed with the alligatoring reflector that is concaveconvex structure through roughening treatment, is translucent body from the appearance with the carrier in described alligatoring reflector.
13. LED light-emitting devices according to claim 12, is characterized in that, the material of described encapsulating structure part comprises one or more in silica gel, silicones, epoxy resin and modified resin; And the material of described carrier comprises the one in glass, pottery and plastics.
14. LED light-emitting devices according to claim 13, is characterized in that, described encapsulating structure part and/or described carrier also include fluorescent material.
15. LED light-emitting devices according to claim 2, is characterized in that, described multiple LED wafers are all blue light wafer, or are all the arbitrary visible ray wafer beyond blue light, or are the combination of blue light wafer and other visible ray wafer.
The manufacture method of 16. 1 kinds of LED light-emitting devices, it is characterized in that, form encapsulating structure part transparent and that can be coated described LED lighting means in the periphery of LED lighting means, and making the pair of electrodes being electrically connected with described LED lighting means extend to the outside of described encapsulating structure part, described LED lighting means comprises LED wafer and energy is omnibearing luminous.
The manufacture method of 17. LED light-emitting devices according to claim 16, it is characterized in that, the quantity of described LED wafer is multiple, described multiple LED wafers are electrically connected to each other and make described LED lighting means, and make the LED wafer in current delivery upstream/downstream in described multiple LED wafer respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes.
The manufacture method of 18. LED light-emitting devices according to claim 16, it is characterized in that, the quantity of described LED wafer is multiple, described multiple LED wafers are fixed on the loading end of carrier, then described multiple LED wafers are electrically connected to each other and make described LED lighting means, and make the LED wafer in current delivery upstream/downstream in described multiple LED wafer respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes, wherein
The material of described carrier comprises the one in glass, pottery and plastics.
The manufacture method of 19. LED light-emitting devices according to claim 18, it is characterized in that, between the loading end of described carrier and/or the faying face of described LED wafer, form the first transparent adhesive layer, and described LED wafer is fixed on the loading end of described carrier via described the first adhesive layer, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or
On non-binding of described LED wafer, form the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
The manufacture method of 20. LED light-emitting devices according to claim 19, is characterized in that, makes to comprise fluorescent material in described the first adhesive layer and/or in described the second adhesive layer.
The manufacture method of 21. LED light-emitting devices according to claim 18, it is characterized in that, make described encapsulating structure part envelope described carrier loading end wafer calmodulin binding domain CaM and on the described LED wafer fixed, and the material of described encapsulating structure part comprises one or more in silica gel, silicones, epoxy resin and modified resin.
The manufacture method of 22. LED light-emitting devices according to claim 21, it is characterized in that, in the cross section of the length direction perpendicular to described carrier, form described encapsulating structure part, make its coated angle take central angle as 360 degree by completely coated in circumferential direction to described carrier and described LED wafer.
The manufacture method of 23. LED light-emitting devices according to claim 22, it is characterized in that, the position of described LED lighting means is set like this, makes in the cross section of the length direction perpendicular to described carrier, described LED lighting means departs from described encapsulating structure Jian center.
24. manufacture methods according to claim 18 to the LED light-emitting device described in any one in 23, characterized by further comprising: roughening treatment is carried out in the surface of carrier, its surface is formed be the alligatoring reflector of concaveconvex structure, making with the carrier in described alligatoring reflector is translucent body from the appearance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210559668.0A CN103887294A (en) | 2012-12-20 | 2012-12-20 | LED light-emitting device and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210559668.0A CN103887294A (en) | 2012-12-20 | 2012-12-20 | LED light-emitting device and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103887294A true CN103887294A (en) | 2014-06-25 |
Family
ID=50956120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210559668.0A Pending CN103887294A (en) | 2012-12-20 | 2012-12-20 | LED light-emitting device and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103887294A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157639A (en) * | 2014-08-28 | 2014-11-19 | 江苏索尔光电科技有限公司 | Full-angle light-emitting packaging module and forming method thereof |
| CN109560179A (en) * | 2017-09-26 | 2019-04-02 | 深圳光峰科技股份有限公司 | A kind of Wavelength converter and light emitting device |
| EP3739257A4 (en) * | 2018-01-10 | 2021-12-01 | Appotronics Corporation Limited | Wavelength conversion apparatus |
| TWI784361B (en) * | 2019-12-02 | 2022-11-21 | 億光電子工業股份有限公司 | LED light emitting device and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188700A1 (en) * | 1999-06-23 | 2004-09-30 | Citizen Electronics Co., Ltd. | Light emitting diode |
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
| WO2012031533A1 (en) * | 2010-09-08 | 2012-03-15 | 浙江锐迪生光电有限公司 | Led lamp bulb and led lighting bar capable of emitting light over 4π |
| CN202281062U (en) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | LED chip 4-Pi light-emitting LED bulb with high color rendering index |
| CN102738356A (en) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure |
-
2012
- 2012-12-20 CN CN201210559668.0A patent/CN103887294A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188700A1 (en) * | 1999-06-23 | 2004-09-30 | Citizen Electronics Co., Ltd. | Light emitting diode |
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
| WO2012031533A1 (en) * | 2010-09-08 | 2012-03-15 | 浙江锐迪生光电有限公司 | Led lamp bulb and led lighting bar capable of emitting light over 4π |
| CN102738356A (en) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | Light emitting diode packaging structure |
| CN202281062U (en) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | LED chip 4-Pi light-emitting LED bulb with high color rendering index |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157639A (en) * | 2014-08-28 | 2014-11-19 | 江苏索尔光电科技有限公司 | Full-angle light-emitting packaging module and forming method thereof |
| CN109560179A (en) * | 2017-09-26 | 2019-04-02 | 深圳光峰科技股份有限公司 | A kind of Wavelength converter and light emitting device |
| EP3739257A4 (en) * | 2018-01-10 | 2021-12-01 | Appotronics Corporation Limited | Wavelength conversion apparatus |
| US11296263B2 (en) | 2018-01-10 | 2022-04-05 | Appotronics Corporation | Wavelength conversion apparatus |
| TWI784361B (en) * | 2019-12-02 | 2022-11-21 | 億光電子工業股份有限公司 | LED light emitting device and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103939758A (en) | LED lighting device | |
| CN203857313U (en) | LED bulb lamp with high lighting effect | |
| CN202721174U (en) | Light emitting device, and lamp | |
| CN103840071B (en) | A kind of LED lamp bar manufacture method and LED lamp bar | |
| CN111219613A (en) | Method for manufacturing all-angle light-emitting bulb | |
| CN103943616A (en) | LED light emitting device | |
| CN101872827B (en) | LED packaging structure and method thereof | |
| CN103994349A (en) | LED bulb lamp with high lighting efficiency | |
| CN102881812B (en) | Manufacturing method for Light emitting diode packaging structure | |
| CN103887294A (en) | LED light-emitting device and manufacture method thereof | |
| CN102437273B (en) | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof | |
| CN203273326U (en) | LED (light emitting diode) illuminating device | |
| CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN203242621U (en) | Led luminescent device | |
| CN102148321A (en) | LED (Light Emitting Diode) white light fluorescent cap and manufacturing method thereof | |
| EP2416359A2 (en) | Warm white light led lamp with high luminance and high color rendering index | |
| CN202585408U (en) | Improved structure of a multilayer array-type light-emitting diode engine | |
| CN103178165A (en) | Light-emitting diode and manufacture method thereof | |
| CN103579457A (en) | LED integration packaging structure and method thereof | |
| CN203134856U (en) | LED light emitting device | |
| CN202996897U (en) | LED luminescent device and LED light fixture having the same | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN204704657U (en) | Integral LED electricity-saving lamp | |
| CN201966248U (en) | LED wafer component | |
| CN105336835A (en) | LED packaging structure and packaging method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140625 |