CN202996897U - LED luminescent device and LED light fixture having the same - Google Patents
LED luminescent device and LED light fixture having the same Download PDFInfo
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- CN202996897U CN202996897U CN 201220711975 CN201220711975U CN202996897U CN 202996897 U CN202996897 U CN 202996897U CN 201220711975 CN201220711975 CN 201220711975 CN 201220711975 U CN201220711975 U CN 201220711975U CN 202996897 U CN202996897 U CN 202996897U
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Abstract
The utility model provides an LED luminescent device and an LED light fixture having the same. The LED luminescent device comprises one or more packaging bodies and an LED subsrate. The one or more packaging bodies include one or more packaging substrates, one or more packaging housings, and one or more LED chips. One end/one ends of the one or more packaging housings has/have an opening or openings; and the opening end/ ends is/are fixed on the one or more packaging substrates. The one or more LED chips are fixed in an area formed by encircling of the opening ends of the packaging housings on the packaging housings. And one side or sides of the one or more packaging substrates of the one or more packaging bodies is or are fixed on the LED structure, wherein the one side or one sides are far away from the LED chips. Besides, the LED luminescent device also has a remote fluorescent housing; one end of the remote fluorescent housing has an opening and the opening end thereof is fixed on the LED substrate; and the one or more packaging bodies are arranged in an area formed by encircling of the opening end of the remote fluorescent housing and there is a gap between the one or more packaging bodies and the inner wall of the remote fluorescent housing. According to the utility model, the provided LED luminescent device has a prolonged service life and the improved luminous efficiency; and the repeatability and uniformity of the LED luminescent device are enhanced.
Description
Technical field
The utility model relates to lighting field, in particular to a kind of LED luminescent device and have its LED light fixture.
Background technology
The Semiconductor light-emitting diode lamp tool is LED(Light Emitting Diode) light fixture is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material, by charge carrier, compound energy of emitting surplus occurs and cause photo emissions in semiconductor, directly sends red, yellow, orange, green, blue or green, blue, purple, white light.The LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.LED be called as the 4th generation lighting source or green light source, have the characteristics such as energy-saving and environmental protection, the life-span is long, volume is little, can be widely used in the fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.
The manufacture craft of existing LED luminescent device is mainly: the blue led chip 13 ' that will be coated with phosphor powder layer 14 ' is welded on base plate for packaging 11 '; and adopt encapsulating housing 12 ' encapsulation to form the white-light LED encapsulation body this blue led chip 13 '; then base plate for packaging 11 ' is fixed on LED substrate 2 ', and a transparent shell 3 ' is set on base plate for packaging 2 ' the white-light LED encapsulation body is protected the LED luminescent device that obtains as shown in Figure 1.Particularity due to LED fluorescent material, the blue led chip 13 ' of present stage all can't be accomplished to apply fully uniformly when YAG fluorescent material applies, more or less all can produce color temperature distribution non-uniform phenomenon (the hot spot phenomenon that namely is commonly called as) when making light fixture, thereby the light sensation that greatly reduces the client is experienced.
Blue led chip 1 ' can produce certain heat in converting electric energy to the luminous energy process; And fluorescent material absorbs blue light, send gold-tinted or ruddiness, not only have Stokes shift, and also have very strong self-absorption process, these processes all can produce heat, and fluorescent material and chip package are in the same place, can improve the working temperature of whole system, make the chip long-term work under higher temperature, reduce reliability and the durability degree of chip, reduce the life-span of whole light fixture, also can cause the look drift simultaneously.The chip light emitting wavelength of different B in value in addition, half-breadth all can have difference, if fluorescent material directly is encapsulated on chip, this difference can be exaggerated, there is certain limit in the final production product, and can't regulate and control accurately product.
The utility model content
The utility model aims to provide a kind of LED luminescent device and has its LED light fixture, has realized the easily purpose of heat radiation of LED luminescent device.
According to an aspect of the present utility model, a kind of LED luminescent device is provided, comprising: one or more packaging bodies, packaging body comprises: base plate for packaging; Encapsulating housing, an end has opening, and openend is fixed on base plate for packaging; LED chip is fixed on base plate for packaging in the zone that the openend by encapsulating housing surrounds; The LED substrate, the base plate for packaging of one or more packaging bodies is fixed on the LED substrate away from a side of LED chip; The LED luminescent device also comprises the remote fluorescence housing, one end of remote fluorescence housing has opening, and openend is fixed on the LED substrate, and packaging body is arranged on the LED substrate in the zone that the openend by the remote fluorescence housing surrounds, and and the inwall of remote fluorescence housing between have the gap.
Further, be provided with the quanta point material layer on the inner surface of above-mentioned remote fluorescence housing or outer surface.
Further, the material of above-mentioned remote fluorescence housing is fluorescence silica gel.
Further, above-mentioned fluorescence silica gel is light transmittance higher than 95% fluorescence silica gel.
Further, above-mentioned remote fluorescence housing is one or more housings that are combined to form in cuboid housing, terrace with edge shape housing, cylindrical housings, truncated cone-shaped housing, hemispherical shell, candle flame housing and conical shell.
Further, above-mentioned remote fluorescence housing clamping, be spirally connected or be bonded on the LED substrate.
Further, the material at the top of above-mentioned encapsulating housing is silica gel or plastics.
Further, in above-mentioned packaging body, LED chip is one, and encapsulating housing is one, and LED chip is arranged on base plate for packaging in the zone that the openend by an encapsulating housing surrounds; Or LED chip is a plurality of, and encapsulating housing is one, and all LED chips are fixed on base plate for packaging in the zone that the openend by an encapsulating housing surrounds; Or LED chip is a plurality of, and encapsulating housing is a plurality of, and the quantity of LED chip is provided with one or more LED chips more than the quantity of encapsulating housing in the zone that the openend of each encapsulating housing surrounds; Or LED chip is a plurality of, and encapsulating housing is a plurality of, and the quantity of LED chip is identical with the quantity of encapsulating housing, is provided with accordingly a LED chip in the zone that the openend of each encapsulating housing surrounds.
Further, above-mentioned LED luminescent device also comprises polyhedron-shaped heat-conducting substrate, a surface of heat-conducting substrate is fixed on the LED substrate, is provided with packaging body at least one surface in remaining surface, and the side away from LED chip of the base plate for packaging of packaging body is fixed on heat-conducting substrate.
According on the other hand of the present utility model, a kind of LED light fixture also is provided, comprise the LED luminescent device, the LED luminescent device is above-mentioned LED luminescent device.
LED luminescent device of the present utility model, the remote fluorescence housing that will contain fluorescent material is isolated setting mutually as an independent accessory and LED chip, formed the remote excitation of LED chip pair and its remote fluorescent material that arranges, form white light, overcome heat that fluorescent powder coating in the prior art produces owing to exciting and be difficult to distribute short and luminous efficiency low problem in the useful life that causes the LED luminescent device when LED chip, due to the technology that adopts remote excitation fluorescent material, greatly reduce the working temperature of LED chip and encapsulating housing, thereby slowed down to a great extent the aging speed of these materials, and then extended life-span of LED luminescent device, and, cause that the colour temperature inequality of LED luminescent device produces the drawback of hot spot because can't accomplish evenly to apply when having avoided applying fluorescent material on LED chip, weaken simultaneously the impact that go out light effect of different B on the LED luminescent device, made the repeatability of product and uniformity strengthen.
Description of drawings
Figure of description is used to provide further understanding of the present utility model, consists of a part of the present utility model, and illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not consist of improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 shows the structural representation of LED luminescent device in prior art;
Fig. 2 shows the structural representation according to the LED luminescent device of a kind of preferred embodiment of the present utility model;
Fig. 3 shows the structural representation according to the LED luminescent device of another kind of preferred embodiment of the present utility model;
Fig. 4 shows the structural representation according to the LED luminescent device of another preferred embodiment of the present utility model;
Fig. 5 shows the vertical view of LED luminescent device shown in Figure 4; And
Fig. 6 shows the vertical view according to the LED luminescent device of another preferred embodiment of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in embodiment of the present utility model is described in detail, but following embodiment and accompanying drawing are only to understand the utility model, and can not limit the utility model, the multitude of different ways that the utility model can be defined by the claims and cover is implemented.
In a kind of typical embodiment of the present utility model, a kind of LED luminescent device is provided, comprise one or more packaging bodies 1 and LED substrate 2, packaging body 1 comprises base plate for packaging 11, encapsulating housing 12 and LED chip 13, one end of encapsulating housing 12 has opening, and openend is fixed on base plate for packaging 11; LED chip 13 is fixed on base plate for packaging 11 in the zone that the openend by encapsulating housing 12 surrounds; LED substrate 2, the base plate for packaging 11 of one or more packaging bodies is fixed on LED substrate 2 away from a side of LED chip 13; Above-mentioned LED luminescent device also comprises remote fluorescence housing 3, one end of remote fluorescence housing 3 has opening, and openend is fixed on LED substrate 2, packaging body 1 is arranged on LED substrate 2 in the zone that the openend by remote fluorescence housing 3 surrounds, and and the inwall of remote fluorescence housing 3 between have the gap.
as shown in Figures 2 and 3, LED luminescent device with said structure, LED chip 13 still is fixed on base plate for packaging 11 by adhesive glue and is encapsulated in encapsulating housing 12, and the remote fluorescence housing 3 that will contain fluorescent material is isolated setting mutually as an independent accessory and LED chip 13, form 13 pairs of remote excitations with its remote fluorescent material that arranges of LED chip and formed white light, overcome heat that fluorescent powder coating in the prior art produces owing to exciting and be difficult to distribute short and luminous efficiency low problem in the useful life that causes the LED luminescent device when LED chip 13, technology owing to adopting remote excitation fluorescent material greatly reduces the working temperature of LED chip 13 and encapsulating housing 12, thereby has slowed down to a great extent the aging speed of these materials, and then extended the life-span of LED luminescent device, and, cause that the colour temperature inequality of LED luminescent device produces the drawback of hot spot because can't accomplish evenly to apply when having avoided applying fluorescent material on LED chip 13, weaken simultaneously the impact that go out light effect of different B on the LED luminescent device, made the repeatability of product and uniformity strengthen.
In a kind of preferred embodiment of the utility model, be provided with quanta point material layer 4 on the inner surface of the remote fluorescence housing 3 of above-mentioned LED luminescent device or outer surface.The quantum dot polymer dispersion that will contain quanta point material adopt to apply or the mode of spraying is formed on the inner surface of remote fluorescence housing 3 or outer surface and obtains quanta point material layer 4, this quanta point material layer 4 makes through the spectrum continuity of its light better, and then the luminous mass with its illuminating lamp improves.
In order further to save the cost of manufacture of LED luminescent device of the present utility model, the material of the remote fluorescence housing 3 of preferred above-mentioned LED luminescent device is fluorescence silica gel.Fluorescence silica gel is the silica gel with fluorescent material, is the conventional material in present LED field, therefore relatively is easy to get.
Disperse after the light that is sent by LED chip need to pass fluorescence silica gel, therefore in order to obtain light efficiency preferably, preferred fluorescence silica gel is light transmittance higher than 95% fluorescence silica gel.
The shape of the remote fluorescence housing 3 of above-mentioned LED luminescent device can be by multiple choices, and preferred remote fluorescence housing 3 is one or more housings that are combined to form in cuboid housing, terrace with edge shape housing, cylindrical housings, truncated cone-shaped housing, hemispherical shell, candle flame shape housing and conical shell.The concrete shape of remote fluorescence housing 3 can go out light effect and selects according to desired.During the shell combination of elected majority kind shape, as an example, can the end that remote fluorescence housing 3 and LED substrate 2 is fixing be designed to squarely, become hemisphere away from the partial design of LED substrate 2.
In the another kind of preferred embodiment of the utility model, remote fluorescence housing 3 clampings of above-mentioned LED luminescent device, be spirally connected or be bonded on LED substrate 2.When adopting the mode of clamping, can adopt " O " type ring to carry out clamping, also the draw-in groove of remote fluorescence housing 3 clampings can be set on LED substrate 2; Perhaps screw thread corresponding to processing is spirally connected both on the remote fluorescence housing 3 of machining screw while in correspondence on LED substrate 2; When adopting the mode of bonding, namely adopt conventional LED special glue to get final product.
The Main Function of the encapsulating housing 12 of above-mentioned LED luminescent device is for packaging protection LED chip 13; so its shape and material can have multiple choices; shape can be cuboid, terrace with edge shape, cylindrical, truncated cone-shaped, hemisphere, candle flame shape or taper shape; that material is selected from is high temperature resistant, light transmission efficiency material preferably, and the material at the top of preferred package housing 12 is silica gel or plastics.
In conjunction with foregoing, because the effect of encapsulating housing 12 is mainly for packaging protection LED chip 13, therefore, as long as can realize that the design of the purpose of protection LED chip 13 all can be used for the utility model, as shown in Figures 2 and 3, preferred LED chip 13 is one, and encapsulating housing 12 is one, and LED chip 13 is arranged on base plate for packaging 11 in the zone that the openend by an encapsulating housing 12 surrounds; Or LED chip 13 is a plurality of, and encapsulating housing 12 is one, and all LED chips 13 are fixed on base plate for packaging 11 in the zone that the openend by an encapsulating housing 12 surrounds; Or LED chip 13 is a plurality of, and encapsulating housing 12 is a plurality of, and the quantity of LED chip 13 is provided with one or more LED chips 13 more than the quantity of encapsulating housing 12 in the zone that the openend of each encapsulating housing 12 surrounds; LED chip 13 is a plurality of, and encapsulating housing 12 is a plurality of, and the quantity of LED chip 13 is identical with the quantity of encapsulating housing 12, is provided with accordingly a LED chip 13 in the zone that the openend of each encapsulating housing 12 surrounds.
For the LED luminescent device that obtains emitting white light, preferred LED luminescent device comprises a LED chip 13, and LED chip 13 is the blue led chip; Or the LED luminescent device comprises a plurality of LED chips 13, and each LED chip 13 is the blue led chip; Or the LED luminescent device comprises a plurality of LED chips 13, comprises red LED chips and blue led chip.
As extremely shown in Figure 6 in Fig. 4, in another preferred embodiment of the utility model, above-mentioned LED luminescent device also comprises polyhedron-shaped heat-conducting substrate 5, a surface of heat-conducting substrate 5 is fixed on LED substrate 2, be provided with packaging body 1 in remaining surface at least one surface, and the side away from LED chip 13 of the base plate for packaging 11 of packaging body 1 is fixed on heat-conducting substrate 5.
In LED luminescent device shown in Figure 4, heat-conducting substrate 5 is hexahedral shape, and be provided with packaging body 1 on its four surfaces vertical with base plate for packaging 11, when work, the heat that LED chip 13 produces is transmitted on LED substrate 2 by heat-conducting substrate 5 and spreads, and, adopt the mode of this three-dimensional encapsulation that packaging body 1 scattering device is conducive to LED chip 13 heat radiations, realizing the high efficiency rapid diffusion that realizes simultaneously heat.
The shape of the heat-conducting substrate 5 in above-described embodiment is not limited to the shape shown in Fig. 4, can also be designed to the structures such as tetrahedron, octahedron, and, can select to have aluminium, copper material of good heat conductive effect etc. as the material of heat-conducting substrate.
In the another kind of typical embodiment of the utility model, a kind of LED light fixture also is provided, comprise the LED luminescent device, this LED luminescent device is above-mentioned LED luminescent device.The thermal diffusivity of LED light fixture with LED luminescent device of the present utility model is better, goes out light effect more excellent, and useful life is longer.
These are only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. LED luminescent device comprises:
One or more packaging bodies (1), described packaging body (1) comprising:
Base plate for packaging (11);
Encapsulating housing (12), an end has opening, and openend is fixed on described base plate for packaging (11);
LED chip (13) is fixed in described base plate for packaging (11) the upper zone that is surrounded by the openend of described encapsulating housing (12);
LED substrate (2), the base plate for packaging of described one or more packaging bodies (11) is fixed on described LED substrate (2) away from a side of described LED chip (13);
It is characterized in that, described LED luminescent device also comprises remote fluorescence housing (3), one end of described remote fluorescence housing (3) has opening, and openend is fixed on described LED substrate (2), described packaging body (1) is arranged in described LED substrate (2) the upper zone that is surrounded by the openend of described remote fluorescence housing (3), and and the inwall of described remote fluorescence housing (3) between have the gap.
2. LED luminescent device according to claim 1, is characterized in that, is provided with quanta point material layer (4) on the inner surface of described remote fluorescence housing (3) or outer surface.
3. LED luminescent device according to claim 1, is characterized in that, the material of described remote fluorescence housing (3) is fluorescence silica gel.
4. LED luminescent device according to claim 3, is characterized in that, described fluorescence silica gel is light transmittance higher than 95% fluorescence silica gel.
5. the described LED luminescent device of any one according to claim 1 to 4, it is characterized in that, described remote fluorescence housing (3) is one or more housings that are combined to form in cuboid housing, terrace with edge shape housing, cylindrical housings, truncated cone-shaped housing, hemispherical shell, candle flame housing and conical shell.
6. the described LED luminescent device of any one according to claim 1 to 4, is characterized in that, described remote fluorescence housing (3) clamping, is spirally connected or is bonded on described LED substrate (2).
7. LED luminescent device according to claim 1, is characterized in that, the material at the top of described encapsulating housing (12) is silica gel or plastics.
8. LED luminescent device according to claim 1, is characterized in that, in described packaging body (1),
Described LED chip (13) is one, and described encapsulating housing (12) is one, and described LED chip (13) is arranged in described base plate for packaging (11) the upper zone that is surrounded by the openend of a described encapsulating housing (12); Or
Described LED chip (13) is a plurality of, and described encapsulating housing (12) is one, and all described LED chips (13) are fixed in described base plate for packaging (11) the upper zone that is surrounded by the openend of a described encapsulating housing (12); Or
Described LED chip (13) is a plurality of, described encapsulating housing (12) is a plurality of, the quantity of described LED chip (13) is provided with one or more described LED chips (13) more than the quantity of described encapsulating housing (12) in the zone that the openend of each described encapsulating housing (12) surrounds; Or
Described LED chip (13) is a plurality of, described encapsulating housing (12) is a plurality of, the quantity of described LED chip (13) is identical with the quantity of described encapsulating housing (12), is provided with accordingly a described LED chip (13) in the zone that the openend of each described encapsulating housing (12) surrounds.
9. LED luminescent device according to claim 1, it is characterized in that, described LED luminescent device also comprises polyhedron-shaped heat-conducting substrate (5), a surface of described heat-conducting substrate (5) is fixed on described LED substrate (2), be provided with described packaging body (1) in remaining surface at least one surface, and the side away from described LED chip (13) of the base plate for packaging (11) of described packaging body (1) is fixed on described heat-conducting substrate (5).
10. a LED light fixture, comprise the LED luminescent device, it is characterized in that, described LED luminescent device is the described LED luminescent device of any one in claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220711975 CN202996897U (en) | 2012-12-20 | 2012-12-20 | LED luminescent device and LED light fixture having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220711975 CN202996897U (en) | 2012-12-20 | 2012-12-20 | LED luminescent device and LED light fixture having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202996897U true CN202996897U (en) | 2013-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220711975 Expired - Lifetime CN202996897U (en) | 2012-12-20 | 2012-12-20 | LED luminescent device and LED light fixture having the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202996897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633256A (en) * | 2016-03-07 | 2016-06-01 | 朱衡 | Remote fluorescent powder structured light emitting diode (LED) lamp with optional light source color temperatures |
| CN109367869A (en) * | 2018-10-24 | 2019-02-22 | 佛山市佳世达薄膜科技有限公司 | A kind of fluorescence protective film |
-
2012
- 2012-12-20 CN CN 201220711975 patent/CN202996897U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633256A (en) * | 2016-03-07 | 2016-06-01 | 朱衡 | Remote fluorescent powder structured light emitting diode (LED) lamp with optional light source color temperatures |
| CN109367869A (en) * | 2018-10-24 | 2019-02-22 | 佛山市佳世达薄膜科技有限公司 | A kind of fluorescence protective film |
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Owner name: SHENZHEN JINGHEYUAN OPTOELECTRONIC CO., LTD. Free format text: FORMER OWNER: HANGZHOU NAJING TECHNOLOGY CO., LTD. Effective date: 20130524 |
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Free format text: CORRECT: ADDRESS; FROM: 310052 HANGZHOU, ZHEJIANG PROVINCE TO: 518057 SHENZHEN, GUANGDONG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130524 Address after: 518057 Guangdong province Shenzhen Guangming New District Office of Gongming Tian Liao community with the concept of techno science and Technology Industrial Park Road 1 building 10 floor 1001 Patentee after: SHENZHEN JINGHEYUAN PHOTOELECTRIC CO.,LTD. Address before: Hangzhou City, Zhejiang province Binjiang District 310052 Spring Road No. 1576 Building 1 layer 4 Patentee before: Hangzhou Najing Technology Ltd. |
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| ASS | Succession or assignment of patent right |
Owner name: NNCRYSTAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN JINGHEYUAN OPTOELECTRONIC CO., LTD. Effective date: 20140107 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 310052 HANGZHOU, ZHEJIANG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20140107 Address after: 310052, Hangzhou, Zhejiang province Binjiang District Qiu Yi Road No. 1, 500, 4 floor Patentee after: NAJING TECHNOLOGY Corp.,Ltd. Address before: 518057 Guangdong province Shenzhen Guangming New District Office of Gongming Tian Liao community with the concept of techno science and Technology Industrial Park Road 1 building 10 floor 1001 Patentee before: SHENZHEN JINGHEYUAN PHOTOELECTRIC CO.,LTD. |
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