CN104157639A - Full-angle light-emitting packaging module and forming method thereof - Google Patents
Full-angle light-emitting packaging module and forming method thereof Download PDFInfo
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- CN104157639A CN104157639A CN201410429275.7A CN201410429275A CN104157639A CN 104157639 A CN104157639 A CN 104157639A CN 201410429275 A CN201410429275 A CN 201410429275A CN 104157639 A CN104157639 A CN 104157639A
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Abstract
The invention discloses a full-angle light-emitting packaging module. The packaging module comprises a carrier made of a transparent material, a positive electrode conductive support, a negative electrode conductive support and a plurality of LED chips, wherein the positive electrode conductive support, the negative electrode conductive support and the LED chips are fixed to the front side of the carrier, the positive electrodes of the LED chips are connected with the positive electrode conductive support through wires, the negative electrodes of the LED chips are connected with the negative electrode conductive support through wires, the LED chips are in parallel connection or serial connection or serial-parallel connection with one another, the carrier, the LED chips, the positive electrode conductive support and the negative electrode conductive support are packaged through a fluorescent adhesive, and the end of the positive electrode conductive support and the end of the negative electrode conductive support are exposed out of the fluorescent adhesive package to be connected with a power supply conveniently. According to the packaging module, full-angle light emission can be truly achieved, and the light emitting efficiency is higher.
Description
Technical field
The present invention relates to a kind of full angle light emitting package module and forming method thereof, on application and LED G4 light source.
Background technology
Traditional its technique of G4 light source is substantially by LED light source discrete device, LED light source discrete device as: 2835, the TOP low-angle light sources such as 3328,3014 add carrier and combine, and carrier is as aluminium base, RT sheet material, FR4 etc.Although above light source also belongs to electricity-saving lamp, there are problems being combined into after whole lamp.As technological process aspect its complex manufacturing technology, as being encapsulated in, SMD needs reflow machine when carrying out paster.Going out light effect aspect, there is some light in discrete light sources combination of devices, dazzle, and rising angle is little, need to carry out secondary light-distribution, has increased light loss, and technological process complexity, its cost is corresponding higher.
Summary of the invention
Technical problem to be solved by this invention is: a kind of full angle light emitting package module is provided, and it is luminous that this package module really can be realized full angle, and luminous efficiency is higher, and low cost of manufacture can meet the requirement of different capacity light source.
Another technical problem to be solved by this invention is: a kind of moulding process of full angle light emitting package module is provided, this moulding process plastic go out luminous efficiency higher, the package module that full angle is luminous, simple process, cost are lower and take into account production capacity and yield.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of full angle light emitting package module, comprise the carrier of being made by transparent material, anodal conducting bracket, negative pole conducting bracket, some LEDs chips, described anodal conducting bracket and negative pole conduction are all fixed on the front of carrier, described some LEDs chips are fixed on the front of carrier, the positive pole of each LED chip is connected with anodal conducting bracket by wire, the negative pole of each LED chip is connected with negative pole conducting bracket by wire, parallel connection or series connection or connection in series-parallel between each LED chip, described whole carrier by fluorescent glue by carrier, some LEDs chips, anodal conducting bracket, the encapsulation of negative pole conducting bracket, and anodal conducting bracket, the end of negative pole conducting bracket exposed convenience from fluorescent glue encapsulation is connected with power supply.
As the preferred scheme of one, described anodal conducting bracket embeds the front of carrier, and anodal conducting bracket is exposed in carrier outside for the junction being connected with LED chip.
As the preferred scheme of one, the fixed form between described negative pole conducting bracket and carrier is identical with the fixed form of anodal conducting bracket.
As the preferred scheme of one, the two ends of described anodal conducting bracket and negative pole conducting bracket all embed in carrier, and the middle part of anodal conducting bracket and negative pole conducting bracket is all exposed outside carrier.
As the preferred scheme of one, the carrier edge of described carrier obverse and reverse is higher than the central panel face of carrier, and the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt.
Adopt after technique scheme, effect of the present invention is: this package module is fixed on some LEDs chips on transparent carrier, and utilize positive and negative electrode conducting bracket that power supply is connected with the both positive and negative polarity of LED chip, thereby guarantee that LED chip is normally luminous, the light sending can directly penetrate from the front of carrier, also can see through transparent carrier and appear from the back side, thereby it is luminous really to have realized full angle; This package module is to utilize plurality of LEDs chip series, parallel or connection in series-parallel in addition, and therefore luminosity can freely configure, and it is smaller that carrier bulk can be made, and horizontal radiating efficiency is higher.This encapsulating structure reduces the binder course of traditional package module, reduces the effect of overall thermal resistance.
Because the carrier edge of described carrier obverse and reverse is higher than the central panel face of carrier, the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt again, and this structure not only can improve angle refraction also can prevent that fluorescent glue overflows in the time of encapsulation simultaneously.
For solving another technical problem of the present invention, technical scheme of the present invention is:
A forming method for full angle light emitting package module,
A. the transparent carrier of moulding anodal conducting bracket, negative pole conducting bracket are fixed on to the front surface of carrier, anodal conducting bracket, negative pole conducting bracket all have partial portion outside exposed;
B. several discrete transparent crystal-bonding adhesive points on the main schedule millet cake of carrier;
C. on each crystal-bonding adhesive point, place LED chip;
D. the semi-finished product in step C are toasted LED chip is fixed in crystal-bonding adhesive oven dry, baking temperature 145-155 DEG C, baking time two hours;
E. arrange wire, the positive pole of LED chip is connected by wire with the exposed position of anodal conducting bracket, the negative pole of LED chip is connected by wire with the exposed position of negative pole conducting bracket, parallel connection, series connection or connection in series-parallel between each LED chip;
F. anodal conducting bracket, negative pole conducting bracket are connected to and in power supply, test LED chip and whether all light, light and can carry out next step, do not light and return to step e and again arrange wire until LED chip is all lighted;
G. the semi-finished product encapsulation of passing through will be tested through step F with fluorescent glue;
H. the semi-finished product after encapsulation are toasted fluorescent glue is solidified;
Wherein, the edge of the carrier after described moulding exceeds the central panel face of carrier, and each LED chip is positioned at the central panel face of carrier, and the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt.
Wherein, the angle between described inclined-plane and central panel face is 135 °.
Wherein, described anodal conducting bracket and negative pole conducting bracket embed the front surface of carrier in the time of carrier moulding, and embedding position is positioned at the two ends of anodal conducting bracket and negative pole conducting bracket.
Adopted after technique scheme, effect of the present invention is: this technique is simple, and moulding packaging time greatly reduces, and only once encapsulates, and can simplify secondary light-distribution etc., saves device packaging cost, photo engine cost of manufacture, secondary light-distribution cost.
Exceed again the central panel face of carrier due to the edge of the carrier after described moulding, each LED chip is positioned at the central panel face of carrier, the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt, first edge is worked out when part can encapsulate with fluorescent glue in step G and is avoided overflowing, without using other shroudings, and the direct projection light of the maximum angle that LED chip sends can penetrate along inclined-plane, thereby reduce light loss as far as possible, simultaneously, the edge that part light also can enter into carrier reflects, and ensures that the part brightness in carrier surrounding is still even.
Brief description of the drawings
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the Facad structure schematic diagram of the embodiment of the present invention;
Fig. 2 is the cutaway view of Fig. 1 at A-A place;
In accompanying drawing: 1. carrier; 2. negative pole conducting bracket; 3. anodal conducting bracket; 4.LED chip; 5. edge; 6. inclined-plane; 7. tack coat; 8. central panel face.
Embodiment
Below by specific embodiment, the present invention is described in further detail.
Front and back described in the present invention determines to have the one side of LED chip 4 for positive with the light emitting module after encapsulating, another side is the back side.And in the time that carrier 1 is not fixed anodal conducting bracket 3 and negative pole conducting bracket 2, can select one of them face as front.
As shown in Figure 1, 2, a kind of full angle light emitting package module, comprise carrier 1, anodal conducting bracket 3, negative pole conducting bracket 2, the some LEDs chips 4 made by transparent material, described anodal conducting bracket 3 and negative pole conduction are all fixed on the front of carrier 1, and the fixed form between described negative pole conducting bracket 2 and carrier 1 is identical with the fixed form of anodal conducting bracket 3.Wherein, the fixed form between positive and negative electrode conducting bracket 2 and carrier 1 has at least following two kinds.1. described in, anodal conducting bracket 3 embeds the front of carrier 1, and anodal conducting bracket 3 is exposed in carrier 1 outside for the junction being connected with LED chip 4, that is to say that positive and negative electrode conducting bracket 2 is just embedded in the front of carrier 1 in the time of carrier 1 moulding, and exposed for connecting the junction of LED chip 4.For example, LED chip 4 is to fix by wire and 2 spot welding of positive and negative electrode conducting bracket, and it is exposed only having so the spot welding position of positive and negative electrode conducting bracket 2, and other place all embeds the front of carrier 1.This structure positive and negative electrode conducting bracket 2 is fixing very firm, avoid loosening and cause welding position not firm, but this fixed form technological forming is more complicated, and cost input ratio is higher.2. described in, the two ends of anodal conducting bracket 3 and negative pole conducting bracket 2 all embed in carrier 1, and the middle part of anodal conducting bracket 3 and negative pole conducting bracket 2 is all exposed outside carrier 1.That is to say taking Fig. 1 as example, in Fig. 1, carrier 1 front is rectangle, to only have two ends be to embed in carrier 1 to positive and negative electrode conducting bracket 2 so, and mid portion is all exposed, no matter be that welding position is exposed, the mid portion of two adjacent welding positions is also exposed, so this shaping structures technique is very simple, fixing point less but fixed effect still can ensure, also has fluorescent glue encapsulation simultaneously, therefore, the fixation degree of positive and negative electrode conducting bracket 2 still can meet the normal use of package module.Described some LEDs chips 4 are fixed on the front of carrier 1, this fixed form is to utilize transparent crystal-bonding adhesive on carrier 1, to form tack coat 7, LED chip 4 is fixed on the front of carrier 1 by tack coat 7, this transparent crystal-bonding adhesive has conductive force, is convenient to heat transmission.The positive pole of each LED chip 4 is connected with anodal conducting bracket 3 by wire, and the negative pole of each LED chip 4 is connected with negative pole conducting bracket 2 by wire, parallel connection or series connection or connection in series-parallel between each LED chip 4, and this wire generally adopts gold thread.Described whole carrier 1 encapsulates carrier 1, some LEDs chips 4, anodal conducting bracket 3, negative pole conducting bracket 2 by fluorescent glue, and the end of anodal conducting bracket 3, negative pole conducting bracket 2 exposed convenience from fluorescent glue encapsulation is connected with power supply.
Wherein, carrier 1 edge 5 of described carrier 1 obverse and reverse is higher than the central panel face 8 of carrier 1, and the edge 5 of carrier 1 is provided with the inclined-plane 6 tilting to carrier 1 central panel face 8.Angle between this inclined-plane 6 and central panel face 8 is preferably 135 °.This structure can be saved box dam technique.This package module has advantage: 1. utilize transparent carrier 1, can realize full angle luminous; 2. plurality of LEDs chip 4 can freely connect combination, meets the light fixture instructions for use of various power; 3. utilize the inclined-plane 6 at edge 5 can reduce light loss, luminous efficiency is provided; 4. this encapsulating structure has reduced binder course, has lowered thermal resistance, has improved radiating effect.5. this encapsulating structure facilitates moulding.
The forming method of above-mentioned reflective package module is:
A. the transparent carrier 1 of moulding anodal conducting bracket 3, negative pole conducting bracket 2 are fixed on to the front surface of carrier 1, anodal conducting bracket 3, negative pole conducting bracket 2 all have partial portion outside exposed; Wherein, transparent carrier 1 in the time of moulding, anodal conducting bracket 3, negative pole conducting bracket 2 two ends and carrier 1 is fitted and formed the covering fixed position of anodal conducting bracket 3, negative pole conducting bracket 2 in carrier 1 further some projections of many moulding in two ends.
B. several discrete transparent crystal-bonding adhesive points on the main schedule millet cake of carrier 1, this crystal-bonding adhesive has heat conductivility;
C. on each crystal-bonding adhesive point, place LED chip 4;
D. the semi-finished product in step C are toasted crystal-bonding adhesive is dried fixing LED chip 4, baking temperature 145-155 DEG C, baking time two hours, after baking, crystal-bonding adhesive solidifies is firmly fixed on carrier 1 LED chip 4;
E. arrange wire, the positive pole of LED chip 4 is connected by wire with the exposed position of anodal conducting bracket 3, the negative pole of LED chip 4 is connected by wire with the exposed position of negative pole conducting bracket 2, parallel connection, series connection or connection in series-parallel between each LED chip 4, wire adopts gold thread, and utilizes bonding equipment to be fixed, spherical to bonding wire, bank, pulling force etc. are tested;
F. anodal conducting bracket 3, negative pole conducting bracket 2 are connected to and in power supply, test LED chip 4 and whether all light, light and can carry out next step, do not light and return to that step e arranges wire again until LED chip 4 is all lighted;
G. will test the semi-finished product encapsulation of passing through through step F with fluorescent glue, this fluorescent glue can make LED chip 4 finally send the product of white light or other colour systems;
H. the semi-finished product after encapsulation are toasted fluorescent glue is solidified;
I. finished product is carried out to final test, test its photoelectric parameter.
In sum, this light emitting package module has single luminous or mixed luminescence function, circuit can free operant, meet different capacity light source, reduce costs, its technique is simple, only need once encapsulate, and reduces thermal resistance, cost.
Claims (9)
1. a full angle light emitting package module, it is characterized in that: comprise the carrier of being made by transparent material, anodal conducting bracket, negative pole conducting bracket, some LEDs chips, described anodal conducting bracket and negative pole conduction are all fixed on the front of carrier, described some LEDs chips are fixed on the front of carrier, the positive pole of each LED chip is connected with anodal conducting bracket by wire, the negative pole of each LED chip is connected with negative pole conducting bracket by wire, parallel connection or series connection or connection in series-parallel between each LED chip, described whole carrier by fluorescent glue by carrier, some LEDs chips, anodal conducting bracket, the encapsulation of negative pole conducting bracket, and anodal conducting bracket, the end of negative pole conducting bracket exposed convenience from fluorescent glue encapsulation is connected with power supply.
2. a kind of full angle light emitting package module as claimed in claim 1, is characterized in that: described anodal conducting bracket embeds the front of carrier, and anodal conducting bracket is exposed in carrier outside for the junction being connected with LED chip.
3. a kind of full angle light emitting package module as claimed in claim 2, is characterized in that: the fixed form between described negative pole conducting bracket and carrier is identical with the fixed form of anodal conducting bracket.
4. a kind of full angle light emitting package module as claimed in claim 3, is characterized in that: the two ends of described anodal conducting bracket and negative pole conducting bracket all embed in carrier, and the middle part of anodal conducting bracket and negative pole conducting bracket is all exposed outside carrier.
5. a kind of full angle light emitting package module as claimed in claim 4, is characterized in that: the carrier edge of described carrier obverse and reverse is higher than the central panel face of carrier, and the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt.
6. a forming method for full angle light emitting package module, is characterized in that:
A. the transparent carrier of moulding anodal conducting bracket, negative pole conducting bracket are fixed on to the front surface of carrier, anodal conducting bracket, negative pole conducting bracket all have partial portion outside exposed;
B. several discrete transparent crystal-bonding adhesive points on the main schedule millet cake of carrier;
C. on each crystal-bonding adhesive point, place LED chip;
D. the semi-finished product in step C are toasted LED chip is fixed in crystal-bonding adhesive oven dry, baking temperature 145-155 DEG C, baking time two hours;
E. arrange wire, the positive pole of LED chip is connected by wire with the exposed position of anodal conducting bracket, the negative pole of LED chip is connected by wire with the exposed position of negative pole conducting bracket, parallel connection, series connection or connection in series-parallel between each LED chip;
F. anodal conducting bracket, negative pole conducting bracket are connected to and in power supply, test LED chip and whether all light, light and can carry out next step, do not light and return to step e and again arrange wire until LED chip is all lighted;
G. the semi-finished product encapsulation of passing through will be tested through step F with fluorescent glue;
H. the semi-finished product after encapsulation are toasted fluorescent glue is solidified.
7. a kind of forming method of full angle light emitting package module as described in claim 6, it is characterized in that: the edge of the carrier after described moulding exceeds the central panel face of carrier, each LED chip is positioned at the central panel face of carrier, and the edge of carrier is provided with to the inclined-plane of carrier central panel face tilt.
8. a kind of forming method of full angle light emitting package module as described in claim 7, is characterized in that: the angle between described inclined-plane and central panel face is 135 °.
9. a kind of forming method of full angle light emitting package module as described in claim 8, it is characterized in that: described anodal conducting bracket and negative pole conducting bracket embed the front surface of carrier in the time of carrier moulding, embedding position is positioned at the two ends of anodal conducting bracket and negative pole conducting bracket.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410429275.7A CN104157639A (en) | 2014-08-28 | 2014-08-28 | Full-angle light-emitting packaging module and forming method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410429275.7A CN104157639A (en) | 2014-08-28 | 2014-08-28 | Full-angle light-emitting packaging module and forming method thereof |
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| US20080121922A1 (en) * | 2006-11-29 | 2008-05-29 | Hsing Chen | Light emitting diode package with large viewing angle |
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN103887294A (en) * | 2012-12-20 | 2014-06-25 | 朱晓飚 | LED light-emitting device and manufacture method thereof |
| CN203760510U (en) * | 2013-12-18 | 2014-08-06 | 四川新力光源股份有限公司 | Large light angle LED light source module |
| CN204045587U (en) * | 2014-08-28 | 2014-12-24 | 江苏索尔光电科技有限公司 | A kind of full angle light emitting package module |
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2014
- 2014-08-28 CN CN201410429275.7A patent/CN104157639A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121922A1 (en) * | 2006-11-29 | 2008-05-29 | Hsing Chen | Light emitting diode package with large viewing angle |
| CN103887294A (en) * | 2012-12-20 | 2014-06-25 | 朱晓飚 | LED light-emitting device and manufacture method thereof |
| CN103123950A (en) * | 2013-02-06 | 2013-05-29 | 深圳市蓝科电子有限公司 | LED light source packaging structure and packaging method |
| CN203760510U (en) * | 2013-12-18 | 2014-08-06 | 四川新力光源股份有限公司 | Large light angle LED light source module |
| CN204045587U (en) * | 2014-08-28 | 2014-12-24 | 江苏索尔光电科技有限公司 | A kind of full angle light emitting package module |
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Application publication date: 20141119 |