CN203449677U - Low-dielectric-loss copper-clad plate - Google Patents
Low-dielectric-loss copper-clad plate Download PDFInfo
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- CN203449677U CN203449677U CN201320450127.4U CN201320450127U CN203449677U CN 203449677 U CN203449677 U CN 203449677U CN 201320450127 U CN201320450127 U CN 201320450127U CN 203449677 U CN203449677 U CN 203449677U
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Abstract
The utility model relates to a low-dielectric-loss copper-clad plate. The low-dielectric-loss copper-clad plate comprises a semi-solidifying layer, a polytetrafluoroethylene layer, epoxy adhesive layers and an electrolytic copper foil layer, wherein the semi-solidifying layer comprises one to eight layers of semi-solidifying sheets, the semi-solidifying layer comprises a piece of glass fiber cloth and epoxy resin layers, the epoxy resin layers are respectively attached to the upper surface and the lower surface of the glass fiber cloth, and each epoxy resin layer is a resin layer which is formed by mixing epoxy resin with a promoter, metal oxide and a flow slowing agent and solidifying the mixture through a cyanate ester at high temperature. The polytetrafluoroethylene layer is divided into an upper polytetrafluoroethylene layer and a lower polytetrafluoroethylene layer which are respectively bonded with the upper surface and the lower surface of the semi-solidifying sheet layer through the epoxy adhesive layers, the electrolytic copper foil layer is divided into an upper electrolytic copper foil layer and a lower electrolytic copper foil layer, the upper electrolytic copper foil layer is bonded with the upper surface of the upper polytetrafluoroethylene layer through the epoxy adhesive layer, and the lower electrolytic copper foil layer is bonded with the lower surface of the lower polytetrafluoroethylene layer through the epoxy adhesive layer. The copper-clad plate has the characteristics of low dielectric constant, small dielectric loss, high heat resistance and the like, and the lead-free processing can be satisfied.
Description
Technical field
The utility model relates to field of electronic materials, more specifically, relates to a kind of low-dielectric loss copper-clad plate.
Background technology
Along with PCB industry develops rapidly, the high frequency of electronics and IT products signal, high speed transmission technology require more and more higher, not only require copper-clad plate to there is low and stable dielectric constant (Dk) and alap dielectric loss (Df), to guarantee integrality and the reliability of signal.And the development of electronic product high frequency and leadless process has proposed different heat resistance requirements to copper-clad plate, traditional FR-4 copper-clad plate material has been not suitable with the PCB industry of present leadless process.And along with the development in current 3G mobile market, high-frequency high-speed printed wiring board is huge for the potential market of the circuit module of cell phone base station, and wherein copper-clad plate is as the carrier of electronic devices and components, its performance has determined the high frequency of high-end electronic information technology, at a high speed and high reliability etc.Signal transmission is fast, dielectric property is superior owing to having for polytetrafluoroethylene film, the anti-breakdown strength of insulating barrier is high, cost is low, polytetrafluoroethylene film has the good features such as tensile strength is high, good insulating, following by the developing focus that is high-end high-frequency copper-clad plate.
Summary of the invention
The utility model, for above-mentioned deficiency, provides a kind of low-dielectric loss copper-clad plate, and this copper-clad plate can meet leadless process, is applicable to making high-rise multilayer circuit board.
For achieving the above object, the technical solution of the utility model is: a kind of low-dielectric loss copper-clad plate, comprise semi-solid preparation layer, polytetrafluoroethylene floor, epoxy adhesive layer and electrodeposited copper foil layer, described polytetrafluoroethylene floor is divided into polytetrafluoroethylene floor and lower polytetrafluoroethylene floor, upper polytetrafluoroethylene floor is bonding by epoxy adhesive layer and semi-solid preparation layer upper surface, lower polytetrafluoroethylene floor is by epoxy adhesive layer and semi-solid preparation layer lower surface bonds, described electrodeposited copper foil layer is divided into By Electrolysis copper foil layer and lower electrodeposited copper foil layer, By Electrolysis copper foil layer is bonding by the upper surface of epoxy adhesive layer and upper polytetrafluoroethylene (PTFE), lower electrodeposited copper foil layer is by the lower surface bonds of epoxy adhesive layer and lower polytetrafluoroethylene (PTFE).
Described semi-solid preparation layer is comprised of 1-8 layer prepreg.
Described polytetrafluoroethylene floor is the membrane structure that process through sodium on surface.
Described polytetrafluoroethylene (PTFE) layer thickness is 50-100 μ m.
Described prepreg comprises glass fabric and is attached to the epoxy resin layer of glass fabric upper surface and lower surface.
Described epoxy resin layer is that epoxy resin adds the resin bed that promoter, metal oxide, unhurried current agent form through cyanate hot setting.
The utlity model has following advantage:
The utility model reaches the designing requirement of low-k and low-dielectric loss by cyanate curing system and polytetrafluoroethylene (PTFE), and by polytetrafluoroethylene (PTFE) being carried out to surperficial sodium processing, adopt special epoxy adhesive can improve the cohesive of polytetrafluoroethylene (PTFE) and Copper Foil and epoxy resin simultaneously, and by cyanate, solidify the heat resistance that also can improve copper-clad plate, meet the requirement of leadless process.
Accompanying drawing explanation
Fig. 1 is the low-dielectric loss structure for covering copper plate figure described in embodiment.
Wherein: 1-By Electrolysis copper foil layer, the upper polytetrafluoroethylene floor of 2-, 3-layer of prepreg, polytetrafluoroethylene floor under 4-, electrodeposited copper foil layer under 5-.
The specific embodiment
Embodiment: as shown in Figure 1, a kind of low-dielectric loss copper-clad plate, comprise semi-solid preparation layer, polytetrafluoroethylene floor, epoxy adhesive layer and electrodeposited copper foil layer, wherein, layer of prepreg 3 comprises 1-8 layer prepreg, prepreg comprises glass fabric and is attached to the epoxy resin layer of glass fabric upper surface and lower surface, epoxy resin layer is that epoxy resin adds promoter, metal oxide, the resin bed that unhurried current agent forms through cyanate hot setting, by adopting cyanate curing system can improve the heat resistance of copper-clad plate, and cyanate dielectric constant is low, can meet the requirement of HF link plate.Polytetrafluoroethylene floor is divided into polytetrafluoroethylene floor 2 and lower polytetrafluoroethylene floor 4, for the membrane structure of surface through sodium processing, upper polytetrafluoroethylene floor 2 is bonding by epoxy adhesive layer and semi-solid preparation layer 3 upper surface, lower polytetrafluoroethylene floor 4 is by epoxy adhesive layer and semi-solid preparation layer 3 lower surface bonds, polytetrafluoroethylene (PTFE) layer thickness is 50-100 μ m, described electrodeposited copper foil layer is divided into By Electrolysis copper foil layer 1 and lower electrodeposited copper foil layer 5, By Electrolysis copper foil layer 1 is bonding by the upper surface of epoxy adhesive layer and upper polytetrafluoroethylene floor 2, lower electrodeposited copper foil layer is by the lower surface bonds of epoxy adhesive layer and lower polytetrafluoroethylene floor, it is fast that polytetrafluoroethylene (PTFE) has signal transmission, dielectric property is superior, the anti-breakdown strength of insulating barrier is high, cost is low, it is high that polytetrafluoroethylene (PTFE) has tensile strength, the feature that good insulating etc. are good, by adding poly tetrafluoroethylene can effectively reduce dielectric constant, reduce dielectric loss, meet the requirement of HF link plate.
Wherein, the low-dielectric loss copper-clad plate prepreg of described applicable leadless process is made by following formula:
The mixed liquor that solvent, filling aluminium hydrate, cyanate curing agent, unhurried current agent, epoxy resin, promoter are mixed by weight 40～50:30～40:5～10:1～5:0.1～1 high-speed stirred, gelation time by glue under 171 ± 0.5 ℃ of conditions is adjusted to 210 ± 20 s, and viscosity is adjusted to 25 ± 5 s.
Weight is less than to 120g/m
2glass fibre be arranged in mixed liquor and flood, then at 150 ℃～230 ℃ temperature, toast, then through cooling acquisition prepreg.
Claims (6)
1. a low-dielectric loss copper-clad plate, comprise semi-solid preparation layer, polytetrafluoroethylene floor, epoxy adhesive layer and electrodeposited copper foil layer, it is characterized in that: described polytetrafluoroethylene floor is divided into polytetrafluoroethylene floor and lower polytetrafluoroethylene floor, upper polytetrafluoroethylene floor is bonding by epoxy adhesive layer and semi-solid preparation layer upper surface, lower polytetrafluoroethylene floor is by epoxy adhesive layer and semi-solid preparation layer lower surface bonds, described electrodeposited copper foil layer is divided into By Electrolysis copper foil layer and lower electrodeposited copper foil layer, By Electrolysis copper foil layer is bonding by the upper surface of epoxy adhesive layer and upper polytetrafluoroethylene (PTFE), lower electrodeposited copper foil layer is by the lower surface bonds of epoxy adhesive layer and lower polytetrafluoroethylene (PTFE).
2. low-dielectric loss copper-clad plate according to claim 1, is characterized in that: described semi-solid preparation layer is comprised of 1-8 layer prepreg.
3. low-dielectric loss copper-clad plate according to claim 1, is characterized in that: the membrane structure that described polytetrafluoroethylene floor is processed through sodium for surface.
4. according to the low-dielectric loss copper-clad plate of claim 1 or 3, it is characterized in that: described polytetrafluoroethylene (PTFE) layer thickness is 50-100 μ m.
5. low-dielectric loss copper-clad plate according to claim 1 and 2, is characterized in that: described prepreg comprises glass fabric and is attached to the epoxy resin layer of glass fabric upper surface and lower surface.
6. low-dielectric loss copper-clad plate according to claim 5, is characterized in that: described epoxy resin layer is that epoxy resin adds the resin bed that promoter, metal oxide, unhurried current agent form through cyanate hot setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320450127.4U CN203449677U (en) | 2013-07-26 | 2013-07-26 | Low-dielectric-loss copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320450127.4U CN203449677U (en) | 2013-07-26 | 2013-07-26 | Low-dielectric-loss copper-clad plate |
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| CN203449677U true CN203449677U (en) | 2014-02-26 |
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| CN201320450127.4U Expired - Fee Related CN203449677U (en) | 2013-07-26 | 2013-07-26 | Low-dielectric-loss copper-clad plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104002526A (en) * | 2014-05-30 | 2014-08-27 | 哈尔滨工业大学 | Carbon fiber reinforced resin board with polytetrafluoroethylene thin films as surface layers and manufacturing method of carbon fiber reinforced resin board |
| CN109545425A (en) * | 2018-09-30 | 2019-03-29 | 天津大学 | A kind of high-temperature superconductive cable low loss insulation and preparation method |
-
2013
- 2013-07-26 CN CN201320450127.4U patent/CN203449677U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104002526A (en) * | 2014-05-30 | 2014-08-27 | 哈尔滨工业大学 | Carbon fiber reinforced resin board with polytetrafluoroethylene thin films as surface layers and manufacturing method of carbon fiber reinforced resin board |
| CN104002526B (en) * | 2014-05-30 | 2016-01-13 | 哈尔滨工业大学 | Top layer is carbon fiber-reinforced resin plate and the method for making thereof of polytetrafluoroethylene film |
| CN109545425A (en) * | 2018-09-30 | 2019-03-29 | 天津大学 | A kind of high-temperature superconductive cable low loss insulation and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Peifeng Inventor before: Mo Zhanxiong |
|
| COR | Change of bibliographic data | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20200726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |