CN103824913B - 一种Mg掺杂P型GaN外延生长方法 - Google Patents
一种Mg掺杂P型GaN外延生长方法 Download PDFInfo
- Publication number
- CN103824913B CN103824913B CN201410090720.1A CN201410090720A CN103824913B CN 103824913 B CN103824913 B CN 103824913B CN 201410090720 A CN201410090720 A CN 201410090720A CN 103824913 B CN103824913 B CN 103824913B
- Authority
- CN
- China
- Prior art keywords
- growth
- layer
- type
- temperature
- gan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000000407 epitaxy Methods 0.000 title claims abstract description 17
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract description 24
- 239000002131 composite material Substances 0.000 claims abstract description 15
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002019 doping agent Substances 0.000 claims abstract description 9
- 238000009792 diffusion process Methods 0.000 claims abstract description 3
- 239000011777 magnesium Substances 0.000 claims description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 15
- 238000000137 annealing Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 13
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 claims description 10
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 10
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 claims description 10
- 239000012298 atmosphere Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- MHYQBXJRURFKIN-UHFFFAOYSA-N C1(C=CC=C1)[Mg] Chemical compound C1(C=CC=C1)[Mg] MHYQBXJRURFKIN-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910021529 ammonia Inorganic materials 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 5
- 239000012159 carrier gas Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 238000005984 hydrogenation reaction Methods 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910000069 nitrogen hydride Inorganic materials 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000001629 suppression Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009467 reduction Effects 0.000 abstract description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XZGYRWKRPFKPFA-UHFFFAOYSA-N methylindium Chemical compound [In]C XZGYRWKRPFKPFA-UHFFFAOYSA-N 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410090720.1A CN103824913B (zh) | 2014-03-12 | 2014-03-12 | 一种Mg掺杂P型GaN外延生长方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410090720.1A CN103824913B (zh) | 2014-03-12 | 2014-03-12 | 一种Mg掺杂P型GaN外延生长方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103824913A CN103824913A (zh) | 2014-05-28 |
CN103824913B true CN103824913B (zh) | 2016-08-24 |
Family
ID=50759870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410090720.1A Active CN103824913B (zh) | 2014-03-12 | 2014-03-12 | 一种Mg掺杂P型GaN外延生长方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103824913B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105720139B (zh) * | 2016-02-24 | 2017-12-08 | 厦门乾照光电股份有限公司 | 提高氮化物发光二极管p型掺杂浓度的外延生长方法 |
CN112501689A (zh) * | 2020-11-12 | 2021-03-16 | 辽宁百思特达半导体科技有限公司 | 一种氮化镓pin结构的外延生长方法 |
CN112481695A (zh) * | 2020-11-12 | 2021-03-12 | 辽宁百思特达半导体科技有限公司 | 一种氮化镓p型层的外延生长方法 |
CN113594028A (zh) * | 2021-07-27 | 2021-11-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | 氮化镓p型掺杂的方法、GaN基PN结的制作方法及其应用 |
CN114464709B (zh) * | 2022-04-13 | 2023-03-03 | 江西兆驰半导体有限公司 | 一种led外延片、外延生长方法及led芯片 |
CN116316073B (zh) * | 2023-05-24 | 2023-08-01 | 苏州长光华芯光电技术股份有限公司 | 一种半导体发光结构及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1502154A (zh) * | 2001-04-12 | 2004-06-02 | ���ǻ�ѧ��ҵ��ʽ���� | 氮化镓系列化合物半导体元件 |
CN101661878A (zh) * | 2009-09-08 | 2010-03-03 | 中山大学 | 一种双元素delta掺杂生长P型GaN基材料的方法 |
CN102227008A (zh) * | 2011-05-18 | 2011-10-26 | 湘能华磊光电股份有限公司 | LED芯片的P型GaN层的制备方法 |
CN102881788A (zh) * | 2012-09-26 | 2013-01-16 | 合肥彩虹蓝光科技有限公司 | 一种改善GaN基LED量子阱结构提高载子复合效率的外延生长方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4305982B2 (ja) * | 1998-11-26 | 2009-07-29 | ソニー株式会社 | 半導体発光素子の製造方法 |
KR20020031683A (ko) * | 2000-10-23 | 2002-05-03 | 송재인 | 질화물 반도체 발광소자 및 그 제조방법 |
KR100661708B1 (ko) * | 2004-10-19 | 2006-12-26 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
CN102867892A (zh) * | 2012-09-06 | 2013-01-09 | 合肥彩虹蓝光科技有限公司 | 具有In掺杂的低温生长P型GaN外延方法 |
CN102931303A (zh) * | 2012-10-22 | 2013-02-13 | 合肥彩虹蓝光科技有限公司 | 外延结构及其生长方法 |
-
2014
- 2014-03-12 CN CN201410090720.1A patent/CN103824913B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1502154A (zh) * | 2001-04-12 | 2004-06-02 | ���ǻ�ѧ��ҵ��ʽ���� | 氮化镓系列化合物半导体元件 |
CN101661878A (zh) * | 2009-09-08 | 2010-03-03 | 中山大学 | 一种双元素delta掺杂生长P型GaN基材料的方法 |
CN102227008A (zh) * | 2011-05-18 | 2011-10-26 | 湘能华磊光电股份有限公司 | LED芯片的P型GaN层的制备方法 |
CN102881788A (zh) * | 2012-09-26 | 2013-01-16 | 合肥彩虹蓝光科技有限公司 | 一种改善GaN基LED量子阱结构提高载子复合效率的外延生长方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103824913A (zh) | 2014-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103824913B (zh) | 一种Mg掺杂P型GaN外延生长方法 | |
CN103824909B (zh) | 一种提高GaN基LED发光亮度的外延方法 | |
CN103337573B (zh) | 半导体发光二极管的外延片及其制造方法 | |
CN103730552B (zh) | 一种提高led发光效率的外延生长方法 | |
CN108461592B (zh) | 一种发光二极管外延片及其制造方法 | |
CN110718612B (zh) | 发光二极管外延片及其制造方法 | |
CN104409587B (zh) | 一种InGaN基蓝绿光发光二极管外延结构及生长方法 | |
CN103811601B (zh) | 一种以蓝宝石衬底为基板的GaN基LED多阶缓冲层生长方法 | |
CN103824908B (zh) | 一种提高GaN基LED静电耐受能力的外延生长方法 | |
CN103811605B (zh) | 一种改善氮化镓基发光二极管的反向漏电的外延生长方法 | |
CN105006503B (zh) | Led外延结构及其制备方法 | |
CN102709424A (zh) | 一种提高发光二极管发光效率的方法 | |
CN103872194B (zh) | 一种提高GaN基LED有源区发光效率的外延生长方法 | |
CN102867892A (zh) | 具有In掺杂的低温生长P型GaN外延方法 | |
CN103346217A (zh) | 一种提高led发光二极管亮度的量子垒设计方法 | |
CN116581210B (zh) | 发光二极管外延片及其制备方法、发光二极管 | |
CN116581216B (zh) | 发光二极管外延片及其制备方法、发光二极管 | |
JP2023511822A (ja) | マイクロ発光ダイオードのエピタキシャル構造及びその製造方法 | |
CN109473514A (zh) | 一种氮化镓基发光二极管外延片及其制造方法 | |
CN115911201A (zh) | 发光二极管外延片及其制备方法、发光二极管 | |
CN116093223A (zh) | 发光二极管外延片及其制备方法、发光二极管 | |
CN116454185A (zh) | 一种高光效发光二极管外延片及其制备方法、发光二极管 | |
CN116598396A (zh) | 发光二极管外延片及其制备方法、led | |
CN115986018A (zh) | 一种外延片、外延片制备方法及发光二极管 | |
CN103824916B (zh) | 一种提高氮化镓晶体质量的复合成核层的生长方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Epitaxial growth method of Mg-doped P-type GaN Effective date of registration: 20161226 Granted publication date: 20160824 Pledgee: CITIC Bank Hefei branch Pledgor: Hefei Rainbow Blu-ray Technology Co.,Ltd. Registration number: 2016340000130 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20171205 Granted publication date: 20160824 Pledgee: CITIC Bank Hefei branch Pledgor: Hefei Rainbow Blu-ray Technology Co.,Ltd. Registration number: 2016340000130 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210308 Address after: Room 110-7, building 3, 290 Xingci 1st Road, Hangzhou Bay New District, Ningbo City, Zhejiang Province, 315336 Patentee after: Ningbo anxinmei Semiconductor Co.,Ltd. Address before: 230012 Hefei City, Anhui, New Station Industrial Park Patentee before: HEFEI IRICO EPILIGHT TECHNOLOGY Co.,Ltd. |