CN103789806B - Electroplating bath - Google Patents
Electroplating bath Download PDFInfo
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- CN103789806B CN103789806B CN201310683838.0A CN201310683838A CN103789806B CN 103789806 B CN103789806 B CN 103789806B CN 201310683838 A CN201310683838 A CN 201310683838A CN 103789806 B CN103789806 B CN 103789806B
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- pilot trench
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention belongs to make solar cell device technical field, particularly relate to a kind of electroplating bath.Described electroplating bath for by copper or gallium or indium or selenium element or alloy deposition in substrate surface, include plating pilot trench and female groove, described plating pilot trench has the receiving chamber containing electroplate liquid；The side of described plating pilot trench is linked with the anode being immersed in electroplate liquid, and the middle of described plating pilot trench is provided with for carrying the transporter that described Substrate Synchronous moves, and described anode is arranged at the both sides of described transporter；It is oppositely arranged with described anode on the two sides of described transporter and is partially submerged in described electroplate liquid；Described substrate, through described plating pilot trench, is attached at described transporter side and is oppositely arranged with described anode.The electroplating assembly line of the present invention shortens the length of production line, and space hold is little, only deposits substrate face, and processing step is few, and anode is oppositely arranged with described substrate, it is ensured that the uniformity on the surface of depositing CIGS absorber layer and fineness.
Description
Technical field
The invention belongs to make solar cell device technical field, particularly relate to the electroplating bath of a kind of volume to volume.
Background technology
CIGS (CIGS) thin-film solar cells has splendid light absorption constant, only needs the ultra-thin suction of 1.5 microns
Receiving layer, photoelectric transformation efficiency is stable, spectral response range width, can carry adjustable, and capability of resistance to radiation is strong, without light-induced degradation, has light
Cause gain, low light level gain, and the most lightweight, low cost, the advantage easily installed becomes the emphasis of field of solar energy research.Its
Typical structure is: metal back electrode Mo layer, CIGS absorbed layer, cushion CdS, Window layer high resistant i:ZnO, low-resistance ZnO:Al,
MgF2 antireflective coating and Ni-Al gate electrode.
CIGS absorbed layer is by Cu, and In, Ga, Se tetra-kinds is elementary composition, and the photoelectric transformation efficiency of battery is rubbed with four kinds of elements
Your ratio is relevant, typically requires Cu/ (In+Ga) between 0.75～1, and Ga/ (In+Ga) is between 0.3～0.5.CIGS absorbed layer
Preparation be the core technology of CIGS (CIGS) thin-film solar cells.
Owing to CIGS absorbed layer is made up of multiple element, prepared by the vacuum-deposited method of many employings.Evaporating deposition technique is such as
Sputtering and selenization technique or coevaporation, its equipment is extremely expensive, and process is complicated, complex process, it is difficult to carry out large-scale production.
The most abroad have been reported that the method using conventional non-vacuum deposition, to prepare CIGS absorbed layer, specifically, uses volume to volume electricity
Plating CIGS absorbed layer, as it is shown in figure 1, be loaded with equipped with electroplate liquid 803 in bath trough 802, and be provided with and be immersed in electroplate liquid 803
In anode 800 and the great wheel 801 that is partially submerged in described electroplate liquid 803, being relatively large in diameter and sun of described great wheel 801
Pole 800, between the upper and lower every setting, has gap.On described anode 800, the face towards great wheel 801 is a concave surface 805, described concave surface
The radian of 805 matches with the radian of described great wheel 801, and described concave surface 805 forms two tips with described anode 800 side
804, flexible substrate 806 is wound on the outer peripheral face of great wheel 801 through over cleaning and is immersed in electroplate liquid 803 and electroplates, heavy
Long-pending CIGS absorbed layer.
This scheme has a disadvantage in that
1, anode 800 need process concave surface 805, complex manufacturing technology, and plating time, the tip of anode concave surface both sides
804 can preferentially be lost, and time one long concave surface 805 shoals, it is impossible to guarantee uniformity and the plating speed of the CIGS absorbed layer of electroplating deposition
Stability；
2, when only need to depositing CIGS absorber layer in the one side of described substrate 701 time, its CIGS element is likely deposited on
The another side of substrate 701；
3, in bath trough 802, the flowing of electroplate liquid 803 is the most smooth, it is impossible to the bubble produced when discharging plating timely and effectively,
On the CIGS absorbed layer of electroplating deposition, easily produce piebaldism, have a strong impact on product quality.
It addition, the mode of a kind of level plating disclosed in U.S. Patent Publication No. US2007/0227633A1, due to, use
Horizontal linear plating, substrate does not turn around, and production line is long, takes up room big, during it addition, use which plating, anode
Being positioned at below substrate, the bubble equally with negative electrode precipitation arranges the problem do not gone out, and is positioned over by anode above substrate, deposits again
In the problem that the flowing of cathode plane electroplate liquid is the most smooth, all the surface quality of the CIGS absorbed layer of electroplating deposition can be produced impact.
Summary of the invention
It is an object of the invention to provide a kind of electroplating bath, it is intended to solve prior art uses antivacuum electroplating deposition method
When depositing copper or gallium or indium or selenium element on substrate, the unmanageable difficult problem of its uniformity.
Embodiments of the invention are achieved in that a kind of electroplating bath, for by copper or gallium or indium or selenium element deposition in
One surface of substrate, including
Plating pilot trench, has the receiving chamber for containing electroplate liquid；
Anode, is used for depositing copper or gallium or indium or the plate-shaped setting of selenium element absorption layer and hanging on described electricity
The sidewall of plating pilot trench,
It is immersed in described electroplate liquid；
Transporter, is arranged at the middle of described plating pilot trench, is used for carrying described Substrate Synchronous and moves, described transmission
The drive path of device is in by the end to end closed of multi-line section；
Described anode is immersed in symmetrically arranged side in electroplate liquid is oppositely arranged in parallel with on described transporter respectively,
Described substrate is attached on described transporter the side being immersed in electroplate liquid and is oppositely arranged in parallel with described anode.
Further, described transporter includes a fixed mount, is installed on described fixed mount top and supports described substrate
Least one set main roller wheel and be installed on described fixed mount bottom and coordinates with described main roller wheel rotation least one set from running roller,
And transmission belt, described transmission belt is attached at described main roller wheel and described from the outer peripheral face of running roller and carry described substrate together
Motion.
Further, the drive path of the transmission belt on described transporter is rectangular, and described anode transmits dress with described
Put and be oppositely arranged and be immersed in the opposing parallel interval setting of the two sides in described electroplate liquid.
Further, described main roller wheel and described tangent with the lateral wall of described fixed mount from the outer peripheral face of running roller.
Further, described main roller wheel and the described outer peripheral face from running roller protrude from the lateral wall of described fixed mount.
Further, described transporter is additionally provided with the adjusting apparatus for regulating described transmission belt rate of tension, described
Adjusting apparatus and described main roller wheel and described be connected from running roller scalable.
Further, described transmission belt is additionally provided with adsorbable described substrate and makes the absorption of itself and the laminating of described transmission belt
Portion.
Further, in described pilot trench, it is provided with at least plating solution jet pipe, each described plating solution jet pipe is provided with uniformly
The spray orifice of distribution.
Further, described spray orifice is bellmouth, the inwall of described spray orifice along the pipe of described plating solution jet pipe to pipe foreign side
To gradually expanding.
Further, the diameter ratio of distance and described spray orifice between the spray orifice same plating solution jet pipe arranged is at 20:1 to 5:
Between 1.
Further, same described plating solution jet pipe being provided with two row's spray orifices, the injection direction of described two row's spray orifices is folder
Angle is arranged.
Further, the injection direction of described spray orifice is towards the diapire of described plating pilot trench.
Further, described plating solution jet pipe is to the degree of depth of the distance bottom described pilot trench with the electroplate liquid of described plating pilot trench
Ratio is between 1:7 to 1:20.
Further, the equal drift net for mild electroplate liquid flow velocity, described equal drift net position it are provided with in described plating pilot trench
Between described transporter and described plating solution jet pipe.
Further, described equal drift net is flat board, and described flat board is provided with equally distributed mesh.
Further, the thickness of described flat board and the depth ratio of the electroplate liquid in described plating pilot trench are at 1:50 to 1:300
Between.
Further, described mesh is taper hole, and the diameter of the inwall of described mesh is gradually increased along direction straight up.
Further, described equal drift net is at the bottom of the distance and described plating solution jet pipe extremely described plating pilot trench of described plating solution jet pipe
The distance ratio of wall is between 2:1 to 10:1.
Further, the mesh of described equal drift net is between 5-50.
Further, the sidewall of described plating pilot trench is provided with overflow mechanism, and described overflow mechanism passes through plating solution return duct
Connect with described plating pilot trench.
Further, described overflow mechanism is overflow launder, is arranged at the outside of described plating pilot trench sidewall, and described plating solution returns
One end of flow tube is connected to the bottom of described overflow launder, and the other end is connected to the bottom of described plating pilot trench.
Further, described plating solution jet pipe connects each constituent concentration of electroplate liquid having to regulate in described plating pilot trench
Electroplate liquid mother's groove.
Further, in the exit of described electroplate liquid mother's groove, described plating solution jet pipe is provided with for electroplate liquid is female
Electroplate liquid in groove is pumped to the circulating pump in described plating pilot trench and for filtering the filter of dirt residue.
Compared with prior art, a kind of electroplating bath that the present invention provides, by substrate being attached at the side of transporter,
So, extend the length of substrate electroplating operations deposition, add the area of depositing CIGS absorber layer, so, decrease plating
The quantity of groove, has saved space, and substrate has been attached on transporter and has only deposited the one side of substrate, needn't be to substrate
Another side do removal and process, simplify processing step, meanwhile, anode hang on plating, and pilot trench side is relative with described substrate sets
Putting, described substrate and described anode planes are to plane, and in whole deposition process, the surface loss of described anode planes is consistent, really
The good uniformity of the CIGS absorbed layer of described substrate surface deposition and stable sedimentation rate are protected.
Accompanying drawing explanation
Fig. 1 be in prior art on substrate the structural representation of electroplating deposition CIGS absorbed layer；
Fig. 2 is the composition schematic diagram of a copper plating groove；
Fig. 3 a is a structural representation of transporter in Fig. 2；
Fig. 3 b is the another structural representation of transporter in Fig. 2；
Fig. 3 c is another structural representation of transporter in Fig. 2；
Fig. 3 d is another structural representation of transporter in Fig. 2；
Fig. 4 is that in Fig. 2, the broken section in a copper plating groove arranges schematic diagram.
Fig. 4 a is the schematic cross-section of plating solution jet pipe in a copper plating groove in Fig. 4.
Description of symbols:
300 actuating device 701 stainless steel bands
301 pressure rollers 702 are coated with the stainless steel band of copper
302 carrying roller 800 anodes
501 copper plating groove 801 great wheels
502 copper facing pilot trench 802 bath troughs
503 copper facing mother's groove 803 electroplate liquids
504 copper plating bath 804 tips
505 copper anode 805 concave surfaces
506 transporter 806 flexible substrate
506A fixed mount X1 the first spacing
507 transmission belt L plating solution jet pipe length
508 from running roller d1 nozzle spacing from
509 main roller wheel d2 injection diameters
510 equal drift net d3 current-sharing mesh diameters
511 plating solution jet pipe d4 current-sharing Mesh distances
512 filter d5 equal drift net thickness
513 circulating pump α spray orifice perforate taperings
Angle between 514 plating solution return duct β two rounds
530 adjusting apparatus γ current-sharing mesh openings taperings
531 copper facing pilot trench diapire h1 plating solution jet pipes and the distance of equal drift net
Distance bottom 532 overflow launder h2 plating solution jet pipes and pilot trench
Cross section in S
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, and
It is not used in the restriction present invention.
Below in conjunction with concrete accompanying drawing, the realization of the present invention is described in detail.
As shown in Fig. 2-4a, the preferred embodiment provided for the present invention.
A kind of electroplating bath that the present embodiment provides, is the work nest that occurs of plating, for by copper or gallium or indium or selenium element
It is deposited on a surface of substrate, it will be understood that described substrate for the benefit of deposits copper or gallium or indium or the conduction of selenium element absorption layer
Material is made, such as aluminium foil, titanium foil, molybdenum foil, filtter gold, rustless steel etc..In the present embodiment, described substrate is 100～600mm
Width, 50～100nm 430 thick rustless steel winding, dry up through over cleaning, vacuum sputtering 100～500nm is thick in order Cr, 100
～the Cu of the Mo of 500nm, 20～150nm is made.The most described substrate surface has sputtered Cr/Mo/Cu in advance.Described substrate has
Having upper and lower two surfaces, for ease of follow-up explanation, the lower surface of described substrate is defined as front, the upper surface of described substrate is fixed
Justice is the back side.Sputtering in advance has the stainless steel band 701 of Cr/Mo/Cu by this example, by deposition of metal in described rustless steel
The front of steel band.
Generally, described electroplating bath is referred to as copper plating groove when containing copper plating bath, is referred to as plating gallium groove when containing plating gallium liquid, contains plating indium
It is referred to as plating indium groove during liquid, when containing plating selenium liquid, is referred to as plating selenium groove.
Owing to copper plating groove, plating gallium groove, plating indium groove are similar with principle with the structure of plating selenium groove, for purposes of illustration only, the present embodiment
Selection copper plating groove illustrates.Substrate in the present embodiment is stainless steel band.
As in figure 2 it is shown, described copper plating groove includes containing electroplate liquid for electroplating the plating pilot trench of work, anode and transmission dress
Put 506.Described plating pilot trench is copper facing pilot trench 502, has receiving chamber, is loaded with copper plating bath 504；Described anode is copper anode
505, for depositing the plate-shaped setting of Copper uptakie layer and hanging on the side of described copper facing pilot trench 502, it is immersed in described copper plating bath
In 504；The two sides relative with described transporter 506 are oppositely arranged, and transporter 506 is arranged at described copper facing pilot trench 502
Middle, be used for carrying described Substrate Synchronous and move, the drive path of described transporter 506 is in end to end by multi-line section
Closed；Described copper anode 505 is immersed in symmetrically arranged side in electroplate liquid with on described transporter 506 respectively
Be oppositely arranged in parallel, described substrate be attached on described transporter 506 side being immersed in electroplate liquid and with described anode
It is oppositely arranged in parallel, and there is a suitable spacing.
In the present embodiment, described copper anode 505 is tabular, and described copper anode 505 is immersed in described copper facing pilot trench 502
Copper plating bath in, so, Anode machining is simple, and elongated, stainless steel band 701 the most to be plated is slightly wider, hangs over plating pilot trench
Both sides, and change anode convenient and simple.Described copper anode 505 be distributed in described actuating device 300 the left and right sides and with institute
State stainless steel band 701 to be oppositely arranged, there is a spacing.By described stainless steel band 701 opposite anode is arranged, described stainless
Steel band 701 and described anode planes are to plane, and in whole deposition process, the surface loss of described anode planes is consistent, it is ensured that
The good uniformity of the Copper uptakie layer of described stainless steel band 701 surface deposition and stable sedimentation rate.In actual production, according to
Need the thickness of the copper of deposition, the spacing between described copper anode 505 and described stainless steel band 701 is set.Specifically, originally
In embodiment, the outline of described transmitting device 506 is cube shape, has six faces, on the two sides of described transporter 506
It is oppositely arranged with described anode and is partially submerged in copper plating bath 504.Wherein, the left and right side of transporter 506 and described copper facing
The left and right side of groove 501 inwall is relative.Described stainless steel band 701 when described copper facing pilot trench 502, described stainless steel band 701
It is attached at left and right side and the bottom surface of described transporter 506, is oppositely arranged in parallel with described copper anode 505.Described transmission fills
The drive path putting transmission belt on 506 is rectangular, described copper anode 505 and described transporter 506 is oppositely arranged and sinks
The opposing parallel interval, left and right side being dipped in described electroplate liquid is arranged.In copper facing pilot trench 502, extend stainless steel band 701
Deposition length, add deposition Copper uptakie layer area, improve the efficiency of deposition, decrease the quantity of copper plating groove, save
Space.By stainless steel band 701 synchronizing moving described in the rotation portability of described transporter 506.Stainless steel band 701 back side
It is affixed with left and right side and the bottom surface of transporter 506, and both synchronizing movings, so, it is to avoid stainless steel band 701 back side is plated
Upper metal level.The most only the front of stainless steel band 701 is deposited, the back side of stainless steel band 701 needn't be done removal and process, letter
Change processing step, improve deposition efficiency, save cost.
For ease of distinguishing, by the spacing between the copper anode 505 in described copper facing pilot trench 502 and described stainless steel band 701
It is defined as the first spacing X1；According to the difference of each coating electroplating technology, described first spacing X1 is rationally set, when gap relatively
Hour, electroplate liquid height speed in reversed direction passes through, and makes the bubble separated out on negative electrode be taken away by plating solution in time, it is ensured that the surface of sedimentary does not has
There is piebaldism.
Specifically, as illustrated in figs. 3 a-3d, described transporter 506 includes a fixed mount 506A, least one set main roller wheel
509 and least one set coordinate with described main roller wheel 509 rotate from running roller 508 and transmission belt 507, described fixed mount 506A's
Rectangular in cross-section shape, the described rectangular setting of transmission belt 507 is also attached at described main roller wheel 509 and described from running roller 508
On side face and carry described substrate and together move.Described main roller wheel 509 is installed on described fixed mount 506A top and supports described
Stainless steel band 701；Described it be installed on described fixed mount 506A bottom from running roller 508 and also support described stainless steel band 701；Described biography
Defeated band 507 be attached at described main roller wheel 509 and described from the outer peripheral face of running roller 508 along with described main roller wheel 509 and described from
The rotation of running roller 508 and carry described stainless steel band 701 and together move.So, simple in construction, on the one hand, guarantee described stainless
The back side of steel band 701 is tightly attached in described transmission belt 507
Specifically, as shown in Figure 3 a, described main roller wheel 509 and the described outer peripheral face from running roller 508 and described fixed mount
The lateral wall of 506A is tangent.Two corners at the top of shown fixed mount 506A are respectively installed with a rotating main roller wheel
509, the outer peripheral face of described main roller wheel 509 is tangent with the top margin of described fixed mount 506A and left and right side, shown fixed mount 506A
Two corners of bottom be respectively installed with one rotating from running roller 508, described solid with described from the outer peripheral face of running roller 508
Determine frame 506A base and and left and right side tangent.Described transmission belt 507 rotating around two main roller wheel 509 and two from running roller
508 surround a cuboid sealed.In plating pilot trench, described actuating device 300 is all mutually nibbled with described main roller wheel 509
Closing, stainless steel band 701 is through actuating device 300 and main roller wheel 509 engagement place, downwards around being arranged at described transporter 506 times
Two of portion, from running roller 508, attach the opposite side from described transporter 506 and lay out, stainless steel lining bottom back side and transmission belt 507
Push against and be affixed, play the not deposited upper metal level in protection stainless steel band 701 back side.
Or, as shown in Figure 3 b, described main roller wheel 509 is provided with two, is fixedly arranged on turning of described fixed mount 506A top
At angle, described it is provided with two from running roller 508, is arranged at the corner of the bottom of described fixed mount 506A, described main roller wheel 509 He
The described outer peripheral face from running roller 508 protrudes from the lateral wall of described fixed mount 506A.Described transmission belt 507 is sheathed on described home roll
Wheel 509 and described from the outer peripheral face of running roller 508, described main roller wheel 509 and described push against described transmission belt 507 from running roller 508.
As shown in Figure 3 c, another embodiment of described transporter 506.Two described main roller wheel 509 are respectively arranged at institute
Stating the corner at fixed mount 506A top, described be provided with nine from running roller 508, wherein, three are fixedly arranged on described fixed mount 506A
Bottom base on, the both sides of described fixed mount 506A are respectively fixed with described in three from running roller 508.Described transmission belt 507 is overlapped
It is located at described main roller wheel 509 and described from the outer peripheral face of running roller 508, described main roller wheel 509 and described push against institute from running roller 508
State transmission belt 507.
As shown in Figure 3 d, described transporter 506 is additionally provided with one for the tune regulating described transmission belt 507 rate of tension
Engagement positions 530, described adjusting apparatus 530 and described main roller wheel 509 and described be connected from running roller 508 scalable.Specifically, Fig. 3 d
In be not shown specifically, described adjusting means has a fixing post and is arranged in the centre position of described fixed mount 506A, fixing post
With described main roller wheel 509 and described be connected by regulating part from running roller 508, the regulating part in the present embodiment is direct acting cylinder, institute
The base stating direct acting cylinder is articulated with described fixing post, and the piston rod of described direct acting cylinder connects described main roller wheel 509 or described
Fixing axle from running roller 508.So, the rate of tension of transmission belt 507 described in scalable, and then regulate in described transmission belt 507
The rate of tension of stainless steel band 701.
Specifically, described transmission belt 507 is additionally provided with the adsorption section of adsorbable described stainless steel band 701.In the present embodiment
Described adsorption section be vacuum cups, described vacuum cups be located in described transmission belt 507 and described stainless steel band 701 laminating
Simultaneously, so, fitting in described transmission belt 507 of described stainless steel band 701 more consolidation can be made, it is to avoid electroplate liquid penetrates into
The back side of described stainless steel band 701.
When specifically applying, it is connected with described vacuum cups by arranging a vacuum generator, when described stainless steel band 701
When having just enter into described plating pilot trench porch, described stainless steel band 701 is positioned at above electroplate liquid, will with described transmission belt 507
Contact that time, the suction nozzle that described transmission belt 507 will touch with described stainless steel band 701 open, thus by described not
Rust steel band 701 is firmly attached in described transmission belt 507；When electroplate liquid taken out of by described stainless steel band 701, plating will be left
During groove, when namely stainless steel band 701 will separate with described transmission belt 507, be positioned on the stainless steel band 701 in exit is true
Suction head is closed, and described transmission belt 507 can be made to separate, so with described stainless steel band 701, it is to avoid vacuum cups suck-back institute
Stating electroplate liquid, the most guaranteed described stainless steel band 701 is adsorbed in the firmness in described transmission belt 507, it is to avoid described not
The backside deposition coat of metal of rust steel band 701.
Certainly, for improving the service life of described transmission belt 507 further, corrosion resistant material can be used to make, and in
One return flow line being communicated in described plating pilot trench is set on the air flue of described vacuum cups, it is, the most described very
Suction head sucks described electroplate liquid, and described return flow line is opened, and is back to by described electroplate liquid in the plating pilot trench of correspondence.As
This, further ensure that, described stainless steel band 701 backside deposition metal level.
As shown in Figure 2 and Figure 4, so that copper plating bath 504 mixing in copper facing pilot trench 502 is uniform, described copper facing
It is provided with at least plating solution jet pipe 511 in groove 502, described plating solution jet pipe is provided with equally distributed spray orifice.Specifically, institute
Stating spray orifice is bellmouth, the inwall of described spray orifice along the pipe of described plating solution jet pipe 511 outside pipe direction gradually expand.Further
Ground, the injection direction of described spray orifice is towards the diapire of described plating pilot trench.So, electroplate liquid is through being arranged at described copper facing pilot trench
The plating solution jet pipe 511 of diapire 531 sprays downwards, and touch the bottom and bounce back up backward upper stirring electroplate liquid, and make that plating mixes is more uniform, respectively
Place's concentration is identical.
Generally, spray orifice perforate tapering α is 30 °～60 °.Further, between the spray orifice same plating solution jet pipe 511 arranged
The ratio of distance d1 and described injection diameter d2 is between 20:1 to 5:1.In the present embodiment, described nozzle spacing from d1 be 2～
20mm, injection diameter d2 are 0.5～3.5mm.Specifically, same described plating solution jet pipe 511 is provided with two row's spray orifices, described
The injection direction of two row's spray orifices is that angle is arranged.Generally, the angle β between two row's spray orifices is 60 °～120 °.
Further, being provided with equal drift net 510 in described plating pilot trench, described equal drift net 510 is for upwards springing up gently
The flow velocity of electroplate liquid, described equal drift net 510 is between described transporter 506 and described plating solution jet pipe 511.So, when
The electroplate liquid sprung up is after equal drift net 510 plate, and fierce springing up is able to mild, makes described electroplate liquid become tranquil, is difficult to produce
Angry bubble, it is to avoid produce piebaldism on electrodeposited coating surface.
Specifically, the depth ratio of the distance bottom described plating solution jet pipe 511 and pilot trench and the electroplate liquid of described plating pilot trench
Between 1:7 to 1:20.So, above-mentioned plating solution jet pipe 511 is located at the correct position in described plating pilot trench, it can be ensured that electricity
Plating solution has preferably mixing effect, avoids remaining dirt blocking, the spray orifice on plating solution jet pipe 511 simultaneously.
Further, described equal drift net 510 is flat board, and described flat board is provided with equally distributed mesh.Specifically, institute
State mesh and be arranged to taper hole, it is, opening up bellmouth orifice, the diameter of the inwall of described mesh along direction straight up by
Cumulative generally, current-sharing mesh diameter d3 is 0.5～3.5mm greatly, and current-sharing mesh openings tapering γ is 20 °～75 °.Specifically, institute
State the mesh of equal drift net 510 between 5-50.Generally, current-sharing Mesh distance d4 is 1～5mm.
Further, the thickness of described flat board and the depth ratio of the electroplate liquid in described plating pilot trench are at 1:50 to 1:300
Between.Generally, equal drift net thickness d 5 is 1～5mm.
Specifically, distance h2 bottom distance h1 of plating solution jet pipe 511 and equal drift net 510 and plating solution jet pipe 511 and pilot trench
Ratio h1/h2 between 2:1 to 10:1.So, both ensure that bottom copper facing pilot trench without circulation dead angle, and made again up to shove
Electroplate liquid is the tranquilest, thus does not produce bubble, it is ensured that coating surface does not has piebaldism.
For purposes of illustration only, specify plating a width of xmm of pilot trench, a length of ymm, generally, plating solution jet pipe length L be x-(15mm～
28mm), the radical N of jet pipe is (1/2) * (y/h2) * ctg (β/2), N round numbers.
Specifically, as in figure 2 it is shown, for avoiding the fluctuation of concentration of copper plating bath in copper facing pilot trench 502 excessive, described copper facing pilot trench
502 are equipped with copper facing mother's groove 503.In like manner, described secondary copper plating groove 502B, equipped with a secondary copper facing mother groove 503B, uses
Secondary copper plating bath 504B concentration in regulating described secondary copper plating groove 502B；Described plating gallium pilot trench 516 is all equipped with a plating
Gallium mother's groove 517, for regulating plating gallium liquid 518 concentration in described plating gallium pilot trench 516；Described plating indium pilot trench 521 is equipped with one
Plating indium mother's groove 522, for regulating plating indium liquid 523 concentration in described plating indium pilot trench 521；Described plating selenium pilot trench 526 is equipped with one
Individual plating selenium mother's groove 527, for regulating the plating selenium concentration in described plating selenium pilot trench 526；So, in described plating pilot trench can being made
Electroplate liquid is in the concentration of a suitable deposition metal level all the time.
Specifically, the sidewall of described copper facing pilot trench 502 is provided with overflow mechanism, and described overflow mechanism passes through plating solution return duct
514 connect with described copper facing pilot trench 502.Specifically, described overflow mechanism is overflow launder 532, the one of described plating solution return duct 514
End is connected to the bottom of described overflow launder 532, and the other end is connected to the bottom of described 502.Further, described plating solution return duct
Connect on 514 and have copper facing mother's groove 503, in described copper facing mother's groove 503, store the copper plating bath of high concentration, and can be by its interior plating
Liquid heating or refrigeration, adjust the concentration of each composition in the temperature with the electroplate liquid in described copper facing pilot trench 502 and electroplate liquid.
As it is shown on figure 3, one end of described plating solution return duct 514 is connected to the bottom of described overflow launder 532, the other end connects
In described copper facing mother's groove 503.Specifically, install on the described plating solution jet pipe 511 in the exit of described electroplate liquid mother's groove
There is circulating pump 513 and for filtering the filter 512 of dirt residue.So, electroplate liquid flows back to copper facing mother by this overflow launder 532
In groove 503, then through the pumping of circulating pump 513 and the filtration of filter 512, it is transmitted back to electroplate pilot trench 502, it is achieved circulation.As
This, can realize circulating of copper plating bath 504, and constantly purify electroplate liquid in described copper plating groove 501, in keeping copper plating groove 501
Clean and bath concentration remain stably.Described plating solution return duct 514 is divided into many plating solution sprays in entering copper facing pilot trench 502
Pipe 511.As shown in fig. 4 a, the interior cross section S sum of each plating solution jet pipe 511 is equal to or more than interior section of described plating solution return duct 514
Face.
Cyclic process with regard to copper plating bath 504 below is briefly described: the copper plating bath 504 in described copper facing mother's groove 503 is electroplated
Liquid is extracted out by circulating pump 513, after filter 512 filters, owing to plating solution return duct 514 branches in copper facing pilot trench 502
Plating solution jet pipe 511, the spray orifice on plating solution jet pipe 511 sprays down, and rebounding after touching copper facing pilot trench diapire 531 upwards springs up,
Slowing down gently through equal drift net 510, the copper plating bath 504 of fluctuation becomes tranquil at once, and the liquid level in copper facing pilot trench 502 rises, and disappears
Except surging, the crack through copper anode 505 and stainless steel belt, overflow the sidewall of described copper facing pilot trench 502, inflow sets
It is placed in the overflow launder 532 on described copper facing pilot trench 502 sidewall, then passes back in copper facing mother's groove 503, with described copper facing mother's groove
Copper plating bath 504 in 503 mixes, then is pumped out to described copper facing pilot trench 502 by circulating pump 513, such iterative cycles.
For more preferably described stainless steel band 701 being introduced in described plating solution copper groove 502, in the entrance of described plating solution copper groove 502
Place and exit, be provided with an actuating device 300, and described actuating device 300 includes intermeshing pressure roller 301 and carrying roller 302,
Described stainless steel band 701 is arranged in described pressure roller 301 and described carrying roller 302 engagement place, described pressure roller 301 and described carrying roller 302
Support the above and below of described stainless steel band 701 respectively.In actual application, described carrying roller 302 is force piece, drives described pressure roller
301 rotate.The carrying roller 302 being positioned at plating pilot trench import department and exit has the effect of conduction, carrying roller 302 during plating the most simultaneously
Connect power cathode, electric current is transmitted at the bottom of stainless steel lining to be plated, makes to become at the bottom of stainless steel lining negative electrode.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (22)
1. an electroplating bath, for by copper or gallium or indium or selenium element deposition in a surface of substrate, it is characterised in that include
Plating pilot trench, has the receiving chamber for containing electroplate liquid；
Anode, for depositing copper or gallium or indium or the plate-shaped setting of selenium element absorption layer and hanging on the side of described plating pilot trench
Wall,
It is immersed in described electroplate liquid；
Transporter, is arranged at the middle of described plating pilot trench, is used for carrying described Substrate Synchronous and moves,
The drive path of described transporter is in by the end to end closed of multi-line section；
Described anode is immersed in symmetrically arranged side in electroplate liquid is oppositely arranged in parallel with on described transporter respectively, described
Substrate is attached on described transporter the side being immersed in electroplate liquid and is oppositely arranged in parallel with described anode；
Wherein, described transporter includes a fixed mount, is installed on described fixed mount top and supports at least the one of described substrate
Group main roller wheel and be installed on described fixed mount bottom and coordinates with described main roller wheel rotate least one set from running roller, and transmit
Band, described transmission belt is attached at described main roller wheel and described from the outer peripheral face of running roller and carry described substrate and together move.
A kind of electroplating bath the most according to claim 1, it is characterised in that: the transmission road of the transmission belt on described transporter
Footpath is rectangular, described anode and described transporter is oppositely arranged and is immersed in the two sides in described electroplate liquid opposing parallel
Interval is arranged.
3. according to a kind of electroplating bath according to any one of claim 1-2, it is characterised in that: described main roller wheel and described from roller
The outer peripheral face of wheel is tangent with the lateral wall of described fixed mount.
4. according to a kind of electroplating bath according to any one of claim 1-2, it is characterised in that: described main roller wheel and described from roller
The outer peripheral face of wheel protrudes from the lateral wall of described fixed mount.
5. according to a kind of electroplating bath according to any one of claim 1-2, it is characterised in that: it is additionally provided with on described transporter
For regulating the adjusting apparatus of described transmission belt rate of tension, described adjusting apparatus and described main roller wheel and described from running roller scalable
Connect.
A kind of electroplating bath the most according to claim 2, it is characterised in that: it is additionally provided with adsorbable described lining in described transmission belt
The end, makes the adsorption section of itself and the laminating of described transmission belt.
7. according to a kind of electroplating bath according to any one of claim 1-2, it is characterised in that: it is provided with at least in described pilot trench
A piece plating solution jet pipe, each described plating solution jet pipe is provided with equally distributed spray orifice.
A kind of electroplating bath the most according to claim 7, it is characterised in that: described spray orifice is bellmouth, described spray orifice interior
Wall along the pipe of described plating solution jet pipe outside pipe direction gradually expand.
A kind of electroplating bath the most according to claim 8, it is characterised in that: between the spray orifice arranged on same plating solution jet pipe away from
From the diameter ratio of described spray orifice between 20:1 to 5:1.
A kind of electroplating bath the most according to claim 9, it is characterised in that: it is provided with two rows on same described plating solution jet pipe
Spray orifice, the injection direction of described two row's spray orifices is that angle is arranged.
11. a kind of electroplating baths according to claim 10, it is characterised in that: the injection direction of described spray orifice is towards described electricity
The diapire of plating pilot trench.
12. a kind of electroplating baths according to claim 11, it is characterised in that: bottom described plating solution jet pipe to described pilot trench
The depth ratio of the electroplate liquid of distance and described plating pilot trench is between 1:7 to 1:20.
13. according to a kind of electroplating bath according to any one of claim 1-2,8-12, it is characterised in that: in described plating pilot trench
Be provided with the equal drift net for mild electroplate liquid flow velocity, described equal drift net be positioned at described transporter and described plating solution jet pipe it
Between.
14. a kind of electroplating baths according to claim 13, it is characterised in that: described equal drift net is flat board, on described flat board
It is provided with equally distributed mesh.
15. a kind of electroplating baths according to claim 14, it is characterised in that: the thickness of described flat board and described plating pilot trench
The depth ratio of interior electroplate liquid is between 1:50 to 1:300.
16. a kind of electroplating baths according to claim 15, it is characterised in that: described mesh is taper hole, described mesh interior
The diameter of wall is gradually increased along direction straight up.
17. a kind of electroplating bath according to claim 16, it is characterised in that: described equal drift net to described plating solution jet pipe away from
From described plating solution jet pipe to the distance ratio of described plating pilot trench diapire between 2:1 to 10:1.
18. a kind of electroplating baths according to claim 17, it is characterised in that: the mesh of described equal drift net is between 5-50.
19. according to a kind of electroplating bath according to any one of claim 1-2,8-12,14-18, it is characterised in that: described plating
The sidewall of pilot trench is provided with overflow mechanism, and described overflow mechanism is connected with described plating pilot trench by plating solution return duct.
20. a kind of electroplating baths according to claim 19, it is characterised in that: described overflow mechanism is overflow launder, is arranged at
The outside of described plating pilot trench sidewall, one end of described plating solution return duct is connected to the bottom of described overflow launder, and the other end connects
Bottom in described plating pilot trench.
21. a kind of electroplating baths according to claim 20, it is characterised in that: connect on described plating solution jet pipe and regulate
Electroplate liquid mother's groove of each constituent concentration of electroplate liquid in described plating pilot trench.
22. a kind of electroplating baths according to claim 21, it is characterised in that: in the exit of described electroplate liquid mother's groove, institute
State the circulating pump and use being provided with on plating solution jet pipe for being pumped in described plating pilot trench by the electroplate liquid in electroplate liquid mother's groove
In the filter filtering dirt residue.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI560899B (en) * | 2014-09-03 | 2016-12-01 | Manz Taiwan Ltd | Roll-to-roll manufacturing equipment and system thereof |
| CN104862769A (en) * | 2015-05-16 | 2015-08-26 | 中北大学 | Electroplate liquid circulating filtration system |
| US10131998B2 (en) * | 2015-10-02 | 2018-11-20 | Global Solar Energy, Inc. | Metalization of flexible polymer sheets |
| CN105803497B (en) * | 2016-05-24 | 2018-05-18 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN106011988B (en) * | 2016-07-07 | 2018-06-26 | 成都乾瑞科技有限公司 | The adjustable electric subcomponent electroplating bath of thickness and color high uniformity |
| CN108265318B (en) * | 2016-12-30 | 2019-12-20 | 上海移宇科技股份有限公司 | Method and device for preparing flexible battery cathode powder |
| CN114808057A (en) * | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | Electroplating device and electroplating system |
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| US20060151315A1 (en) * | 2005-01-12 | 2006-07-13 | Jin-Kyu Yang | Apparatus for manufacturing electrolytic metal foil |
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| US20130168256A1 (en) * | 2011-12-30 | 2013-07-04 | Ashworth Bros., Inc. | System and method for electropolishing or electroplating conveyor belts |
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| JPH093690A (en) * | 1995-06-20 | 1997-01-07 | Chuo Seisakusho Ltd | One-side electric plating equipment of metallic sheet |
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| US20060151315A1 (en) * | 2005-01-12 | 2006-07-13 | Jin-Kyu Yang | Apparatus for manufacturing electrolytic metal foil |
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN102884660A (en) * | 2010-03-01 | 2013-01-16 | 古河电气工业株式会社 | Surface treatment method for copper foil, surface treated copper foil and copper foil for negative electrode collector of lithium ion secondary battery |
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