CN103730565B - 一种氮化铝cob led光源的封装方法 - Google Patents
一种氮化铝cob led光源的封装方法 Download PDFInfo
- Publication number
- CN103730565B CN103730565B CN201410023171.6A CN201410023171A CN103730565B CN 103730565 B CN103730565 B CN 103730565B CN 201410023171 A CN201410023171 A CN 201410023171A CN 103730565 B CN103730565 B CN 103730565B
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- Prior art keywords
- aluminium nitride
- component
- radiating substrate
- light source
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410023171.6A CN103730565B (zh) | 2014-01-17 | 2014-01-17 | 一种氮化铝cob led光源的封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410023171.6A CN103730565B (zh) | 2014-01-17 | 2014-01-17 | 一种氮化铝cob led光源的封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN103730565A CN103730565A (zh) | 2014-04-16 |
CN103730565B true CN103730565B (zh) | 2016-08-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410023171.6A Expired - Fee Related CN103730565B (zh) | 2014-01-17 | 2014-01-17 | 一种氮化铝cob led光源的封装方法 |
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CN (1) | CN103730565B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105081329A (zh) * | 2015-07-29 | 2015-11-25 | 长沙鼎成新材料科技有限公司 | 一种led用碳氮化钛陶瓷基板 |
CN106601898A (zh) * | 2015-10-19 | 2017-04-26 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN105742466A (zh) * | 2016-04-21 | 2016-07-06 | 陕西锐士电子技术有限公司 | 汽车灯用led光源板 |
CN106838642A (zh) * | 2017-02-24 | 2017-06-13 | 广东昭信照明科技有限公司 | 一种led贴片光源 |
CN206929725U (zh) * | 2017-05-12 | 2018-01-26 | 深圳市光峰光电技术有限公司 | 波长转换装置和激光荧光转换型光源 |
CN108493320B (zh) * | 2018-05-10 | 2020-04-28 | 北京大学东莞光电研究院 | 纳米复合缓冲镀层mcob封装氮化铝基板及其制备方法 |
CN109951947B (zh) * | 2019-03-07 | 2023-10-20 | 珠海市航达科技有限公司 | 一种反射陶瓷电路板及其加工方法 |
CN116410001A (zh) * | 2021-12-31 | 2023-07-11 | 江苏博睿光电股份有限公司 | 一种基板、制备方法及应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202443970U (zh) * | 2011-12-31 | 2012-09-19 | 杭州电子科技大学 | 一种采用cob技术的led封装结构 |
CN202616297U (zh) * | 2012-02-20 | 2012-12-19 | 高新低碳能源科技股份有限公司 | 一种高功率led散热陶瓷基板 |
CN103508759A (zh) * | 2012-06-26 | 2014-01-15 | 比亚迪股份有限公司 | 一种大功率led底座的制备方法和大功率led底座 |
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2014
- 2014-01-17 CN CN201410023171.6A patent/CN103730565B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202443970U (zh) * | 2011-12-31 | 2012-09-19 | 杭州电子科技大学 | 一种采用cob技术的led封装结构 |
CN202616297U (zh) * | 2012-02-20 | 2012-12-19 | 高新低碳能源科技股份有限公司 | 一种高功率led散热陶瓷基板 |
CN103508759A (zh) * | 2012-06-26 | 2014-01-15 | 比亚迪股份有限公司 | 一种大功率led底座的制备方法和大功率led底座 |
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CN103730565A (zh) | 2014-04-16 |
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Effective date of registration: 20180710 Address after: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee after: Dongguan Yanyuan Investment Co.,Ltd. Address before: 523808 the 4 floor of Building 1, Songshan Lake innovation and Technology Park, Dongguan, Guangdong, Dongguan, Peking University Patentee before: Dongguan Institute of Opto-Electronics Peking University |
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Effective date of registration: 20180801 Address after: 523000 Dongguan, Guangdong Province, the town of Xiao Lang village, 8 Patentee after: DONGGUAN ZHONGHAO LIGHTING TECHNOLOGY CO.,LTD. Address before: 523000 407, room 4, building 1, innovation and Technology Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong, China Patentee before: Dongguan Yanyuan Investment Co.,Ltd. |
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Granted publication date: 20160803 Termination date: 20220117 |