CN107371356A - The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner - Google Patents
The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner Download PDFInfo
- Publication number
- CN107371356A CN107371356A CN201710760995.5A CN201710760995A CN107371356A CN 107371356 A CN107371356 A CN 107371356A CN 201710760995 A CN201710760995 A CN 201710760995A CN 107371356 A CN107371356 A CN 107371356A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- power component
- metal cooling
- air conditioner
- board assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of circuit board assemblies,The electric-controlled box and air conditioner of air conditioner,Wherein,The circuit board assemblies include circuit board,Power component,Metal cooling board and thermally conductive insulating layer,The power component is on the circuit board,The metal cooling board offers the holding tank of cooling matchmaker cooling line installation,The thermally conductive insulating layer is arranged between the metal cooling board and the power component,The metal cooling board and the power component to be insulated,And the metal cooling board and the power component thermal conductivity are connect,Refrigerant cooling line is connect by metal cooling board and thermally conductive insulating layer with the power component thermal conductivity,Efficiently to be cooled down to the power component,The thermally conductive insulating layer can insulate the power component and the metal cooling board simultaneously,So as to,It can take into account and the power component is efficiently radiated,The power component is insulated again simultaneously.
Description
Technical field
The present invention relates to air conditioner technical field, more particularly to a kind of circuit board assemblies, the electric-controlled box and sky of air conditioner
Adjust device.
Background technology
The use of convertible frequency air-conditioner is more and more extensive at present, and the popularization of particularly high-power frequency conversion air-conditioning is more and more wider, still
The power component of convertible frequency air-conditioner such as IGBT device (English full name：Insulated Gate Bipolar Transistor,
Chinese：Insulated gate bipolar transistor), diode etc. due to the limitation of technique, be all to use at present to reliably radiate
Nonisulated design, thus brings a stubborn problem, because power component is all to carry high pressure at work,
It is again simultaneously to be operated in high current pattern, heating is very severe, so having to reliably be radiated, takes into account again reliable
Insulation.
The content of the invention
The main object of the present invention is to propose a kind of circuit board assemblies, the electric-controlled box and air conditioner of air conditioner, it is intended to energy
It is enough that power component is preferably cooled down, while ensure again and power component is preferably insulated.
To achieve the above object, the present invention provides a kind of circuit board assemblies, for the electric-controlled box of air conditioner, the circuit board
Component includes：
Circuit board；
Power component, on the circuit board；
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace
The holding tank of dress；And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold
But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect.
Preferably, the material of the metal cooling board is aluminium.
Preferably, a surface of the metal cooling board back to the circuit board offers a plurality of holding tank.
Preferably, the metal cooling board is provided with mounting groove back to a surface of the circuit board, is set in the mounting groove
There are collets；
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conduction
Insulating barrier connects with the power component.
Preferably, the metal cooling board is respectively equipped with the installation back to two surfaces in face of the circuit board
Groove, the mounting groove on described two surfaces is in being oppositely arranged and the collets being equipped with it, to form a pair of collets；
First spiro connecting piece passes through the pair of collets, connects with the thermally conductive insulating layer and the power component
Connect.
Preferably, the material of the collets is ceramics.
Preferably, the collets are spirally connected by the second spiro connecting piece is fixed to the bottom wall of the mounting groove.
Preferably, the circuit board is provided with insulating mounting frame, and the power component is located at the insulating mounting inframe,
The insulating mounting inframe is also equipped with multiple control chips；
The metal cooling board is on the insulating mounting frame.
Preferably, the power component includes at least one of IGBT device and diode.
The present invention also provides a kind of electric-controlled box of air conditioner, including box body and the circuit board assemblies in the box body,
The circuit board assemblies include：
Circuit board；
Power component, on the circuit board；
Metal cooling board, on the power component, the metal cooling board offers cooling matchmaker cooling line peace
The holding tank of dress；And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to the metal is cold
But plate and power component insulation, and the metal cooling board and the power component thermal conductivity are connect.
The present invention provides a kind of air conditioner again, including：
The electric-controlled box of air conditioner, the electric-controlled box of the air conditioner include box body and the circuit board group in the box body
Part, the circuit board assemblies include circuit board, power component, metal cooling board and thermally conductive insulating layer；The power member device
Part is on the circuit board, and the metal cooling board is on the power component, and the metal cooling board offers
The holding tank of cooling matchmaker cooling line installation, the thermally conductive insulating layer are arranged on the metal cooling board and the power component
Between, the metal cooling board and the power component to be insulated, and the metal cooling board and the power is first
Device thermal conductivity connects；And
Refrigerant cooling line, it is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling line is installed with
The holding tank.
In technical scheme provided by the invention, refrigerant cooling line passes through metal cooling board and thermally conductive insulating layer and the work(
Rate component thermal connects, and efficiently to be cooled down to the power component, while the thermally conductive insulating layer can be by the work(
Rate component insulate with the metal cooling board, the power component is efficiently radiated it is thus possible to take into account, simultaneously
The power component is insulated again.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the perspective exploded view of an embodiment of circuit board assemblies provided by the invention；
Fig. 2 is the combination diagram for the circuit board assemblies that Fig. 1 is provided；
Fig. 3 is Fig. 2 schematic cross-sectional view.
Drawing reference numeral explanation：
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
If it is to be appreciated that related in the embodiment of the present invention directionality instruction (such as up, down, left, right, before and after ...),
Then directionality instruction be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each part,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, " first ", " second " etc. are somebody's turn to do
Description be only used for describing purpose, and it is not intended that instruction or implying its relative importance or implicit indicating indicated skill
The quantity of art feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes at least one spy
Sign.In addition, the technical scheme between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
Based on enough realizations, the knot of this technical scheme is will be understood that when the combination appearance of technical scheme is conflicting or can not realize
Conjunction is not present, also not within the protection domain of application claims.
The present invention provides a kind of air conditioner, and in particular transducer air conditioning, air conditioner includes the electric-controlled box of air conditioner, air-conditioning
The electric-controlled box of device includes box body and the circuit board assemblies in the box body, the power component of transducer air conditioning (including
At least one of IGBT device, diode etc.) due to the limitation of technique, in order to reliably radiate all be at present employ it is non-
The design of insulation, for example, the outer face of IGBT device is provided with a metallic heat radiating plate, by the inside member of the power component
The heat derives of part, cooling and insulation accordingly, for power component are particularly important.
In consideration of it, the present invention provides a kind of circuit board assemblies, Fig. 1 to Fig. 3 is the one of circuit board assemblies provided by the invention
Embodiment, refers to Fig. 1 to Fig. 3, the circuit board assemblies 100 include circuit board 1, power component 2, metal cooling board 3 with
And thermally conductive insulating layer 4.
The power component 2 specifically, other electronics is additionally provided with the circuit board 1 on the circuit board 1
Device such as electric capacity, resistance and some control chips etc..
The metal cooling board 3 offers cooling matchmaker cooling line, and (the refrigerant cooling line is connected to the air conditioner
Refrigerant pipeline system in) holding tank 31 of installation, the metal cooling board 3 is located at the work(on the circuit board 1
On rate component 2, specifically, the circuit board 1 is provided with insulating mounting frame 8, and the power component 2 is pacified located at the insulation
Frame up in 8, multiple control chips are also equipped with the insulating mounting frame 8, the metal cooling board 3 is located at the insulating mounting
On frame 8.
The thermally conductive insulating layer 4 is arranged between the metal cooling board 3 and the power component 2, to by described in
Metal cooling board 3 and the power component 2 are insulated, and the metal cooling board 3 and the thermal conductivity of the power component 2 are connect.
In technical scheme provided by the invention, refrigerant cooling line by metal cooling board 3 and thermally conductive insulating layer 4 with it is described
The thermal conductivity of power component 2 connects, and efficiently to be cooled down to the power component 2, while the thermally conductive insulating layer 4 can be by institute
State power component 2 to insulate with the metal cooling board 3, the power component 2 is efficiently dissipated it is thus possible to take into account
Heat, while the power component 2 is insulated again.
The metal cooling board 3 is the preferable metal material of heat conductivility, for example, copper, iron, aluminium etc., in the present embodiment
In, the material of the metal cooling board 3 is aluminium, because aluminium has the advantages that light, cheap and thermal conductivity factor is high.
The one side of thermally conductive insulating layer 4 plays a part of heat conduction, also will the metal cooling board 3 and power member
The thermal conductivity of device 2 connects, and on the other hand plays a part of insulation, also will the power component 2 and the metal cooling board 3 it is exhausted
Edge, therefore, the specific material of the thermally conductive insulating layer 4 is not limited, such as can be heat conduction silicone or heat-conducting silicone grease etc.,
Can be that single layer structure can also be sandwich construction, as shown in figures 1 and 3, the thermally conductive insulating layer 4 is that sandwich construction includes position
Heat conductive insulating soft layer 41 (such as heat conduction silicone) in outer layer and the metal heat-conducting layer 42 positioned at intermediate layer, wherein institute
The effect for stating metal heat-conducting layer 42 is to play a part of the protection heat conductive insulating soft layer 41, and especially protection is located at the gold
Belong to the heat conductive insulating soft layer 41 between heat-conducting layer 42 and the metal cooling board 3, according to the heat conduction of the individual layer of routine
Insulate soft layer, the heat conductive insulating soft layer of the individual layer easily damaged by the structure in the structure of hard, such as circuit board 1 and
Breakage, and then insulating properties can be influenceed, in the present embodiment, positioned at the metal heat-conducting layer 42 and the metal cooling board 3 it
Between the heat conductive insulating soft layer 41, be protected between the metal heat-conducting layer 42 and the metal cooling board 3, and do not allow
Easily by extraneous adamant breakage.
In the present embodiment, a surface of the metal cooling board 3 back to the circuit board 1 offers a plurality of receiving
Groove 31, can be installed with for more refrigerant cooling tubes or a refrigerant cooling tube is installed with back and forth, and then can improve metal
Heat exchange area between coldplate 3 and the refrigerant cooling tube, and improve cooling effect.
In the present embodiment, the metal cooling board 3 is provided with mounting groove 32 back to a surface of the circuit board 1, described
Collets 5 are provided with mounting groove 32, the circuit board assemblies 100 also include the first spiro connecting piece 6, and first spiro connecting piece passes through institute
State collets 5 to be connected with the thermally conductive insulating layer 4 and the power component 2, the collets 5 avoid the power component
2 are connected with the metal cooling board 3 by first spiro connecting piece 6.
Further, in the present embodiment, the metal cooling board 3 back to in face of two surfaces of the circuit board 1
The mounting groove 32 is respectively equipped with, the mounting groove 32 on described two surfaces is in be oppositely arranged and the collets 5 are equipped with it,
To form a pair of collets 5；First spiro connecting piece 6 passes through a pair of collets 5, with the thermally conductive insulating layer 4 and
The power component 2 connects.So as to which two collets 5 can lift the power component 2 and be cooled down with the metal
Insulating properties between plate 3.
The material of the collets 5 be can be, but not limited to as ceramics, it is clear that other insulating materials are also suitable.
In the present embodiment, the collets 5 are spirally connected by the second spiro connecting piece 7 is fixed to the bottom wall of the mounting groove 32,
Obviously, the design not limited to this, can also be that holding is consolidated between the mounting groove 32 of the collets 5 and the metal cooling board 3
Fixed, viscose glue fixation etc..
The preferred embodiments of the present invention are these are only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field is included in the scope of patent protection of the present invention.
Claims (11)
1. a kind of circuit board assemblies, the electric-controlled box for air conditioner, it is characterised in that the circuit board assemblies include：
Circuit board；
Power component, on the circuit board；
Metal cooling board, on the power component, the metal cooling board offers the installation of cooling matchmaker cooling line
Holding tank；And
Thermally conductive insulating layer, it is arranged between the metal cooling board and the power component, to by the metal cooling board
Insulated with the power component, and the metal cooling board and the power component thermal conductivity are connect.
2. circuit board assemblies according to claim 1, it is characterised in that the material of the metal cooling board is aluminium.
3. circuit board assemblies according to claim 1, it is characterised in that the metal cooling board is back to the circuit board
One surface offers a plurality of holding tank.
4. circuit board assemblies according to claim 1, it is characterised in that the metal cooling board is back to the circuit board
One surface is provided with mounting groove, and collets are provided with the mounting groove；
The circuit board assemblies also include the first spiro connecting piece, and first spiro connecting piece passes through the collets and the heat conductive insulating
Layer connects with the power component.
5. circuit board assemblies according to claim 4, it is characterised in that the metal cooling board back to in face of the electricity
Two surfaces of road plate are respectively equipped with the mounting groove, and the mounting groove on described two surfaces is in be oppositely arranged and be all provided with it
Collets are stated, to form a pair of collets；
First spiro connecting piece passes through the pair of collets, is connected with the thermally conductive insulating layer and the power component.
6. the circuit board assemblies according to claim 4 or 5, it is characterised in that the material of the collets is ceramics.
7. the circuit board assemblies according to claim 4 or 5, it is characterised in that the collets pass through the second spiro connecting piece spiral shell
Connect the bottom wall for being fixed to the mounting groove.
8. circuit board assemblies according to claim 1, it is characterised in that the circuit board is provided with insulating mounting frame, institute
State power component and be located at the insulating mounting inframe, the insulating mounting inframe is also equipped with multiple control chips；
The metal cooling board is on the insulating mounting frame.
9. circuit board assemblies according to claim 1, it is characterised in that the power component includes IGBT device and two
At least one of pole pipe.
10. a kind of electric-controlled box of air conditioner, it is characterised in that the circuit board assemblies including box body and in the box body, institute
Circuit board assemblies are stated as the circuit board assemblies as described in claim 1 to 9 any one.
A kind of 11. air conditioner, it is characterised in that including：
The electric-controlled box of air conditioner as claimed in claim 10；And
Refrigerant cooling line, it is connected in the refrigerant pipeline system of the air conditioner, the refrigerant cooling line is installed with described
Holding tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710760995.5A CN107371356A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710760995.5A CN107371356A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107371356A true CN107371356A (en) | 2017-11-21 |
Family
ID=60312240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710760995.5A Pending CN107371356A (en) | 2017-08-29 | 2017-08-29 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107371356A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020181571A1 (en) * | 2019-03-14 | 2020-09-17 | 珠海市伟高变频科技有限公司 | Air conditioner controller |
| CN113115531A (en) * | 2020-01-09 | 2021-07-13 | 宁波奥克斯电气股份有限公司 | Electric control box and air conditioner with same |
| CN113498296A (en) * | 2020-03-20 | 2021-10-12 | 上海禾赛科技有限公司 | Circuit structure with heat conducting device and heat dissipation method and manufacturing method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155498A (en) * | 2006-09-29 | 2008-04-02 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat radiating device |
| JP2008101862A (en) * | 2006-10-20 | 2008-05-01 | Daikin Ind Ltd | Electrical equipment box |
| CN101373744A (en) * | 2007-08-24 | 2009-02-25 | 奇美电子股份有限公司 | Chip module and display apparatus with the same |
| CN201541362U (en) * | 2009-05-15 | 2010-08-04 | 宋光� | Power supply structure for high-power LED lamp |
| US20100321895A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
| CN102412214A (en) * | 2010-09-25 | 2012-04-11 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN202189775U (en) * | 2011-08-23 | 2012-04-11 | 山亿新能源股份有限公司 | Solar energy transistor radiating fixing structure |
| CN203912441U (en) * | 2014-06-12 | 2014-10-29 | 东莞市万丰纳米材料有限公司 | Composite heat conduction material |
| CN204084659U (en) * | 2014-06-19 | 2015-01-07 | 美的集团武汉制冷设备有限公司 | Air-conditioning electric control box, air-conditioner outdoor unit and air-conditioning system |
| CN204335267U (en) * | 2015-01-05 | 2015-05-13 | 广东美的制冷设备有限公司 | Air conditioner and electric-controlled box assembly thereof |
| CN207099539U (en) * | 2017-08-29 | 2018-03-13 | 广东美的制冷设备有限公司 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
-
2017
- 2017-08-29 CN CN201710760995.5A patent/CN107371356A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155498A (en) * | 2006-09-29 | 2008-04-02 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat radiating device |
| JP2008101862A (en) * | 2006-10-20 | 2008-05-01 | Daikin Ind Ltd | Electrical equipment box |
| CN101373744A (en) * | 2007-08-24 | 2009-02-25 | 奇美电子股份有限公司 | Chip module and display apparatus with the same |
| CN201541362U (en) * | 2009-05-15 | 2010-08-04 | 宋光� | Power supply structure for high-power LED lamp |
| US20100321895A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
| CN102412214A (en) * | 2010-09-25 | 2012-04-11 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN202189775U (en) * | 2011-08-23 | 2012-04-11 | 山亿新能源股份有限公司 | Solar energy transistor radiating fixing structure |
| CN203912441U (en) * | 2014-06-12 | 2014-10-29 | 东莞市万丰纳米材料有限公司 | Composite heat conduction material |
| CN204084659U (en) * | 2014-06-19 | 2015-01-07 | 美的集团武汉制冷设备有限公司 | Air-conditioning electric control box, air-conditioner outdoor unit and air-conditioning system |
| CN204335267U (en) * | 2015-01-05 | 2015-05-13 | 广东美的制冷设备有限公司 | Air conditioner and electric-controlled box assembly thereof |
| CN207099539U (en) * | 2017-08-29 | 2018-03-13 | 广东美的制冷设备有限公司 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020181571A1 (en) * | 2019-03-14 | 2020-09-17 | 珠海市伟高变频科技有限公司 | Air conditioner controller |
| CN113115531A (en) * | 2020-01-09 | 2021-07-13 | 宁波奥克斯电气股份有限公司 | Electric control box and air conditioner with same |
| CN113498296A (en) * | 2020-03-20 | 2021-10-12 | 上海禾赛科技有限公司 | Circuit structure with heat conducting device and heat dissipation method and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107371356A (en) | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner | |
| CN107567244A (en) | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner | |
| CN103206805A (en) | Semiconductor refrigerating device | |
| CN106558563A (en) | Power model and the vehicle with which | |
| CN107896421A (en) | A kind of PCB of quick heat radiating | |
| CN107851626A (en) | Component module and power model | |
| CN104661487B (en) | Optical module radiator structure and electronic product | |
| CN107249249A (en) | Outdoor unit electric control gear, outdoor unit and air conditioner | |
| CN109245556A (en) | A kind of diesel locomotive high-power loop circuit heat pipe power module and its mirror-image structure | |
| CN207099539U (en) | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner | |
| CN110265367A (en) | A kind of middle power inverter single tube radiator structure | |
| CN207099540U (en) | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner | |
| CN113115510A (en) | Printed circuit board heat dissipation system using high-thermal-conductivity substrate | |
| CN210808094U (en) | Circuit board, heat exchange system and refrigerating system | |
| CN105957848B (en) | A kind of bottom plate and its modular device with integrated heat pipe | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN201571152U (en) | Radiating structure of liquid crystal display television | |
| CN215571363U (en) | Semiconductor refrigerating device and air-conditioning suit | |
| CN206099401U (en) | Electric vehicle charging ware with refrigeration function | |
| CN106714504B (en) | Remote Radio Unit, installation part and RF communication system | |
| CN205355038U (en) | Heat pipe cooling ware structure of IGBT module in converter | |
| CN209462704U (en) | A kind of single-clad board with radiator structure | |
| CN208047149U (en) | A kind of electric vehicle heating element radiator structure | |
| CN208383146U (en) | A kind of Novel navigator radiator | |
| CN210432265U (en) | Heat radiation structure of high-heating graphene |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |