CN103687346A - Rigid-flexible combined printed circuit board preparation method - Google Patents
Rigid-flexible combined printed circuit board preparation method Download PDFInfo
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- CN103687346A CN103687346A CN201310577462.5A CN201310577462A CN103687346A CN 103687346 A CN103687346 A CN 103687346A CN 201310577462 A CN201310577462 A CN 201310577462A CN 103687346 A CN103687346 A CN 103687346A
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Abstract
The invention discloses a rigid-flexible combined printed circuit board preparation method. The rigid-flexible combined printed circuit board comprises a rigid sub board, a dielectric layer, a flexible sub board, another dielectric layer, and another rigid sub board which are laminated sequentially. The method comprises the following steps of: flexible board preparation, rigid board preparation, dielectric layer preparation, pressing, cover opening, and post processes. In the invention, a PI film resistance glue is pasted in a rigid board slot area; a flow type prepreg (a PP sheet) windowing area is increased; and the total thickness of the PP sheet is controlled to be less than the total thickness of a polyimide cover film and a polyimide resistance glue film, so that the flow type prepreg can be applied to preparation of the rigid-flexible combined printed circuit board. The excessive glue length of the rigid-flexible connecting point of the pressed printed circuit board is less than 1.0mm, so that the requirements of the IPC-6013B relevant regulation are met.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of rigid-flexible combined circuit board and preparation method thereof.
Background technology
Along with the future development of electronic product to miniaturization, portability, the market demand of rigid-flex combined board is growing.Rigid-flex combined board is a kind of advantage that combines rigid plate and flex plate, can the three-dimensional special type of track plate of assembling in implementation space.In order to control rigid-flex combined board at the excessive glue of rigid-flexible junction, it adopts not flow model prepreg to bond between flexible material layer and rigid material layer.But the poor fluidity of flow model prepreg resin in pressing process not, easily causes that filler is not enough and has occurred the defects such as pressing hickie, cavity, particularly for the larger thick copper coin of filler amount and high laminate.The conventional flow model prepreg using of rigid plate, its gummosis amount is much larger than flow model prepreg not.Rigid-flex combined board adopts flow model prepreg can improve the stitch defect because flow model prepreg poor fluidity does not bring.
The special structure of rigid-flex board need to first be carried out milling fenestration procedure before pressing to prepreg, avoid flexure region to be stained with prepreg.However, in pressing process, the resin of prepreg also can flow to flexure region from rigid region, forms excessively the overflowing glue of rigid-flexible junction and affects bending performance.The mobility of flow model prepreg resin, much larger than flow model prepreg not, will inevitably cause the excessive glue that rigid-flexible junction is larger in pressing process.So rigid-flex board is used flow model prepreg, need special method to control the excessive glue of rigid-flexible junction, thereby realize the effect same with adopting low mobile prepreg.
Summary of the invention
Based on this, the object of this invention is to provide a kind of preparation method who uses flow model prepreg to make rigid-flexible combined circuit board.
Concrete technical scheme is as follows:
A preparation method for rigid-flexible combined circuit board, described rigid-flexible combined circuit board comprises rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer and the rigidity daughter board stacking gradually, and comprises the steps:
(1) flexible daughter board is made: flexible sheet is shifted and etched circuit by figure, and paste polyimides coverlay in the flexure region of flexible sheet, described polyimides coverlay comprises epoxy glue layer and PI(polyimides) layer, the thickness of described epoxy glue layer is 15.0-75.0 μ m, the thickness of described PI layer is 12.7-50.4 μ m, and then pressing obtains described flexible board;
(2) rigidity daughter board is made: rigidity sheet material is shifted and etched circuit by figure, and carry out milling half groove operation in flexible windowed regions, then PI adhesive block film is pasted in the groove milling region obtaining in milling half groove operation, the size of described each length of side of PI adhesive block film is than the little 0.2-0.8mm of the size of corresponding each length of side of flexure region, and thickness is 0.05-0.2mm;
(3) dielectric layer is made: using flow model prepreg as dielectric layer, by the flexible windowed regions mill off of flow model prepreg, the size of each length of side of windowed regions is than the large 1.2-2.0mm of the size of corresponding each length of side of flexure region, the gross thickness of described flow model prepreg is 0.05-0.2mm, and than the little 0.01-0.05mm of gross thickness of polyimides coverlay and polyimides adhesive block film;
(4) after being stacked gradually, rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer and rigidity daughter board carry out pressing;
(5) wiring board after step (4) pressing is holed routinely, hole metallization and outer-layer circuit make;
(6) controlling dark milling uncaps: control dark milling and open the corresponding flexible windowed regions of rigid plate, expose flexure region;
(7) carry out routinely follow-up flow process, obtain described rigid-flexible combined circuit board.
In an embodiment, in described step (2), the cutter footpath of milling cutter is 0.6-1.0mm therein; In described step (3), the cutter footpath of milling cutter is 0.6-1.0mm.
In an embodiment, in described step (6), the milling cutter cutter footpath of the dark milling of control is 1.2-2.0mm therein.
In an embodiment, described in step (1), the parameter of pressing is therein: pressure is 100-140kg/cm
2, temperature is 175-200 ℃, time 120-480 second.
In an embodiment, described in step (4), the parameter of pressing is therein: pressure is 25.6-30.4kg/cm
2, temperature is 180-195 ℃.
In an embodiment, described rigidity daughter board is individual layer rigid plate or multilayer rigid plate therein; Described flexible daughter board is single-layer flexible plate or multi-layer flexible sheet.
Another object of the present invention is to provide the rigid-flexible combined circuit board that above-mentioned preparation method prepares.
Concrete technical scheme is as follows:
The rigid-flexible combined circuit board that above-mentioned preparation method prepares.
Beneficial effect of the present invention:
The present invention adopts in the flexible slot area of rigid plate and pastes resistance glue PI film, the increasing of flow model prepreg (PP sheet) windowed regions and control the combination that PP sheet gross thickness is less than the modes such as gross thickness of polyimides coverlay and polyimides adhesive block film, can realize the application of flow model prepreg in rigid-flexible combined circuit board is made.The excessive glue length of the rigid-flexible junction of pressing rear board is less than 1.0mm, meets the requirement of IPC-6013B relevant regulations.
Accompanying drawing explanation
Fig. 1 is that flexible board is made schematic diagram;
Fig. 2 is that rigid plate is made schematic diagram;
Fig. 3 is that dielectric layer is made schematic diagram;
Fig. 4 is pressing process schematic diagram;
Fig. 5 is operation schematic diagram after pressing;
Fig. 6 is operation schematic diagram after uncapping.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further elaborated.
The present embodiment is prepared certain 4 layers of rigid-flexible combined circuit board, wherein the 2nd and 3 layers be flexible layer, the 1st and 4 layers be rigid layer.Between layers 1 and 2 and the 3rd layer and the 4th layer, also has dielectric layer (flow model prepreg).Concrete making step is as follows:
(1) flexible daughter board is made (with reference to figure 1): flexible sheet is shifted and etched circuit by figure, and paste polyimides coverlay in the flexure region of flexible sheet, described polyimides coverlay comprises epoxy glue layer and PI layer, the thickness of described epoxy glue layer is 15.0-75.0 μ m, the thickness of described polyimides coverlay is 12.7-50.4 μ m, then pressing obtains described flexible daughter board, and described pressing parameter is: pressure 100-140kg/cm
2, temperature 175-200 ℃, time 120-480 second;
(2) rigidity daughter board is made (with reference to figure 2): rigidity sheet material is shifted and etched circuit by figure, and carry out milling half groove operation in flexible windowed regions, the cutter footpath of milling cutter is 0.6-1.0mm, then PI adhesive block film is pasted in the groove milling region obtaining in milling half groove operation, the size of described each length of side of PI adhesive block film is than the little 0.2-0.8mm of the size of corresponding each length of side of flexure region, and thickness is 0.05-0.2mm;
(3) dielectric layer is made (with reference to figure 3): using flow model prepreg as dielectric layer, by the flexible windowed regions mill off of flow model prepreg, the size of each length of side of windowed regions is than the large 1.2-2.0mm of the size of corresponding each length of side of flexure region, milling cutter cutter footpath is 0.6-1.0mm, the gross thickness of described flow model prepreg is 0.05-0.2mm, and than the little 0.01-0.05mm of gross thickness of polyimides coverlay and polyimides adhesive block film;
(4) with reference to figure 4, after being stacked gradually, rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer and rigidity daughter board carry out pressing, and pressing condition is: pressure is 25.6-30.4kg/cm
2, temperature is 180-195 ℃;
(5) with reference to figure 5, by the wiring board after step (4) pressing hole routinely, hole metallization and outer-layer circuit make;
(6) with reference to figure 6, control dark milling and uncap: control dark milling and open the corresponding flexible windowed regions of rigid plate, expose flexure region, milling cutter cutter footpath is 1.2-2.0mm;
(7) carry out routinely follow-up flow process, obtain described rigid-flexible combined circuit board.
Employing is pasted resistance glue PI film in rigid plate slot area, flow model prepreg (PP sheet) windowed regions strengthens and control PP sheet gross thickness is less than the modes such as polyimides coverlay thickness, can realize the application of flow model prepreg in rigid-flexible combined circuit board is made.If the excessive glue length of the rigid-flexible junction of pressing rear board is less than 1.0mm(and does not take above-mentioned measure, the excessive glue length general >=30.0mm of rigid-flexible junction, causes wiring board not use and scraps), meet the requirement of IPC-6013B relevant regulations.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (7)
1. a preparation method for rigid-flexible combined circuit board, described rigid-flexible combined circuit board comprises rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer and the rigidity daughter board stacking gradually, and it is characterized in that, comprises the steps:
(1) flexible daughter board is made: flexible sheet is shifted and etched circuit by figure, and paste polyimides coverlay in the flexure region of flexible sheet, described polyimides coverlay comprises epoxy glue layer and polyimide layer, the thickness of described epoxy glue layer is 15.0-75.0 μ m, the thickness of described polyimide layer is 12.7-50.4 μ m, and then pressing obtains described flexible daughter board;
(2) rigidity daughter board is made: rigidity sheet material is shifted and etched circuit by figure, and carry out milling half groove operation in flexible windowed regions, then polyimides adhesive block film is pasted in the groove milling region obtaining in milling half groove operation, the size of described each length of side of polyimides adhesive block film is than the little 0.2-0.8mm of the size of corresponding each length of side of flexure region, and thickness is 0.05-0.2mm;
(3) dielectric layer is made: using flow model prepreg as dielectric layer, by the flexible windowed regions mill off of flow model prepreg, the size of each length of side of windowed regions is than the large 1.2-2.0mm of the size of corresponding each length of side of flexure region, the gross thickness of described flow model prepreg is 0.05-0.2mm, and than the little 0.01-0.05mm of gross thickness of polyimides coverlay and polyimides adhesive block film;
(4) after being stacked gradually, rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer and rigidity daughter board carry out pressing;
(5) wiring board after step (4) pressing is holed routinely, hole metallization and outer-layer circuit make;
(6) controlling dark milling uncaps: control dark milling and open the corresponding flexible windowed regions of rigid plate, expose flexure region;
(7) carry out routinely follow-up flow process, obtain described rigid-flexible combined circuit board.
2. the preparation method of rigid-flexible combined circuit board according to claim 1, is characterized in that, in described step (2), the cutter footpath of milling cutter is 0.6-1.0mm; In described step (3), the cutter footpath of milling cutter is 0.6-1.0mm.
3. the preparation method of rigid-flexible combined circuit board according to claim 1, is characterized in that, in described step (6), the milling cutter cutter footpath of the dark milling of control is 1.2-2.0mm.
4. the preparation method of rigid-flexible combined circuit board according to claim 1, is characterized in that, described in step (1), the parameter of pressing is: pressure is 100-140kg/cm
2, temperature is 175-200 ℃, the time is 120-480 second.
5. the preparation method of rigid-flexible combined circuit board according to claim 1, is characterized in that, described in step (4), the parameter of pressing is: pressure is 25.6-30.4kg/cm
2, temperature is 180-195 ℃.
6. according to the preparation method of the rigid-flexible combined circuit board described in claim 1-5 any one, it is characterized in that, described rigidity daughter board is individual layer rigid plate or multilayer rigid plate; Described flexible daughter board is single-layer flexible plate or multi-layer flexible sheet.
7. the rigid-flexible combined circuit board that described in claim 1-6 any one, preparation method prepares.
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| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104363718A (en) * | 2014-12-04 | 2015-02-18 | 奥士康科技（益阳）有限公司 | Production method of soft and hard combined circuit board |
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