CN104640375A - Method for manufacturing soft-hard combination board - Google Patents
Method for manufacturing soft-hard combination board Download PDFInfo
- Publication number
- CN104640375A CN104640375A CN201510043066.3A CN201510043066A CN104640375A CN 104640375 A CN104640375 A CN 104640375A CN 201510043066 A CN201510043066 A CN 201510043066A CN 104640375 A CN104640375 A CN 104640375A
- Authority
- CN
- China
- Prior art keywords
- central layer
- soft
- hard
- coverlay
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of soft-hard combination board manufacturing, in particular to a manufacturing method of a soft-hard combination board. A cover film of which the polyimide layer thickness d is more than or equal to 25 microns and less than or equal to 50 microns can cover a soft core board, and is laminated integrally with a hard core board without roughening the surface of the cover film; the peeling strength between the cover film and a prepreg can be up to 0.056kg/mm as specified in the IPC-6013B (2009) standard. The used prepreg is 64 microns in thickness, 75 percent in glue content, 56*56 in the warp and weft densities of glass fiber cloth and 25g/cm<2> in base weight of the glass fiber cloth, so that a better laminating effect is achieved, the bonding force between the cover film and the prepreg is enhanced, and the delamination phenomenon is avoided. Before the soft core board is laminated with the hard core board, the cover film on the surface of the soft core board is not browned, so that the combination of the cover film with the prepreg is facilitated, and a better lamination effect is achieved.
Description
Technical field
The present invention relates to Rigid Flex manufacture technology field, particularly relate to a kind of on soft central layer whole plate paste the manufacture method of the Rigid Flex of epiphragma.
Background technology
Rigid Flex (Rigid-Flexible Printed Circuit Board, R-F PCB) refer to the printed circuit board comprising one or more hardboard district and one or more flexible board area, it has hardboard (Rigid Printed Circuit Board concurrently, RPCB) durability and soft board (Flexible Printed Circuit Board, FPCB) flexibility, thus there is the features such as frivolous compact and resistance to severe applied environment, be particularly suitable for the application in the precise electronics such as portable type electronic product, medical electronics product, military equipment.Thus, numerous researcher has carried out extensive research to Rigid Flex in recent years.
In the making of Rigid Flex, in order to protect the circuit of flexible board area, epiphragma need be pasted on the soft central layer of flexible board area.In prior art, the mode pasting epiphragma has dispersion film applicator coating and whole plate film applicator coating two kinds.Dispersion film applicator coating refers to before being laminated, and on the soft central layer of flexible board area, paste epiphragma one by one, after shaping, these regions become the bent flexible board area of exposing.The concrete operations of dispersion pad pasting are: after laser cutting coverlay, manual are attached to blocks of for coverlay on the soft central layer of flexible board area.Coverlay needs pre-to harmomegathus, and X, Y-direction reduce-1.5/10000 on soft central layer harmomegathus basis.Whole plate film applicator coating refers to first to be cropped to by coverlay and mates with soft central layer size, then whole for coverlay plate is attached on soft central layer, and by the method such as manual grinding, plasma treatment alligatoring coverlay surface, pasted coverlay and soft central layer after alligatoring be allowed for access after operation.The shortcoming of dispersion film applicator coating wastes time and energy, and production capacity is extremely low.Though whole plate film applicator coating solves the problem that dispersion film applicator coating is wasted time and energy, but in order to there is stronger adhesion between ensuring coverage film (PI layer) and prepreg (PP sheet), roughening treatment need be carried out to coverlay surface, and roughening treatment can have a strong impact on the outward appearance of product, and cannot at coverlay surface silk-screen character.For existing whole plate film applicator coating, if do not carry out roughening treatment to coverlay, peel strength after lamination between coverlay and prepreg cannot reach the 0.056kg/mm that IPC-6013B (2009) standard specifies, product can cause layering because the adhesion between coverlay and prepreg is too weak.
Summary of the invention
The present invention is directed in Rigid Flex manufacturing process, adopt whole plate film applicator coating need carry out roughening treatment to coverlay, have a strong impact on the outward appearance of product and in the problem of coverlay surface silk-screen character, cannot provide a kind of and whole for coverlay plate can be attached on soft central layer without the need to carrying out the manufacture method of the Rigid Flex of roughening treatment to coverlay surface.
For achieving the above object, by the following technical solutions, a kind of manufacture method of Rigid Flex, comprises the following steps in the present invention:
S1, on soft central layer and hard central layer, make internal layer circuit respectively.
S2, whole for coverlay plate is attached on soft central layer, then carries out hot-pressing processing and make coverlay together with soft central layer tight bond; The thickness of the polyimide layer (PI layer) of described coverlay is d, 25 μm≤d≤50 μm.The size of coverlay is consistent with the size of soft central layer, and windows in the position overlapped with slotted eye on coverlay.
Preferably, the temperature of hot-pressing processing is 170-190 DEG C, and pressure is 7-15MPa, and the time is 80-180s.
Preferably, after hot-pressing processing is carried out to soft central layer, baking sheet 60min at soft central layer is placed in 150-170 DEG C.
S3, first brown process is carried out to hard central layer, then by prepreg, soft central layer and hard central layer are pressed together, form soft or hard and combine and partly become plate.
Preferably, the thickness of described prepreg is 64 μm, and gel content is 75%; Glass fabric in prepreg through weft count be 56 × 56; Glass fabric basic weight is 25g/cm
2.
S4, combine half in soft or hard and become on plate to make outer-layer circuit and solder mask successively, then carry out surface treatment, obtain Rigid Flex.
Compared with prior art, the invention has the beneficial effects as follows: the present invention by using polyimides layer thickness to be 25 μm≤coverlay of d≤50 μm, whole for coverlay plate can be covered on soft central layer and without the need to carrying out roughening treatment to coverlay surface before being integrated with hard central layer pressing, the peel strength between coverlay and prepreg can reach the 0.056kg/mm that IPC-6013B (2009) standard specifies.Use thickness be 64 μm, gel content is 75%, glass fabric be 56 × 56 through weft count, glass fabric basic weight is 25g/cm
2prepreg, pressing better effects if, the adhesion between coverlay and prepreg is stronger, there will not be lamination.Soft central layer with hard central layer pressing before, do not carry out brown process to the coverlay of soft core plate surface, be conducive to coverlay and be combined with prepreg, pressing effect is better.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment 1
The present embodiment provides a kind of manufacture method of Rigid Flex, and concrete making step is as follows:
(1) soft central layer
As the production process of the FPC of prior art, carry out to the raw material of FPC the soft central layer that sawing sheet obtains required size, described soft central layer is divided into soft or hard land and flexible board area.Successively through upper film, exposure, development, etch and move back membrane process, soft central layer makes internal layer circuit.Carry out internal layer AOI inspection to the soft central layer having made internal layer circuit, qualified product introduction subsequent processing, the surface namely cleaning soft central layer makes it clean, and pastes epiphragma at the whole plate in the surface of soft central layer.Polyimide layer (PI layer) thickness of described coverlay is 50 μm, and the size of coverlay is consistent with the size of soft central layer, and windows in the position overlapped with slotted eye on coverlay.
Then, hot-pressing processing (quick pressing) is carried out to soft central layer, make coverlay together with soft central layer tight bond.The temperature of hot-pressing processing is 180 ± 10 DEG C, pressure 7-15MPa, time 80-180s.
In order to enable coverlay be bonded together with soft central layer inner surface more closely, continue to carry out hot curing process to soft central layer, baking sheet 60min at being placed in 150-170 DEG C by soft central layer.
Through the soft central layer of hot curing process without the need to carrying out roughening treatment, the coverlay namely soft central layer pasted does not need alligatoring, and soft central layer stores for future use after naturally cooling.
(2) hard central layer
As the production process of the PCB of prior art, the hard central layer that sawing sheet obtains required size is carried out to the raw material of PCB.Successively through upper film, exposure, development, etch and move back membrane process, hard central layer makes internal layer circuit.
Carry out internal layer AOI inspection to the hard central layer having made internal layer circuit, qualified product introduction subsequent processing, namely carries out brown process to hard central layer, prepares for the follow-up soft central layer that will carry out and hard central layer pressing are integrated.
(3) soft or hard combines and partly becomes plate
By soft central layer and the hard central layer through brown process, and prepreg carries out walkthrough plate, then soft central layer and hard central layer is pressed together, and forms soft or hard combination and partly becomes plate.The thickness of prepreg used is 64 μm, and gel content is 75%, the glass fabric in prepreg be 56 × 56 through weft count, glass fabric basic weight is 25g/cm
2, i.e. the prepreg EM-370B (L) 106 of Elite Material Co..
Pressing parameter (compare existing rigid-flexible combination adopt the advantage of technique to be do not need to add the period) as shown in the table:
After testing, the peel strength between coverlay and prepreg is 0.30kg/mm.
(4) Rigid Flex
Utilize borehole data to combine half in soft or hard and become holes drilled through and/or blind hole on plate, after heavy copper and electric plating of whole board, make to combine half in soft or hard and become on plate to form plated-through hole and/or metalized blind vias.Then adopt positive blade technolgy to combine half in soft or hard to become on plate to make outer-layer circuit.Detect through outer AOI, flawless product introduction downstream, silk-screen welding resistance, character, make solder mask.Then combining half to soft or hard becomes plate to carry out surface treatment.Then by hard for part corresponding for the flexible board area of soft central layer central layer removing, Rigid Flex is obtained.
Rigid Flex is successively after shaping and whole inspection (take a sample test respectively the outward appearance of finished product, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thick etc.), and qualified finished product gets final product shipment.
Embodiment 2
The present embodiment provides a kind of manufacture method of Rigid Flex, and this manufacture method is substantially identical with the manufacture method of embodiment 1, and difference is only: the thickness of the PI layer of the coverlay that soft central layer pastes is 25 μm.
Soft central layer and hard central layer pressing formed soft or hard be combined half becomes plate after, the peel strength between detection coverlay and prepreg.Peel strength between coverlay and prepreg is 0.15kg/mm.
Comparative example 1
The present embodiment provides a kind of manufacture method of Rigid Flex, and this manufacture method is substantially identical with the manufacture method of embodiment 1, and difference is only: the thickness of the PI layer of the coverlay that soft central layer pastes is 13 μm.
Soft central layer and hard central layer pressing formed soft or hard be combined half becomes plate after, the peel strength between detection coverlay and prepreg.Peel strength between coverlay and prepreg is 0.02kg/mm.
Comparative example 2
The present embodiment provides a kind of manufacture method of Rigid Flex, this manufacture method is substantially identical with the manufacture method of embodiment 1, difference is only: after carrying out hot-pressing processing and hot curing process successively to soft central layer, also roughening treatment is carried out to soft central layer, namely roughening treatment is carried out to the coverlay that soft central layer pastes.
Soft central layer and hard central layer pressing formed soft or hard be combined half becomes plate after, the peel strength between detection coverlay and prepreg.Peel strength between coverlay and prepreg is 0.03kg/mm.
Comparative example 3
The present embodiment provides a kind of manufacture method of Rigid Flex, this manufacture method is substantially identical with the manufacture method of embodiment 1, difference is only: soft central layer is different with the prepreg that the hard central layer through brown process presses together prepreg used used from embodiment 1, the thickness of the prepreg that the present embodiment is used is 81 μm, gel content is 65%, glass fabric is 60 × 48 through weft count, and glass fabric basic weight is 48g/cm
2, i.e. the prepreg EM-370B (L) 1080 of Elite Material Co..
Soft central layer and hard central layer pressing formed soft or hard be combined half becomes plate after, the peel strength between detection coverlay and prepreg.Peel strength between coverlay and prepreg is 0.06kg/mm.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (6)
1. a manufacture method for Rigid Flex, is characterized in that, comprises the following steps:
S1, on soft central layer and hard central layer, make internal layer circuit respectively;
S2, whole for coverlay plate is attached on soft central layer, then carries out hot-pressing processing and make coverlay together with soft central layer tight bond; The thickness of the polyimide layer of described coverlay is d, 25 μm≤d≤50 μm;
S3, first brown process is carried out to hard central layer, then by prepreg, soft central layer and hard central layer are pressed together, form soft or hard and combine and partly become plate;
S4, combine half in soft or hard and become on plate to make outer-layer circuit and solder mask successively, then carry out surface treatment, obtain Rigid Flex.
2. the manufacture method of a kind of Rigid Flex according to claim 1, is characterized in that, in step S2, after hot-pressing processing is carried out to soft central layer, and baking sheet 60min at soft central layer is placed in 150-170 DEG C.
3. the manufacture method of a kind of Rigid Flex according to claim 2, it is characterized in that, in described step S2, the temperature of hot-pressing processing is 170-190 DEG C, and pressure is 7-15MPa, and the time is 80-180s.
4. the manufacture method of a kind of Rigid Flex according to claim 3, it is characterized in that, in step S2, the size of coverlay is consistent with the size of soft central layer, and windows in the position overlapped with slotted eye on coverlay.
5. a kind of manufacture method of Rigid Flex according to any one of claim 1-4, it is characterized in that, in step S3, the thickness of described prepreg is 64 μm, and gel content is 75%.
6. the manufacture method of a kind of Rigid Flex according to claim 5, it is characterized in that, glass fabric basic weight is 25g/cm
2, glass fabric through weft count be 56 × 56.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510043066.3A CN104640375A (en) | 2015-01-28 | 2015-01-28 | Method for manufacturing soft-hard combination board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510043066.3A CN104640375A (en) | 2015-01-28 | 2015-01-28 | Method for manufacturing soft-hard combination board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640375A true CN104640375A (en) | 2015-05-20 |
Family
ID=53218542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510043066.3A Pending CN104640375A (en) | 2015-01-28 | 2015-01-28 | Method for manufacturing soft-hard combination board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640375A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208801A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Fitting method for cover film of rigid and flexible combined board |
| CN106793491A (en) * | 2016-12-28 | 2017-05-31 | 深圳市鑫达辉软性电路科技有限公司 | Rigid Flex and preparation method thereof |
| CN108513455A (en) * | 2018-05-23 | 2018-09-07 | 高德（无锡）电子有限公司 | A kind of Rigid Flex processing technology using high frequency material |
| CN108551729A (en) * | 2018-03-14 | 2018-09-18 | 江门崇达电路技术有限公司 | A kind of production method of more grafting Rigid Flexs |
| CN110248501A (en) * | 2019-07-01 | 2019-09-17 | 高德（无锡）电子有限公司 | The manufacturing process of the Rigid Flex of text is printed on soft board |
| CN111010820A (en) * | 2019-12-27 | 2020-04-14 | 上海嘉捷通电路科技股份有限公司 | Method for manufacturing rigid-flex board with overlapped flexible board area |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
-
2015
- 2015-01-28 CN CN201510043066.3A patent/CN104640375A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN103687284A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208801A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Fitting method for cover film of rigid and flexible combined board |
| CN105208801B (en) * | 2015-08-11 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of rigid-flex combined board cover film applying method |
| CN106793491A (en) * | 2016-12-28 | 2017-05-31 | 深圳市鑫达辉软性电路科技有限公司 | Rigid Flex and preparation method thereof |
| CN106793491B (en) * | 2016-12-28 | 2019-11-01 | 深圳市鑫达辉软性电路科技有限公司 | Rigid Flex and preparation method thereof |
| CN108551729A (en) * | 2018-03-14 | 2018-09-18 | 江门崇达电路技术有限公司 | A kind of production method of more grafting Rigid Flexs |
| CN108513455A (en) * | 2018-05-23 | 2018-09-07 | 高德（无锡）电子有限公司 | A kind of Rigid Flex processing technology using high frequency material |
| CN110248501A (en) * | 2019-07-01 | 2019-09-17 | 高德（无锡）电子有限公司 | The manufacturing process of the Rigid Flex of text is printed on soft board |
| CN111010820A (en) * | 2019-12-27 | 2020-04-14 | 上海嘉捷通电路科技股份有限公司 | Method for manufacturing rigid-flex board with overlapped flexible board area |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104640375A (en) | Method for manufacturing soft-hard combination board | |
| US9743533B2 (en) | Method for manufacturing rigid-flexible printed circuit board | |
| JP5098646B2 (en) | Circuit board manufacturing method | |
| JP2015061058A (en) | Multilayer printed wiring board manufacturing method and multilayer printed wiring board | |
| KR100957418B1 (en) | Method for maanufacturig pcb and pcb manufactured using the same | |
| CN103687284A (en) | Rigidity-flexibility combined circuit board of flying-tail structure and manufacturing method thereof | |
| CN103582320B (en) | Multilayer circuit board and manufacturing method thereof | |
| CN104507260A (en) | Manufacturing method of rigid-flexible board with reinforce panel | |
| JP2004327510A (en) | Copper-plated laminated board for multilayered printed wiring board, multilayered printed wiring board and method of manufacturing the same | |
| KR20040061409A (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| CN109041459B (en) | Manufacturing method of groove bottom pattern stepped groove and PCB | |
| JP2004319962A (en) | Flex rigid printed wiring board and its manufacturing method | |
| CN103578804B (en) | A kind of preparation method of rigid/flexible combined printed circuit board | |
| CN102045948A (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN103841771A (en) | Combined printed circuit board manufacturing method and printed circuit board | |
| CN103582322A (en) | Multilayer circuit board and manufacturing method thereof | |
| KR101099454B1 (en) | A manufacturing method for multilayer flexible printed cirkit board | |
| CN103144378B (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN103582321A (en) | Multilayer circuit board and manufacturing method thereof | |
| TWI618462B (en) | Method for manufacturing embedded electronic component circuit board with dielectric directly attached | |
| JP2009182070A (en) | Multilayer base for forming multilayer printed wiring board, and multilayer printed wiring board | |
| KR20190124616A (en) | Method of manufacturing the printed circuit board | |
| CN109104829B (en) | Deep micropore manufacturing method and PCB | |
| KR101097504B1 (en) | The method for preparing multi layered circuit board | |
| CN106550532A (en) | For manufacturing the protection structure including lazy flow material of parts carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150520 |