CN103645004A - Pressure sensor chip packaging structure - Google Patents
Pressure sensor chip packaging structure Download PDFInfo
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- CN103645004A CN103645004A CN201310617980.5A CN201310617980A CN103645004A CN 103645004 A CN103645004 A CN 103645004A CN 201310617980 A CN201310617980 A CN 201310617980A CN 103645004 A CN103645004 A CN 103645004A
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Abstract
The invention discloses a hydraulic sensor chip (2) packaging structure. An opening of an extension cylinder (11) of a substrate (1) is provided with a deformable rubber sleeve (3), and the rubber sleeve (3) is externally sleeved with a sleeve (4) for entering of a medium to be measured so that pressure of the medium to be measured is conducted into a first medium cavity (12) filled with a silicon oil medium via the rubber sleeve (3). The silicon oil medium without corrosiveness is contacted with components and parts in the internal part of a sensor so that corrosion of elements in the internal part of the sensor is prevented, and the service life of the sensor is greatly enhanced.
Description
Technical field
The invention belongs to pressure sensor technique field, relate in particular to a kind of pressure sensor chip encapsulating structure.
Background technology
The oil inlet passage of conventional hydraulic sensor is directly communicated to substrate inner side, and testing medium flows directly into sensor internal, and testing medium often has corrosivity, and slowly the element of corrosion sensor inside, causes the damage of sensor, reduces the serviceable life of sensor.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of anticorrosion, high hydraulic pressure transducer chip-packaging structure of life-span.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of pressure sensor chip encapsulating structure, comprise substrate and chip, described substrate is provided with groove, described chip is arranged in groove, and described substrate back is also provided with the exntension tubs that are communicated with groove, and described exntension tubs and chip enclose first medium cavity, described exntension tubs are set with rubber sleeve outward, opening the sealing of described rubber sleeve sealing exntension tubs; In described first medium cavity, be filled with non-corrosiveness medium;
Described rubber sleeve is set with sleeve outward, and described sleeve and rubber sleeve enclose second medium cavity, and described sleeve is provided with and can flows into for testing medium the entrance of second medium cavity.
Described chip periphery is connected by glue with the sidewall of groove.
Between described chip and bottom portion of groove, be provided with O-ring seal.
Described non-corrosiveness medium is silicone oil medium.
Described exntension tubs and substrate are integral type structure.
Described rubber sleeve upper end is connected with substrate and seals.
Described sleeve is metallic sheath, described metallic sheath upper end and substrate welding.
The invention has the advantages that, the medium of substrate inside is non-corrosiveness medium, can corrosion sensor not inner original paper, by being used for holding testing medium at arranged outside second medium cavity, between first medium cavity and second medium cavity, by rubber sleeve, separate, can there is deformation in rubber sleeve, can be by the pressure conduction in second medium cavity to first medium cavity, thereby detect pressure, prevent the corrosion of sensor internal original paper, greatly improved the serviceable life of sensor.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of pressure sensor chip encapsulating structure of the present invention;
Mark in above-mentioned figure is: 1, substrate, 11, exntension tubs, 12, first medium cavity, 2, chip, 3, rubber sleeve, 31, second medium cavity, 4, sleeve, 41, entrance, 5, O-ring seal.
Embodiment
Fig. 1 is the structural representation of a kind of pressure sensor chip encapsulating structure of the present invention, comprise substrate 1 and chip 2, substrate 1 is provided with groove, chip 2 is arranged in groove, substrate 1 back side is also provided with the exntension tubs 11 that are communicated with groove, exntension tubs 11 enclose first medium cavity 12 with chip 2, the outer rubber sleeve 3 that is set with of exntension tubs 11, and the opening of rubber sleeve 3 sealing exntension tubs 11 also seals first medium cavity 12; In first medium cavity 12, be filled with non-corrosiveness medium, non-corrosiveness medium is silicone oil medium.
The outer sleeve 4 that is set with of rubber sleeve 3, sleeve 4 encloses second medium cavity 31 with rubber sleeve 3, and sleeve 4 is provided with and can flows into for testing medium the entrance 41 of second medium cavity 31.
Chip 2 peripheries are connected by glue with the sidewall of groove.By chip 2 is arranged in groove, reduced the distance of chip 2 upper surfaces and substrate 1 upper surface, Bang alignment nation regularly, has reduced difference in height, reduces nation's alignment stroke and flexibility, thereby improves nation's alignment permanance, improves sensor serviceable life.Adopt chip 2 peripheries and the mode that the sidewall of groove is connected simultaneously, increased the contact area of chip 2 with substrate 1, connect more firm.
Between chip 2 and bottom portion of groove, be provided with O-ring seal 5.O-ring seal 5 plays seal protection effect, prevents that the medium in first medium cavity 12 from revealing, damage sensor internal element.
Sleeve 4 is metallic sheath, and metallic sheath upper end and substrate 1 welding, prevent from revealing.
During use, testing medium enters in second medium cavity 31 through the entrance 41 of sleeve 4, the testing medium of second medium cavity 31 extruding rubber sleeve 3, rubber sleeve 3 deforms, by the silicone oil medium in extruding first medium cavity 12, thus by pressure conduction to chip 2, chip 2 is experienced pressure.
Adopt after above-mentioned structure, the medium of substrate 1 inside is non-corrosiveness medium, can corrosion sensor not inner original paper, by at arranged outside second medium cavity 31 for holding testing medium, between first medium cavity 12 and second medium cavity 31, by rubber sleeve 3, separate, can there is deformation in rubber sleeve 3, can be by the pressure conduction in second medium cavity 31 to first medium cavity 12, thereby detect pressure, prevent the corrosion of sensor internal original paper, greatly improved the serviceable life of sensor.
By reference to the accompanying drawings the present invention is exemplarily described above; obviously specific implementation of the present invention is not subject to the restrictions described above; as long as adopted the improvement of the various unsubstantialities that method of the present invention design and technical scheme carry out; or without improving, design of the present invention and technical scheme are directly applied to other occasion, all within protection scope of the present invention.
Claims (7)
1. a pressure sensor chip encapsulating structure, comprise substrate (1) and chip (2), it is characterized in that, described substrate (1) is provided with groove, described chip (2) is arranged in groove, and described substrate (1) back side is also provided with the exntension tubs (11) that are communicated with groove, and described exntension tubs (11) enclose first medium cavity (12) with chip (2), the outer rubber sleeve (3) that is set with of described exntension tubs (11), the opening of described rubber sleeve (3) sealing exntension tubs (11) sealing; In described first medium cavity (12), be filled with non-corrosiveness medium;
The outer sleeve (4) that is set with of described rubber sleeve (3), described sleeve (4) encloses second medium cavity (31) with rubber sleeve (3), and described sleeve (4) is provided with and can flows into for testing medium the entrance (41) of second medium cavity (31).
2. hydraulic pressure transducer chip-packaging structure as claimed in claim 1, is characterized in that, described chip (2) periphery is connected by glue with the sidewall of groove.
3. hydraulic pressure transducer chip-packaging structure as claimed in claim 1 or 2, is characterized in that, is provided with O-ring seal (5) between described chip (2) and bottom portion of groove.
4. hydraulic pressure transducer chip-packaging structure as claimed in claim 3, is characterized in that, described non-corrosiveness medium is silicone oil medium.
5. hydraulic pressure transducer chip-packaging structure as claimed in claim 4, is characterized in that, described exntension tubs (11) are integral type structure with substrate (1).
6. hydraulic pressure transducer chip-packaging structure as claimed in claim 5, is characterized in that, described rubber sleeve (3) upper end is connected and seals with substrate (1).
7. hydraulic pressure transducer chip-packaging structure as claimed in claim 6, is characterized in that, described sleeve (4) is metallic sheath, described metallic sheath upper end and substrate (1) welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617980.5A CN103645004A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617980.5A CN103645004A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103645004A true CN103645004A (en) | 2014-03-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310617980.5A Pending CN103645004A (en) | 2013-11-27 | 2013-11-27 | Pressure sensor chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103645004A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105333991A (en) * | 2015-12-01 | 2016-02-17 | 佛山高富中石油燃料沥青有限责任公司 | High-viscosity medium pressure gauge isolating device |
| CN108547322A (en) * | 2018-05-14 | 2018-09-18 | 河源迪奇亚工业技术有限公司 | Seabed wirerope with application sensing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04164219A (en) * | 1990-10-26 | 1992-06-09 | Fuji Electric Co Ltd | Hydraulic pressure sensor manufacturing method |
| JP2001174355A (en) * | 1999-10-07 | 2001-06-29 | Denso Corp | Pressure detecting device |
| CN1648627A (en) * | 2004-01-30 | 2005-08-03 | 株式会社电装 | Sensor |
| CN101922987A (en) * | 2010-07-15 | 2010-12-22 | 芜湖通和汽车管路***有限公司 | Intake manifold pressure sensor and manufacturing method thereof |
| CN201892596U (en) * | 2010-09-28 | 2011-07-06 | 刘胜 | Gas pressure transmitter |
| CN203191140U (en) * | 2013-04-11 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Dielectric isolation packaging structure for pressure sensor |
-
2013
- 2013-11-27 CN CN201310617980.5A patent/CN103645004A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04164219A (en) * | 1990-10-26 | 1992-06-09 | Fuji Electric Co Ltd | Hydraulic pressure sensor manufacturing method |
| JP2001174355A (en) * | 1999-10-07 | 2001-06-29 | Denso Corp | Pressure detecting device |
| CN1648627A (en) * | 2004-01-30 | 2005-08-03 | 株式会社电装 | Sensor |
| CN101922987A (en) * | 2010-07-15 | 2010-12-22 | 芜湖通和汽车管路***有限公司 | Intake manifold pressure sensor and manufacturing method thereof |
| CN201892596U (en) * | 2010-09-28 | 2011-07-06 | 刘胜 | Gas pressure transmitter |
| CN203191140U (en) * | 2013-04-11 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Dielectric isolation packaging structure for pressure sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105333991A (en) * | 2015-12-01 | 2016-02-17 | 佛山高富中石油燃料沥青有限责任公司 | High-viscosity medium pressure gauge isolating device |
| CN108547322A (en) * | 2018-05-14 | 2018-09-18 | 河源迪奇亚工业技术有限公司 | Seabed wirerope with application sensing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHU ZHITONG AUTOMOBILE ELECTRONICS CO., LTD. Free format text: FORMER OWNER: WUHU TONGHE AUTO PIPELINE SYSTEM CO., LTD. Effective date: 20150611 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150611 Address after: 8 A building, block 35, car electronics Pioneer Park, Hengshan Road, Wuhu economic and Technological Development Zone, Anhui 241009, China Applicant after: Wuhu causes the Electronics Co., Ltd. that is open to the traffic Address before: 241009 Hengshan Road economic and Technological Development Zone, Anhui, No. 26, Applicant before: Wuhu Tonhe Automobile Fluid System Co., Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140319 |
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| WD01 | Invention patent application deemed withdrawn after publication |