CN1648627A - Sensor - Google Patents
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- CN1648627A CN1648627A CN 200510005872 CN200510005872A CN1648627A CN 1648627 A CN1648627 A CN 1648627A CN 200510005872 CN200510005872 CN 200510005872 CN 200510005872 A CN200510005872 A CN 200510005872A CN 1648627 A CN1648627 A CN 1648627A
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- support portion
- protuberance
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- sensor construction
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Abstract
A layered body layered with the sensor structure part 100, a plurality of structures 30, 40 and the connector part 200 is formed in a space between the sensor structure part 100 and the connector part 200, by interposing the plurality of structures 30, 40, support parts 22, 32, 42 are provided in an outer circumferential part in the layered body, so as to support and fix the sensor structure part 100, the individual structures 30, 40 and the connector part 200 each other, electronic components 31, 41 are mounted on the respective structures 30, 40, and a sensor chip 11, the electronic components 31, 41 and the connector part 200 are electrically connected by pin members.
Description
Technical field
The present invention relates to have the sensor of sensing detection portion and connecting portion.
Background technology
Sensor with sensing detection portion and connecting portion for example is disclosed on the patent disclosure 2002-542107 communique.This sensor has as the sensing detection portion of sensor construction portion and the connecting portion that outputs to outside usefulness from the signal of sensing detection portion.Be specifically have be arranged on as the sensor chip of sensing detection portion on the diaphragm sensor construction portion and as the pressure transducer of the contact plug of connecting portion.
But, in this pressure transducer, require to dwindle the radial dimension of sensor as sensing device, promptly dwindle the sensor diameter, specifically, must make the pressure-active element miniaturization in the pressure transducer.
Here, this pressure-active element adopts integrated sensor chip, promptly the circuit of processes sensor signal and sensor chip form integrated, in order to make the pressure-active element miniaturization, must the simplification circuit.
Yet, the diagnosis that needs in sensor constantly increases with function such as communicate by letter, and is the miniaturization of sensing detection portion and the increase of function in order to realize pressure-active element, must improve semiconductor technology, from time, cost, quality aspect, realize that above-mentioned target is very difficult.
Therefore, be pressure-active element that the function of sensing detection portion is separated, making pressure-active element only is the structure of test section, the circuit part of amplifying, adjusting (IC) can be arranged on other position.And, can consider that handle continues to remain unchanged as the function of the integrated transducer chip of sensing detection portion, the circuit part that needs in addition is arranged on other position.
Like this, circuit part is arranged under the situation on the position beyond the sensing detection portion, this circuit part (IC) for example can be accommodated in the support portion etc.
And requirement can increase capacitor etc. as required, freely change circuit part according to purposes, requires the structure of the change of easy adaptive circuit portion structure.
That is to say, require in above-mentioned sensing device, can either to realize the thin footpathization of sensing device, the sensing device changed of the structure of adaptive circuit portion easily again.
And, can think above-mentioned requirements, for other sensing devices beyond the pressure transducer, the sensing device that promptly has the sensing arrangement portion of sensing detection portion and be used for the signal from sensing detection portion is outputed to outside connecting portion also is the item that requires that needs.
Summary of the invention
The present invention be directed to above-mentioned situation and propose, its purpose is, realizes such sensing device, and it has sensing detection portion and connecting portion, has both reduced the diameter of sensing device, can change the structure of circuit part at an easy rate again.
Sensing device comprises: connecting portion, structure, sensor construction portion, structure and the connector that have the sensing arrangement portion of sensing detection portion, the signal from sensing detection portion is outputed to outside usefulness supports mutually and the fixedly support portion and the electronic component of usefulness.Sensor construction portion, structure and connecting portion are configured in proper order with this, and duplexer is provided.The support portion is configured on the peripheral part of duplexer, and electronic component is carried on structure.Sensing detection portion, electronic component and connecting portion are electrically connected respectively.
If adopt this structure, then can constitute the circuit part that the signal from sensing detection portion is carried out signal Processing etc. by carrying electronic component on each structure.And,,, can from connecting portion, export by the circuit part that constitutes by this electronic component from the signal of sensing detection portion.
And the support of each one of duplexer is supported in the support portion that is arranged on the duplexer peripheral part, so on the central portion of each structure, the change in design that can adapt to the kind and the configuration of the electronic component of lift-launch on this structure.
Therefore, freely change circuit part according to purposes easily, and, even the structure of sensing detection portion and connecting portion is modified, also be easy to the syndeton of these sensing detection portions and connecting portion and structure is changed.
And as mentioned above, circuit part can be made of each stacked structure.That is to say, circuit part be configured in sensing device axially on, so, can prevent as far as possible that the radial dimension of sensing device from increasing.
So, according to sensing device of the present invention, it possesses: have the sensing arrangement portion of sensing detection portion and the connecting portion that outputs to outside usefulness from the signal of sensing detection portion, can both realize reducing the diameter of sensing device, can change the structure of circuit part at an easy rate again.The support portion preferably is made of the 1st support portion and the 2nd support portion.And the 1st support portion is configured between sensor construction portion and the structure, so that connect sensor construction portion and structure, the 2nd support portion is configured between structure and the connecting portion, so that syndeton body and connecting portion.Moreover preferably, the 1st support portion has protuberance on the end of structure one side; The 2nd support portion has protuberance on the end of connecting portion one side, have recess on the other end, and connecting portion has recess on the end on structure side.In addition, the 2nd support portion and structure constitute one, and the 1st support portion engages one another with sensor construction portion and is in the same place.And, the protuberance by the 1st support portion and the recess of the 2nd support portion chimeric, and connect sensor construction portion and structure; The protuberance by the 2nd support portion and the recess of connecting portion chimeric, and syndeton body and connecting portion.And preferably the shape of the protuberance of the shape of the protuberance of the 1st support portion and the 2nd support portion is different.
Above-mentioned or other purpose, structure, advantage of the present invention can be clear that from following detailed description with reference to following accompanying drawing.
Description of drawings
Fig. 1 is the summary sectional view, represents the pressure transducer among the 1st embodiment of the present invention.
Fig. 2 A is a part sectioned view, and expression is along the 4th structure of the pressure transducer of the IIA-IIA line among Fig. 1.
Fig. 2 B is a part sectioned view, and expression is along the 3rd structure of the pressure transducer of the IIB-IIB line among Fig. 1.
Fig. 2 C is a part sectioned view, and expression is along second structure of the pressure transducer of the IIC-IIC line among Fig. 1.
Fig. 2 D is a part sectioned view, and expression is along first structure of the pressure transducer of the IID-IID line among Fig. 1.
Fig. 3 is a part sectioned view, the pressure transducer among expression the present invention the 2nd embodiment.
Fig. 4 is a sectional view, the pressure transducer in the variation of expression the present invention the 2nd embodiment.
Fig. 5 is a sectional view, the pressure transducer among expression the present invention the 3rd embodiment.
Fig. 6 is a part sectioned view, and expression is along the 1st structure of the pressure transducer of the VI-VI line among Fig. 5.
Fig. 7 is the summary sectional view, and the expression edge is as the pressure transducer of the comparative example of the 1st embodiment.
Fig. 8 is local amplification profile, and the sensing detection portion of the pressure transducer of presentation graphs 7 is provided with portion.
Embodiment
(the 1st embodiment)
Fig. 7 is the integrally-built part sectioned view of expression for the pressure transducer of the sensing device with sensing detection portion and connecting portion, inventor's trial-production.And Fig. 8 is the summary sectional view that the sensing detection portion in the shell 300 among Fig. 7 is provided with portion 301.
As shown in Figure 8, sensing detection portion is provided with portion 301 and has another the distolateral recess 303 that is formed on shell 300, is provided with the pressure-active element 11 as sensing detection portion in this recess 303.This pressure-active element 11 for example is the sensor element of semiconductor film chip, can adopt the sensor element that can export with the corresponding electric signal of institute's plus-pressure.
And recess 303 seals by the metallic membrane 304 that is fixed on the shell 300 with methods such as welding, is packaged with the oil 305 that transmits medium as pressure in recess 303.
Then, the pressure that is added on this metallic membrane 304 305 is delivered on the pressure-active element 11 by oil, and pressure-active element 11 is according to the pressure that is subjected to and output signal.
And as shown in Figure 8, the bottom of the peristome 302 in shell 300 is formed with and is arranged on sensing detection portion the reach through hole 306 that the pressure-active element 11 in the portion 301 is connected is set.
Then, the peristome from shell 300 302 inserts the terminal pins 307 that is made of metal etc.One end side of this terminal pins 307 is penetrated on peristome 301 bottoms by reach through hole 306, is exposed in the recess 303.
And, in reach through hole 306, between shell 300 and terminal pins 307, seal by glass component 308 as the insulativity seal glass.And shell 300 and terminal pins 307 are carried out electrical isolation by glass component 308.
Then, an end of the terminal pins of exposing in recess 303 307 is carried out wiring by welding wires 309 such as pressure-active element 11 and gold or aluminium, and is electrically connected.
And, as shown in Figure 7, on the other end of terminal pins 307 outstanding from the peristome 302 of shell 300,, carry out electricity, mechanicalness engages with the connecting pin 310 that ferrous metal etc. is constituted by conductive bonding materials such as welding or riveted joint, scolding tin etc.
Moreover connecting pin 310 is supported by the drip molding 311 that is made of resin etc., constitutes the coupling assembling 312 as connecting portion.
And, on the drip molding 311 of this coupling assembling 312, forming one with support portion 314, this support portion 314 has the hole portion 313 that can pass terminal pins 307, inserts terminal pins 307 in this hole portion 313, supports.
Moreover an end of the tubing cylindraceous 315 that is made of metal etc. is installed in peristome 302 1 sides of shell 300.And, hide by terminal pins 307 outstanding in the peristome 302 till the place, junction surface of terminal pins 307 and connecting pin 310 by this tubing 315.
At this, as shown in Figure 7, the coating material 316,317 that is made of resin materials such as epoxy resin or silicone resins is filled in the peristome 302 of shell 300 and in the tubing 315.
In this pressure transducer, sensing detection portion is provided with portion 301 places measured environment, the pressure that is subjected on the metallic membrane 304 is delivered on the pressure-active element 11 by oil 305.Then, the transducing signal from pressure-active element 11 outputs is delivered to the outside by welding wire 309, terminal pins 307, connecting pin 310.
But, in this pressure transducer, wish to dwindle the radial dimension of sensor as sensing device, that is to say, reduce the diameter of sensor, specifically, in above-mentioned pressure transducer shown in Figure 8, need the miniaturization of pressure-active element 11.
At this, this pressure-active element 11 adopts the integrated transducer chip, and promptly the circuit of processes sensor signal and sensor chip become one.In order to make pressure-active element 11 miniaturizations, need to simplify circuit.And, require the change of the easy adaptive circuit of its structure portion structure.
In order to simplify circuit, under situation about circuit part being arranged on the position different with sensing detection portion, for example in above-mentioned pressure transducer shown in Figure 7, this circuit part (IC) is accommodated in 314 grades of support portion.
Yet what above-mentioned measure can not fully adapt to the sensing device diameter reduces change with the circuit part structure etc.
In view of the above problems, made the sensing device that the present invention the 1st embodiment relates to sensing detection portion and connecting portion.Fig. 1 is the integrally-built summary sectional view of expression as the pressure transducer S1 of this sensing device.From Fig. 2 A is the figure of the structure of the each several part the presentation graphs 1 to Fig. 2 D.This pressure transducer S1 does not limit purposes, for example goes for detecting the pressure transducer etc. of the pressure of the brake oil in the brake system of car.
Fig. 2 A is the summary sectional view along the 4th structure 50 of the IIA-IIA line among Fig. 1, Fig. 2 B is the summary planimetric map along the 3rd structure 40 on the face of the IIB-IIB line among Fig. 1, Fig. 2 C is the summary planimetric map along the 2nd structure 30 on the face of the IIC-IIC line among Fig. 1, and Fig. 2 D is the summary planimetric map along the 1st structure 20 on the face of the IID-IID line among Fig. 1.
(structure of sensor etc.)
This pressure transducer S1 possesses: have the sensor construction portion 100 as the pressure-active element 11 of sensing detection portion, the signal from sensing detection portion 11 is outputed to the connecting portion 200 of outside usefulness.At this, the 1st structure 20 is parts of sensor construction portion 100, and the 4th structure 50 constitutes the part of connecting portion 200.
Then,, between sensor construction portion 100 and connecting portion 200, and form by a plurality of structures 30,40,50 by the stacked duplexer of sensor construction portion the 100, the 2nd structure the 30, the 3rd structure 40 and connecting portion 200.
Sensor construction portion 100 is made of following two parts: inside has the stem stem (ス テ system) 10 that letter shape in the end is arranged of hollow part, promptly forms the stem stem 10 of hollow tubular and be installed in the 1st structure 20 on this stem stem 10.
Stem stem 10 is processed and is formed cylinder basically.This stem stem 10 has the diaphragm 10a that can be out of shape with pressure on the part of its outside, and has pressure is incorporated into the peristome 10b that uses in the hollow part.
In the present embodiment, diaphragm 10a is set on the distolateral end face of axle of stem stem 10, peristome 10b be set at another of axle of stem stem 10 distolateral on.At this, diaphragm 10a is processed into thinner wall section to a distolateral end face of the axle of stem stem 10 and forms.
And this stem stem 10 is installed on the position of peristome 10b one side, forms the form that seals with measured object, is formed with O shape annular groove 10c on the outer peripheral face of the peristome 10b of stem stem 10 side, is used to install the no illustrated O shape ring of sealing usefulness.At this, above-mentioned measured object for example is the brake oil pipeline in the brake system of automobile.
Like this, under stem stem 10 was installed to state on the measured object, the pressure that comes from measured object, promptly by measuring pressure was directed in the hollow part of stem stem 10 from the peristome 10b of stem stem 10.So, according to be imported into by the size of measuring pressure, make diaphragm 10a produce distortion.
And, shown in Fig. 1, Fig. 2 D, on the diaphragm 10a of stem stem 10, be provided with sensor chip 11 as sensing detection portion.This sensor chip 11 is used to export the electric signal corresponding to the distortion of above-mentioned diaphragm 10a, and constitutes the pressure-active element that carries out pressure detection.
For example, sensor chip 11 is made of single crystalline Si semi-conductor chips such as (silicon), in this example, does not wait engaging with the diaphragm 10a of stem stem 10 to fix by there being illustrated low-melting glass.
Following specifying not is qualification to its meaning.This sensor chip 11 has bridge circuit, when the pressure that imports as the peristome 10b by stem stem 10 makes diaphragm 10a distortion, exports be transformed into electric signal with this variation of being out of shape corresponding resistance, and this process can be used as the strainmeter use.And, the key property of these diaphragms 10a and sensor chip 11 decision pressure transducer S1.
And, in stem stem 10, on the outer peripheral face between diaphragm 10a and the O shape annular groove 10c, be formed with outstanding flange part 10d from this outer peripheral face.And, on this flange part 10d, be equipped with the 1st structure 30 and shell 60.
At this, constitute the metal material of stem stem 10, owing to will bear UHV (ultra-high voltage), thus require to reach high strength, moreover, owing to wait the sensor chip 11 that is made of Si is engaged by glass, so, the thermal expansivity that requires to reach low etc.
Specifically, stem stem 10 is based on Fe, Ni, Co or Fe, Ni, as separating out reinforcing material, selected to increase the material of Ti, Nb, Al or Ti, Nb, can form by methods such as punching press, cutting and cold forgings.
As the 1st structure 20 of the part of sensing arrangement portion 100, form toroidal, wait by resin with electrical insulating property and pottery to constitute.The 1st structure 20 is carried on the flange part 10d of stem stem 10 by method such as bonding, and is fixed on the stem stem 10.
And the 1st structure 20 is configured to the state that surrounds to diaphragm 10a in the stem stem 10 and sensor chip 11 on every side.At this, shown in Fig. 2 D, the upper surface of the 1st structure 20 is provided with the liner 21 that is made of aluminium (Al) or gold (Au), copper (Cu) etc.
Moreover this liner 21 and sensor chip 11 carry out wiring by the metal wire 12 of formations such as gold or aluminium, are electrically connected.Methods such as these tinsel 12 usefulness wire-bonded form.
And, on the upper surface of the 1st structure 20, be provided with support portion 22, be used to support and fix and undertaken stacked and duplexer that form by sensor construction portion 100, a plurality of structure 30,40 and connecting portion 200.This support portion 22 is set on the upper surface of the 1st structure 20 of ring-type, and the state of Xing Chenging is arranged on the peripheral part of sensor construction portion 100 like this.
At this, the 1st structure 20, be the support portion 22 of sensor construction portion 100, be set up 2 positions above (being 3 positions in the illustrated example), each support portion 22 is from the outstanding column in the upper surface of the 1st structure 20, has protuberance 22a on its termination.
Moreover, on the upper surface of the 1st structure 20, be provided with electric conductivity pin parts 23 highlightedly.This sells parts 23, for example by inserting methods such as shaping pin parts such as metal is fixed on the 1st structure 20.
Then, pin parts 23 and liner 21 wait to form by the lip-deep no illustrated wiring that is formed on the 1st structure 20 and conduct.That is to say that in sensor construction portion 100, sensor chip 11 and pin parts 23 are electrically connected by metal wire 12, liner 21.
And the 2nd structure 30 is laminated in sensor construction portion 100, the i.e. top of the 1st structure 20, and the 2nd structure 30 is the circular plate shape that are made of resin or pottery.
Shown in Fig. 2 C, on the 2nd structure 30, the IC chip 31 as the electronic component of the circuit part that constitutes this pressure transducer S1 is installed.At this, IC chip 31 carries out wiring (ワ イ ヤ ボ Application De) by metal wire 31a and installs.
And, on the peripheral part on the 2nd structure 30, be provided with support portion 32, be used to support and fix and undertaken stacked and duplexer that form by sensor construction portion 100, a plurality of structure 30,40 and connecting portion 200.
At this, the support portion 32 of the 2nd structure 30 is provided with more than 2 and (is 3 in illustrated example), and each supporter 32 is outstanding columns above the 2nd structure 30, has protuberance 32a in its termination portion.
And, as shown in Figure 1, below the 2nd structure 30 (with the face of the opposite side of face shown in Figure 2), in above-mentioned the 1st structure 20 with on the corresponding position of protuberance 22a of support portion 22, be formed with the recess 32b of the protuberance 22a that embeds the 1st structure 20.
In the 2nd structure 30, the support portion 32 that protuberance 32a and the recess 32b by the 2nd structure 30 constitutes the 2nd structure 30.And, make the recess 32b of the protuberance 22a of the 1st structure 20 and the 2nd structure 30 chimeric mutually, like this, can make the 1st structure 20, be that sensor construction portion 100 and the 2nd structure 30 support mutually and fixing.
Moreover, shown in Fig. 2 C, on the upper surface of the 2nd structure 30, be provided with electric conductivity pin parts 33 with outstanding state.This sells parts 33, by methods such as insertion shapings, for example pin parts such as metal is fixed on the 2nd structure 30.
And, on the peripheral part of the 2nd structure 30, be provided with reach through hole 34 with the pin parts 23 opposed positions of the 1st structure 20.
In this reach through hole 34, as shown in Figure 1, insert the pin parts 23 of the 1st structure 20, like this, the 1st structure member 10 and the 2nd structure member 30 are electrically connected.This reach through hole 34 and pin parts 23 can be electrically connected by methods such as method of attachment of spring contact formula or scolding tin.
Then, in the 2nd structure 30, IC chip 31 and pin parts 33 and reach through hole 34 wait to form by metal wire 31 and no illustrated wiring to conduct.Like this, the IC chip 31 that is carried on sensor chip 11 in the sensor construction portion 100 and the 2nd structure 30 just is electrically connected.
And the 3rd structure 40 carries out stacked on the 2nd structure 30, and the 3rd structure 40 also is the circular plate shape that is made of resin or pottery.
Shown in Fig. 2 B, on the 3rd structure 40, the chip capacitor 41 as the electronic component of the circuit that constitutes this pressure transducer S1 is installed.At this, chip capacitor 41 is expressed 4, does not install by having illustrated conductive adhesive or scolding tin etc.
And, on the peripheral part on the 3rd structure 40, be provided with support portion 42, be used to support and the fixing and duplexer that form stacked by sensor construction portion 100, a plurality of structure 30,40 and connecting portion 200.
At this, the support portion 42 of the 3rd structure 40 is provided with more than 2 and (is 3 in illustrated example), and each support portion 42 is outstanding columns above the 3rd structure 40, has protuberance 42a in its termination portion.
And, as shown in Figure 1, below the 3rd structure 40 on (with the face of the opposite side of face shown in Figure 2), in above-mentioned the 2nd structure 30 with on the corresponding position of protuberance 32a of support portion 32, be formed with the recess 42b of the protuberance 32a that embeds the 2nd structure 30.
In the 3rd structure 40, the support portion 42 that protuberance 42a and the recess 42b by the 3rd structure 40 constitutes the 3rd structure 40.And, make the recess 42b of the protuberance 32a of the 2nd structure 30 and the 3rd structure 40 chimeric mutually, like this, the 2nd structure 30 and the 3rd structure 40 are supported and fixing mutually.
Moreover, shown in Fig. 2 B, on the upper surface of the 3rd structure 40, be provided with electric conductivity pin parts 43 with outstanding state.This sells parts 43, by methods such as insertion shapings, for example pin parts such as metal is fixed on the 3rd structure 40.
And, on the peripheral part of the 3rd structure 40, be provided with reach through hole 44 with the pin parts 33 opposed positions of the 2nd structure 30.
In this reach through hole 44, insert the pin parts 33 of the 2nd structure 30, like this, the 2nd structure member 30 and the 3rd structure member 40 are electrically connected.This reach through hole 44 can be the same with above-mentioned situation with pin parts 33, waits with method of attachment of spring contact formula or welding to be electrically connected.
Then, in the 3rd structure 40, chip capacitor 41 and pin parts 43 and reach through hole 44 do not wait to form and conduct by there being illustrated wiring.Like this, the chip capacitor 41 that is carried on IC chip 31 that is carried on the 2nd structure 30 and the 3rd structure 40 is electrically connected.
And the 4th structure 50 carries out stacked on the 3rd structure 40, and the 4th structure 50 is as the part of connecting portion 200, and the circular plate shape of one is formed at the bottom in connecting portion 200.
At this, connecting portion 200 inserts the terminal 210 that is made of conductive metal material etc. to be formed in the resin portion 220 and makes.Here be provided with 3 terminals 210, in Fig. 1, the upper end side of each terminal 210 can be electrically connected with ECU of automobile etc. by wiring part.
And the 4th structure 50 is configured as one as the part of this resin portion 220.
As shown in Figure 1, below the 4th structure 50 on (with the face of the opposite side of face shown in Figure 2), in above-mentioned the 3rd structure 40 with the corresponding position of protuberance 42a of support portion 42 on, be formed with the recess 52b of the protuberance 42a that embeds the 3rd structure 40.
And, at the 4th structure 50, be in the connecting portion 200, constitute the support portion 52 of the 4th structure 50 by this recess 52b.And, make the recess 52b of the protuberance 42a of the 3rd structure 40 and the 4th structure 50 chimeric mutually, like this, can make the 3rd structure 40 and the 4th structure 50, be that connecting portion 200 supports mutually and fixing.
And, shown in Fig. 2 (a), on the peripheral part of the 4th structure 50, be provided with reach through hole 54 with the pin parts 43 opposed positions of the 3rd structure 40.
In this reach through hole 54, insert the pin parts 43 of the 3rd structure 40, like this, the 3rd structure member 40 and the 4th structure member 50 are electrically connected.This reach through hole 54 can equally with above-mentioned situation wait by spring contact formula method of attachment or welding with pin parts 43 and be electrically connected.
And as shown in Figure 1, at the 4th structure 50, be in the connecting portion 200, terminal 210 exposes in reach through hole 54, forms with the pin parts 43 of the 3rd structure 40 to conduct.Like this, the chip capacitor 41 that is carried on the 3rd structure 40 and the terminal 210 of connecting portion 200 are electrically connected.
Like this, in this pressure transducer S1, a plurality of structures 30,40 form the duplexer that is laminated by sensor construction portion 100, a plurality of structure 30,40 and connecting portion 200 between sensor construction portion 100 and connecting portion 200.
And, as mentioned above, on the peripheral part in this duplexer, be provided with support portion 22,32,42,52, be used for sensor construction portion 100, each structure 30,40, reach connecting portion 200 support and fixing mutually.
Moreover, on the structure between sensor construction portion 100 and the connecting portion 200 30,40, carry electronic component 31,41, be electrically connected as mentioned above as sensor chip 11, electronic component 31,41 and the connecting portion 200 of sensing detection portion.And, constitute the circuit part of this pressure transducer S1 by these electronic components 31,41.
And, as shown in Figure 1, shell 60 is fixed on the flange part 10d of stem stem 10 by methods such as melting welding.This shell 60 is by what metal or resin etc. constituted the bottom tube-like thing to be arranged, and covers on the outside of the 1st structure 20 of sensor construction portion 100 and the 2nd, the 3rd structure 30,40 and connecting portion 200.
At this, the connection end of terminal 210 outsides in the connecting portion 200, outstanding from the reach through hole 61 that is arranged on the shell 60 to the outside of shell 60.And O shape ring 70 prevents that moisture and foreign matter from invading in the 4th structure 50 between the resin portion 220 and shell 60 of connecting portion 200.
In the pressure transducer S1 of present embodiment, imported from the peristome 10b of stem stem 10 by measuring pressure, according to be imported into by the size of measuring pressure, diaphragm 10a produces distortion.Then, from sensor chip 11, export,, can from connecting portion 200, export by the circuit part that constitutes by above-mentioned electronic component 31,41 with the corresponding electric signal of distortion of this diaphragm 10a.
At this, for example,, can amplify and adjust electric signal from sensor chip 11 by carrying IC chip 31 on the 2nd structure 30 etc., export or the noise and the surge of power supply by carrying chip capacitor 41 on the 3rd structure 40 etc., can controlling.
(assembling of sensor)
And, have the pressure transducer S1 of the present embodiment of this structure, for example assembling by the following method.
At first, the stem stem 10 and the 1st structure 20 that have carried sensor chip 11 are assembled, between the liner 21 of sensor chip 11 and the 1st structure 20, carried out wire-bonded, carry out wiring betwixt by metal wire 12.
Then, stack gradually and assemble the 2nd structure 30 that has carried IC chip 31 and the 3rd structure 40 that has carried chip capacitor 41.At this moment, make recess 32b～52b and protuberance 22a～42a between each structure 20～50 chimeric mutually, and the pin parts are inserted in the reach through hole are electrically connected.And it is bonding that each recess 32b～52b and protuberance 22a～42a are carried out as required.
And, connecting portion 200 is layered on the 3rd structure 40, after the assembling, shell 60 is covered on duplexer, shell 60 and stem stem 10 are engaged.Like this, promptly can be made into the pressure transducer S1 of present embodiment.
The present invention has following effect etc.
But, according to present embodiment, pressure transducer S1, it possesses: have as the sensor construction portion 100 of the sensor chip 11 of sensing detection portion and be used for the signal from sensor chip 11 is outputed to outside connecting portion 200, it is characterized in that, a plurality of structures 30,40 are between sensor construction portion 100 and connecting portion 200, so be formed with duplexer stacked by sensor construction portion 100, a plurality of structure 30,40 and connecting portion 200 and that constitute.The peripheral part of this duplexer is provided with and is used for sensor construction portion 100, each structure 30,40 and connecting portion 200 are supported mutually and fixing support portion 22,32,42,52, on each structure 30,40, carry electronic component 31,41, sensor chip 11, electronic component 31,41 and connecting portion 200 are electrically connected.
Like this, by carrying the electronic component 31,41 on the 2nd, the 3rd each structure 30,40, can constitute the circuit part that the signal from sensor chip 11 is carried out signal Processing etc.Then, from the signal of sensor chip 11,, can from connecting portion 200, export by the circuit part that constitutes by this electronic component.
And, the support of the each several part of duplexer is undertaken by the support portion 22,32,42,52 that is arranged on the duplexer peripheral part, so, central portion at the 2nd, the 3rd each structure 30,40, can freely carry out suitable change in design to carrying the kind and the configuration of the electronic component 31,41 on this structure 30,40.
Therefore, freely change circuit part according to purposes easily, and, even the structure of sensor chip 11 and connecting portion 200 is changed, also can change the syndeton of these sensor chips 11 and connecting portion 200 and structure 30,40 at an easy rate.
And as mentioned above, circuit part can be made of the 2nd, the 3rd stacked each structure 30,40.That is to say and since circuit part be configured in pressure transducer S1 axially on, so, can prevent to increase the radially volume of pressure transducer S1 as far as possible.
Therefore, according to present embodiment, pressure transducer S1 possesses: have the sensor construction portion 100 of sensor chip 11 and be used for the connecting portion 200 that a signal from sensor chip 11 outputs to the outside, can either realize reducing the diameter of pressure transducer S1, again easily under the situation such as adaptive circuit portion structure change.
And, in the present embodiment, shown in Fig. 2 A～2D, support portion 22,32,42,52, each peripheral part of sensor construction portion the 100, the 2nd, the 3rd each structure 30,40 and connecting portion 200 is provided with more than 2.
The support portion also can be provided with one on each parts that constitute duplexer.But as present embodiment,, then can make duplexer obtain stable support if on each parts 100,30,40,200, be provided with more than 2, respond well.
And, in the present embodiment, support portion 22,32,42,52, between each parts of sensor construction portion the 100, the 2nd, the 3rd each structure 30,40 and connecting portion 200, on parts, have protuberance 22a, 32a, 42a, on the part of another parts opposed, have the protuberance of embedding 22a, recess 32b, the 42b of 32a, 42a, 52b with it.
So, chimeric mutually in protuberance 22a, 32a, 42a and recess 32b, 42b, 52b, thus, can suitably fix between the adjacent parts, and these protuberances and recess become mark, be convenient to carry out position alignment.
Under the situation of the chimeric support portion that utilizes this protuberance and recess, also can make shape and the position of protuberance 22a, 32a, 42a and recess 32b, 42b, 52b, different between sensor construction portion the 100, the 2nd, the 3rd each structure 30,40 and connecting portion 200 each parts, so that when combination was incorrect, protuberance and recess can not be chimeric.
So, in the lamination order according to mistake each parts 100,30,40,200 is carried out under the stacked situation, protuberance 22a, the 32a of opposed parts, 42a and recess 32b, 42b, 52b can not be chimeric.That is to say, can prevent that assembling sequence and direction from making a mistake etc., respond well.
Moreover, in the present embodiment, between each parts of sensor construction portion the 100, the 2nd, the 3rd each structure 30,40 and connecting portion 200, parts on one side are provided with pin parts 23,33,43, the parts of another side opposed with it are provided with reach through hole 34,44,54, pin parts 23,33,43 are inserted in the reach through hole 34,44,54, the parts on one side and the parts of another side are electrically connected.And, sensing detection portion 11, electronic unit 31,41 and connecting portion 200 are electrically connected with this.
Especially, in above-mentioned illustrated example, good mode is: pin parts 23,33,43 are inserted in the reach through hole 34,44,54 and the electrical connection section that forms is arranged on the peripheral part of duplexer.
So, except that support portion 22,32,42,52, electrical connection section also is positioned on the peripheral part of duplexer, so, 2nd, the central portion of the 3rd each structure 30,40 (the diagonal line hatches part among Fig. 2 B and the 2C), suitable change in design can be more freely carried out in the kind and the configuration of the electronic component 31,41 of lift-launch on this structure 30,40.
Moreover in the present embodiment, the outside of a plurality of structures 30,40 of the 2nd, the 3rd is covered by shell 60, suitably protects each structure 30,40 by shell 60, and is respond well.
(the 2nd embodiment)
The sensing device of the 2nd embodiment is shown in Fig. 3 and Fig. 4 according to the present invention.
Fig. 3 is the planimetric map of expression sensing device, and it has changed the wiring state of the metal wire 12 of sensor chip 11 and the 1st structure 20.Like this, by suitably changing the configuration of liner 21 in the 1st structure 20 and support portion 22, pin parts 23, even the wiring state of metal wire 12 changes, also can be corresponding at an easy rate.
And Fig. 4 is the summary sectional view of the variation of expression the 2nd embodiment, has increased the structure 30,40 between sensor construction portion 100 and connecting portion 200, the quantity of 30a, 40a.
At this, compare with above-mentioned example shown in Figure 1, increased structure 30a, structure 40a, but in this embodiment, these structures 30a, structure 40a are respectively and the identical structure of above-mentioned the 2nd structure the 30, the 3rd structure 40, have carried same electronic component 31,41.
Moreover the 1st structure 20 and sensor construction portion 100 form independently state, and they connect by the following method.
Sensor construction portion 100 has the outstanding cylindrical projection 100a of face from it.And, the support portion 22 of the 1st structure 20, below the 1st structure 20, with the corresponding position of protuberance 100a of sensor construction portion 100 on, be formed with the recess 22b of the protuberance 100a that embeds sensor construction portion 100.
In the 1st structure 20, the protuberance 22b tabling of the protuberance 100a of sensor construction portion 100 and the 1st structure 20, thus, the 1st structure 20 and sensor construction portion 100 support mutually and are fixing.
Under the situation of electronic components such as a plurality of chip capacitors 41 of needs and IC chip 31, as shown in Figure 4, can come corresponding by structure 30a, the 40a that increases same design.
At this moment, the size that only changes shell 60 gets final product, so, also can change the structure of the 1st structure 20 and the 4th structure 50, that is to say, needn't change sensor construction portion 100 and connecting portion 200.
And, in above-mentioned example shown in Figure 1, in the 2nd structure 30, be equipped with IC chip 31; In the 3rd structure 40, be equipped with chip capacitor 41.On the contrary, also can in the 2nd structure 30, carry chip capacitor 41; In the 3rd structure 40, carry IC chip 31.Moreover, also can IC chip 31 and the 2nd and the 3rd structure 30,40 be carried together by circuit structure.
(the 3rd embodiment)
Fig. 5 is the integrally-built part sectioned view of the pressure transducer S2 of the sensing device that relates to as the present invention the 3rd embodiment of expression, and Fig. 6 is the monomer summary planimetric map along the 1st structure 20 on the face of the VI-VI line among Fig. 5.So stress difference with the foregoing description.
The pressure transducer S2 of present embodiment has been suitable for the present invention to above-mentioned Fig. 7, pressure transducer (hereinafter referred to as relatively using sensor) shown in Figure 8.
This pressure transducer S2 has and the above-mentioned structure that relatively with identical shell 300 of sensor and sensing detection portion portion 301 is set, and the structure of the 2nd, the 3rd structure 30,40, connecting portion 200 and shell 60 is identical with above-mentioned the 1st embodiment.
And, in the pressure transducer S2 of present embodiment, the shell 300 of portion 301 is set and, forms sensor structure 200 by the 1st structure 20 that is fixed as one with this shell 300 such as bonding by having sensing detection portion.And shell 60 is fixed on the shell 300 by methods such as melting welding.
In this pressure transducer S1, be provided with in the portion 301 in sensing detection portion, with pressure-active element, be that the terminal pins 307 that is connected of sensor chip 11 and the syndeton of the 1st structure 20 have unique point.
That is to say,, in the 1st structure 20 of ring-type, electric conductivity terminal bar 25 is arranged to from the inner peripheral surface outstanding, terminal pins 307 is inserted on this terminal bar 25 in the formed hole, be electrically connected as Fig. 5, shown in Figure 6.
The pressure detection action of the pressure transducer S2 of the embodiment of the invention, from above-mentioned relatively with the detection of the sensor action as can be seen, be added in the pressure on the metallic membrane 304,305 be delivered on the pressure-active element 11 by oil, pressure-active element 11 is according to the pressure that is subjected to and output signal (referring to Fig. 8).
And, the electric signal of output from pressure-active element 11, can by the circuit part that by above-mentioned electronic component 31,41 constitute from connecting portion 200 export the same with the foregoing description.
Moreover in the present embodiment, also as can be seen, the effect of its generation is identical with the described effect of above-mentioned the 1st embodiment.
Like this, the structure of duplexer of the present invention except having the pressure transducer with above-mentioned diaphragm 10a stem stem 10, also can be easy to adapt to for the structure of various sensing arrangement portion.
And as mentioned above, in the pressure transducer of the various embodiments described above, at middle body, a plurality of structures that disposed support and electrical connection section on peripheral part overlap each other electronic component arrangements, thus, have realized small-sized and the operation simple sensors.Moreover, the also expansion and the change of adaptive circuit scale easily.
(variation)
And in the above-described embodiments, each structure between sensor construction portion 100 and connecting portion 200 is the circular plate shape of resin or pottery, but is not limited in plectane, also can be the plate with arbitrary plane shape.And this structure also can be the mode of the electronic component that carries and connecting portion being carried out casting mold with resin.
And, for example to understand in the above-described embodiments sensing device of the present invention is applicable to a kind of pressure transducer, this pressure transducer has the sensor chip 11 as pressure-active element, and this pressure-active element carries out pressure detection by its sensing detection portion.But the present invention is not limited only to pressure transducer.
In a word, if the present invention has the sensing arrangement portion of band sensing detection portion and the sensing device that outputs to the connecting portion of outside usefulness from the signal of sensing detection portion, then can be applicable to various sensing devices such as acceleration transducer, angular-rate sensor, flow sensor, gas sensor, temperature sensor, humidity sensor, infrared ray sensor, optical sensor.
Can think that above-mentioned improvement example and variation belong in the scope of the present invention by claims defined of annex.
Claims (13)
1, a kind of sensing device is characterized in that, comprising:
Sensor construction portion (100) with sensing detection portion (11);
Signal from sensing detection portion (11) is outputed to the connecting portion (200) of outside usefulness;
Structure (30,40);
Sensor construction portion (100), structure (30,40) and connecting portion (200) are supported mutually and fixedly the support portion of usefulness (22,32,42);
And electronic component (31,41),
Sensor construction portion (100), structure (30,40) and connecting portion (200) are configured in proper order with this, and duplexer is provided,
Support portion (22,32,42) is configured on the peripheral part of duplexer,
Electronic component (31,41) is carried on structure (30,40),
Sensing detection portion (11), electronic component (31,41) and connecting portion (200) are electrically connected respectively.
2, sensing device as claimed in claim 1 is characterized in that,
Support portion (22,32,42) is made of the 1st support portion (22) and the 2nd support portion (32,42),
The 1st support portion (22) is configured between sensor construction portion (100) and the structure (30,40), so that connect sensor construction portion (100) and structure (30,40),
The 2nd support portion (32,42) is configured between structure (30,40) and the connecting portion (200), so that syndeton body (30,40) and connecting portion (200).
3, sensing device as claimed in claim 2 is characterized in that,
The the 1st and the 2nd support portion (22,32,42) has a plurality of support sections on each peripheral part of sensor construction portion (100), structure (30,40) and connecting portion (200).
4, sensing device as claimed in claim 2 is characterized in that,
The the 1st and the 2nd support portion (22,32,42) have respectively protuberance (22a, 32a, 42a) and recess (32b, 42b),
(22a, 32a 42a) are configured on the end of each support portion (22,32,42) protuberance; Recess (32b 42b) is configured on the other end of each support portion (22,32,42),
By the protuberance (22a) of the 1st support portion (22) and the recess of the 2nd support portion (32,42) (32b, 42b) chimeric, and connect sensor construction portion (100), structure (30,40) and connecting portion (200) respectively.
5, sensing device as claimed in claim 2 is characterized in that,
The 1st support portion (22) has protuberance (22a) on the end of structure (30, a 40) side,
The 2nd support portion (32,42) on the end of connecting portion (200) one sides, have protuberance (32a, 42a), on the other end, have recess (32b, 42b),
Connecting portion (200) has recess (52b) on the end of structure (30, a 40) side,
The 2nd support portion (32,42) constitutes one with structure (30,40),
The 1st support portion (22) and sensor construction portion (100) engage one another together.
By the protuberance (22a) of the 1st support portion (22) and the recess of the 2nd support portion (32,42) (32b, 42b) chimeric, and connect sensor construction portion (100) and structure (30,40),
Protuberance by the 2nd support portion (32,42) (32a, 42a) and the recess (52b) of connecting portion (200) chimeric, and syndeton body (30,40) and connecting portion (200).
6, sensing device as claimed in claim 5 is characterized in that, (32a, shape 42a) is different for the shape of the protuberance (22a) of the 1st support portion (22) and the protuberance of the 2nd support portion (32,42).
7, sensing device as claimed in claim 2 is characterized in that,
Sensor construction portion (100) has protuberance (100a) on the end of structure (30, a 40) side,
The 1st support portion (22) has protuberance (22a) on the end of structure (30, a 40) side, have recess (22b) on the other end,
The 2nd support portion (32,42) on the end of connecting portion (200) one sides, have protuberance (32a, 42a), on the other end, have recess (32b, 42b),
Connecting portion (200) has recess (52b) on the end of structure (30, a 40) side,
The 2nd support portion (32,42) constitutes one with structure (30,40),
The protuberance (100a) by sensor construction portion (100) and the recess (22b) of the 1st support portion (22) chimeric, and connect sensor construction portion (100) and the 1st support portion (22),
By the protuberance (22a) of the 1st support portion (22) and the recess of the 2nd support portion (32,42) (32b, 42b) chimeric, and connect sensor construction portion (100) and structure (30,40),
Protuberance by the 2nd support portion (32,42) (32a, 42a) and the recess (52b) of connecting portion (200) chimeric, and syndeton body (30,40) and connecting portion (200).
8, sensing device as claimed in claim 7 is characterized in that,
(32a, shape 42a) is different for the shape of the shape of the protuberance (100a) of sensor construction portion (100), the protuberance (22a) of the 1st support portion (22) and the protuberance of the 2nd support portion (32,42).
9, sensing device as claimed in claim 2 is characterized in that,
Sensor construction portion (100) has the 1st pin parts (23),
Structure (30,40) has the 2nd pin parts (33,43) and the 1st reach through hole (34,44),
Connecting portion (200) has the 2nd reach through hole (54),
Sell the 1st reach through hole (34,44) of parts (23) break-through structures (30,40) by the 1st of sensor construction portion (100), and be electrically connected the sensing detection portion (11) of sensor construction portion (100) and the electronic component (31,41) of structure (30,40),
The 2nd reach through hole (54) of the 2nd pin parts (33,43) break-through connecting portions (200) by structure (30,40), and the electronic component (31,41) of electric connection structure body (30,40) and connecting portion (200).
10, sensing device as claimed in claim 9 is characterized in that,
The 2nd reach through hole (54) of the 1st pin parts (23) of sensor construction portion (100), the 2nd pin parts (33,43) of structure (30,40) and the 1st interspersed through hole (34,44), connecting portion (200) is configured in respectively on the peripheral part of duplexer.
11, sensing device as claimed in claim 2 is characterized in that,
Structure (30,40) is formed by resin or pottery.
12, sensing device as claimed in claim 2 is characterized in that,
The shell (60) that also has covering structure body (30,40).
13, sensing device as claimed in claim 2 is characterized in that,
Sensing detection portion (11) is the pressure-active element (11) that carries out pressure detection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004022986A JP4069874B2 (en) | 2004-01-30 | 2004-01-30 | Sensor device |
| JP022986/2004 | 2004-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1648627A true CN1648627A (en) | 2005-08-03 |
| CN100390518C CN100390518C (en) | 2008-05-28 |
Family
ID=34879100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100058728A Expired - Fee Related CN100390518C (en) | 2004-01-30 | 2005-01-27 | Sensor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4069874B2 (en) |
| CN (1) | CN100390518C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645004A (en) * | 2013-11-27 | 2014-03-19 | 芜湖通和汽车管路***有限公司 | Pressure sensor chip packaging structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2318222B1 (en) * | 2008-08-29 | 2016-06-22 | Compagnie Générale des Etablissements Michelin | 1-d tire apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2136466Y (en) * | 1992-10-06 | 1993-06-16 | 吉首大学 | Semiconductor pressure transducer |
| CN2359686Y (en) * | 1997-08-08 | 2000-01-19 | 李怀平 | Alarm sensor for tyre underpressure |
| JPH11316166A (en) * | 1998-05-06 | 1999-11-16 | Hitachi Ltd | Semiconductor pressure sensor |
| US6453747B1 (en) * | 2000-01-12 | 2002-09-24 | Peter A. Weise | Hermetic pressure transducer |
| CN1346974A (en) * | 2001-11-16 | 2002-05-01 | 湖南长沙索普测控技术有限公司 | Pressure sensor with high-temp strain nano membrane |
| JP3824964B2 (en) * | 2002-05-17 | 2006-09-20 | 長野計器株式会社 | Absolute pressure sensor |
-
2004
- 2004-01-30 JP JP2004022986A patent/JP4069874B2/en not_active Expired - Fee Related
-
2005
- 2005-01-27 CN CNB2005100058728A patent/CN100390518C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645004A (en) * | 2013-11-27 | 2014-03-19 | 芜湖通和汽车管路***有限公司 | Pressure sensor chip packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005214829A (en) | 2005-08-11 |
| CN100390518C (en) | 2008-05-28 |
| JP4069874B2 (en) | 2008-04-02 |
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