CN103635027A - A circuit board making method and the circuit board - Google Patents
A circuit board making method and the circuit board Download PDFInfo
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- CN103635027A CN103635027A CN201210312364.4A CN201210312364A CN103635027A CN 103635027 A CN103635027 A CN 103635027A CN 201210312364 A CN201210312364 A CN 201210312364A CN 103635027 A CN103635027 A CN 103635027A
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Abstract
The invention discloses a circuit board making method comprising the following steps; providing a multi-layer plate comprising a metal substrate and a first insulation dielectric layer, and a second insulation dielectric layer is arranged between the metal substrate and the first insulation dielectric layer; laser etching the first and second insulation dielectric layers, forming a groove on the multi-layer plate, and the bottom of the groove is the surface of the metal substrate; carrying out electroless plating copper to the laser etched multi-layer plate, and forming a metal circuit in the groove; eliminating the first insulation dielectric layer after the metal circuit is formed, and processing and flattening exposed surfaces of the metal circuit and the second insulation dielectric layer. In the circuit board, the metal circuit is embedded in the groove to improve the bonding force with the second insulation dielectric layer; the exposed surface of the metal circuit is flush with the exposed surface of the second insulation dielectric layer, so the metal circuit can be protected by the second insulation dielectric layer, thereby preventing damages in a follow up circuit board processing step, and improving circuit board yield.
Description
Technical field
The present invention relates to a kind of manufacture method and wiring board of wiring board.
Background technology
The technique of traditional manufacture wiring board circuit is mainly a subtractive to technique, and it is on copper clad laminate surface, and selective remove portion Copper Foil obtains the method for conductive pattern.But along with improving constantly of wiring board wiring density, distance between centers of tracks and the live width of wiring board constantly reduce, traditional subtract into the requirement that technique has been difficult to meet fine and closely woven circuit.In order to meet the requirement of high-density wiring, general half additive process that adopts is manufactured high-density circuit board now.
Figure 1A to Fig. 1 E is for adopting half additive process to make the generalized section of wiring board.As shown in Figure 1A, first provide a resin substrate 100; As shown in Figure 1B, in surface deposition a layer thickness of resin substrate 100, be the copper layer 101 of 0.5 to 1.2 micron; As shown in Figure 1 C, at the surface label last layer dry film 102 of copper layer 101; As shown in Fig. 1 D, dry film 102 is carried out to exposure imaging, produce line pattern; As shown in Fig. 1 E, electro-coppering on copper layer 101 surface that do not covered by dry film 102, forms circuit 103; As shown in Fig. 1 F, with alkali lye, wash away dry film 102; By acid solution, wash away the copper layer being exposed to outside dry film, thereby on resin substrate 100, form circuit 103.
Because half additive process is to make circuit on the surface of resin substrate 100, after washing away dry film 102, circuit is completely outside exposed, easily in the follow-up wiring board course of processing, sustain damage, thereby cause the decline of wiring board yield, the product that especially some line widths is less than to 15 microns, line impairment is very serious, can not share contact horizontal line with traditional subtractive process, must drop into special-purpose contactless horizontal production line and scratch damage to reduce circuit.
Summary of the invention
The embodiment of the present invention provides a kind of manufacture method and wiring board of wiring board, by make metallic circuit in the groove of wiring board, to solve half additive process, to make in high-density circuit board process, circuit is completely outside exposed, easily sustain damage, the problem that causes wiring board yield to decline.In addition, the inventive method also adopts contact horizontal line compatible with traditional subtractive process, does not need to drop into special-purpose contactless horizontal production line, can reduce equipment investment.
A manufacture method for wiring board, comprising:
Multi-layer sheet is provided, and described multi-layer sheet comprises metal substrate and the first insulating medium layer, between described metal substrate and described the first insulating medium layer, is provided with the second insulating medium layer;
Described in laser ablation, the first insulating medium layer and described the second insulating medium layer form groove, the surface that the bottom surface of described groove is described metal substrate on described multi-layer sheet;
Described multi-layer sheet after laser ablation is sunk to copper and electroplate, in described groove, form metallic circuit;
After forming metallic circuit, remove described the first insulating medium layer, the exposed surface of described metallic circuit is processed concordant with the exposed surface of described the second insulating medium layer.
A kind of wiring board, comprise metal substrate and insulating medium layer, described insulating medium layer is formed on the surface of described metal substrate, also offers groove on the surface of described insulating medium layer, the bottom surface of described groove is the surface of described metal substrate, in described groove, is filled with metallic circuit.
A kind of wiring board, comprise central layer and insulating medium layer, between described central layer and described insulating medium layer, be provided with prepreg, on the surface of described insulating medium layer, also offer groove, the bottom surface of described groove is the surface of described prepreg, in described groove, is filled with metallic circuit.
In embodiments of the present invention; described metallic circuit is embedded in groove; improve the adhesion with described the second insulating medium layer; the exposed surface of described metallic circuit is also concordant with the exposed surface of described the second insulating medium layer; make described metallic circuit can access the protection of the second insulating medium layer; avoid sustaining damage in the follow-up wiring board course of processing, improved wiring board yield.Owing to adopting laser-induced thermal etching groove, the embodiment of the present invention can be prepared highdensity wiring board, and line pitch can reach 5 microns, and line width can reach 5 microns.In addition, adopting heavy copper electroplating technology to generate in metallic circuit process, without adopting etching mask, can be directly multi-layer sheet being sunk to copper electroplates, after forming metallic circuit, can remove described the first insulating medium layer by modes such as grindings, technological process is simple.In addition, wiring board prepared by the embodiment of the present invention is after removing metal substrate, and the exposed surface of metallic circuit is concordant with the exposed surface of insulating medium layer, can be for repeatedly pressing, and the high-density circuit board of preparation multilayer.
Accompanying drawing explanation
Figure 1A to Fig. 1 F adopts half additive process to make the generalized section of wiring board;
Fig. 2 is the schematic flow sheet of the manufacture method of 1 one kinds of wiring boards of the embodiment of the present invention;
Fig. 3 A to Fig. 3 D is the generalized section that the embodiment of the present invention 1 is made wiring board;
Fig. 4 is the schematic flow sheet of the manufacture method of 2 one kinds of wiring boards of the embodiment of the present invention;
Fig. 5 A and Fig. 5 B are the generalized sections of the high-density multi-layered wiring board of making in the embodiment of the present invention 2;
Fig. 6 is the schematic flow sheet of the manufacture method of 3 one kinds of wiring boards of the embodiment of the present invention;
Fig. 7 A to Fig. 7 D is the generalized section that the embodiment of the present invention 3 is made wiring board;
Fig. 8 A and Fig. 8 B are the generalized sections of the high-density multi-layered wiring board of making in the embodiment of the present invention 3;
Fig. 9 is the structural representation of 4 one kinds of wiring boards of the embodiment of the present invention;
Figure 10 is the structural representation of 5 one kinds of wiring boards of the embodiment of the present invention;
Figure 11 is the structural representation of 6 one kinds of wiring boards of the embodiment of the present invention.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of wiring board, is applicable to being applied to the making of high-density circuit board.
Below enumerate embodiment, and be elaborated by reference to the accompanying drawings.
Embodiment 1
As shown in Figure 2, a kind of manufacture method of wiring board, comprising:
201, provide multi-layer sheet.As shown in Figure 3A, described multi-layer sheet comprises metal substrate 300 and the first insulating medium layer 301, between described metal substrate 300 and described the first insulating medium layer 301, is provided with the second insulating medium layer 302.
The material of metal substrate can be the metals such as copper, iron or nickel.The material of described the first insulating medium layer can be the ganoid insulating material that is difficult for plated metal copper, such as solder resist material, the application of this material can avoid metallic circuit 305 in groove to interconnect at electroplating process top, if metallic circuit 305 tops interconnect in groove, after being easy to cause having electroplated, be difficult to remove the first insulating medium layer.The material of the second insulating medium layer can be bismaleimide-triazine resin (Bismalimides-triazine, BT), insulation film ABF (Ajinomoto Build-up Film), phenylbenzene cyclobutadiene (Benzocylobutene, BCB), liquid crystal polymer (Liquid Crystal Polymer), polyimides (Polymide, PI), polyvinylether (Poly (phenylene ether)) polytetrafluoroethylene (poly (Tetrafluoroethylene), a kind of material PTFE), in aramid fiber (Aramide), epoxy resin and glass fibre.
202, as shown in Figure 3 B, the first insulating medium layer 301 and described the second insulating medium layer 302 described in laser ablation form groove 303, the surface 304 that the bottom surface of described groove 303 is described metal substrate on described multi-layer sheet.
203, as shown in Figure 3 C, the described multi-layer sheet after laser ablation is sunk to copper and electroplate, in described groove, form metallic circuit 305.The recess width being gone out by laser ablation can be 5 to 12 microns, and the spacing between groove and groove can be 5 to 12 microns.
204, after forming metallic circuit, remove described the first insulating medium layer, the exposed surface of described metallic circuit is processed concordant with the exposed surface of described the second insulating medium layer.As shown in Figure 3 D, the exposed surface 306 of described metallic circuit and the exposed surface 307 of described the second insulating medium layer are concordant.Therefore, be embedded in described the second insulating medium layer in described metallic circuit, only have an exposed surface, itself and described the second insulating medium layer are combined closely, and obtain the protection of described the second insulating medium layer, avoid scratching, and have improved the yield of wiring board.The embodiment of the present invention is in making metallic circuit process, do not use etching mask, directly multi-layer sheet being sunk to copper electroplates, after forming Cu metal line, can remove described the first insulating medium layer by modes such as grindings, so that the exposed surface of described Cu metal line is concordant with the exposed surface of described the second insulating medium layer.
It is to be noted; in order to prepare in multilayer circuit board process follow-up, when chemical etching is removed metal substrate, better protect metallic circuit; can be on metal substrate the nickel of re-plating or chemical plating last layer 1 to 5 micron thickness, to avoid metallic circuit to be subject to etching.Certainly, if metal substrate is nickel, need on metal substrate, not carry out nickel plating.
Embodiment 2
As shown in Figure 4, a kind of manufacture method of wiring board, comprising:
401, provide multi-layer sheet, described multi-layer sheet comprises metal substrate and the first insulating medium layer, between described metal substrate and described the first insulating medium layer, is provided with the second insulating medium layer.
The material of described the first insulating medium layer can be solder resist material, and the material of described metal substrate can be copper, iron or nickel.The material of the second insulating medium layer can be a kind of material in BT, ABF, BCB, liquid crystal polymer, PI, polyvinylether, PTFE, aramid fiber, epoxy resin and glass fibre.
402, the first insulating medium layer and described the second insulating medium layer described in laser ablation form groove, the surface that the bottom surface of described groove is described metal substrate on described multi-layer sheet.
403, the described multi-layer sheet after laser ablation is sunk to copper and electroplate, in described groove, form metallic circuit.
Because the material of the first insulating medium layer is solder resist material, its smooth surface is difficult for deposited copper in heavy copper process, thereby metallic circuit top in groove can not interconnected in electroplating process.Therefore, this step is without using etching mask, can be directly described multi-layer sheet sink to copper plating, in described groove, forms metallic circuit.
404, after forming metallic circuit, remove described the first insulating medium layer, the exposed surface of described metallic circuit is processed concordant with the exposed surface of described the second insulating medium layer.
Concrete, after forming metallic circuit, the exposed surface of the first insulating medium layer and described metallic circuit described in mechanical lapping, to remove described the first insulating medium layer, and makes the exposed surface of described metallic circuit concordant with the exposed surface of described the second insulating medium layer.
405, after removing described the first insulating medium layer, the described metallic circuit place face of take is stitching surface, and described multi-layer sheet and central layer are carried out to pressing.As shown in Figure 5A, the upper surface of central layer 500 is by first prepreg 510 pressing the first multi-layer sheet 501, and the lower surface of central layer 500 is by second prepreg 509 pressing the second multi-layer sheet 502.Described the first multi-layer sheet 501 comprises the first metal substrate 504 and the second insulating medium layer 503, and the first metallic circuit 505 that is positioned at the first groove on described the first multi-layer sheet 501.Described the second multi-layer sheet 502 comprises the second metal substrate 507 and the 3rd edge dielectric layer 506, and the second metallic circuit 508 that is positioned at the second groove on described the second multi-layer sheet 502.
406, after by described multi-layer sheet and central layer pressing, remove described metal substrate.
Can remove described metal substrate by the mode of chemical etching.For example, the material of described metal substrate is nickel, can adopt to take off nickel water and remove described metal substrate.After removing described metal substrate, form high-density circuit board.As shown in Figure 5 B, in the first metallic circuit 505 on high-density circuit board, be embedded in described the second insulating medium layer 503, and its exposed surface is concordant with the exposed surface of described the second insulating medium layer 503, is not vulnerable to external influence and damages.In the second metallic circuit 508 on high-density circuit board, be embedded in described the 3rd insulating medium layer 506, and its exposed surface is concordant with the exposed surface of described the 3rd insulating medium layer 506, is not vulnerable to external influence and damages.
On this basis, this high-density multi-layered wiring board can also carry out further pressing, forms more multi-layered high-density circuit board.
Embodiment 3
As shown in Figure 6, a kind of manufacture method of wiring board, comprising:
601, as shown in Figure 7 A, provide multi-layer sheet, described multi-layer sheet comprises metal substrate 700 and the first insulating medium layer 701, between described metal substrate 700 and described the first insulating medium layer 701, is provided with the second insulating medium layer 702; Described metal substrate 700 comprises the first metal layer 703 and is located at lip-deep described the second metal level 704 of described the first metal layer 703, and described the second metal level 704 is located between described the first metal layer 703 and described the second insulating medium layer 702.
As can be seen from Figure 7A, described the second metal level 704 is located between described the first metal layer 703 and described the first insulating medium layer 701, described the second insulating medium layer 702 is located between described the second metal level 704 and described the first insulating medium layer 701, wherein, the material of described the first metal layer 703 is copper or iron, and the material of described the second metal level 704 is nickel.
Optionally, the material of described the first insulating medium layer 701 is solder resist material.
Optionally, the thickness of described the second metal level 704 is 1 to 5 micron.The thickness of described the second insulating medium layer is 8 to 50 microns.
602, as shown in Figure 7 B, the first insulating medium layer 701 and described the second insulating medium layer 702 described in laser ablation form groove 705 on described multi-layer sheet, and the bottom surface 706 of described groove is the surface of described metal substrate 700.
603, as shown in Fig. 7 C, the described multi-layer sheet after laser ablation is sunk to copper and electroplate, in described groove, form metallic circuit 707.
Because the material of the first insulating medium layer is solder resist material, its smooth surface is difficult for deposited copper in heavy copper process, thereby metallic circuit top in groove can not interconnected in electroplating process.Therefore, this step is without using etching mask, can be directly described multi-layer sheet sink to copper plating, in described groove, forms metallic circuit.
604, as shown in Fig. 7 D, after forming metallic circuit, the exposed surface of the first insulating medium layer 701 and described metallic circuit described in mechanical lapping, to remove described the first insulating medium layer 701, and make the exposed surface 708 of described metallic circuit and the exposed surface 709 of described the second insulating medium layer concordant.
605, after removing described the first insulating medium layer, the described metallic circuit place face of take is stitching surface, and described multi-layer sheet and central layer are carried out to pressing.
As shown in Figure 8 A, concrete, by step 601, prepare two multi-layer sheet to 604, be respectively the first multi-layer sheet 811 and the second multi-layer sheet 812.Described the first multi-layer sheet 811 comprises the first metal layer 804, the second metal level 803 and the second insulating medium layer 802, and the first metallic circuit 809 that is positioned at the first groove on described the first multi-layer sheet 811.Described the second multi-layer sheet 812 comprises the 3rd metal level 808, the 4th metal level 807 and the 4th insulating medium layer 806, and the second metallic circuit 810 that is positioned at the second groove on described the second multi-layer sheet 812.The first multi-layer sheet 811 and the second multi-layer sheet 812 are carried out to pressing with central layer 800.The upper surface of central layer 800 is by first prepreg 801 pressing the first multi-layer sheet 811, and the lower surface of central layer 800 is by second prepreg 805 pressing the second multi-layer sheet 812.
606, after by described multi-layer sheet and central layer pressing, remove described metal substrate.
The described metal substrate of described removal comprises: acid etching is removed the first metal layer of described metal substrate; After removing described the first metal layer, use and take off the second metal level that nickel water etching is removed described metal substrate.Because the material of the first metal layer is copper or iron, easily by acid etching, and the second metal layer material is nickel, is difficult for by acid etching, and metallic circuit (metallic circuit is generally copper wire) is played a protective role.Because nickel is easily taken off nickel water etching, and metallic circuit is not etched, thereby in use, taking off nickel water removes after the second metal level, and the exposed surface of described metallic circuit is concordant with the exposed surface of described the second insulating medium layer, forms high-density multi-layered wiring board.As shown in Figure 8 B, by after first multiple-plate the first metal layer 804 and second multiple-plate the 3rd metal level 808 removals, obtain the high-density multi-layered wiring board after pressing.In the first metallic circuit 809 on high-density circuit board, be embedded in described the second insulating medium layer 802, and its exposed surface is concordant with the exposed surface of described the second insulating medium layer 802, is not vulnerable to external influence and damages.In the second metallic circuit 810 on high-density circuit board, be embedded in described the 4th insulating medium layer 806, and its exposed surface is concordant with the exposed surface of described the 4th insulating medium layer 806, is not vulnerable to external influence and damages.
On this basis, high-density multi-layered wiring board can also carry out further pressing, forms more multi-layered high-density circuit board.
Embodiment 4
As shown in Figure 9, a kind of wiring board, comprise metal substrate 901 and insulating medium layer 902, described insulating medium layer 902 is formed on the surface of described metal substrate 901, on the surface of described insulating medium layer 902, also offer groove 905, the bottom surface of described groove 905 is the surface of described metal substrate 901, in described groove 905, is filled with metallic circuit 904.Described metallic circuit 904 is generally copper wire, is embedded in described groove in it, is not vulnerable to external influence and damages.
Described wiring board for and central layer pressing, and etching removes the metal substrate of described wiring board, is made into high-density multi-layered wiring board.This high-density multi-layered wiring board can also carry out pressing with described wiring board again, forms more multi-layered high-density multi-layered wiring board.
Optionally, the material of described metal substrate comprises copper, iron or nickel, if metal substrate material is nickel, the chemical medicinal liquid of removing metal substrate adopts and takes off nickel water.
Optionally, the material of described insulating medium layer can be bismaleimide-triazine resin (Bismalimides-triazine, BT), insulation film ABF (Ajinomoto Build-up Film), phenylbenzene cyclobutadiene (Benzocylobutene, BCB), liquid crystal polymer (Liquid Crystal Polymer), polyimides (Polymide, PI), polyvinylether (Poly (phenylene ether)) polytetrafluoroethylene (poly (Tetrafluoroethylene), a kind of material PTFE), in aramid fiber (Aramide), epoxy resin and glass fibre.
Optionally, the thickness of described insulating medium layer is 8 to 50 microns.
Embodiment 5
As shown in figure 10, a kind of wiring board, comprise metal substrate 1000 and insulating medium layer 1003, described insulating medium layer 1003 is formed on the surface of described metal substrate 1000, on the surface of described insulating medium layer 1003, also offer groove 1006, the bottom surface of described groove 1006 is the surface of described metal substrate 1000, in described groove 1006, is filled with metallic circuit 1004.Groove 1004 width that laser ablation goes out can be 5 to 12 microns, and the spacing between groove and groove can be 5 to 12 microns.
Described metal substrate 1000 comprises the first metal layer 1001 and is located at lip-deep described the second metal level 1002 of described the first metal layer 1001, described the second metal level 1002 is located between described the first metal layer 1001 and described insulating medium layer 1003, wherein, the material of described the first metal layer is copper or iron, and the material of described the second metal level is nickel.
Optionally, the thickness of described the second metal level 1002 is 1 to 5 micron, and the thickness of described insulating medium layer is 8 to 50 microns.
Described wiring board for and central layer pressing, and etching removes the metal substrate of described wiring board, is made into high-density multi-layered wiring board.Because the material of the first metal layer 1001 is copper or iron, easily by acid etching, and the second metal level 1002 materials are nickel, are difficult for by acid etching, and metallic circuit (being generally copper wire) is played a protective role.Because nickel is easily taken off nickel water etching, and metallic circuit is difficult for being taken off nickel water etching, thereby by taking off nickel water etching, remove after the second metal level 1002, the exposed surface of described metallic circuit is concordant with the exposed surface of described the second insulating medium layer, forms high-density multi-layered wiring board.
Embodiment 6
A kind of wiring board, comprise central layer and insulating medium layer, between described central layer and described insulating medium layer, be provided with prepreg, on the surface of described insulating medium layer, also offer groove, the bottom surface of described groove is the surface of described prepreg, in described groove, is filled with metallic circuit.Described recess width can be 8 to 12 microns, and the spacing between groove and groove can be 8 to 12 microns.
Specifically as shown in figure 11, a kind of wiring board comprises central layer 1100, the first insulating medium layer 1102 and the second insulating medium layer 1104, between described central layer 1100 and described the first insulating medium layer 1102, be provided with the first prepreg 1101, between described central layer 1100 and the second insulating medium layer 1104, be provided with the second prepreg 1103.On the surface of described the first insulating medium layer, also offer the first groove 1105, the bottom surface of described the first groove 1105 is the surface of described the first prepreg, in described the first groove 1105, is filled with metallic circuit.On the surface of described the second insulating medium layer 1104, also offer the second groove 1106, the bottom surface of described the second groove 1106 is the surface of described the second prepreg 1103, in described the second groove 1106, is filled with metallic circuit.
The wiring board that described wiring board can also be again prepared with embodiment 1 or embodiment 2 carries out pressing, obtains highdensity multilayer circuit board.
Manufacture method and the wiring board of a kind of the wiring board above embodiment of the present invention being provided are described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (10)
1. a manufacture method for wiring board, is characterized in that, comprising:
Multi-layer sheet is provided, and described multi-layer sheet comprises metal substrate and the first insulating medium layer, between described metal substrate and described the first insulating medium layer, is provided with the second insulating medium layer;
Described in laser ablation, the first insulating medium layer and described the second insulating medium layer form groove, the surface that the bottom surface of described groove is described metal substrate on described multi-layer sheet;
Described multi-layer sheet after laser ablation is sunk to copper and electroplate, in described groove, form metallic circuit;
After forming metallic circuit, remove described the first insulating medium layer, and the exposed surface of described metallic circuit is processed concordant with the exposed surface of described the second insulating medium layer.
2. the manufacture method of wiring board according to claim 1, it is characterized in that, described metal substrate comprises the first metal layer and is located at lip-deep described the second metal level of described the first metal layer, described the second metal level is located between described the first metal layer and described the second insulating medium layer, wherein, the material of described the first metal layer is copper or iron, and the material of described the second metal level is nickel; The material of described the first insulating medium layer is solder resist material.
3. the manufacture method of wiring board according to claim 1, is characterized in that, the material of described metal substrate is nickel, and the material of described the first insulating medium layer is solder resist material.
4. the manufacture method of wiring board according to claim 1, it is characterized in that, remove described the first insulating medium layer, the exposed surface of described metallic circuit is processed to concordant comprising with the exposed surface of described the second insulating medium layer: the exposed surface of the first insulating medium layer and described metallic circuit described in mechanical lapping, to remove described the first insulating medium layer, and make the exposed surface of described metallic circuit concordant with the exposed surface of described the second insulating medium layer.
5. according to the manufacture method of the wiring board described in claim 2 to 4 any one, it is characterized in that, also comprise:
After removing described the first insulating medium layer, the described metallic circuit place face of take is stitching surface, and described multi-layer sheet and central layer are carried out to pressing;
After by described multi-layer sheet and central layer pressing, remove described metal substrate.
6. the manufacture method of wiring board according to claim 2, is characterized in that, also comprises: after removing described the first insulating medium layer, the described metallic circuit place face of take is stitching surface, and described multi-layer sheet and central layer are carried out to pressing; After by described multi-layer sheet and central layer pressing, remove described metal substrate;
The described metal substrate of described removal comprises: acid etching is removed the first metal layer of described metal substrate; After removing described the first metal layer, use and take off the second metal level that nickel water etching is removed described metal substrate.
7. a wiring board, it is characterized in that, comprise metal substrate and insulating medium layer, described insulating medium layer is formed on the surface of described metal substrate, on the surface of described insulating medium layer, also offer groove, the bottom surface of described groove is the surface of described metal substrate, in described groove, is filled with metallic circuit.
8. wiring board according to claim 7, it is characterized in that, described metal substrate comprises the first metal layer and is located at lip-deep described the second metal level of described the first metal layer, described the second metal level is located between described the first metal layer and described insulating medium layer, wherein, the material of described the first metal layer is copper or iron, and the material of described the second metal level is nickel.
9. wiring board according to claim 7, is characterized in that, the material of described metal substrate is copper, iron or nickel.
10. a wiring board, it is characterized in that, comprise central layer and insulating medium layer, between described central layer and described insulating medium layer, be provided with prepreg, on the surface of described insulating medium layer, also offer groove, the bottom surface of described groove is the surface of described prepreg, in described groove, is filled with metallic circuit.
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| CN201210312364.4A CN103635027B (en) | 2012-08-29 | 2012-08-29 | The manufacture method and wiring board of a kind of wiring board |
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| CN201210312364.4A CN103635027B (en) | 2012-08-29 | 2012-08-29 | The manufacture method and wiring board of a kind of wiring board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技（珠海）有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
| CN108788486A (en) * | 2017-05-05 | 2018-11-13 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor devices and forming method thereof |
| CN114630504A (en) * | 2020-12-10 | 2022-06-14 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| WO2023071446A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Package carrier, preparation method therefor, circuit substrate, package structure, and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4336320A (en) * | 1981-03-12 | 1982-06-22 | Honeywell Inc. | Process for dielectric stenciled microcircuits |
| US5244538A (en) * | 1991-07-26 | 1993-09-14 | Microelectronics And Computer Technology Corporation | Method of patterning metal on a substrate using direct-write deposition of a mask |
| JP2001168481A (en) * | 1999-12-08 | 2001-06-22 | Ibiden Co Ltd | Copper-clad laminate, and circuit substrate for printed wiring board and manufacturing method therefor |
| CN1713799A (en) * | 2004-06-22 | 2005-12-28 | 日东电工株式会社 | Production method of suspension board with circuit |
| US20090178276A1 (en) * | 2008-01-16 | 2009-07-16 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for forming circuit in making printed circuit board |
-
2012
- 2012-08-29 CN CN201210312364.4A patent/CN103635027B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4336320A (en) * | 1981-03-12 | 1982-06-22 | Honeywell Inc. | Process for dielectric stenciled microcircuits |
| US5244538A (en) * | 1991-07-26 | 1993-09-14 | Microelectronics And Computer Technology Corporation | Method of patterning metal on a substrate using direct-write deposition of a mask |
| JP2001168481A (en) * | 1999-12-08 | 2001-06-22 | Ibiden Co Ltd | Copper-clad laminate, and circuit substrate for printed wiring board and manufacturing method therefor |
| CN1713799A (en) * | 2004-06-22 | 2005-12-28 | 日东电工株式会社 | Production method of suspension board with circuit |
| US20090178276A1 (en) * | 2008-01-16 | 2009-07-16 | Fukui Precision Component (Shenzhen) Co., Ltd. | Method for forming circuit in making printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104791734A (en) * | 2015-04-21 | 2015-07-22 | 乐健科技（珠海）有限公司 | Heat sink with embedded circuit, manufacturing method thereof, LED module and manufacturing method thereof |
| CN108788486A (en) * | 2017-05-05 | 2018-11-13 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor devices and forming method thereof |
| CN108788486B (en) * | 2017-05-05 | 2021-05-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device and method of forming the same |
| CN114630504A (en) * | 2020-12-10 | 2022-06-14 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| WO2023071446A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Package carrier, preparation method therefor, circuit substrate, package structure, and electronic device |
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