CN103589994A - Preparation method of evaporation mask plate - Google Patents
Preparation method of evaporation mask plate Download PDFInfo
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- CN103589994A CN103589994A CN201310464801.9A CN201310464801A CN103589994A CN 103589994 A CN103589994 A CN 103589994A CN 201310464801 A CN201310464801 A CN 201310464801A CN 103589994 A CN103589994 A CN 103589994A
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- evaporation
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Abstract
The invention discloses a preparation method of an evaporation mask plate. The preparation method comprises the following steps: filming a core mold; exposing; developing; performing primary electroforming; performing post-treatment 1; performing secondary electroforming; performing post-treatment 2, and is characterized in that the electroforming layer thickness of the primary electroforming is equal to the thickness of a film in the step of filming the core mold; the electroforming layer of the secondary electroforming step is formed on the basis of the electroforming layer of the primary electroforming step and an exposure film formed in the exposure step. According to the evaporation mask plate manufactured by using the method, on the section of the central axes of evaporation holes, the edge lines of the evaporation holes are expanded flaring-shaped; the hole walls of the evaporation holes and the plate face of the mask plate body form an included angle of 30-60 degrees; the shelter of the hole walls of the evaporation holes to an evaporation material can be reduced, no evaporation dead angles exist during the evaporation, and the thickness of the evaporation layer is uniform; when the mask plate of the small-size evaporation holes is manufactured, the size of the evaporation holes can be smaller to improve the resolution of a display.
Description
Technical field
The present invention relates to the preparation method of mask plate for a kind of evaporation, be specifically related to the preparation method of mask plate for a kind of OLED evaporation.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode; OLED) indicating meter has a series of advantages such as independently luminous, low-voltage direct-current drives, entirely solidifies, visual angle is wide, color is abundant, compare with liquid-crystal display, OLED indicating meter does not need backlight, visual angle is large, power is low, its response speed can reach 1000 times of liquid-crystal display, and its manufacturing cost is but lower than the liquid-crystal display of equal resolving power.Therefore, OLED displaying appliance has broad application prospects, and becomes gradually the following 20 years the fastest novel technique of display of growth.
The making of the organic layer material in OLED structure need to be used the mask plate that evaporation is used, tradition is made mask plate by two-sided etch process, the schematic cross-section in mask plate evaporation hole as shown in Figure 1, 1 is the ito surface (one side contacting with ITO deposition substrate) of mask plate, 2 is the evaporation face one side of vapor deposition source (towards) of mask plate, 11 is the evaporation hole of mask plate, the cross section in evaporation hole 11 is calabash shaped, evaporation hole 11 is the bad control of size of the size L in deposition aperture effectively, cause the precision in evaporation hole not high, evaporation hole is difficult to accomplish less, utilize the dead angle of mask plate evaporation hole 12(mask plate of ito surface in evaporate process that two-sided etch process makes simultaneously) locate to form the dead angle of evaporation layer, cause evaporation layer thickness uneven, affect evaporating quality, and when making undersized evaporation hole, utilize etch process to be difficult to evaporation hole to accomplish desired small size.
The present invention proposes the preparation method of mask plate for a kind of evaporation for above problem, solves preferably the above problem.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of method of mask plate for evaporation of making, the evaporation that utilizes this method to make can reduce hole wall the blocking deposition material in evaporation hole in evaporate process with mask plate, and in evaporate process, there is not the dead angle of evaporation, make evaporation layer thickness even, can the size in small size evaporation hole be accomplished less simultaneously.
The invention provides the preparation method of mask plate for a kind of evaporation, comprise core pad pasting → exposure → development → mono-time electroforming → aftertreatment 1 → secondary electroforming → aftertreatment 2, it is characterized in that: the electroformed layer thickness of a described electroforming step equates with the thickness of film described in described core step of membrane sticking, on the basis of the exposed film that the electroformed layer of described secondary electroforming step forms in the electroformed layer of a described electroforming step and described step of exposure, form.
Further, the electroformed layer of secondary electroforming step forms evaporation hole at exposed film place, and on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out.
Further, the electroformed layer of secondary electroforming step forms the body of mask plate, and the plate face of the hole wall in evaporation hole and mask plate body is 30～60 ° of angles.
Further, the electroformed layer thickness of an electroforming step is 3～30 μ m.
Preferably, the electroformed layer thickness of an electroforming step is 5～20 μ m.
Further, the electroformed layer thickness of secondary electroforming step is 8～80 μ m.
Further, aftertreatment 2 steps comprise cleaning, strip step.
Further, strip step is that the electroformed layer of secondary electroforming step is peeled off from the electroformed layer of an electroforming step.
Further, aftertreatment 1 comprises standing or baking.
Further, the standing time is 5～30min, and baking time is set according to specific environment.
Beneficial effect of the present invention is, the evaporation mask plate that utilizes method provided by the invention to make, on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out, the plate face of the hole wall in evaporation hole and mask plate body is 30～60 ° of angles, can reduce hole wall the blocking deposition material in evaporation hole, and in evaporate process, there is not the dead angle of evaporation, the even thickness of evaporation layer, utilizing electrocasting method provided by the invention to make evaporation can also accomplish less by the size in evaporation hole with mask plate simultaneously, to reach the high-resolution requirement of indicating meter.
The aspect that the present invention is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Figure 1 shows that the schematic cross-section in traditional double facet etch making mask plate evaporation hole;
Figure 2 shows that the schematic cross-section after core pad pasting;
Figure 3 shows that exposure schematic cross-section;
Figure 4 shows that the schematic cross-section after development;
Figure 5 shows that the schematic cross-section after electroforming one time;
Figure 6 shows that the schematic cross-section after secondary electroforming;
Figure 7 shows that the schematic cross-section that the electroformed layer of secondary electroforming is peeled off;
Figure 8 shows that the enlarged diagram of 70 parts in Fig. 7;
Fig. 9 and Figure 10 shows that mask plate integral planar structural representation;
Figure 11 shows that the enlarged diagram of 100 parts in Figure 10;
Figure 12 shows that the enlarged diagram of 100 parts in Figure 10;
Figure 13 shows that mask assembly two dimensional structure schematic diagram;
Figure 14 shows that evaporation schematic cross-section;
In Fig. 1,1 is ito surface, and 2 is evaporation face, the 11 evaporation holes that are mask plate, 12 dead angles that are mask plate;
In Fig. 2,20 is core, and 21 is film;
In Fig. 3,30 is exposed film;
In Fig. 4,40 is the core region of exposing after developing;
In Fig. 5,50 is the electroformed layer of an electroforming;
In Fig. 6,60 is the electroformed layer of secondary electroforming, i.e. mask plate body;
In Fig. 7,70 amplify observation part for waiting, 71 is evaporation hole;
In Fig. 8, θ is the hole wall in evaporation hole and the angle of mask plate entity plate face;
In Fig. 9,90 represent that mask plate is whole, and A-A is for treating Anatomical observation direction;
In Figure 10,100 amplify observation part for waiting, 101 is mask pattern;
In Figure 11, B-B is for treating Anatomical observation direction;
In Figure 12, C-C is for treating Anatomical observation direction;
In Figure 13,130 is mask frame;
In Figure 14,141 is deposition substrate, and 142 is support, and 143 is vapor deposition source;
Embodiment
Describe below with reference to accompanying drawings embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
According to embodiments of the invention, shown in figure 2～Fig. 8, the invention provides the preparation method of mask plate for a kind of evaporation, comprise: core pad pasting → exposure → development → mono-time electroforming → aftertreatment 1 → secondary electroforming → aftertreatment 2, electroformed layer 50 thickness of a described electroforming step equate with the thickness of film 21 in described core step of membrane sticking, on the basis of the exposed film 30 that the electroformed layer 60 of described secondary electroforming step forms in the electroformed layer 50 of a described electroforming step and step of exposure, form.
Describe the preparation method of mask plate for evaporation below in detail:
S1, core step of membrane sticking: Figure 2 shows that the schematic cross-section that film 21 is overlayed or is coated to core 20 one sides, described core 20 through processing such as sandblast, cleanings, is removed mandrel surface impurity before step of membrane sticking, makes the one side of core pad pasting totally smooth;
S2, step of exposure: through step of exposure, by the film exposure of default evaporation bore region, as shown in Figure 3,30 is the film (being exposed film) after exposure;
S3, development step: Figure 4 shows that development schematic cross-section, through development step, developing solution and unexposed film reaction, remove unexposed film, exposes core region 40, exposed film 30 continues to retain;
S4, an electroforming step: after an electroforming step, form one deck electroformed layer 50, as shown in Figure 5, the thickness of electroformed layer 50 equates with the thickness of film, and preferably, the thickness of electroformed layer 50 equates with the thickness of film 21;
S5, aftertreatment 1 step: after an electroforming step, carry out aftertreatment 1 step, aftertreatment 1 step can be standing or baking, can make the electroformed layer of twice electroforming have certain bonding force can make again the electroformed layer of secondary electroforming strip down from the electroformed layer of an electroforming by aftertreatment 1 step;
S6, secondary electroforming step: Figure 6 shows that the schematic cross-section after secondary electroforming step, the electroformed layer 60 of secondary electroforming step is the body of mask plate, in secondary electroforming process, the evaporation hole of mask plate forms at exposed film 30 places, the area of the one side that evaporation hole contacts with exposed film 30 is less than the area in exposed film 30 regions, on the cross section at central axis place, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out.
S7, aftertreatment 2 steps: aftertreatment 2 steps comprise peel off, cleaning step, through strip step, the electroformed layer 60 of secondary electroforming step is stripped down from the electroformed layer 50 of an electroforming step, through cleaning step by electroformed layer 60 wash cleans, Figure 7 shows that the schematic cross-section after electroformed layer 60 is peeled off, electroformed layer 60 is mask plate body, and 71 is evaporation hole.
Figure 8 shows that 70 part enlarged diagrams in Fig. 7, the angle theta scope of the plate face of the hole wall in evaporation hole and the body of mask plate 60 is 30～60 °.
According to some embodiments of the present invention, electroformed layer 50 thickness of an electroforming are 3～30 μ m.
According to some embodiments of the present invention, electroformed layer 50 thickness of an electroforming are 5～20 μ m.
According to some embodiments of the present invention, electroformed layer 60 thickness of secondary electroforming are 8～80 μ m, and electroformed layer 60 thickness of for example secondary electroforming are 20 μ m or 30 μ m or 50 μ m or 60 μ m or 75 μ m.
According to some embodiments of the present invention, aftertreatment 1 step comprises standing or baking.
The standing time is 5～30min, and the time of baking arranges according to specific environment.
In an electroforming (S4) and secondary electroforming (S6) step, the concentration parameter of electroforming solution is as follows:
Single nickel salt 220～260g/L
Ferrous sulfate 35～45g/L
Electroforming material is magnetic nickel or nickel-bass alloy material.Nickel-bass alloy material is a kind of in Rhometal, nickel cobalt (alloy), Perminvar.
The additive of electroforming solution comprises:
Stablizer 0.5～5ml/L
Wetting agent 0.5～5ml/L
Agent 0.5～5ml/L walks
Figure 9 shows that the mask plate integral planar structural representation for evaporation that utilizes method provided by the invention to make, evaporation hole is large-sized evaporation mask plate, evaporation comprises mask plate body 60 and is formed on the evaporation hole 71 on mask plate body with mask plate 90, mask plate body 60 is run through in described evaporation hole 71, on the cross section at 71 central axis places, evaporation hole, it is horn-like that the edge line in evaporation hole is the formula of extending out, in Fig. 9 along the schematic cross-section of A-A direction as shown in Figure 7.
Figure 10 shows that the another kind of mask plate integral planar structural representation that utilizes method provided by the invention to make, evaporation hole is undersized evaporation mask plate, evaporation comprises mask plate body 60 with mask plate 90, mask plate body 60 is provided with mask pattern 101, is provided with the evaporation hole 71 arranging with array way in mask pattern 101.
Figure 11 shows that the enlarged diagram of a kind of structure of mask pattern 100 part ito surfaces in Figure 10, in Figure 11, evaporation hole 71 is arranged on mask plate body 60 for the mode of little opening with array, in Figure 11 along the cross section enlarged diagram of B-B direction as shown in Figure 8.
Figure 12 shows that the enlarged diagram of the another kind of structure of mask pattern 100 part ito surfaces in Figure 10, the opening that in Figure 12, evaporation hole 71 is strip, along the cross section enlarged diagram of C-C direction as shown in Figure 8.
According to embodiments of the invention, the present invention also provides a kind of mask assembly, and as shown in figure 13, mask assembly comprises mask frame 130 and mask plate 90 for evaporation described above, and evaporation is fixed on mask frame 130 with mask plate 90.
According to embodiments of the invention, evaporation is fixed on mask frame 130 by laser welding or bonding way with mask plate 90.
Shown in Figure 14, for evaporation schematic diagram, mask assembly is fixed on bracing frame 142, and evaporation is adjacent to deposition substrate 141 with the ito surface of mask plate 90, and the evaporation hole of the organic materials of vapor deposition source 143 transmitting by mask plate is deposited on and in deposition substrate 141, forms predetermined organic material layer.
Although the specific embodiment of the present invention is described in detail with reference to a plurality of illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and within embodiment will drop on spirit and scope.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present invention.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (10)
1. the preparation method of mask plate for an evaporation, comprise core pad pasting → exposure → development → mono-time electroforming → aftertreatment 1 → secondary electroforming → aftertreatment 2, it is characterized in that: the electroformed layer thickness of a described electroforming step equates with the thickness of film described in described core step of membrane sticking, on the basis of the exposed film that the electroformed layer of described secondary electroforming step forms in the electroformed layer of a described electroforming step and described step of exposure, form.
2. the preparation method of mask plate for evaporation according to claim 1, it is characterized in that, the electroformed layer of described secondary electroforming step forms evaporation hole at described exposed film place, on the cross section at central axis place, described evaporation hole, it is horn-like that the edge line in described evaporation hole is the formula of extending out.
3. the preparation method of mask plate for evaporation according to claim 1, is characterized in that, the electroformed layer of described secondary electroforming step forms the body of mask plate, and the hole wall in described evaporation hole and the plate face of described mask plate body are 30～60 ° of angles.
4. the preparation method of mask plate for evaporation according to claim 1, is characterized in that, the electroformed layer thickness of a described electroforming step is 3～30 μ m.
5. the preparation method of mask plate for evaporation according to claim 4, is characterized in that, the electroformed layer thickness of a described electroforming step is 5～20 μ m.
6. the preparation method of mask plate for evaporation according to claim 1, is characterized in that, the electroformed layer thickness of described secondary electroforming step is 8～80 μ m.
7. the preparation method of mask plate for evaporation according to claim 1, is characterized in that, described aftertreatment 2 steps comprise cleaning, strip step.
8. the preparation method of mask plate for evaporation according to claim 7, is characterized in that, described strip step is that the electroformed layer of described secondary electroforming step is peeled off from the electroformed layer of a described electroforming step.
9. the preparation method of mask plate for evaporation according to claim 1, is characterized in that, described aftertreatment 1 comprises standing or baking.
10. the preparation method of mask plate for evaporation according to claim 9, is characterized in that, the described standing time is 5～30min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464801.9A CN103589994A (en) | 2013-10-09 | 2013-10-09 | Preparation method of evaporation mask plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464801.9A CN103589994A (en) | 2013-10-09 | 2013-10-09 | Preparation method of evaporation mask plate |
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| CN103589994A true CN103589994A (en) | 2014-02-19 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110551973A (en) * | 2015-02-10 | 2019-12-10 | 大日本印刷株式会社 | Vapor deposition mask |
| CN110724906A (en) * | 2019-11-21 | 2020-01-24 | 云谷（固安）科技有限公司 | Mask plate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202913046U (en) * | 2012-09-07 | 2013-05-01 | 昆山允升吉光电科技有限公司 | Composited mask plate |
| CN103205685A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Electroforming mask plate |
| CN103205697A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Vapor deposition mask plate and method for producing same |
-
2013
- 2013-10-09 CN CN201310464801.9A patent/CN103589994A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103205685A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Electroforming mask plate |
| CN103205697A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Vapor deposition mask plate and method for producing same |
| CN202913046U (en) * | 2012-09-07 | 2013-05-01 | 昆山允升吉光电科技有限公司 | Composited mask plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110551973A (en) * | 2015-02-10 | 2019-12-10 | 大日本印刷株式会社 | Vapor deposition mask |
| CN110551973B (en) * | 2015-02-10 | 2022-06-14 | 大日本印刷株式会社 | Vapor deposition mask |
| CN110724906A (en) * | 2019-11-21 | 2020-01-24 | 云谷（固安）科技有限公司 | Mask plate and manufacturing method thereof |
| CN110724906B (en) * | 2019-11-21 | 2021-10-22 | 云谷（固安）科技有限公司 | Mask plate and manufacturing method thereof |
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Application publication date: 20140219 |
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