CN103579353B - 一种具有p型辅助埋层的半超结vdmos - Google Patents
一种具有p型辅助埋层的半超结vdmos Download PDFInfo
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- CN103579353B CN103579353B CN201310638191.XA CN201310638191A CN103579353B CN 103579353 B CN103579353 B CN 103579353B CN 201310638191 A CN201310638191 A CN 201310638191A CN 103579353 B CN103579353 B CN 103579353B
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- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000005684 electric field Effects 0.000 description 23
- 238000000034 method Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310638191.XA CN103579353B (zh) | 2013-11-27 | 2013-11-27 | 一种具有p型辅助埋层的半超结vdmos |
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CN201310638191.XA CN103579353B (zh) | 2013-11-27 | 2013-11-27 | 一种具有p型辅助埋层的半超结vdmos |
Publications (2)
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CN103579353A CN103579353A (zh) | 2014-02-12 |
CN103579353B true CN103579353B (zh) | 2016-02-03 |
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CN201310638191.XA Expired - Fee Related CN103579353B (zh) | 2013-11-27 | 2013-11-27 | 一种具有p型辅助埋层的半超结vdmos |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105633153B (zh) * | 2014-11-06 | 2019-01-11 | 比亚迪股份有限公司 | 超级结半导体器件及其形成方法 |
CN107994075B (zh) * | 2016-10-26 | 2020-10-16 | 深圳尚阳通科技有限公司 | 沟槽栅超结器件及其制造方法 |
CN106876439B (zh) * | 2017-02-08 | 2020-04-14 | 上海华虹宏力半导体制造有限公司 | 超结器件及其制造方法 |
CN108054212A (zh) * | 2017-12-22 | 2018-05-18 | 南京方旭智芯微电子科技有限公司 | 超结场效应管及超结场效应管的制造方法 |
CN108231903B (zh) * | 2018-01-24 | 2020-06-02 | 重庆大学 | 一种带软恢复体二极管的超结功率mosfet |
CN109713041B (zh) * | 2018-12-27 | 2022-05-24 | 四川立泰电子有限公司 | 一种适用于超结dmos器件的改良结构 |
CN110224017A (zh) * | 2019-04-30 | 2019-09-10 | 上海功成半导体科技有限公司 | 超结器件结构及其制备方法 |
CN111799323B (zh) * | 2020-07-21 | 2024-06-25 | 苏州华太电子技术股份有限公司 | 超级结绝缘栅双极型晶体管结构及其制作方法 |
CN114759081B (zh) * | 2022-06-14 | 2022-11-04 | 绍兴中芯集成电路制造股份有限公司 | 半导体结构及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102184856A (zh) * | 2011-03-28 | 2011-09-14 | 电子科技大学 | 一种槽型纵向半导体器件的制造方法 |
CN102738214A (zh) * | 2012-06-08 | 2012-10-17 | 电子科技大学 | 一种能够有效防止电荷失衡的超结vdmos器件 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7723172B2 (en) * | 2007-04-23 | 2010-05-25 | Icemos Technology Ltd. | Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102184856A (zh) * | 2011-03-28 | 2011-09-14 | 电子科技大学 | 一种槽型纵向半导体器件的制造方法 |
CN102738214A (zh) * | 2012-06-08 | 2012-10-17 | 电子科技大学 | 一种能够有效防止电荷失衡的超结vdmos器件 |
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