CN103558249B - Based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect - Google Patents
Based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect Download PDFInfo
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- CN103558249B CN103558249B CN201310540705.8A CN201310540705A CN103558249B CN 103558249 B CN103558249 B CN 103558249B CN 201310540705 A CN201310540705 A CN 201310540705A CN 103558249 B CN103558249 B CN 103558249B
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Abstract
The present invention relates to field of non destructive testing, disclose a kind of Infrared Non-destructive Testing method of hardware, particularly based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect.It is characterized in that: utilize By Impulsive Current electric discharge device to pass in hardware by pulse current, electric current can produce at the fault location of hardware and concentrate and stream, form electromagnetic thermal effect and ohm effect, near non-conductive defect, electric energy conversion becomes heat energy, thus fault location temperature is raised, poor with other region formation temperatures of hardware; Utilizing thermal infrared imager to detecting simultaneously, obtaining the surface temperature field distribution of measurand; Finally by analysis thermography, position and the approximate size of defect can be determined.Present system has high, the easy to operate feature of detection efficiency.
Description
Technical field
The present invention relates to field of non destructive testing, disclose a kind of Infrared Non-destructive Testing method of hardware, particularly based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect.
Background technology
Infrared Non-destructive Testing technology is the Dynamic Non-Destruction Measurement that new development is got up, and its principle is heated test specimen to be detected by thermal source, adopts thermal infrared imager to gather the real-time image signal of surface of test piece temperature.In heat transfer process, when test specimen inside exists the defects such as fracture, pore, layering, the heat-conductive characteristic of material can change, and the surface temperature of test specimen produces uneven distribution.By the temperature signal that process gathers, thus test specimen inherent vice information can be judged.The defect such as crackle, unsticking that infrared detection technology can realize existing in metal, nonmetal and compound substance detects, and has noncontact, area of detection is large, speed is fast, the advantage such as on-line checkingi.
In infrared inspection process, generally to treat test block and carry out active heating.Conventional method has hot blast method, infrared radiation lamp irradiation, pulse flash method, ultrasonic action method etc., but these active heated methods all exist respective shortcoming.There is the uneven shortcoming of heating in hot blast method, pulse flash method and ultrasonic action method effects on surface defect and cosmetic bug heating effect good, be conducive to the detection of defect, but unsatisfactory for inherent vice effect.
Pass into pulse current to metal specimen, electric current can produce at the Defect Edge place of hardware concentrates and streams, and current density increases thereupon.Due to electromagnetic thermal effect and ohm effect, near non-conductive Defect Edge, electric energy conversion becomes heat energy, expects and the line heat source having acted on a week near Defect Edge, thus fault location temperature is raised.On the temperature of fault location and hardware, other regions produce temperature difference.
Summary of the invention
The object of the invention is to solve the detection of prior art to metal component surface defect or inherent vice can not reach good result simultaneously, propose a kind of Infrared Non-destructive Testing method of hardware.
For achieving the above object, technical scheme of the present invention is: based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect, it is characterized in that: comprise the following steps,
S01: connect pulse current generating device and tested hardware, and be energized;
S02: pulse current produces at the fault location of hardware and concentrates and stream, and the current density of Defect Edge is increased, electromagnetic thermal effect and ohm effect occur;
S03: be heat energy at Defect Edge electric energy conversion, thus Defect Edge temperature raises, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collected, analyze in thermography whether there is temperature anomaly region, and the quantity in temperature anomaly region and color;
S06: determine defective locations, defects count and degree of injury.
Further, described pulse current generating device comprises the AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch that connect successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
Further, the discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
Further, due to direction of current and defect move towards perpendicular time, electromagnetic thermal effect is the most obvious, therefore need according to the real-time thermography in testing process, and constantly adjustment direct-current discharge electrode position, so that accurately detect defect of metallic member.
Further, according to thickness and the size of tested hardware, current path and strength of current can be regulated by the control system of pulse current generating device.
Further, described pulse current generating device is introduced by low-voltage alternating current power supply, deliver to transformer through pressure regulator, output voltage converts direct current to through rectifier, and charges to energy capacitance set, when trigger element sends high pressure trigger pulse here, discharge switch punctures, and Capacitor banks discharges to tested hardware, makes fault location generation electromagnetic thermal effect and ohm effect of hardware, temperature raises, with poor with other region formation temperatures of hardware.
Compared to prior art, the present invention has following beneficial effect:
1, the present invention utilizes the electromagnetic thermal effect that the fault location at hardware of pulse current produces, and detects in conjunction with infrared detection technology measuring targets, and testing result precision is higher;
2, testing process can not cause damage to hardware to be measured;
3, detection speed is fast, efficiency is high, simple operation.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of the defect of metallic member infrared detection method that the present invention is based on pulse current electromagnetic thermal effect.
Fig. 2 is embodiment of the present invention system topological figure.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is specifically described.
As shown in Figure 1, the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect of the present invention, is characterized in that: comprise the following steps,
S01: connect pulse current generating device and tested hardware, and be energized;
S02: pulse current produces at the fault location of hardware and concentrates and stream, and the current density of Defect Edge is increased, electromagnetic thermal effect and ohm effect occur;
S03: be heat energy at Defect Edge electric energy conversion, thus Defect Edge temperature raises, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collected, analyze in thermography whether there is temperature anomaly region, and the quantity in temperature anomaly region and color;
S06: determine defective locations, defects count and degree of injury.
In order to realize the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect of the present invention, provide the detection system based on the inventive method, described pulse current generating device comprises the AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch that connect successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
The discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
In order to reach best Detection results, due to direction of current and defect move towards perpendicular time, electromagnetic thermal effect is the most obvious, therefore according to the real-time thermography in testing process, constantly need adjust direct-current discharge electrode position, so that accurately detect defect of metallic member; Because the electromagnetic thermal effect of Defect Edge is relevant with the trend of defect, when defect trend is parallel to electrical current direction, the thermal effect at Defect Edge place is very little, when the thermal effect of the Defect Edge vertical with electrical current direction is the most remarkable.
Further, according to thickness and the size of tested hardware, current path and strength of current can be regulated by the control system of pulse current generating device.
Described pulse current generating device is introduced by low-voltage alternating current power supply, transformer is delivered to through pressure regulator, output voltage converts direct current to through rectifier, and to energy capacitance set charging, when trigger element sends high pressure trigger pulse here, discharge switch punctures, Capacitor banks discharges to tested hardware, make fault location generation electromagnetic thermal effect and ohm effect of hardware, temperature raises, with poor with other region formation temperatures of hardware.
It is below specific embodiment.
As shown in Figure 2, pulse current generating device comprises the AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set, discharge switch, trigger element and the control system that are connected; Pulse current generating device is introduced by AC power, delivers to transformer through pressure regulator, and output voltage converts direct current to through bridge rectifier, and DC voltage is charged to energy capacitance set through charging resistor; The main discharge circuit of the present embodiment comprises energy capacitance set, discharge switch and load (hardware to be measured) resistance; The process of Capacitor banks charging is exactly the process of capacitor storage of electrical energy; When trigger element sends high pressure trigger pulse here, discharge switch punctures, and Capacitor banks is to load (hardware to be measured) conductive discharge.
Said detecting system is to the detection method of hardware, first pulse current generating device is connected with tested hardware, then AC power is connected, AC conversion is pulse current by device, and pulse current can produce at the fault location of hardware and concentrate and stream, and forms ohm effect, near non-conductive defect, electric energy conversion becomes heat energy, and fault location temperature is raised, and adopts thermal infrared imager to carry out infrared image acquisition to the surface temperature field of hardware to be measured simultaneously; By the image input computing machine collected, analyze in thermography whether there is temperature anomaly region, and quantity and color, can defective locations be determined, defects count and degree of injury.
Experiment proves that the electromagnetic thermal effect of Defect Edge is relevant with the trend of defect, and when defect trend is parallel to electrical current direction, the thermal effect at Defect Edge place is very little, when the thermal effect of the Defect Edge vertical with electrical current direction is the most remarkable; In testing process, in conjunction with real-time thermography, adjustment direct-current discharge electrode position, makes electrical current direction perpendicular to the trend of defect, controls current path and strength of current simultaneously, namely can reach best Detection results.
During detection, according to thickness, the size of tested hardware, current path and strength of current can be regulated by the control system of pulse current generating device; In testing process, in conjunction with real-time thermography, constantly adjustment direct-current discharge electrode position, reaches optimum detection effect.
It is more than the preferred embodiment of the defect of metallic member infrared detection method that the present invention is based on pulse current electromagnetic thermal effect; all changes done according to technical solution of the present invention; when the function produced does not exceed the scope of technical solution of the present invention, all belong to protection scope of the present invention.
Claims (5)
1., based on a defect of metallic member infrared detection method for pulse current electromagnetic thermal effect, it is characterized in that: comprise the following steps,
S01: connect pulse current generating device and tested hardware, and be energized;
S02: pulse current produces at the fault location of hardware and concentrates and stream, and the current density of Defect Edge is increased, electromagnetic thermal effect and ohm effect occur;
S03: be heat energy at Defect Edge electric energy conversion, thus Defect Edge temperature raises, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collected, analyze in thermography whether there is temperature anomaly region, and the quantity in temperature anomaly region and color; Due to direction of current and defect move towards perpendicular time, electromagnetic thermal effect is the most obvious, therefore need according to the real-time thermography in testing process, and constantly adjustment direct-current discharge electrode position, so that accurately detect defect of metallic member;
S06: determine defective locations, defects count and degree of injury.
2. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 1, is characterized in that: described pulse current generating device comprises the AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch that connect successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
3. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 2, is characterized in that: the discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
4. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 1, it is characterized in that: according to thickness and the size of tested hardware, current path and strength of current can be regulated by the control system of pulse current generating device.
5. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 3, it is characterized in that: described pulse current generating device is introduced by low-voltage alternating current power supply, transformer is delivered to through pressure regulator, output voltage converts direct current to through rectifier, and charge to energy capacitance set, when trigger element sends high pressure trigger pulse here, discharge switch punctures, energy capacitance set is discharged to tested hardware, make fault location generation electromagnetic thermal effect and ohm effect of hardware, temperature raises, with poor with other region formation temperatures of hardware.
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| CN103940852B (en) * | 2014-04-17 | 2016-07-06 | 江苏理工学院 | The defect in conductor magnetic of energy magnetic conduction closes 9 Cr 2 steel using electromagnetic heating excitation detecting device and detection method |
| CN104698036B (en) * | 2015-04-01 | 2017-12-05 | 武汉理工大学 | Vortex thermal imaging imperfection recognition methods based on three dimensional temperature curved surface similarity analysis |
| CN104880486B (en) * | 2015-06-05 | 2018-01-30 | 大连理工大学 | A kind of metallic element crack nondestructive detection means |
| CN105510385A (en) * | 2015-11-29 | 2016-04-20 | 四川大学 | Nondestructive testing apparatus and method for impact damage of component of conductive material |
| CN107655937A (en) * | 2017-08-25 | 2018-02-02 | 南京航空航天大学 | A kind of structural damage monitors in real time and localization method |
| CN107490599B (en) * | 2017-09-29 | 2019-08-20 | 电子科技大学 | A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method |
| CN109374526A (en) * | 2018-10-19 | 2019-02-22 | 江苏盛久变压器有限公司 | A kind of surface detection apparatus of transformer |
| CN111122655B (en) * | 2020-03-05 | 2024-06-07 | 福州大学 | Infrared thermal image nondestructive testing method based on electric pulse heating |
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| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| JP2013178176A (en) * | 2012-02-28 | 2013-09-09 | Sharp Corp | Defect detection method, defect detection device, and method of manufacturing semiconductor substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| JP2013178176A (en) * | 2012-02-28 | 2013-09-09 | Sharp Corp | Defect detection method, defect detection device, and method of manufacturing semiconductor substrate |
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