CN103558249A - Infrared detection method for metal component defects based on pulse-current electromagnetic heat effect - Google Patents
Infrared detection method for metal component defects based on pulse-current electromagnetic heat effect Download PDFInfo
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Abstract
The invention relates to the field of nondestructive inspection, discloses an infrared nondestructive inspection method for a metal component and in particular relates to an infrared detection method for metal component defects based on the pulse-current electromagnetic heat effect. The infrared detection method is characterized in that a high-pulse-current discharging device is used for applying pulse current to the metal component, and the current can be concentrated and also can generate bypass at a defect part of the metal component to form the electromagnetic heat effect and the ohm effect; electric energy is converted into heat energy at a position near to a non-conductive defect, so that the temperature at the defect is risen, and a temperature difference is formed between the defect and other areas of the metal component; furthermore, a thermal infrared imager is used for detecting an object to obtain a surface temperature field distribution of the detected object; the position and a general size of the defect can be finally determined by analyzing a thermogram. A system disclosed by the invention has the characteristics of high detection efficiency and convenience in operation.
Description
Technical field
The present invention relates to field of non destructive testing, disclose a kind of Infrared Non-destructive Testing method of hardware, particularly the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect.
Background technology
Infrared Non-destructive Testing technology is the Dynamic Non-Destruction Measurement that new development is got up, and its principle is by thermal source, test specimen to be detected to be heated, and adopts thermal infrared imager to gather the realtime graphic signal of test specimen surface temperature.In heat transfer process, while there is the defects such as fracture, pore, layering when test specimen inside, the heat-conductive characteristic of material can change, and the surface temperature of test specimen produces uneven distribution.The temperature signal gathering by processing, thus can judge test specimen inherent vice information.Infrared detection technology can be realized the defects such as crackle to existing in metal, nonmetal and compound substance, unsticking and detect, and has noncontact, an advantage such as area of detection is large, speed is fast, online detection.
In infrared detection process, generally to treat test block and carry out active heating.Conventional method has hot blast method, infrared radiation lamp irradiation, pulse flash method, ultrasonic action method etc., but these active heating means all exist shortcoming separately.There is the inhomogeneous shortcoming of heating in hot blast method, pulse flash method and ultrasonic action method effects on surface defect and cosmetic bug heating effect are good, are conducive to the detection of defect, but unsatisfactory for inherent vice effect.
Metal specimen is passed into pulse current, and electric current can produce at the Defect Edge place of hardware to be concentrated and streams, and current density increases thereupon.Due to electromagnetic thermal effect and ohm effect, near non-conductive Defect Edge, electric energy conversion becomes heat energy, expects and near the line heat source that has acted on a week Defect Edge, thereby fault location temperature is raise.On the temperature of fault location and hardware, other regions produce temperature difference.
Summary of the invention
The object of the invention is to solve prior art and can not reach good result to the detection of metal component surface defect or inherent vice simultaneously, proposed a kind of Infrared Non-destructive Testing method of hardware.
For achieving the above object, technical scheme of the present invention is: the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect, is characterized in that: comprise the following steps,
S01: connect pulse current generating device and tested hardware, and energising;
S02: pulse current produces concentrated and streams at the fault location of hardware, increases the current density of Defect Edge, and electromagnetic thermal effect and ohm effect occur;
S03: at Defect Edge electric energy conversion, be heat energy, thereby Defect Edge temperature raise, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collecting, analyze in thermography whether have temperature anomaly region, and the quantity in temperature anomaly region and color;
S06: determine defective locations, defects count and degree of injury.
Further, described pulse current generating device comprises AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch connecting successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
Further, the discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
Further, while moving towards perpendicular due to direction of current and defect, electromagnetic thermal effect is the most obvious, thus need constantly adjust direct-current discharge electrode position according to the real-time thermography in testing process, so that accurately detect defect of metallic member.
Further, according to the thickness of tested hardware and size, can regulate current path and strength of current by the control system of pulse current generating device.
Further, described pulse current generating device is introduced by low-voltage alternating current power supply, through pressure regulator, deliver to transformer, output voltage converts direct current to through rectifier, and charges to energy capacitance set, when trigger element is sent high pressure trigger pulse here, discharge switch punctures, and capacitor group is discharged to tested hardware, makes fault location generation electromagnetic thermal effect and ohm effect of hardware, temperature raises, with poor with other region formation temperatures of hardware.
Compared to prior art, the present invention has following beneficial effect:
1, the present invention utilizes the electromagnetic thermal effect that the fault location at hardware of pulse current produces, and in conjunction with infrared detection technology, object under test is detected, and testing result precision is higher;
2, testing process can not cause damage to hardware to be measured;
3, detection speed is fast, efficiency is high, simple operation.
Accompanying drawing explanation
Fig. 1 is the process flow diagram that the present invention is based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect.
Fig. 2 is embodiment of the present invention system topological figure.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is specifically described.
As shown in Figure 1, the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect of the present invention, is characterized in that: comprise the following steps,
S01: connect pulse current generating device and tested hardware, and energising;
S02: pulse current produces concentrated and streams at the fault location of hardware, increases the current density of Defect Edge, and electromagnetic thermal effect and ohm effect occur;
S03: at Defect Edge electric energy conversion, be heat energy, thereby Defect Edge temperature raise, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collecting, analyze in thermography whether have temperature anomaly region, and the quantity in temperature anomaly region and color;
S06: determine defective locations, defects count and degree of injury.
In order to realize the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect of the present invention, detection system based on the inventive method is provided, and described pulse current generating device comprises AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch connecting successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
The discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
In order to reach best detection effect, while moving towards perpendicular due to direction of current and defect, electromagnetic thermal effect is the most obvious, thus need constantly adjust direct-current discharge electrode position according to the real-time thermography in testing process, so that accurately detect defect of metallic member; Because the electromagnetic thermal effect of Defect Edge is relevant with the trend of defect, when defect trend is parallel to electrical current direction, the thermal effect at Defect Edge place is very little, when the thermal effect of the Defect Edge vertical with electrical current direction the most remarkable.
Further, according to the thickness of tested hardware and size, can regulate current path and strength of current by the control system of pulse current generating device.
Described pulse current generating device is introduced by low-voltage alternating current power supply, through pressure regulator, deliver to transformer, output voltage converts direct current to through rectifier, and to energy capacitance set charging, when trigger element is sent high pressure trigger pulse here, discharge switch punctures, capacitor group is discharged to tested hardware, the fault location generation electromagnetic thermal effect and ohm effect that make hardware, temperature raises, with poor with other region formation temperatures of hardware.
It is below specific embodiment.
As shown in Figure 2, pulse current generating device comprises AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set, discharge switch, trigger element and the control system being connected; Pulse current generating device is introduced by AC power, through pressure regulator, delivers to transformer, and output voltage converts direct current to through bridge rectifier, and DC voltage is charged to energy capacitance set through charging resistor; The main discharge circuit of the present embodiment comprises energy capacitance set, discharge switch and load (hardware to be measured) resistance; The process of capacitor group charging is exactly the process of capacitor stores electric energy; When trigger element is sent high pressure trigger pulse here, discharge switch punctures, and capacitor group is to load (hardware to be measured) conductive discharge.
The detection method of said detecting system to hardware, first pulse current generating device is connected with tested hardware, then connect AC power, device is converted into pulse current by alternating current, and pulse current can produce concentrated and stream at the fault location of hardware, forms ohm effect, near non-conductive defect, electric energy conversion becomes heat energy, and fault location temperature is raise, and adopts thermal infrared imager to carry out infrared image acquisition to the surface temperature field of hardware to be measured simultaneously; By the image input computing machine collecting, analyze in thermography whether have temperature anomaly region, and quantity and color, can determine defective locations, defects count and degree of injury.
Experimental results show that the electromagnetic thermal effect of Defect Edge is relevant with the trend of defect, when defect trend is parallel to electrical current direction, the thermal effect at Defect Edge place is very little, when the thermal effect of the Defect Edge vertical with electrical current direction the most remarkable; In testing process, adjust direct-current discharge electrode position in conjunction with real-time thermography, make electrical current direction perpendicular to the trend of defect, control current path and strength of current simultaneously, can reach best detection effect.
During detection, according to the thickness of tested hardware, size, can regulate current path and strength of current by the control system of pulse current generating device; In testing process, constantly adjust direct-current discharge electrode position in conjunction with real-time thermography, reach optimum detection effect.
It is more than the preferred embodiment that the present invention is based on the defect of metallic member infrared detection method of pulse current electromagnetic thermal effect; all changes of doing according to technical solution of the present invention; when the function producing does not exceed the scope of technical solution of the present invention, all belong to protection scope of the present invention.
Claims (6)
1. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect, is characterized in that: comprises the following steps,
S01: connect pulse current generating device and tested hardware, and energising;
S02: pulse current produces concentrated and streams at the fault location of hardware, increases the current density of Defect Edge, and electromagnetic thermal effect and ohm effect occur;
S03: at Defect Edge electric energy conversion, be heat energy, thereby Defect Edge temperature raise, poor with other region formation temperatures of hardware;
S04: adopt thermal infrared imager to carry out real-time infrared image collection to the surface temperature field of hardware to be measured;
S05: by the image input computing machine collecting, analyze in thermography whether have temperature anomaly region, and the quantity in temperature anomaly region and color;
S06: determine defective locations, defects count and degree of injury.
2. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 1, is characterized in that: described pulse current generating device comprises AC power, pressure regulator, stepup transformer, rectifier, energy capacitance set and the discharge switch connecting successively; Described pulse current generating device also comprises a control system; Described control system is connected with pressure regulator, stepup transformer, rectifier, energy capacitance set and discharge switch respectively.
3. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 2, is characterized in that: the discharge switch of described pulse current generating device connects tested hardware, thermal infrared imager and computing machine successively; Described discharge switch is also connected with trigger element.
4. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 1, it is characterized in that: while moving towards perpendicular due to direction of current and defect, electromagnetic thermal effect is the most obvious, therefore need be according to the real-time thermography in testing process, constantly adjust direct-current discharge electrode position, so that accurately detect defect of metallic member.
5. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 1, it is characterized in that: according to the thickness of tested hardware and size, can regulate current path and strength of current by the control system of pulse current generating device.
6. the defect of metallic member infrared detection method based on pulse current electromagnetic thermal effect according to claim 3, it is characterized in that: described pulse current generating device is introduced by low-voltage alternating current power supply, through pressure regulator, deliver to transformer, output voltage converts direct current to through rectifier, and charge to energy capacitance set, when trigger element is sent high pressure trigger pulse here, discharge switch punctures, capacitor group is discharged to tested hardware, make fault location generation electromagnetic thermal effect and ohm effect of hardware, temperature raises, poor with other region formation temperatures of hardware.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103940852A (en) * | 2014-04-17 | 2014-07-23 | 江苏理工学院 | Magnetically sealed electromagnetism thermal excitation conductor defect detection device capable of magnetizing and detection method |
| CN104698036A (en) * | 2015-04-01 | 2015-06-10 | 武汉理工大学 | Eddy current thermal imaging defect recognition method based on three-dimensional temperature curved surface similarity analysis |
| CN104880486A (en) * | 2015-06-05 | 2015-09-02 | 大连理工大学 | Nondestructive testing method and device for crack of metal part |
| CN105510385A (en) * | 2015-11-29 | 2016-04-20 | 四川大学 | Nondestructive testing apparatus and method for impact damage of component of conductive material |
| CN107490599A (en) * | 2017-09-29 | 2017-12-19 | 电子科技大学 | A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method |
| CN107655937A (en) * | 2017-08-25 | 2018-02-02 | 南京航空航天大学 | A kind of structural damage monitors in real time and localization method |
| CN109374526A (en) * | 2018-10-19 | 2019-02-22 | 江苏盛久变压器有限公司 | A kind of surface detection apparatus of transformer |
| CN111122655A (en) * | 2020-03-05 | 2020-05-08 | 福州大学 | Infrared thermal image nondestructive testing method based on electric pulse heating |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| JP2013178176A (en) * | 2012-02-28 | 2013-09-09 | Sharp Corp | Defect detection method, defect detection device, and method of manufacturing semiconductor substrate |
-
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| JP2013178176A (en) * | 2012-02-28 | 2013-09-09 | Sharp Corp | Defect detection method, defect detection device, and method of manufacturing semiconductor substrate |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103940852A (en) * | 2014-04-17 | 2014-07-23 | 江苏理工学院 | Magnetically sealed electromagnetism thermal excitation conductor defect detection device capable of magnetizing and detection method |
| CN104698036A (en) * | 2015-04-01 | 2015-06-10 | 武汉理工大学 | Eddy current thermal imaging defect recognition method based on three-dimensional temperature curved surface similarity analysis |
| CN104880486A (en) * | 2015-06-05 | 2015-09-02 | 大连理工大学 | Nondestructive testing method and device for crack of metal part |
| CN105510385A (en) * | 2015-11-29 | 2016-04-20 | 四川大学 | Nondestructive testing apparatus and method for impact damage of component of conductive material |
| CN107655937A (en) * | 2017-08-25 | 2018-02-02 | 南京航空航天大学 | A kind of structural damage monitors in real time and localization method |
| CN107490599A (en) * | 2017-09-29 | 2017-12-19 | 电子科技大学 | A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method |
| CN107490599B (en) * | 2017-09-29 | 2019-08-20 | 电子科技大学 | A kind of leaded steel multilayer material debonding defect recurrent pulse thermal imaging testing method |
| CN109374526A (en) * | 2018-10-19 | 2019-02-22 | 江苏盛久变压器有限公司 | A kind of surface detection apparatus of transformer |
| CN111122655A (en) * | 2020-03-05 | 2020-05-08 | 福州大学 | Infrared thermal image nondestructive testing method based on electric pulse heating |
| CN111122655B (en) * | 2020-03-05 | 2024-06-07 | 福州大学 | Infrared thermal image nondestructive testing method based on electric pulse heating |
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