CN103551957B - Single side polishing machine - Google Patents
Single side polishing machine Download PDFInfo
- Publication number
- CN103551957B CN103551957B CN201310534409.7A CN201310534409A CN103551957B CN 103551957 B CN103551957 B CN 103551957B CN 201310534409 A CN201310534409 A CN 201310534409A CN 103551957 B CN103551957 B CN 103551957B
- Authority
- CN
- China
- Prior art keywords
- cylinder
- single side
- polishing machine
- side polishing
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 27
- 229910052573 porcelain Inorganic materials 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a kind of single side polishing machine, comprise: casing, be arranged on dumping in described casing, grind platen, cylinder and electric rotating machine, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine control described grinding platen knee-action and rotation respectively, and the inside of described grinding platen is provided with center cylinder.The mode that the present invention adopts center cylinder to pressurize makes the bottom of grinding platen produce a certain amount of deflection, thus improves the uniformity of wafer thickness.
Description
Technical field
The present invention relates to polishing machine, particularly a kind of single side polishing machine.
Background technology
During semiconductor wafer (as silicon chip, GaAs, germanium wafer, sapphire, indium phosphide etc.) polishing, the flatness of monolithic polishing machine polishing disk controls to be the key technology having influence on wafer polishing precision.Current single side polishing machine, due to polishing disk and grinding upper disc, operationally different radii linear velocity is different, only pressurizes by single plane, causes inside and outside variable thickness to cause, affects wafer quality.
Summary of the invention
The invention provides a kind of single side polishing machine, the problem that during to overcome single side polishing machine polished wafer in prior art, variable thickness causes.
For solving the problems of the technologies described above, the invention provides a kind of single side polishing machine, comprise: casing, be arranged on dumping in described casing, grind platen, cylinder and electric rotating machine, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine control described grinding platen knee-action and rotation respectively, and the inside of described grinding platen is provided with center cylinder.
As preferably, described in dump and be provided with multiple rotary cylinder around.
As preferably, described grinding platen also comprises: porcelain dish, top board, take over a business and outer shroud, wherein, described in take over a business to be arranged at the top of described outer shroud and affixed with described cylinder, center cylinder be arranged at described outer shroud center and and top plate contact, described porcelain dish is fixed on bottom outer shroud.
As preferably, described in take over a business in be provided with the air inlet corresponding with described center cylinder.
As preferably, described grinding platen is provided with two groups.
As preferably, described casing is also provided with control panel.
Compared with prior art, the present invention has the following advantages: the mode that the present invention adopts center cylinder to pressurize makes the bottom of grinding platen produce a certain amount of deflection, thus improves the uniformity of wafer thickness.
Accompanying drawing explanation
Fig. 1 is the front view of single side polishing machine in the embodiment of the invention;
Fig. 2 is the structural representation of the grinding platen of single side polishing machine in the embodiment of the invention;
Fig. 3 is the rearview of single side polishing machine in the embodiment of the invention.
In figure: 10-casing, 20-dumps, 30-grinds platen, 301-center cylinder, 302-take over a business, 303-top board, 304-porcelain dish, 305-outer shroud, 306-air inlet, 40-cylinder, 50-rotary cylinder, 60-control panel.
Detailed description of the invention
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.It should be noted that, accompanying drawing of the present invention all adopts the form of simplification and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1 ~ 3, single side polishing machine of the present invention, comprise: casing 10, be arranged in described casing 10 dump 20, grinding platen 30, cylinder 40 and electric rotating machine, dump above 20 described in described grinding platen 30 is arranged on, described cylinder 40 and electric rotating machine control described grinding platen 30 knee-action and rotation respectively, and the inside of described grinding platen 30 is provided with center cylinder 301.Particularly, described electric rotating machine rotates for controlling described grinding platen 30, described cylinder 40 controls described grinding platen 30 and rises or decline, and center cylinder 301 works when described grinding platen 30 pushes down wafer, make to produce deflection bottom grinding platen 30, and then make the center of wafer consistent with the grinding thickness of surrounding.Therefore, the mode that the present invention adopts center cylinder 301 to pressurize makes the bottom of grinding platen 30 produce a certain amount of deflection, thus improves the uniformity of wafer thickness.
Continue referring to Fig. 1 ~ 3, as preferably, described in dump around 20 and be provided with multiple rotary cylinder 50, for 20 rotations of dumping described in controlling, further, described grinding platen 30 is provided with two groups, and polishing while of can carrying out multiple wafer, enhances productivity.
Please emphasis with reference to Fig. 2, described grinding platen 30 also comprises: porcelain dish 304, top board 303, take over a business 302 and outer shroud 305, wherein, describedly take over a business 302 to be arranged at the top of described outer shroud 305 and affixed with described cylinder 40, center cylinder 301 is arranged at described outer shroud 305 center and contacts with top board 303, and described porcelain dish 304 is fixed on bottom outer shroud 305.Further, take over a business described in 302 and be provided with the air inlet 306 corresponding with described center cylinder 301.As shown in phantom in Figure 2, when grinding platen 30 and working, cylinder 40 drives the action downwards of grinding platen 30, center cylinder 301 action, by the action of top board 303 pairs of disks 304, disk 304 is made to produce certain deflection (as shown in dashed line in figure 2), guarantee to dump 20 and grinding platen 30 when rotating, the polished amount of center wafer and surrounding, thus the uniformity improving wafer thickness.
Please refer to Fig. 3, described casing 10 is also provided with control panel 60, for regulating the various parameters in described single side polishing machine, and described single side polishing machine action can be monitored by control panel 60.
In sum, single side polishing machine of the present invention, comprise: casing 10, be arranged in described casing 10 dump 20, grinding platen 30, cylinder 40 and electric rotating machine, dump above 20 described in described grinding platen 30 is arranged on, described cylinder 40 and electric rotating machine control described grinding platen 30 knee-action and rotation respectively, and the inside of described grinding platen 30 is provided with center cylinder 301.The mode that the present invention adopts center cylinder 301 to pressurize makes the bottom of grinding platen 30 produce a certain amount of deflection, thus improves the uniformity of wafer thickness.
Obviously, those skilled in the art can carry out various change and modification to invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (5)
1. a single side polishing machine, it is characterized in that, comprise: casing, be arranged on dumping in described casing, grind platen, cylinder and electric rotating machine, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine control described grinding platen knee-action and rotation respectively, and the inside of described grinding platen is provided with center cylinder; Described grinding platen also comprises: porcelain dish, top board, take over a business and outer shroud, wherein, described in take over a business to be arranged at the top of described outer shroud and affixed with described cylinder, center cylinder be arranged at described outer shroud center and and top plate contact, described porcelain dish is fixed on bottom outer shroud.
2. single side polishing machine as claimed in claim 1, is characterized in that, described in dump and be provided with multiple rotary cylinder around.
3. single side polishing machine as claimed in claim 1, is characterized in that, described in take over a business in be provided with the air inlet corresponding with described center cylinder.
4. single side polishing machine as claimed in claim 1, it is characterized in that, described grinding platen is provided with two groups.
5. single side polishing machine as claimed in claim 1, is characterized in that, described casing is also provided with control panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534409.7A CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534409.7A CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103551957A CN103551957A (en) | 2014-02-05 |
| CN103551957B true CN103551957B (en) | 2016-04-20 |
Family
ID=50006394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310534409.7A Active CN103551957B (en) | 2013-11-01 | 2013-11-01 | Single side polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103551957B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041721B (en) * | 2016-07-26 | 2019-01-08 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of upper lower burrs self-balancing mechanism of grinder or polishing machine |
| CN114871941B (en) * | 2022-04-25 | 2024-04-05 | 季华实验室 | Polishing head and polishing machine |
| CN116175305B (en) * | 2023-04-26 | 2023-07-04 | 北京特思迪半导体设备有限公司 | Platen structure for processing flat workpiece, apparatus and attitude control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400548A (en) * | 1992-07-23 | 1995-03-28 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for manufacturing semiconductor wafers having deformation ground in a defined way |
| CN1271306A (en) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | Wafer processing apparatus |
| CN201632921U (en) * | 2010-01-28 | 2010-11-17 | 湖南永创机电设备有限公司 | High-accuracy oversized single side polishing machine |
| CN203003663U (en) * | 2012-11-30 | 2013-06-19 | 长沙永凯科技设备有限公司 | Dual-driven single-sided polishing machine |
| CN203003626U (en) * | 2012-12-10 | 2013-06-19 | 长沙永凯科技设备有限公司 | High-precision super large size single face polishing machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5180557B2 (en) * | 2007-10-31 | 2013-04-10 | 株式会社ディスコ | Processing equipment |
-
2013
- 2013-11-01 CN CN201310534409.7A patent/CN103551957B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400548A (en) * | 1992-07-23 | 1995-03-28 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for manufacturing semiconductor wafers having deformation ground in a defined way |
| CN1271306A (en) * | 1997-09-26 | 2000-10-25 | Memc电子材料有限公司 | Wafer processing apparatus |
| CN201632921U (en) * | 2010-01-28 | 2010-11-17 | 湖南永创机电设备有限公司 | High-accuracy oversized single side polishing machine |
| CN203003663U (en) * | 2012-11-30 | 2013-06-19 | 长沙永凯科技设备有限公司 | Dual-driven single-sided polishing machine |
| CN203003626U (en) * | 2012-12-10 | 2013-06-19 | 长沙永凯科技设备有限公司 | High-precision super large size single face polishing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103551957A (en) | 2014-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215129 No. 39 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant after: SUZHOU CHENXUAN PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 3 factory building, Shishan industrial corridor, No. 855, Zhujianglu Road hi tech Zone, Jiangsu, Suzhou 215129 Applicant before: SUZHOU CHENXUAN PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Hu Xiaohui Inventor after: Zhang Weiguo Inventor after: Li Qiqing Inventor before: Zhang Weiguo Inventor before: Li Qiqing |
|
| CB03 | Change of inventor or designer information |