CN204149028U - A kind of lapping device - Google Patents
A kind of lapping device Download PDFInfo
- Publication number
- CN204149028U CN204149028U CN201420599765.7U CN201420599765U CN204149028U CN 204149028 U CN204149028 U CN 204149028U CN 201420599765 U CN201420599765 U CN 201420599765U CN 204149028 U CN204149028 U CN 204149028U
- Authority
- CN
- China
- Prior art keywords
- abrasive disk
- retractor device
- grinding
- outer grinding
- grinding dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model provides a kind of lapping device, at least comprises: abrasive disk in plate-like; Be sheathed on the ring-type outer grinding dish outside described interior abrasive disk; Described interior abrasive disk is connected to the lower end of the first retractor device controlling described interior abrasive disk lifting; Described outer grinding dish is connected to the lower end of the second retractor device controlling the lifting of described outer grinding dish; The upper end of described first retractor device is connected to the first motor controlling described interior abrasive disk rotation, and the upper end of described second retractor device is connected to the second motor controlling the rotation of described outer grinding dish.Abrasive disk is divided into inside and outside two parts by lapping device of the present utility model, and the lifting of inside and outside abrasive disk is controlled respectively with compressed air, utilize that inside and outside abrasive disk is different from the contact area of grinding pad, grinding rate is different regulates grinding rate, make grinding rate keep stable, improve the uniformity of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of lapping device.
Background technology
Along with developing rapidly of high-tech electronic consumption market, wafer manufacturing requires more and more higher device density, more and more less live width, and thereupon, the requirement of crystal column surface planarization is more and more higher.Cmp (Chemical MechanicalPolishing, CMP) be the most frequently used flattening wafer surface processing method of current semiconductor manufacturing industry, cmp completes planarization by chemical reaction process and mechanical grinding process acting in conjunction.
As shown in Figure 1, the capital equipment of cmp comprises: grinding pad adjuster 1, grinding table 2, grinding pad 3 (Pad), lapping liquid feeder 4, grinding head 5.Grinding pad 3 is arranged on grinding table 2; The lower end of grinding head 5 is equipped with wafer 6 to be ground, and described wafer 6 to be ground contacts with grinding pad 3; Lapping liquid feeder 4 is for providing lapping liquid (Slurry) to grinding pad 3 surface; The lower end of grinding pad adjuster 1 is equipped with abrasive disk 12 (Disk), for repairing the surface of grinding pad 3, improves the uniformity that lapping liquid distributes on described grinding pad 3 simultaneously; Lapping liquid flows to the surface of grinding pad 3 with certain speed, grinding head 5 applies certain pressure to wafer 6 to be ground, to be ground of wafer 6 to be ground is made to produce Mechanical Contact with grinding pad 3, in process of lapping, grinding head 5, grinding pad adjuster 1, grinding table 2 rotate with certain speed respectively, removed the film on wafer 6 surface to be ground by machinery and chemical action, thus reach the object of wafer 6 surface planarisation to be ground.The surface of usual grinding pad 3 has many concaveconvex structures helping to grind, the therefore degree of roughness of the surface presentation 1 μm ~ 2 μm of grinding pad 3.General chemical-mechanical grinding device is after several pieces wafers of grinding, and the original rough surface of grinding pad 3 will become smooth, so that the grainding capacity of grinding pad 3 reduces, and the uniformity of simultaneous grinding also can not get ensureing.Simultaneously, the material in process of lapping, wafer 6 to be ground is polished can remain in grinding pad 3 surface, and meanwhile, some the lapping liquid pair material in lapping liquid also can remain in grinding pad 3 surface, these granular impurity will make abrasive characteristic change, and then affect grinding effect.Therefore, need the moment to keep the degree of roughness on grinding pad 3 surface consistent, get rid of the residuals dropping on grinding pad 3 surface in time simultaneously.And grinding pad adjuster 1 is just for regulating grinding pad 3, the surface recovery of grinding pad 3 can be made to become rough surface and keep the stability of its degree of roughness, striking off the residuals on grinding pad 3, guarantee Grinding Quality simultaneously.
Grinding pad adjuster 1 mainly comprises passive grinding pad adjuster arm 11 and for keeping grinding pad 3 surface roughness and removing the lapping device 12 of grinding pad 3 remained on surface material, as shown in Figure 2, described lapping device 12 is a discoid abrasive disk 12, its surface inserting has high rigidity abrasive article, and the Mechanical Contact on these high rigidity mill part and grinding pad 3 surface makes grinding pad 3 surface keep certain roughness just.The surface ratio of new abrasive disk surface grinding part is sharper, and correspondingly grinding rate is also very fast, but along with the increase of abrasive disk service time, its high rigidity abrasive article can wear and tear, and its finishing effect for grinding pad 3 surface will reduce, and grinding rate is greatly affected.The grinding rate of fast, the old abrasive disk of the grinding rate of new abrasive disk is slow, and the grinding rate in production process will certainly be caused unstable, and the uniformity of grinding also can not get ensureing.In addition, the grinding rate of old abrasive disk is slow, is very disadvantageous for large-scale industrial production, but if the old abrasive disk of wearing and tearing is abandoned need not; the very large wasting of resources could be caused.
Therefore, how when not affecting grinding rate, minimizing cost and becoming those skilled in the art's problem demanding prompt solution.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of lapping device, for solving the problem such as grinding rate instability, lack of homogeneity in prior art.
For achieving the above object and other relevant objects, the utility model provides a kind of lapping device, and described lapping device at least comprises: abrasive disk in plate-like; Be sheathed on the ring-type outer grinding dish outside described interior abrasive disk; Described interior abrasive disk is connected to the lower end of the first retractor device controlling described interior abrasive disk lifting; Described outer grinding dish is connected to the lower end of the second retractor device controlling the lifting of described outer grinding dish; The upper end of described first retractor device is connected to the first motor controlling described interior abrasive disk rotation, and the upper end of described second retractor device is connected to the second motor controlling the rotation of described outer grinding dish.
Preferably, described interior abrasive disk is disc-shaped structure, and described outer grinding dish is circular ring.
Preferably, the external diameter of described interior abrasive disk is consistent with the internal diameter of described outer grinding dish.
Preferably, described first retractor device and described second retractor device be there is the hollow telescopic shaft of confined space, outside that described second retractor device is sheathed on described first retractor device.
More preferably, described first retractor device and described second retractor device realize being connected respectively by vent line and compressed air generator, are realized stretching, extension or the contraction of described first retractor device and described second retractor device by the pressure difference passing into gas respectively.
Preferably, described interior abrasive disk and described outer grinding dish comprise basal disc respectively and are arranged at the mill part of described basal disc lower surface.
More preferably, the pedestal material of described interior abrasive disk and described outer grinding dish is steel.
More preferably the mill part material of described interior abrasive disk and described outer grinding dish is diamond.
Preferably, the material of described first retractor device and described second retractor device is stainless steel.
Preferably, described interior abrasive disk and described outer grinding disc spins direction consistent.
As mentioned above, grinding pad adjuster of the present utility model, has following beneficial effect:
Abrasive disk is divided into inside and outside two parts by lapping device of the present utility model, and the lifting of inside and outside abrasive disk is controlled respectively with compressed air, utilize that inside and outside abrasive disk is different from the contact area of grinding pad, grinding rate is different regulates grinding rate, make grinding rate keep stable, improve the uniformity of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.
Accompanying drawing explanation
Fig. 1 is shown as chemical-mechanical grinding device schematic diagram of the prior art.
Fig. 2 is shown as abrasive disk schematic diagram of the prior art.
Fig. 3 is shown as lapping device schematic diagram of the present utility model.
Fig. 4 is shown as the abrasive disk schematic diagram of lapping device of the present utility model.
Element numbers explanation
1 grinding pad adjuster
11 grinding pad adjuster arms
12 lapping devices
Abrasive disk in 1211
1212 outer grinding dishes
1213 basal discs
1214 mill parts
1221 first retractor devices
1222 second retractor devices
1231 first motors
1232 second motors
1241 first compressed air generators
1242 second compressed air generators
1251 first vent lines
1252 second vent lines
2 grinding tables
3 grinding pads
4 lapping liquid feeders
5 grinding heads
6 wafers to be ground
Detailed description of the invention
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art the content disclosed by this description can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by detailed description of the invention different in addition, and the every details in this description also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.
Refer to Fig. 3 and Fig. 4.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present utility model in a schematic way, then only the assembly relevant with the utility model is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
As shown in Figure 3, the utility model provides a kind of lapping device 12, and described lapping device 12 at least comprises: abrasive disk 1211 in plate-like; Be sheathed on the ring-type outer grinding dish 1212 outside described interior abrasive disk 1211; Described interior abrasive disk 1211 is connected to the lower end controlling the first retractor device 1221 that described interior abrasive disk 1211 is elevated; Described outer grinding dish 1212 is connected to the lower end controlling the second retractor device 1222 that described outer grinding dish 1212 is elevated; The upper end of described first retractor device 1221 is connected to the first motor 1231 controlling the rotation of described interior abrasive disk 1211, and the upper end of described second retractor device 1222 is connected to the second motor 1232 controlling the rotation of described outer grinding dish 1212.
As shown in Figure 4, in the present embodiment, described interior abrasive disk 1211 is disc-shaped structure, and described outer grinding dish 1212 is circular ring.The external diameter of described interior abrasive disk 1211 is consistent with the internal diameter of described outer grinding dish 1212.
As shown in Figure 3, described first retractor device 1221 and described second retractor device 1222 are respectively used to the lifting controlling described interior abrasive disk 1211 and described outer grinding dish 1212.In the present embodiment, described first retractor device 1221 and described second retractor device 1222 are the outside having the hollow telescopic shaft of confined space, described second retractor device 1222 is sheathed on described first retractor device 1221, form the circular hollow telescopic shaft surrounded and outside described first retractor device 1221.
As shown in Figure 3, in the present embodiment, described first retractor device 1221 realizes being connected with the first compressed air generator 1241 by the first vent line 1251; Described second retractor device 1222 realizes being connected with the second compressed air generator 1242 by the second vent line 1252.Realized stretching, extension or the contraction of described first retractor device 1221 and described second retractor device 1222 by the pressure difference passing into gas respectively, control the lifting of described interior abrasive disk 1211 and described outer grinding dish 1212 further.When described compressed air generator produces negative-pressure gas, negative-pressure gas enters in the confined space of retractor device by vent line, drives described retractor device to shrink, and abrasive disk rises; Otherwise when passing into barotropic gas, barotropic gas enters in the confined space of retractor device by vent line, drive described retractor device to stretch, abrasive disk declines.Because compressed air generator, vent line and retractor device are independently respectively, therefore, interior abrasive disk 1211 and outer grinding dish 1212 can realize separate type lifting, contact area and the grinding rate of abrasive disk and grinding pad 3 is controlled with this, grinding rate is stabilized in claimed range, and then improves the uniformity of grinding.
As shown in Figure 4, described interior abrasive disk 1211 and described outer grinding dish 1212 comprise basal disc 1213 respectively and are arranged at the mill part 1214 of described basal disc 1213 lower surface.In the present embodiment, basal disc 1213 material of described interior abrasive disk 1211 and described outer grinding dish 1212 is steel.Described mill part 1214 can be the high hardness materials such as diamond, boron nitride, carborundum, pottery, and in the present embodiment, the material of described mill part 1214 is diamond.
In the present embodiment, the material of described first retractor device 1221 and described second retractor device 1222 is stainless steel.Described first retractor device 1221 and described second retractor device 1222 can protect described interior abrasive disk 1211 and described outer grinding dish 1212 smooth rotation, further increase uniformity and the stability of grinding.
Described interior abrasive disk 1211 and described outer grinding dish 1212 direction of rotation are consistent, to guarantee the uniformity of grinding and stability.
The abrasive disk of lapping device 12 of the present utility model is divided into inside and outside two parts, the lifting of interior abrasive disk 1211 and outer grinding dish 1212 is controlled respectively by compressed air, so that control area and the speed of grinding, further control grinding rate in a stable scope, and then improves the uniformity of grinding.
Lapping device 12 of the present utility model, by controlling interior abrasive disk 1211 and outer grinding dish 1212 alternate play lifting action, controls the stable of grinding rate.In the present embodiment, grinding rate is stabilized in 1800 A/min of clock ~ 2200 A/min clocks, namely wafer to be ground 6 per minute surface grinding falls THICKNESS CONTROL at 1800 dust ~ 2200 dusts, and the contact area by different abrasive disk newness degrees and abrasive disk and grinding pad 3 realizes.Abrasive disk 1211 (interior abrasive disk 1211 declines, outer grinding dish 1212 rises) in only using, interior abrasive disk 1211 being assembled new abrasive disk, just can to realize grinding rate be 2000 A/min of clocks; Only use outer grinding dish 1212 (interior abrasive disk 1211 rises, outer grinding dish 1212 declines), outer grinding dish 1212 being assembled new abrasive disk, just can to realize grinding rate be 2000 A/min of clocks; Interior abrasive disk 1211 and outer grinding dish 1212 use simultaneously (interior abrasive disk 1211 declines, outer grinding dish 1212 declines), then in, abrasive disk 1211 and outer grinding dish 1212 all assemble old abrasive disk can to realize grinding rate be 2000 A/min of clocks.The different grinding rate stability required can be realized by the combination of the abrasive disk of different newness degree, abrasive disk can be fully utilized in whole life cycle, save resource and cost.
In sum, the utility model provides a kind of lapping device, and described lapping device at least comprises abrasive disk in plate-like; Be sheathed on the ring-type outer grinding dish outside described interior abrasive disk; Described interior abrasive disk is connected to the lower end of the first retractor device controlling described interior abrasive disk lifting; Described outer grinding dish is connected to the lower end of the second retractor device controlling the lifting of described outer grinding dish; The upper end of described first retractor device is connected to the first motor controlling described interior abrasive disk rotation, and the upper end of described second retractor device is connected to the second motor controlling the rotation of described outer grinding dish.Abrasive disk is divided into inside and outside two parts by lapping device of the present utility model, and the lifting of inside and outside abrasive disk is controlled respectively with compressed air, utilize that inside and outside abrasive disk is different from the contact area of grinding pad, grinding rate is different regulates grinding rate, make grinding rate keep stable, improve the uniformity of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.So the utility model effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (10)
1. a lapping device, is characterized in that, described lapping device at least comprises: abrasive disk in plate-like; Be sheathed on the ring-type outer grinding dish outside described interior abrasive disk; Described interior abrasive disk is connected to the lower end of the first retractor device controlling described interior abrasive disk lifting; Described outer grinding dish is connected to the lower end of the second retractor device controlling the lifting of described outer grinding dish; The upper end of described first retractor device is connected to the first motor controlling described interior abrasive disk rotation, and the upper end of described second retractor device is connected to the second motor controlling the rotation of described outer grinding dish.
2. lapping device according to claim 1, is characterized in that: described interior abrasive disk is disc-shaped structure, and described outer grinding dish is circular ring.
3. lapping device according to claim 1, is characterized in that: the external diameter of described interior abrasive disk is consistent with the internal diameter of described outer grinding dish.
4. lapping device according to claim 1, is characterized in that: described first retractor device and described second retractor device be there is the hollow telescopic shaft of confined space, outside that described second retractor device is sheathed on described first retractor device.
5. lapping device according to claim 4, it is characterized in that: described first retractor device and described second retractor device realize being connected respectively by vent line and compressed air generator, realized stretching, extension or the contraction of described first retractor device and described second retractor device by the pressure difference passing into gas respectively.
6. lapping device according to claim 1, is characterized in that: described interior abrasive disk and described outer grinding dish comprise basal disc respectively and be arranged at the mill part of described basal disc lower surface.
7. lapping device according to claim 6, is characterized in that: the pedestal material of described interior abrasive disk and described outer grinding dish is steel.
8. lapping device according to claim 6, is characterized in that: the mill part material of described interior abrasive disk and described outer grinding dish is diamond.
9. lapping device according to claim 1, is characterized in that: the material of described first retractor device and described second retractor device is stainless steel.
10. lapping device according to claim 1, is characterized in that: described interior abrasive disk and described outer grinding disc spins direction consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599765.7U CN204149028U (en) | 2014-10-16 | 2014-10-16 | A kind of lapping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599765.7U CN204149028U (en) | 2014-10-16 | 2014-10-16 | A kind of lapping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204149028U true CN204149028U (en) | 2015-02-11 |
Family
ID=52507180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420599765.7U Expired - Fee Related CN204149028U (en) | 2014-10-16 | 2014-10-16 | A kind of lapping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204149028U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074287A (en) * | 2020-08-11 | 2022-02-22 | 平坦标准技术有限公司 | Grinding equipment for display device substrate |
-
2014
- 2014-10-16 CN CN201420599765.7U patent/CN204149028U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074287A (en) * | 2020-08-11 | 2022-02-22 | 平坦标准技术有限公司 | Grinding equipment for display device substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10335918B2 (en) | Workpiece processing apparatus | |
| JP2014233830A (en) | Abrasive pad dresser and production method thereof, abrasive pad dressing device, and polishing system | |
| CN103537981B (en) | A kind of superfine processing method of high accuracy circular cylindrical parts cylindrical | |
| KR20140097995A (en) | Polishing method | |
| CN203726355U (en) | Grinding wheel for chamfering edge of large-diameter silicon carbide wafer | |
| CN206357051U (en) | Abrasive disk, grinding pad conditioners and lapping device | |
| CN202021541U (en) | Polishing device | |
| CN203887683U (en) | Grinding head and grinding device | |
| CN106078469A (en) | The glossing of the 3D cambered surface of a kind of ceramic member and device thereof | |
| CN204149007U (en) | A kind of grinding pad adjuster | |
| CN204149028U (en) | A kind of lapping device | |
| TWI733705B (en) | Chemical mechanical polishing system | |
| CN202952160U (en) | Chemical-mechanical polishing finisher | |
| CN102574266A (en) | Method for polishing semiconductor wafer | |
| CN102862121B (en) | Chemical mechanical polishing (CMP) grinding pad finishing structure | |
| CN203792152U (en) | Single-face grinding machine | |
| CN203887682U (en) | Grinding head and grinding device | |
| CN102975110A (en) | Chemical and mechanical grinding rate control method | |
| CN202162705U (en) | Disc dressing device of tabletop type grinding and polishing machine | |
| CN106217146A (en) | The Cinnabaris artware processing unit (plant) that a kind of many grinding abrasive disks ladder is horizontally-arranged | |
| CN204471118U (en) | A kind of end surface of diamond grinding wheel edging device | |
| CN207272915U (en) | A kind of burnishing device of monolithic thermal response glass production automatic lens trim grinder | |
| CN202825547U (en) | Grinding pad finishing plate | |
| CN208231570U (en) | A kind of grinding pad conditioners | |
| CN102339742A (en) | Method for pre-polishing polishing pad by adopting polysilicon CMP (Chemical Mechanical Polishing) process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20191016 |