CN204149007U - A kind of grinding pad adjuster - Google Patents
A kind of grinding pad adjuster Download PDFInfo
- Publication number
- CN204149007U CN204149007U CN201420599764.2U CN201420599764U CN204149007U CN 204149007 U CN204149007 U CN 204149007U CN 201420599764 U CN201420599764 U CN 201420599764U CN 204149007 U CN204149007 U CN 204149007U
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- Prior art keywords
- abrasive disk
- grinding pad
- grinding
- pad adjuster
- power set
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a kind of grinding pad adjuster, comprising: grinding pad adjuster arm, and is connected to the multiple abrasive disks on described grinding pad adjuster arm by many shaft couplings; Described many shaft couplings be connected with the rotation for controlling each abrasive disk respectively the first power set, for controlling the second power set of the lifting of each abrasive disk respectively, and for controlling the 3rd power set of at least one abrasive disk movement on described grinding pad adjuster arm.Grinding pad adjuster of the present utility model adopts multiple abrasive disk, and the lifting of abrasive disk is controlled respectively with compressed air, utilize the grinding rate difference of each abrasive disk to regulate grinding rate, grinding rate is made to keep stable, utilize moving horizontally of abrasive disk to realize wider grinding pad surfacing and surface particles cleaning simultaneously, improve uniformity and the Grinding Quality of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of grinding pad adjuster.
Background technology
Along with developing rapidly of high-tech electronic consumption market, wafer manufacturing requires more and more higher device density, more and more less live width, and thereupon, the requirement of crystal column surface planarization is more and more higher.Cmp (Chemical MechanicalPolishing, CMP) be the most frequently used flattening wafer surface processing method of current semiconductor manufacturing industry, cmp completes planarization by chemical reaction process and mechanical grinding process acting in conjunction.
As shown in Figure 1, the capital equipment of cmp comprises: grinding pad adjuster 1, grinding table 2, grinding pad 3 (Pad), lapping liquid feeder 4, grinding head 5.Grinding pad 3 is arranged on grinding table 2; The lower end of grinding head 5 is equipped with wafer 6 to be ground, and described wafer 6 to be ground contacts with grinding pad 3; Lapping liquid feeder 4 is for providing lapping liquid (Slurry) to grinding pad 3 surface; The lower end of grinding pad adjuster 1 is equipped with abrasive disk 11 (Disk), for repairing the surface of grinding pad 3, improves the uniformity that lapping liquid distributes on described grinding pad 3 simultaneously; Lapping liquid flows to the surface of grinding pad 3 with certain speed, grinding head 5 applies certain pressure to wafer 6 to be ground, to be ground of wafer 6 to be ground is made to produce Mechanical Contact with grinding pad 3, in process of lapping, grinding head 5, grinding pad adjuster 1, grinding table 2 rotate with certain speed respectively, removed the film on wafer 6 surface to be ground by machinery and chemical action, thus reach the object of wafer 6 surface planarisation to be ground.The surface of usual grinding pad 3 has many concaveconvex structures helping to grind, the therefore degree of roughness of the surface presentation 1 μm ~ 2 μm of grinding pad 3.General chemical-mechanical grinding device is after several pieces wafers of grinding, and the original rough surface of grinding pad 3 will become smooth, so that the grainding capacity of grinding pad 3 reduces, and the uniformity of simultaneous grinding also can not get ensureing.Simultaneously, the material in process of lapping, wafer 6 to be ground is polished can remain in grinding pad 3 surface, simultaneously, some lapping liquid pair material in lapping liquid also can remain in grinding pad 3 surface, these granular impurity will make abrasive characteristic change, and then affect grinding effect, make wafer 6 surface to be ground there is cut.Therefore, need the moment to keep the degree of roughness on grinding pad 3 surface consistent, get rid of the residuals dropping on grinding pad 3 surface in time simultaneously.And grinding pad adjuster 1 is just for regulating grinding pad 3, the surface recovery of grinding pad 3 can be made to become rough surface and keep the stability of its degree of roughness, striking off the residuals on grinding pad 3, guarantee Grinding Quality simultaneously.
Grinding pad adjuster 1 mainly comprises passive grinding pad adjuster arm 11 and for keeping the abrasive disk 12 of grinding pad 3 surface roughness and removal grinding pad 3 remained on surface material, controls the motor (not shown) that described abrasive disk 12 rotates.As shown in Figure 1, in order to can by the job enlargement of described grinding pad adjuster 1 to whole grinding pad 3, need described abrasive disk 12 to reciprocate in the horizontal direction, grinding efficiency be low.As shown in Figure 2, abrasive disk 12 is a disk, and its surface inserting has high rigidity abrasive article, and the Mechanical Contact on these high rigidity mill part and grinding pad 3 surface makes grinding pad 3 surface keep certain roughness just.The surface ratio of new abrasive disk surface grinding part is sharper, correspondingly grinding rate is also very fast, but along with the increase of abrasive disk service time, as shown in Figure 3, its high rigidity abrasive article can wear and tear, and the finishing effect for grinding pad 3 surface will reduce, grinding rate is greatly affected, meanwhile, the surface attachment of abrasive disk 12 has the metallic residue of ring-type, and these residues have an impact for lapping uniformity.In addition, the grinding rate of fast, the old abrasive disk of the grinding rate of new abrasive disk is slow, and the grinding rate in production process will certainly be caused unstable, and the uniformity of grinding also can not get ensureing.And the grinding rate of old abrasive disk is slow, is very disadvantageous for large-scale industrial production, but if the old abrasive disk of wearing and tearing is abandoned need not; the very large wasting of resources could be caused.
Therefore, minimumization of the maximization and cost that how as far as possible to reach output on the basis that Grinding Quality is high has become those skilled in the art's problem demanding prompt solution.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of grinding pad adjuster, for solving the problems such as grinding rate is unstable, lapping uniformity is poor, Grinding Quality is poor, grinding efficiency is low in prior art.
For achieving the above object and other relevant objects, the utility model provides a kind of grinding pad adjuster, described grinding pad adjuster at least comprises: grinding pad adjuster arm, and is connected to the multiple abrasive disks on described grinding pad adjuster arm by many shaft couplings; Described many shaft couplings be connected with the rotation for controlling each abrasive disk respectively the first power set, for controlling the second power set of the lifting of each abrasive disk respectively, and for controlling the 3rd power set of at least one abrasive disk movement on described grinding pad adjuster arm.
Preferably, the quantity of described abrasive disk is no less than 2.
Preferably, each abrasive disk is disc-shaped structure.
Preferably, described first power set are electric rotating machine.
Preferably, described shaft coupling can realize the expansion link of stretching, extension or contraction.
More preferably, described second power set are compressed air generator, realized stretching, extension or the contraction of each shaft coupling respectively, control the lifting of each abrasive disk further respectively by the pressure controlling the gas passed in each shaft coupling.
Preferably, described 3rd power set are scan module.
Preferably, described 3rd power set control described abrasive disk and move horizontally on described grinding pad adjuster arm.
Preferably, described abrasive disk is consistent with the direction of rotation of grinder station, grinding head.
As mentioned above, grinding pad adjuster of the present utility model, has following beneficial effect:
Grinding pad adjuster of the present utility model adopts multiple abrasive disk, and the lifting of abrasive disk is controlled respectively with compressed air, utilize the grinding rate difference of each abrasive disk to regulate grinding rate, grinding rate is made to keep stable, utilize moving horizontally of abrasive disk to realize wider grinding pad surfacing and surface particles cleaning simultaneously, improve uniformity and the Grinding Quality of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.
Accompanying drawing explanation
Fig. 1 is shown as chemical-mechanical grinding device schematic diagram of the prior art.
Fig. 2 is shown as new abrasive disk schematic diagram of the prior art.
Fig. 3 is shown as old abrasive disk schematic diagram of the prior art.
Fig. 4 is shown as the chemical-mechanical grinding device schematic diagram in the utility model.
Element numbers explanation
1 grinding pad adjuster
11 grinding pad adjuster arms
12 abrasive disks
121 first abrasive disks
122 second abrasive disks
123 the 3rd abrasive disks
13 first power set
14 second power set
15 the 3rd power set
2 grinding tables
3 grinding pads
4 lapping liquid feeders
5 grinding heads
6 wafers to be ground
Detailed description of the invention
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art the content disclosed by this description can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by detailed description of the invention different in addition, and the every details in this description also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.
Refer to Fig. 4.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present utility model in a schematic way, then only the assembly relevant with the utility model is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
As shown in Figure 4, the utility model provides a kind of grinding pad adjuster 1, and described grinding pad adjuster 1 at least comprises: grinding pad adjuster arm 11, and is connected to the multiple abrasive disks on described grinding pad adjuster arm 11 by many shaft couplings; Described many shaft couplings be connected with the rotation for controlling each abrasive disk respectively the first power set 13, for controlling the second power set 14 of the lifting of each abrasive disk respectively, and for controlling the 3rd power set 15 of at least one abrasive disk movement on described grinding pad adjuster arm.
Described abrasive disk is disc-shaped structure, and the quantity of abrasive disk is no less than 2, specifically can set according to grinding requirement.As shown in Figure 4, in the present embodiment, described abrasive disk is set as 3, is respectively the first abrasive disk 121, second abrasive disk 122, the 3rd abrasive disk 123.The design of multiple abrasive disk effectively can improve the efficiency of grinding.
As shown in Figure 4, described first power set 13 are connected to described first abrasive disk 121, described second abrasive disk 122 and several 3rd abrasive disk 123, for controlling the rotation of each abrasive disk.Described first power set 13 can be any devices that can control abrasive disk rotation, and in the present embodiment, described first power set 13 are electric rotating machine.Abrasive disk is accelerated by rotation or slows down the Mechanical Contact between grinding pad 3, realizes raising or the attenuating of grinding rate, and the rotational velocity by controlling abrasive disk realizes the control of grinding rate.
As shown in Figure 4, described shaft coupling is the expansion link with confined space, can realize stretching or shrinking, and can control the lifting of each abrasive disk with this respectively.Described second power set 14 can be any devices that can control described shaft coupling and stretch or shrink, and in the present embodiment, described second power set 14 are compressed air generator.Gas passes in described shaft coupling by vent line by described compressed air generator respectively, and the air pressure in each shaft coupling is different, and when passing into negative-pressure gas, shaft coupling shrinks, and corresponding abrasive disk rises; When passing into barotropic gas, shaft coupling stretches, and corresponding abrasive disk declines.Described first abrasive disk 121 is given by compressed-air actuated air pressure size, described second abrasive disk 122 and several 3rd abrasive disk 123 apply pressure respectively to control described first abrasive disk 121 respectively, described second abrasive disk 122 and the lifting of several 3rd abrasive disk 123, described first abrasive disk 121, described second abrasive disk 122 and several 3rd abrasive disk 123 realize separate type lifting, each abrasive disk also can select different newness degrees, contact area and the grinding rate of abrasive disk and grinding pad 3 is controlled with this, grinding rate is made to be stabilized in claimed range, and then improve the uniformity of grinding.
Described 3rd power set 15 are connected with at least one abrasive disk.As shown in Figure 4, in the present embodiment, described first abrasive disk 121 and described 3rd abrasive disk 123 are connected with described 3rd power set 15, and move horizontally on described grinding pad adjuster arm 11 by the control realization of described 3rd power set.Described 3rd power set 15 can be any device that can control abrasive disk and move horizontally, and in the present embodiment, described 3rd power set 15 are scan module.Described first abrasive disk 121 and moving horizontally of described 3rd abrasive disk 123 can increase described first abrasive disk 121 and the contact area between described 3rd abrasive disk 123 and described grinding pad 3, increase the finishing area to grinding pad.Also can increase clean area when removing the particulate on grinding pad 3 surface simultaneously, improving cleaning efficiency.
Described abrasive disk is consistent with the direction of rotation of grinder station 2, grinding head 5, effectively can improve uniformity and the stability of grinding.
Grinding pad adjuster 1 of the present utility model has multiple abrasive disk, the present embodiment comprises 3 described abrasive disks, the lifting of each abrasive disk is controlled respectively by compressed air, so that control area and the speed of grinding, further control grinding rate in a stable scope, and then improves the uniformity of grinding.
Grinding pad adjuster 1 of the present utility model is when carrying out the finishing of grinding pad 3, assemble the abrasive disk of different newness degree, the grinding rate of fast, the old abrasive disk of the grinding rate of new abrasive disk is slow, by controlling each abrasive disk alternate play lifting action, controls the stable of grinding rate.In the present embodiment, if grinding rate is excessively slow, the abrasive disk in 2 Geju City (being assemblied in the position of described first abrasive disk 121 and described 3rd abrasive disk 123 respectively) can be utilized simultaneously to carry out the finishing of described grinding pad 3,1 new abrasive disk (being assemblied in the position of described second abrasive disk 122) also can be utilized to carry out the finishing of described grinding pad 3; If grinding rate is too fast, the abrasive disk in 1 Geju City (being assemblied in the position of described second abrasive disk 122) can be utilized to carry out the finishing of described grinding pad 3; The quantity of concrete use abrasive disk, position and use the newness degree of abrasive disk to set according to the requirement of grinding rate.The different grinding rate stability required can be realized by the combination of the abrasive disk of different newness degree, abrasive disk can be fully utilized in whole life cycle, save resource and cost, abrasive disk can be utilized simultaneously on described grinding pad adjuster arm 11 to move horizontally expansion milling area.
Grinding pad adjuster 1 of the present utility model is when carrying out grinding pad 3 clean, and each abrasive disk applies certain power to described grinding pad, and in the present embodiment, the power of applying controls at 0 pound ~ 5 pounds.Then rotate each abrasive disk and described grinding pad 3 (grinding pad 3 realizes rotating by the rotation of grinding table 2), meanwhile, described first abrasive disk 121 and described 3rd abrasive disk 123 move horizontally.Effectively can increase clean area, improve cleaning efficiency.
In sum, the utility model provides a kind of grinding pad adjuster, and described grinding pad adjuster at least comprises: be arranged at the multiple abrasive disks on grinding pad adjuster arm, each abrasive disk is toward grinding pad; Be connected to each abrasive disk and control each abrasive disk rotate the first power set; Be connected to each abrasive disk and control the second power set of each abrasive disk lifting, and controlling the 3rd power set of at least one abrasive disk movement on described grinding pad adjuster arm.Grinding pad adjuster of the present utility model adopts multiple abrasive disk, and the lifting of abrasive disk is controlled respectively with compressed air, utilize the grinding rate difference of each abrasive disk to regulate grinding rate, grinding rate is made to keep stable, utilize moving horizontally of abrasive disk to realize wider grinding pad surfacing and surface particles cleaning simultaneously, improve uniformity and the Grinding Quality of grinding further.Meanwhile, abrasive disk can be fully utilized in whole life cycle, has greatly saved resource and cost.So the utility model effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (9)
1. a grinding pad adjuster, is characterized in that, described grinding pad adjuster at least comprises: grinding pad adjuster arm, and is connected to the multiple abrasive disks on described grinding pad adjuster arm by many shaft couplings; Described many shaft couplings be connected with the rotation for controlling each abrasive disk respectively the first power set, for controlling the second power set of the lifting of each abrasive disk respectively, and for controlling the 3rd power set of at least one abrasive disk movement on described grinding pad adjuster arm.
2. grinding pad adjuster according to claim 1, is characterized in that: the quantity of described abrasive disk is no less than 2.
3. grinding pad adjuster according to claim 1, is characterized in that: each abrasive disk is disc-shaped structure.
4. grinding pad adjuster according to claim 1, is characterized in that: described first power set are electric rotating machine.
5. grinding pad adjuster according to claim 1, is characterized in that: described shaft coupling can realize the expansion link stretching or shrink.
6. grinding pad adjuster according to claim 5, it is characterized in that: described second power set are compressed air generator, realized stretching, extension or the contraction of each shaft coupling by the pressure controlling the gas passed in each shaft coupling respectively, control the lifting of each abrasive disk further respectively.
7. grinding pad adjuster according to claim 1, is characterized in that: described 3rd power set are scan module.
8. grinding pad adjuster according to claim 1, is characterized in that: described 3rd power set control described abrasive disk and move horizontally on described grinding pad adjuster arm.
9. grinding pad adjuster according to claim 1, is characterized in that: described abrasive disk is consistent with the direction of rotation of grinder station, grinding head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599764.2U CN204149007U (en) | 2014-10-16 | 2014-10-16 | A kind of grinding pad adjuster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420599764.2U CN204149007U (en) | 2014-10-16 | 2014-10-16 | A kind of grinding pad adjuster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204149007U true CN204149007U (en) | 2015-02-11 |
Family
ID=52507159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420599764.2U Expired - Fee Related CN204149007U (en) | 2014-10-16 | 2014-10-16 | A kind of grinding pad adjuster |
Country Status (1)
| Country | Link |
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| CN (1) | CN204149007U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581748A (en) * | 2018-04-12 | 2018-09-28 | 南昌华学科技有限公司 | A kind of bridge construction polishing adjustable area stone mill |
| CN109702637A (en) * | 2019-02-28 | 2019-05-03 | 郑州工程技术学院 | Superhard solidified abrasive grinding parameter optimization and manufacturing method are emulated based on Adams |
| CN114473859A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | Wafer polishing apparatus and wafer polishing method |
-
2014
- 2014-10-16 CN CN201420599764.2U patent/CN204149007U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581748A (en) * | 2018-04-12 | 2018-09-28 | 南昌华学科技有限公司 | A kind of bridge construction polishing adjustable area stone mill |
| CN108581748B (en) * | 2018-04-12 | 2019-10-08 | 叶盛 | A kind of bridge construction polishing adjustable area stone mill |
| CN109702637A (en) * | 2019-02-28 | 2019-05-03 | 郑州工程技术学院 | Superhard solidified abrasive grinding parameter optimization and manufacturing method are emulated based on Adams |
| CN109702637B (en) * | 2019-02-28 | 2020-10-02 | 郑州工程技术学院 | Adams simulation based superhard consolidation abrasive grinding parameter optimization and manufacturing method |
| CN114473859A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | Wafer polishing apparatus and wafer polishing method |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20191016 |
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| CF01 | Termination of patent right due to non-payment of annual fee |