CN103548214A - 高速输入/输出连接接口元件、线缆组件和串扰减小的互连*** - Google Patents
高速输入/输出连接接口元件、线缆组件和串扰减小的互连*** Download PDFInfo
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Abstract
本发明涉及高速输入/输出(I/O)连接接口元件(100),涉及包括这种接口元件的线缆组件以及涉及包括这种线缆组件和用于接触该线缆组件的合适的插座连接器的互连***。所述I/O连接接口元件包括基板(102),基板承载多条导电引线(106),每条所述传导引线具有要被连接到至少一个I/O导体(104)的过渡接口。导电引线包括布置在所述基板的相反面的输入引线和输出引线,并且其中至少一个导电接地平面层(116)被布置为至少部分地位于所述基板中,与所述多条传导引线电绝缘。至少一个接地平面层在邻近过渡接口的区域中提供有至少一个间隙(118)。
Description
技术领域
本发明涉及高速输入/输出(I/O)连接接口元件,涉及包括这样的接口元件的线缆组件,以及涉及互连***,该***包括线缆组件和用于接触线缆组件的合适的插座连接器。
背景技术
由于近来发展的通信***中的高数据速率具有大于5Gbp的数据传输速度,信号线之间的串扰变成主要的考虑。
理想地,互连***将在没有失真的情况下传送信号。一种类型的失真叫做串扰。串扰在当一个信号在另一条信号线上产生不需要的信号时发生。大体上地,串扰由信号线之间的电磁耦合引起。因此,串扰对于高速高密度互连***尤其成问题。当信号线在一起更近或者当信号线所传送的信号的频率更高时,电磁耦合增加。这两种情况都出现在高速高密度互连***中。连接器中的不连续性常常加剧所有串扰问题。已知***屏蔽件到互连***的连接器中以减小串扰的影响。
此外,已知使用差分信号用于传递信息。两个导体上传送一个差分信号,该信号被表现为导体之间的电平差。差分信号相比于单端信号更加抗串扰,因为任何作用到导体上的干扰信号(stray signal)将普遍地改变两个导体的电平,但是不改变其电平差。
因而,传统的高速I/O连接线缆组件使用电路板作为***接到插座连接器中的基板,并使用具有一对电线的线缆来传送差分信号。印刷电路板在其至少一个表面上具有迹线和焊盘,其中特定的接触焊盘可被配合插座接触。迹线横过印刷电路板传输电信号。例如,它们可从配合插座的触头传输信号到线缆组件的电线并且反之亦然。
线缆组件可包括几对电线,例如四条输入信号线缆和四条输出信号线缆。然而,线缆组件还可包括最多32或更多对电线,即大体上线缆组件包括以二为增量的电线对。此外线缆组件包括排流线,其连接到每条线缆的屏蔽件。
在连接器中从印刷电路板到线缆的传输相应地需要具有处理高数据速率的能力。此外,由于连接器的小型(small form factor),邻近的线对之间的串扰是重要的参数。本发明的发明人已找到串扰的主要原因是在线缆连接接口处的印刷电路板。
为了减少连接接口元件上的串扰,已知通过在印刷电路板的顶部和底部分别排布输入和输出对以分隔电线的输入和输出对(Rx和Tx)。通过在印刷电路板中采用附加的接地层,能够有效地消除Rx和Tx线之间的串扰。
然而,在线缆所焊接到的接口处,必须使用阻抗补偿以避免由于信号反射引起的信号失真。因此,传统线缆组件省略了在特定区域中的内接地层,在该区域线缆被焊接到迹线的传导焊盘。然而,由此,信号线之间的串扰不再被足够有效地消除。尤其是当遵守诸如IEEE标准802.3ap10GBASE-KR(2008)的10Gbp规范时,这些已知的布局不能满意地实现相应的要求。
发明内容
因此,本发明的目的是在减小串扰方面改善高速输入/输出连接接口元件以及合适的线缆组件,同时保持小型和成本有效的构造。通过独立权利要求的主题实现了本目的。创造性的连接接口元件的有利设计为从属权利要求的主题。
本发明基于一种发现,该发现为通过在邻近焊接的电线与基板上的焊盘之间的过渡接口的区域中提供间隙并且由此在间隙的边缘区域留下接地层的窄带,阻隔了低频串扰分量。同时,接口处的差分阻抗只受到可忽略的影响,因而保持了线缆和接口元件之间的过渡的电性能。
虽然更高频率分量仍然可造成串扰,但是直至5GHz(即10Gbps),通过本布置可在相对的Tx和Rx对之间使串扰减小约3dB。因而,利用根据本发明的布置可达到减少的串扰,进而实现改善的数据链(data link)电性能。
本发明可被有利地用于所有铜线缆组件链,尤其是在那些高速应用中,比如泰科电子公司的小型可插接(SFP+)产品、四通道小型可插接(QSFP)产品以及高速输入/输出(HSIO)产品。
当间隙形成为使得在过渡接口的外周边区域中形成有接地带,且该接地带在沿传导引线的方向上的尺寸小于过渡接口的尺寸的10%时,能够实现对阻抗的最小影响。
通过为每对引线提供单独的间隙以及通过以由接地层形成的条板分隔这些间隙,邻近的引线对之间的串扰能够被减少。
根据本发明,连接接口元件可以特别成本有效的方式通过多层印刷电路板(PCB)形成。这种PCB可具有迹线层、芯层、接地平面层、中心层、另一层接地层、另一层芯层以及第二迹线层。迹线层和接地平面层有利地由传导材料制成,比如铜。芯层和中心层由例如绝缘材料制成,比如带有编织玻璃纤维垫的增强的环氧树脂,比如FR408。此外,PCB还可包括阻焊层(soldermask layer),其位于迹线层周围并且只敞开要被焊接的焊盘以及要与插座连接器接合的连接区域。
根据本发明,线缆组件包括一条或多条线缆以及接口元件,有利地提供有电绝缘壳体。此外,可提供包塑(overmold)材料用于将线缆机械地紧固到接口元件。
根据本发明,互连***包括多条输入/输出线缆、连接到线缆的接口元件以及插座连接器,插座连接器适于可分离地连接到提供在接口元件处的触头区域。为了允许实现牢固的机械接触并且尽管如此该接触仍可被轻松地释放,插座连接器包括弹簧触头元件,其用于接合接口元件的触头区域。为了减少沿着线缆的信号干扰,同样地包括用于传送代表一个输入或输出信号的差分信号的一对线以及通过排流线接地的屏蔽件。
附图说明
附图被包括在详述中并形成详述的一部分以阐述本发明的几个实施例。这些附图与说明书一起,用于解释本发明的原理。附图仅用于详述本发明如何能够被制造或使用的最佳或替换示例的目的,并且不被解释为将本发明仅限制为所阐释和描述的实施例。此外,根据本发明,本发明的几个方面可分别地或以不同的组合形成解决方案。其他的特征和优势将从以下对附图所示的本发明各种实施例的更具体的描述中变得明显,其中相同的标记标示相同的元件。
图1示出了根据本发明的线缆组件的一部分的透视图;
图2示出了根据本发明的第一接地平面层的布局图;
图3示出了根据本发明的第一迹线层的布局图;
图4示出了第一迹线层与接地平面层相对于彼此的相互关系;
图5示出了被与标准IEEE802.3ap10GBASE-KR(2008)的要求相比较的、传统线缆组件的基于频率的插损串扰率拟合;
图6示出了根据本发明的线缆组件的插损串扰率拟合;
图7示出了连接器插座壳体的透视图;
图8示出了连接器插座触头区域的示例的透视图。
具体实施例
现在参见图1,线缆组件100包括基板102和被焊接到基板102上的迹线上的传导焊盘的多条线缆104。根据本发明,基板102具有多条迹线106,他们从过渡接口108通往用于接合插座连接器的多个触头区域。所述触头区域在图1的切面视图中并未被示出,但是将参见图2-4对其做出更详细的解释。
根据本发明,每条线缆104包括两条电线110、112,它们一起传送差分信号,这是普遍已知的。在I/O过渡接口108的区域中,电线110、112被焊接到迹线106。此外,连接到线缆104的屏蔽件的排流引线114连接到接地迹线,接地迹线又通过过孔被连接到所有其他接地平面层以形成公共接地。然而,代替焊接的线缆,当然其他任何合适的导体也可通过诸如压接连接或插接连接的其他连接技术被附接到接口元件。
根据本发明,输入(Rx)和输出(Tx)线缆以基板102的一个表面只有Tx线缆并且基板102的另一个表面只有Rx对出现的方式被布置。为了减少线缆的上方与下方对与迹线106之间的串扰,在基板102中提供两个接地平面层116。当然,也可只用一个或多于两个接地平面层。
在图2所示的接地平面层116的布局图中显见的是,接地平面层在迹线106延伸越过基板12的区域中为连续的(solid)金属屏蔽,但是在线缆被焊接到接口元件的焊接焊盘的过渡接口区域108中具有间隙118。间隙118被布置且设定一定的尺寸,使得在每对信号迹线焊接焊盘的正下方没有接地平面金属化,然而在外周边区域中形成了狭窄接地带120。
如图2所示,每个间隙118通过接地平面层116的条板形部分112与邻近的间隙隔开。这些条板形结构122直接地位于迹线层106的接地引线下面。通过在印刷电路板102中使用这种串扰抑制带120,能够达到双重效果:第一,部分接地层116仍然位于相应的迹线下面,具有与ESD屏蔽相等效果。另一方面,为了达到需要的阻抗匹配和由此避免信号反射,在线缆以间隙118的形式连接的区域中的迹线下方设置切口。这样,当仍然保持差分阻抗不改变(或只最低程度地改变)时,能够阻挡直至至少5GHz的串扰部分。
在通往插座连接器的连接器所处的区域中,根据本设计,接地平面层完全地不存在。然而,对于本领域技术人员来说当然清楚,如果需要,可应用与过渡接口区域相似的结构。
图3示出了图1所示线缆组件100的上侧出现的第一迹线层106的布局的示例。如图3所示,四对迹线从I/O过渡接口区域108通向适于接合合适的插座连接器的触头区域。每对信号迹线通过接地的迹线与邻近的信号迹线隔开。如果需要,其他的电子部件可被焊接到这一层,比如将发光二极管(LED)焊接到LED触头126。
图1的基板的相反表面上的第二迹线层被以与图3中类似的方式设计。
图4示意性地图示了间隙118相对于迹线106的位置。如可从图中所得出的,串扰抑制带118的尺寸可选择为使得该带在沿着传导引线的方向上仅延伸过渡接口区域108的尺寸的约10%。因而,串扰抑制带118对展示给线缆的整体阻抗的影响能够被忽略并且可以达到足够的阻抗匹配。
在IEEE802.3ap规范中没有给出绝对的串扰界限,但是认识到损耗较小的通道可容忍更高的串扰水平,基于***损耗与总串扰的比率(ICR)限定了界限。相对于该规范定义并设定了实际ICR值的拟合。
由于IEEE802.3ap10GBASE-KR(2008)给出的ICR界限,图5和6允许对由根据本发明设计的印刷电路板所达到的结果的评估。图5示出了I/O过渡接口区域108中完全没有接地平面层的情况。虽然阻抗匹配是最佳的,在频率高于0.1GHz时传输线与接收线之间的串扰低于10GBASE-KR的置信界限,该置信界限由虚线128示出。
相比之下,当使用根据本发明的接地平面布局(见图6)时,插损串扰率很好地保持在根据10GBASE-KR的置信界限128上方。已示出通过根据本发明引入串扰抑制带,在整个感兴趣的范围上ICR被改善了大约3dB。
图7和8图示了金属被屏蔽壳体132中的示例性的插座连接器130,其被设计为与根据本发明的线缆组件配合。提供弹簧触头134用于接合迹线层106的触头区域。这些弹簧触头电连接到触头插针136,其容许例如在印刷电路板上的安装。
术语“一”和“一个”以及描述本发明(尤其是以下的权利要求)的上下文中相似的用语被解释为包含单数和复数两种,除非在此处指出或与上下文明显地矛盾。术语“包括”、“具有”、“包含”和“含有”被解释为开放式术语(即意为“包括,但是不限于”)除非另外说明。此处值的范围的陈述仅意在用作对落入范围内的每个单独的值的简单指称方法,除非在此处另外指出,并且每个单独的值被包括在说明书中如同其被独立地在此处被陈述。此处所描述的所有方法能够以任何合适的顺序表现除非在此处另外指出或者另外地与上下文明显地矛盾。此处提供的任一或所有示例的使用,或者示例性的语言(例如,比如)仅意为更好地阐释本发明并且不提出本发明的范围的界限除非另外声明。在规范中没有任何语言应被解释为表示没有声明的元件对于本发明的实施是必要的。
此处描述了示例性的实施例。这些实施例的变化对本领域技术人员在读完上述说明书后变得明显。本发明人预期本领域技术人员视情况采用这些变化,并且发明人希望本发明在此处特别描述的领域以外的领域实施。相应地,如可适用的法律所允许的,本发明包括所附权利要求中所限定的主题的所有变型和等同方案。此外,以上描述的元件的任何组合的所有可能的变化都被包括在本发明中除非在此处另外指出或者另外明显地与上下文矛盾。
特别地,根据本发明的接地带还能够与焊接到PCB的同轴线缆一起使用。传输线能够为差分线(如描述的)或同轴线两者。
Claims (12)
1.一种高速输入/输出(I/O)连接接口元件(100),包括:
基板(102),其承载多条导电引线(106),每条所述导电引线具有I/O过渡接口(108),所述I/O过渡接口要被连接到至少一个I/O导体(104)。
其中所述导电引线(106)包括被布置在所述电路板(102)的相反面上的输入引线和输出引线,并且其中至少一个导电接地平面层(116)被布置为至少部分地位于所述基板(112)中,与所述多条传导引线(106)电绝缘。
其中至少一个接地平面层(116)在邻近所述过渡接口(108)的区域中设置有至少一个间隙(118)。
2.根据权利要求1的接口元件,其中所述间隙(118)形成为使得在所述过渡接口的外周边区域中,形成有接地带(120)。
3.根据权利要求1的接口元件,其中所述接地带(120)在沿所述传导引线(106)的方向上具有的尺寸小于过渡接口(108)的尺寸的10%。
4.根据上述权利要求之一的接口元件,其中提供有多个间隙(118),每个间隙通过接地条板(122)与邻近的间隙隔开。
5.根据上述权利要求之一的接口元件,其中每条传导引线(106)的阻抗被调整为匹配被焊接到所述过渡接口的线缆的特征阻抗。
6.根据上述权利要求之一的接口元件,其中所述基板(102)包括多层印刷电路板,即PCB。
7.根据权利要求6的接口元件,其中所述接地平面层(116)由所述PCB中的结构化的铜层形成。
8.线缆组件,其包括至少一条线缆,该线缆包括电线对、壳体和根据权利要求1至7之一所述的接口元件(100)。
9.根据权利要求8的线缆组件,其中所述线缆通过应变释放包塑机械地紧固到所述接口元件(100)。
10.一种互连***,包括:
多条输入和输出线缆,
根据权利要求1至7之一所述的接口元件(100),其被连接到所述线缆,
插座连接器(130),其适于可分离地连接到设置在所述接口元件(100)处的触头区域。
11.根据权利要求10的互连***,其中所述插座连接器(130)包括用于接合所述触头区域的弹簧触头元件(134)。
12.根据权利要求10或11的互连***,其中每条线缆包括线对和屏蔽件,所述线对用于传送代表一个输入或输出信号的差分信号,所述屏蔽件接地。
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Cited By (6)
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2701471B8 (en) * | 2011-04-26 | 2017-09-27 | Tyco Electronics Belgium EC bvba | High speed input/output connection interface element and interconnection system with reduced cross-talk |
EP2739125A1 (en) * | 2012-11-28 | 2014-06-04 | Tyco Electronics Svenska Holdings AB | Electrical connection interface for connecting electrical leads for high speed data transmission |
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US9912083B2 (en) * | 2015-07-21 | 2018-03-06 | Sentinel Connector Systems, Inc. | High speed plug |
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BE1026802B1 (de) * | 2018-11-26 | 2020-06-25 | Phoenix Contact Gmbh & Co | Steckverbinder |
CN113966647A (zh) * | 2019-06-28 | 2022-01-21 | 3M创新有限公司 | 多层电路板 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1290800A (zh) * | 1970-01-16 | 1972-09-27 | ||
US20090277665A1 (en) * | 2008-05-09 | 2009-11-12 | Fujitsu Component Limited | Connector and cable connector for balanced transmission |
EP2224552A2 (en) * | 2009-02-18 | 2010-09-01 | Cinch Connectors, Inc. | Electrical connector |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6867668B1 (en) * | 2002-03-18 | 2005-03-15 | Applied Micro Circuits Corporation | High frequency signal transmission from the surface of a circuit substrate to a flexible interconnect cable |
US7145411B1 (en) * | 2002-03-18 | 2006-12-05 | Applied Micro Circuits Corporation | Flexible differential interconnect cable with isolated high frequency electrical transmission line |
TW542454U (en) * | 2002-06-21 | 2003-07-11 | Molex Inc | Electrical connector |
EP2701471B8 (en) * | 2011-04-26 | 2017-09-27 | Tyco Electronics Belgium EC bvba | High speed input/output connection interface element and interconnection system with reduced cross-talk |
CN104183986B (zh) * | 2013-05-24 | 2017-06-20 | 富士康(昆山)电脑接插件有限公司 | 插头连接器 |
-
2011
- 2011-04-26 EP EP13193556.1A patent/EP2701471B8/en active Active
- 2011-04-26 EP EP11163695.7A patent/EP2519086B1/en active Active
-
2012
- 2012-04-23 CN CN201280020622.XA patent/CN103548214B/zh active Active
- 2012-04-23 WO PCT/EP2012/057400 patent/WO2012146562A1/en active Application Filing
-
2013
- 2013-10-25 US US14/063,646 patent/US9124037B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1290800A (zh) * | 1970-01-16 | 1972-09-27 | ||
US20090277665A1 (en) * | 2008-05-09 | 2009-11-12 | Fujitsu Component Limited | Connector and cable connector for balanced transmission |
EP2224552A2 (en) * | 2009-02-18 | 2010-09-01 | Cinch Connectors, Inc. | Electrical connector |
Cited By (9)
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CN108616015A (zh) * | 2016-12-12 | 2018-10-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其组件 |
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US9124037B2 (en) | 2015-09-01 |
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