CN103540233A - Nano electronic coating as well as preparation method thereof - Google Patents
Nano electronic coating as well as preparation method thereof Download PDFInfo
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- CN103540233A CN103540233A CN201310446418.0A CN201310446418A CN103540233A CN 103540233 A CN103540233 A CN 103540233A CN 201310446418 A CN201310446418 A CN 201310446418A CN 103540233 A CN103540233 A CN 103540233A
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- bisphenol
- epoxy resin
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- liquid epoxy
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Abstract
The invention discloses a nano electronic coating which comprises the following components in percentage by weight: 50-60% of bisphenol A type solid epoxy resin, 2-10% of bisphenol A type liquid epoxy resin, 3-5% of a curing agent, 3-5% of butoxyethanol, 15-25% of light calcium carbonate, 1-2% of nano silicon dioxide and 5-15% of titanium dioxide. The preparation method of the nano electronic coating comprises the following steps: firstly, mixing the 50-60% of bisphenol A type solid epoxy resin, 2-10% of bisphenol A type liquid epoxy resin, 15-25% of light calcium carbonate, 1-2% of nano silicon dioxide, 5-15% of titanium dioxide and 3-5% of the curing agent, and after mixing, placing for 10-36 hours; and then, adding 3-5% of butoxyethanol to mix and stir for 3-5 hours and vacuumizing and defoaming. According to the invention, the bisphenol A type solid epoxy resin and the bisphenol A type liquid epoxy resin are combined and matched with corresponding curing agents, solvents and related fillers for proportioning optimization, so that the prepared coating has the characteristics of short curing time, high temperature resistance, flame retardance, ablation resistance, high toughness and strength and the like.
Description
Technical field
The present invention relates to paint field technology, nanoelectronic coating and preparation method thereof is particularly provided.
Background technology
Along with scientific and technological development, electronic product updates more and more faster.Resistance develops into metal film resistor by carbon resister, and oxide film resistance.The ultimate challenge of resistance manufacturers is to add more power in the resistance of same package size, and no matter it is for miniaturized electronic devices or for large industry equipment.When obtaining higher rated output, also require resistance can not produce excessive heat.Now, resistance manufacturers is strengthening their power product line, to higher power and better heat dispersion is provided in the encapsulation at identical or smaller szie.In addition, there have been several resistance manufacturerss can work in the resistance of 275 ℃ in supply, these resistance can tolerate the severe environmental conditions in automobile and industrial application, this just has higher requirement to electronic paint, and the performance need of heat-resisting, insulation, electroconductibility, ablation resistance and flame retardant resistance improves thereupon.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide nanoelectronic coating of a kind of set time of short, high temperature resistant, fire-retardant, resistance to ablation and high tenacity and preparation method thereof.
For achieving the above object, the present invention adopts following technical scheme: a kind of nanoelectronic coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 50-60%;
Bisphenol-A liquid epoxy resin 2-10%;
Solidifying agent 3-5%;
Anti-plain boiled water 3-5%;
Light calcium carbonate 15-25%;
Nano silicon 1-2%;
Titanium dioxide 5-15%.
As a kind of preferred version, the solid content of described bisphenol-A liquid epoxy resin is 75 ~ 90%.
As a kind of preferred version, described solidifying agent is one or more in diethylenetriamine, quadrol, isophorone.
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 55%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 15%;
The solid content of described bisphenol-A liquid epoxy resin is 76 ~ 80%.
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 51%;
Bisphenol-A liquid epoxy resin 10%;
Isophorone 4%
Anti-plain boiled water 4%
Light calcium carbonate 20%
Nano silicon 1%
Titanium dioxide 10%
The solid content of described bisphenol-A liquid epoxy resin is 76 ~ 80%.
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 60%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%
Quadrol 2%
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 9%.
The solid content of described bisphenol-A liquid epoxy resin is 76 ~ 80%.
As a kind of preferred version, described bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
Described anti-plain boiled water is ethylene glycol monobutyl ether.
A kind of preparation method of nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 50-60%, bisphenol-A liquid epoxy resin 2-10%, light calcium carbonate 15-25%, nano silicon 1-2%, titanium dioxide 5-15% and solidifying agent 3-5% are mixed, mix after 2 ~ 5 hours and place 10 ~ 36 hours; Then add anti-plain boiled water 3-5% to carry out mix and blend after 3 ~ 5 hours, carry out vacuumizing and defoaming.
The present invention compared with prior art has obvious advantage and beneficial effect, specific as follows:
1, in the prepared electronic paint matrix material of the present invention, adopt the multiple Nano fillings such as light calcium carbonate, nano silicon and titanium dioxide, these nanoparticles are as disperse phase, there is scale effect, very large specific surface area and extremely strong interfacial interaction, can rely on the component synergies such as chemical bond and absorption, make matrix material there is the new excellent properties that many common materials do not have.This is compound due to nano inorganic material and organic insulation polymkeric substance, its inorganic phase and organic phase are compound in nanometer range, interfacial area between two-phase is very large, Chemical bond between Presence of an interface, form desirable cohesive force, can eliminate the unmatched problem of thermal expansivity between inorganic phase and organic phase, and the toughness of the rigidity of inorganic phase, thermostability and organic phase, processibility, moisture resistivity and dielectric properties are combined, thereby in performance, improve significantly, have higher.
2, by the optimization design of whole formula, particularly adopting in the present invention selects bisphenol A-type solid epoxy and bisphenol-A liquid epoxy resin to combine, and coordinate corresponding solidifying agent, solvent and relevant filler to carry out ratio optimization, make its prepared coating there is the features such as short, high temperature resistant, fire-retardant, resistance to ablation set time and high-toughness high-strength.
Embodiment
Embodiment 1
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 60%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%;
Quadrol 2%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 9%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 60%, bisphenol-A liquid epoxy resin 5%, light calcium carbonate 15%, nano silicon 2%, titanium dioxide 9%, diethylenetriamine 3% and quadrol 2% are mixed, mix after 5 hours and place 15 hours; Then add anti-plain boiled water 5% to carry out mix and blend after 5 hours, carry out vacuumizing and defoaming.
Embodiment 2
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 55%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 15%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 55%, bisphenol-A liquid epoxy resin 5%, light calcium carbonate 15%, nano silicon 2%, titanium dioxide 15% and diethylenetriamine 3% are mixed, mix after 4 hours and place 20 hours; Then add anti-plain boiled water 5% to carry out mix and blend after 5 hours, carry out vacuumizing and defoaming.
Embodiment 3
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 51%;
Bisphenol-A liquid epoxy resin 10%;
Isophorone 4%
Anti-plain boiled water 4%
Light calcium carbonate 20%
Nano silicon 1%
Titanium dioxide 10%
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 51%, bisphenol-A liquid epoxy resin 10%, light calcium carbonate 20%, nano silicon 12%, titanium dioxide 10% and isophorone 4% are mixed, mix after 3 hours and place 30 hours; Then add anti-plain boiled water 4% to carry out mix and blend after 3 hours, carry out vacuumizing and defoaming.
Embodiment 4
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 52%;
Bisphenol-A liquid epoxy resin 8%;
Isophorone 3%;
Anti-plain boiled water 5%;
Light calcium carbonate 20%;
Nano silicon 2%;
Titanium dioxide 10%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 52%, bisphenol-A liquid epoxy resin 8%, light calcium carbonate 20%, nano silicon 2%, titanium dioxide 10% and isophorone 3% are mixed, mix after 5 hours and place 10 hours; Then add anti-plain boiled water 5% to carry out mix and blend after 5 hours, carry out vacuumizing and defoaming.
Embodiment 5
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 57%;
Bisphenol-A liquid epoxy resin 3%;
Isophorone 3%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 15%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 57%, bisphenol-A liquid epoxy resin 3%, light calcium carbonate 15%, nano silicon 2%, titanium dioxide 15% and isophorone 3% are mixed, mix after 4 hours and place 25 hours; Then add anti-plain boiled water 5% to carry out mix and blend after 5 hours, carry out vacuumizing and defoaming.
Embodiment 6
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 52%;
Bisphenol-A liquid epoxy resin 10%;
Diethylenetriamine 4%;
Anti-plain boiled water 4%;
Light calcium carbonate 16%;
Nano silicon 2%;
Titanium dioxide 12%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 52%, bisphenol-A liquid epoxy resin 10%, light calcium carbonate 16%, nano silicon 2%, titanium dioxide 12% and diethylenetriamine 4% are mixed, mix after 2 hours and place 15 hours; Then add anti-plain boiled water 4% to carry out mix and blend after 4 hours, carry out vacuumizing and defoaming.
Embodiment 7
A coating, by quality 100%, includes:
Bisphenol A-type solid epoxy 55%;
Bisphenol-A liquid epoxy resin 8%;
Quadrol 5%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 10%.
This bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
The preparation method of this nanoelectronic coating, its step is as follows: first bisphenol A-type solid epoxy 55%, bisphenol-A liquid epoxy resin 8%, light calcium carbonate 15%, nano silicon 2%, titanium dioxide 10% and quadrol 5% are mixed, mix after 5 hours and place 32 hours; Then add anti-plain boiled water 5% to carry out mix and blend after 5 hours, carry out vacuumizing and defoaming.
In sum, embodiment 1 ~ 7 is by the optimization design to nanoelectronic formulation for coating material, and adopt the prepared electronic paint layer of above-mentioned formula, high temperature that can resistance to 320 ℃, and long term operation under 275 ℃ of high temperature, under 25 ℃, 800V condition of high voltage, do not ftracture and breakdown burning not, thermal conductivity is between 6.3 ~ 7.1W/mK.The solid content of this electronic paint is 78% left and right, and its condition of cure is 180 ℃, 3 ~ 5 minutes; This electronic paint has higher solvent resistance, at 25 ℃, dimethylbenzene, soaks 10 minutes, and it films unchanged; In circulation experiment ,-55/125 ℃ of four circulation, films and does not destroy; The humidity resistance of this electronic paint coating is GB 1740-1979 (1989)≤2 grade.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, therefore every foundation technical spirit of the present invention is to any trickle modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (9)
1. a nanoelectronic coating, is characterized in that: by quality 100%, include:
Bisphenol A-type solid epoxy 50-60%;
Bisphenol-A liquid epoxy resin 2-10%;
Solidifying agent 3-5%;
Anti-plain boiled water 3-5%;
Light calcium carbonate 15-25%;
Nano silicon 1-2%;
Titanium dioxide 5-15%.
2. a kind of nanoelectronic coating according to claim 1, is characterized in that: the solid content of described bisphenol-A liquid epoxy resin is 75 ~ 90%.
3. a kind of nanoelectronic coating according to claim 1, is characterized in that: described solidifying agent is one or more in diethylenetriamine, quadrol, isophorone.
4. a kind of nanoelectronic coating according to claim 3, is characterized in that: by quality 100%, include:
Bisphenol A-type solid epoxy 55%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%;
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 15%.
5. a kind of nanoelectronic coating according to claim 3, is characterized in that: by quality 100%, include:
Bisphenol A-type solid epoxy 51%;
Bisphenol-A liquid epoxy resin 10%;
Isophorone 4%
Anti-plain boiled water 4%
Light calcium carbonate 20%
Nano silicon 1%
Titanium dioxide 10%.
6. a kind of nanoelectronic coating according to claim 3, is characterized in that: by quality 100%, include:
Bisphenol A-type solid epoxy 60%;
Bisphenol-A liquid epoxy resin 5%;
Diethylenetriamine 3%
Quadrol 2%
Anti-plain boiled water 5%;
Light calcium carbonate 15%;
Nano silicon 2%;
Titanium dioxide 9%.
7. according to a kind of nanoelectronic coating described in claim 5 ~ 7 any one, it is characterized in that: the solid content of described bisphenol-A liquid epoxy resin is 76 ~ 80%.
8. according to a kind of nanoelectronic coating described in claim 1 ~ 7 any one, it is characterized in that: described bisphenol-A liquid epoxy resin is the bisphenol-A liquid epoxy resin of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD127; Described bisphenol A-type solid epoxy is the bisphenol A-type solid epoxy of Sinopec Ba Ling petrochemical complex limited liability company, and its trade mark is CYD011.
9. the preparation method of nanoelectronic coating as claimed in claim 1, it is characterized in that: first bisphenol A-type solid epoxy 50-60%, bisphenol-A liquid epoxy resin 2-10%, light calcium carbonate 15-25%, nano silicon 1-2%, titanium dioxide 5-15% and solidifying agent 3-5% are mixed, mix after 2 ~ 5 hours and place 10 ~ 36 hours; Then add anti-plain boiled water 3-5% to carry out mix and blend after 3 ~ 5 hours, carry out vacuumizing and defoaming.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310446418.0A CN103540233B (en) | 2013-09-27 | 2013-09-27 | A kind of nanoelectronic coating and preparation method thereof |
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| CN201310446418.0A CN103540233B (en) | 2013-09-27 | 2013-09-27 | A kind of nanoelectronic coating and preparation method thereof |
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| CN103540233A true CN103540233A (en) | 2014-01-29 |
| CN103540233B CN103540233B (en) | 2016-04-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104650697A (en) * | 2014-06-26 | 2015-05-27 | 柳州市安龙机械设备有限公司 | High temperature resistant nano coating |
| CN107033734A (en) * | 2017-04-07 | 2017-08-11 | 国家纳米科学中心 | One kind can ceramic epoxy resin fireproof coating |
| CN108795233A (en) * | 2018-06-04 | 2018-11-13 | 北京碧海舟腐蚀防护工业股份有限公司 | Wear-resisting epoxy coating, wear-resistant coating and its application |
| CN109456663A (en) * | 2018-09-07 | 2019-03-12 | 湖北三赢兴智能光电科技有限公司 | Surface treating agent for electronic product and treating method |
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| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| US4734468A (en) * | 1986-02-28 | 1988-03-29 | Shell Oil Company | Epoxy resin composition |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN102604045A (en) * | 2012-03-22 | 2012-07-25 | 华东理工大学 | Epoxy resin composition and method for preparing glue film, prepreg and composite material by using same |
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2013
- 2013-09-27 CN CN201310446418.0A patent/CN103540233B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5359799A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Ind Co Ltd | Epoxy resin varnish |
| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| US4734468A (en) * | 1986-02-28 | 1988-03-29 | Shell Oil Company | Epoxy resin composition |
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN102604045A (en) * | 2012-03-22 | 2012-07-25 | 华东理工大学 | Epoxy resin composition and method for preparing glue film, prepreg and composite material by using same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104650697A (en) * | 2014-06-26 | 2015-05-27 | 柳州市安龙机械设备有限公司 | High temperature resistant nano coating |
| CN107033734A (en) * | 2017-04-07 | 2017-08-11 | 国家纳米科学中心 | One kind can ceramic epoxy resin fireproof coating |
| CN107033734B (en) * | 2017-04-07 | 2019-10-11 | 国家纳米科学中心 | One kind can ceramic epoxy resin fireproof coating |
| CN108795233A (en) * | 2018-06-04 | 2018-11-13 | 北京碧海舟腐蚀防护工业股份有限公司 | Wear-resisting epoxy coating, wear-resistant coating and its application |
| CN109456663A (en) * | 2018-09-07 | 2019-03-12 | 湖北三赢兴智能光电科技有限公司 | Surface treating agent for electronic product and treating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103540233B (en) | 2016-04-13 |
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